JP7725586B2 - 非接触通信媒体 - Google Patents

非接触通信媒体

Info

Publication number
JP7725586B2
JP7725586B2 JP2023530149A JP2023530149A JP7725586B2 JP 7725586 B2 JP7725586 B2 JP 7725586B2 JP 2023530149 A JP2023530149 A JP 2023530149A JP 2023530149 A JP2023530149 A JP 2023530149A JP 7725586 B2 JP7725586 B2 JP 7725586B2
Authority
JP
Japan
Prior art keywords
housing
lid
communication medium
contact communication
sealing portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023530149A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022270633A5 (https=
JPWO2022270633A1 (https=
Inventor
裕一 阿部
一英 草野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022270633A1 publication Critical patent/JPWO2022270633A1/ja
Publication of JPWO2022270633A5 publication Critical patent/JPWO2022270633A5/ja
Application granted granted Critical
Publication of JP7725586B2 publication Critical patent/JP7725586B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Casings For Electric Apparatus (AREA)
JP2023530149A 2021-06-24 2022-06-24 非接触通信媒体 Active JP7725586B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021105181 2021-06-24
JP2021105181 2021-06-24
PCT/JP2022/025387 WO2022270633A1 (ja) 2021-06-24 2022-06-24 非接触通信媒体

Publications (3)

Publication Number Publication Date
JPWO2022270633A1 JPWO2022270633A1 (https=) 2022-12-29
JPWO2022270633A5 JPWO2022270633A5 (https=) 2024-03-28
JP7725586B2 true JP7725586B2 (ja) 2025-08-19

Family

ID=84545514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023530149A Active JP7725586B2 (ja) 2021-06-24 2022-06-24 非接触通信媒体

Country Status (2)

Country Link
JP (1) JP7725586B2 (https=)
WO (1) WO2022270633A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017514A (ja) 2001-03-20 2003-01-17 Schlumberger Holding Ltd 電子タグ装置および電子タグをパッケージする方法
US20030089512A1 (en) 2001-10-01 2003-05-15 Siemens Aktiengesellschaft Heat-resistant housing for electrical function elements and use of such a device for a mobile data memory
JP2004297554A (ja) 2003-03-27 2004-10-21 Seiko Epson Corp 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器
JP2006232292A (ja) 2005-02-22 2006-09-07 Nippon Sheet Glass Co Ltd 電子タグ付き容器およびｒｆｉｄシステム
JP2006287533A (ja) 2005-03-31 2006-10-19 Sharp Corp 光学装置用モジュール
JP2010033612A (ja) 1998-12-31 2010-02-12 Casio Comput Co Ltd 電子機器
JP2010087650A (ja) 2008-09-30 2010-04-15 Daishinku Corp 表面実装型圧電振動デバイス
US20100102967A1 (en) 2008-10-27 2010-04-29 Sang Mok Lee Container lid with a rfid tag
JP2011185953A (ja) 2011-06-27 2011-09-22 Casio Computer Co Ltd 電子機器
JP2012235351A (ja) 2011-05-02 2012-11-29 Denso Corp アンテナ装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135835U (https=) * 1988-03-11 1989-09-18
JP3192507B2 (ja) * 1992-12-18 2001-07-30 三菱電機株式会社 樹脂シール中空型半導体装置の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010033612A (ja) 1998-12-31 2010-02-12 Casio Comput Co Ltd 電子機器
JP2003017514A (ja) 2001-03-20 2003-01-17 Schlumberger Holding Ltd 電子タグ装置および電子タグをパッケージする方法
US20030089512A1 (en) 2001-10-01 2003-05-15 Siemens Aktiengesellschaft Heat-resistant housing for electrical function elements and use of such a device for a mobile data memory
JP2004297554A (ja) 2003-03-27 2004-10-21 Seiko Epson Corp 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器
JP2006232292A (ja) 2005-02-22 2006-09-07 Nippon Sheet Glass Co Ltd 電子タグ付き容器およびｒｆｉｄシステム
JP2006287533A (ja) 2005-03-31 2006-10-19 Sharp Corp 光学装置用モジュール
JP2010087650A (ja) 2008-09-30 2010-04-15 Daishinku Corp 表面実装型圧電振動デバイス
US20100102967A1 (en) 2008-10-27 2010-04-29 Sang Mok Lee Container lid with a rfid tag
JP2012235351A (ja) 2011-05-02 2012-11-29 Denso Corp アンテナ装置
JP2011185953A (ja) 2011-06-27 2011-09-22 Casio Computer Co Ltd 電子機器

Also Published As

Publication number Publication date
WO2022270633A1 (ja) 2022-12-29
JPWO2022270633A1 (https=) 2022-12-29

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