JP7728456B2 - 終端回路基板、電子部品実装用パッケージ、および電子モジュール - Google Patents

終端回路基板、電子部品実装用パッケージ、および電子モジュール

Info

Publication number
JP7728456B2
JP7728456B2 JP2024524879A JP2024524879A JP7728456B2 JP 7728456 B2 JP7728456 B2 JP 7728456B2 JP 2024524879 A JP2024524879 A JP 2024524879A JP 2024524879 A JP2024524879 A JP 2024524879A JP 7728456 B2 JP7728456 B2 JP 7728456B2
Authority
JP
Japan
Prior art keywords
ground conductor
line
resistor
conductor line
signal line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024524879A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023234306A1 (https=
JPWO2023234306A5 (https=
Inventor
芳規 川頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023234306A1 publication Critical patent/JPWO2023234306A1/ja
Publication of JPWO2023234306A5 publication Critical patent/JPWO2023234306A5/ja
Application granted granted Critical
Publication of JP7728456B2 publication Critical patent/JP7728456B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/24—Terminating devices
    • H01P1/26—Dissipative terminations
    • H01P1/268—Strip line terminations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies

Landscapes

  • Structure Of Printed Boards (AREA)
JP2024524879A 2022-06-01 2023-05-30 終端回路基板、電子部品実装用パッケージ、および電子モジュール Active JP7728456B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022089677 2022-06-01
JP2022089677 2022-06-01
PCT/JP2023/020127 WO2023234306A1 (ja) 2022-06-01 2023-05-30 終端回路基板、電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023234306A1 JPWO2023234306A1 (https=) 2023-12-07
JPWO2023234306A5 JPWO2023234306A5 (https=) 2025-02-14
JP7728456B2 true JP7728456B2 (ja) 2025-08-22

Family

ID=89024877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024524879A Active JP7728456B2 (ja) 2022-06-01 2023-05-30 終端回路基板、電子部品実装用パッケージ、および電子モジュール

Country Status (3)

Country Link
EP (1) EP4535553A1 (https=)
JP (1) JP7728456B2 (https=)
WO (1) WO2023234306A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050128022A1 (en) 2003-10-27 2005-06-16 Markus Ulm Structural element having a coplanar line
JP2008085699A (ja) 2006-09-28 2008-04-10 Kyocera Corp 高周波用終端抵抗基板および電子装置
KR101462391B1 (ko) 2013-06-18 2014-11-17 전자부품연구원 터미네이션부를 포함하는 알에프 소자

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135712A (ja) 2008-10-29 2010-06-17 Kyocera Corp 配線基板および半導体素子収納用パッケージならびに半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050128022A1 (en) 2003-10-27 2005-06-16 Markus Ulm Structural element having a coplanar line
JP2008085699A (ja) 2006-09-28 2008-04-10 Kyocera Corp 高周波用終端抵抗基板および電子装置
KR101462391B1 (ko) 2013-06-18 2014-11-17 전자부품연구원 터미네이션부를 포함하는 알에프 소자

Also Published As

Publication number Publication date
JPWO2023234306A1 (https=) 2023-12-07
EP4535553A1 (en) 2025-04-09
WO2023234306A1 (ja) 2023-12-07

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