JP7718604B2 - 伸縮性デバイス - Google Patents

伸縮性デバイス

Info

Publication number
JP7718604B2
JP7718604B2 JP2024549983A JP2024549983A JP7718604B2 JP 7718604 B2 JP7718604 B2 JP 7718604B2 JP 2024549983 A JP2024549983 A JP 2024549983A JP 2024549983 A JP2024549983 A JP 2024549983A JP 7718604 B2 JP7718604 B2 JP 7718604B2
Authority
JP
Japan
Prior art keywords
wiring
substrate
protective layer
overlapping region
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024549983A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024070592A1 (enExample
JPWO2024070592A5 (enExample
Inventor
祐依 中村
俊文 飛鳥井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024070592A1 publication Critical patent/JPWO2024070592A1/ja
Publication of JPWO2024070592A5 publication Critical patent/JPWO2024070592A5/ja
Application granted granted Critical
Publication of JP7718604B2 publication Critical patent/JP7718604B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2024549983A 2022-09-28 2023-09-08 伸縮性デバイス Active JP7718604B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022155142 2022-09-28
JP2022155142 2022-09-28
PCT/JP2023/032850 WO2024070592A1 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024070592A1 JPWO2024070592A1 (enExample) 2024-04-04
JPWO2024070592A5 JPWO2024070592A5 (enExample) 2025-03-21
JP7718604B2 true JP7718604B2 (ja) 2025-08-05

Family

ID=90477361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549983A Active JP7718604B2 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Country Status (3)

Country Link
US (1) US20250210505A1 (enExample)
JP (1) JP7718604B2 (enExample)
WO (1) WO2024070592A1 (enExample)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088055A (ja) 2005-09-20 2007-04-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板およびその製造方法
WO2013105402A1 (ja) 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
US20140328030A1 (en) 2013-05-03 2014-11-06 Rolls-Royce Plc Electrical harness connector
JP2017069530A (ja) 2015-10-01 2017-04-06 日本メクトロン株式会社 伸縮性配線基板および伸縮性配線基板の製造方法
JP2017195230A (ja) 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018056321A (ja) 2016-09-28 2018-04-05 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
WO2019093069A1 (ja) 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088055A (ja) 2005-09-20 2007-04-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板およびその製造方法
WO2013105402A1 (ja) 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
US20140328030A1 (en) 2013-05-03 2014-11-06 Rolls-Royce Plc Electrical harness connector
JP2017069530A (ja) 2015-10-01 2017-04-06 日本メクトロン株式会社 伸縮性配線基板および伸縮性配線基板の製造方法
JP2017195230A (ja) 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018056321A (ja) 2016-09-28 2018-04-05 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
WO2019093069A1 (ja) 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Also Published As

Publication number Publication date
JPWO2024070592A1 (enExample) 2024-04-04
US20250210505A1 (en) 2025-06-26
WO2024070592A1 (ja) 2024-04-04

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