JP7729330B2 - 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法 - Google Patents

感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法

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Publication number
JP7729330B2
JP7729330B2 JP2022509975A JP2022509975A JP7729330B2 JP 7729330 B2 JP7729330 B2 JP 7729330B2 JP 2022509975 A JP2022509975 A JP 2022509975A JP 2022509975 A JP2022509975 A JP 2022509975A JP 7729330 B2 JP7729330 B2 JP 7729330B2
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Japan
Prior art keywords
photosensitive resin
mass
meth
resin composition
less
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JP2022509975A
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English (en)
Japanese (ja)
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JPWO2021193232A1 (https=
Inventor
敬司 小野
聖司 春原
哲朗 山下
雄祥 平山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/04—Homopolymers or copolymers of styrene
    • C09D125/08—Copolymers of styrene
    • C09D125/14—Copolymers of styrene with unsaturated esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
JP2022509975A 2020-03-24 2021-03-16 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法 Active JP7729330B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2020/013106 WO2021192058A1 (ja) 2020-03-24 2020-03-24 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法
JPPCT/JP2020/013106 2020-03-24
PCT/JP2021/010588 WO2021193232A1 (ja) 2020-03-24 2021-03-16 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021193232A1 JPWO2021193232A1 (https=) 2021-09-30
JP7729330B2 true JP7729330B2 (ja) 2025-08-26

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JP2022509975A Active JP7729330B2 (ja) 2020-03-24 2021-03-16 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法

Country Status (4)

Country Link
US (1) US20230145264A1 (https=)
JP (1) JP7729330B2 (https=)
CN (1) CN115298615A (https=)
WO (2) WO2021192058A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230161863A (ko) * 2021-03-24 2023-11-28 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법
WO2023120570A1 (ja) * 2021-12-22 2023-06-29 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、プリント配線板、及びプリント配線板の製造方法
TWI883599B (zh) 2022-10-21 2025-05-11 日商旭化成股份有限公司 感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法
JP7695484B2 (ja) 2023-02-21 2025-06-18 旭化成株式会社 感光性エレメント、及びレジストパターンの形成方法
CN121002445A (zh) 2023-06-27 2025-11-21 旭化成株式会社 感光性树脂组合物、感光性树脂层叠体、以及抗蚀图案的形成方法等
TW202513615A (zh) 2023-08-21 2025-04-01 日商旭化成股份有限公司 感光性元件、光阻圖案之形成方法、以及配線板之製造方法
JP2025164502A (ja) 2024-04-19 2025-10-30 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Citations (6)

* Cited by examiner, † Cited by third party
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WO2014061674A1 (ja) 2012-10-17 2014-04-24 富士フイルム株式会社 光学材料用永久膜の製造方法、これにより作製した硬化膜、これを用いた有機ｅｌ表示装置および液晶表示装置
JP2014134815A (ja) 2006-12-27 2014-07-24 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2014214186A (ja) 2013-04-23 2014-11-17 三洋化成工業株式会社 活性エネルギー線硬化性樹脂組成物
WO2015125871A1 (ja) 2014-02-20 2015-08-27 富士フイルム株式会社 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、赤外線カットフィルター、並びに、固体撮像装置
JP2016139154A (ja) 2016-04-07 2016-08-04 旭化成株式会社 感光性樹脂組成物
JP2016189006A (ja) 2012-09-28 2016-11-04 富士フイルム株式会社 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置

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WO2007010614A1 (ja) * 2005-07-22 2007-01-25 Asahi Kasei Emd Corporation 感光性樹脂組成物及び積層体
JP5327310B2 (ja) * 2009-02-26 2013-10-30 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN102272676B (zh) * 2009-02-26 2013-07-31 日立化成株式会社 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
CN103403127A (zh) * 2011-03-30 2013-11-20 株式会社艾迪科 聚合性液晶组合物、偏振发光性涂料、新型萘内酰胺衍生物、新型香豆素衍生物、新型尼罗红衍生物以及新型蒽衍生物
JP6100500B2 (ja) * 2012-10-26 2017-03-22 富士フイルム株式会社 感光性転写材料、パターン形成方法およびエッチング方法
JPWO2015098870A1 (ja) * 2013-12-27 2017-03-23 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR102375653B1 (ko) * 2014-02-12 2022-03-16 쇼와덴코머티리얼즈가부시끼가이샤 감광성 엘리먼트
JP6734913B2 (ja) * 2016-02-29 2020-08-05 富士フイルム株式会社 パターン積層体の製造方法、反転パターンの製造方法およびパターン積層体
MY200922A (en) * 2018-06-22 2024-01-23 Asahi Chemical Ind Photosensitive Resin Composition and Resist Pattern Formation Method

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JP2014134815A (ja) 2006-12-27 2014-07-24 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2016189006A (ja) 2012-09-28 2016-11-04 富士フイルム株式会社 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
WO2014061674A1 (ja) 2012-10-17 2014-04-24 富士フイルム株式会社 光学材料用永久膜の製造方法、これにより作製した硬化膜、これを用いた有機ｅｌ表示装置および液晶表示装置
JP2014214186A (ja) 2013-04-23 2014-11-17 三洋化成工業株式会社 活性エネルギー線硬化性樹脂組成物
WO2015125871A1 (ja) 2014-02-20 2015-08-27 富士フイルム株式会社 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、赤外線カットフィルター、並びに、固体撮像装置
JP2016139154A (ja) 2016-04-07 2016-08-04 旭化成株式会社 感光性樹脂組成物

Also Published As

Publication number Publication date
JPWO2021193232A1 (https=) 2021-09-30
TW202136324A (zh) 2021-10-01
US20230145264A1 (en) 2023-05-11
WO2021192058A1 (ja) 2021-09-30
WO2021193232A1 (ja) 2021-09-30
CN115298615A (zh) 2022-11-04
KR20220157947A (ko) 2022-11-29

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