JP7707423B2 - 伸縮性配線基板及び電流供給装置 - Google Patents

伸縮性配線基板及び電流供給装置 Download PDF

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Publication number
JP7707423B2
JP7707423B2 JP2024514714A JP2024514714A JP7707423B2 JP 7707423 B2 JP7707423 B2 JP 7707423B2 JP 2024514714 A JP2024514714 A JP 2024514714A JP 2024514714 A JP2024514714 A JP 2024514714A JP 7707423 B2 JP7707423 B2 JP 7707423B2
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JP
Japan
Prior art keywords
wiring board
stretchable
reinforcing
conductive layer
stretchable wiring
Prior art date
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Active
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JP2024514714A
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English (en)
Japanese (ja)
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JPWO2025027749A5 (https=
JPWO2025027749A1 (https=
Inventor
壮一郎 福井
大介 塩川
真史 井田
美穂 田畑
広和 大舘
雅之 岩瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEKTEC CORPORATION
Ya Man Ltd
Original Assignee
MEKTEC CORPORATION
Ya Man Ltd
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Publication of JPWO2025027749A1 publication Critical patent/JPWO2025027749A1/ja
Priority to JP2025112355A priority Critical patent/JP2025129307A/ja
Publication of JPWO2025027749A5 publication Critical patent/JPWO2025027749A5/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrotherapy Devices (AREA)
JP2024514714A 2023-07-31 2023-07-31 伸縮性配線基板及び電流供給装置 Active JP7707423B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025112355A JP2025129307A (ja) 2023-07-31 2025-07-02 伸縮性配線基板及び電流供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/027963 WO2025027749A1 (ja) 2023-07-31 2023-07-31 伸縮性配線基板及び電流供給装置

Related Child Applications (1)

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JP2025112355A Division JP2025129307A (ja) 2023-07-31 2025-07-02 伸縮性配線基板及び電流供給装置

Publications (3)

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JPWO2025027749A1 JPWO2025027749A1 (https=) 2025-02-06
JPWO2025027749A5 JPWO2025027749A5 (https=) 2025-07-08
JP7707423B2 true JP7707423B2 (ja) 2025-07-14

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ID=94394729

Family Applications (2)

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JP2024514714A Active JP7707423B2 (ja) 2023-07-31 2023-07-31 伸縮性配線基板及び電流供給装置
JP2025112355A Pending JP2025129307A (ja) 2023-07-31 2025-07-02 伸縮性配線基板及び電流供給装置

Family Applications After (1)

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JP2025112355A Pending JP2025129307A (ja) 2023-07-31 2025-07-02 伸縮性配線基板及び電流供給装置

Country Status (3)

Country Link
JP (2) JP7707423B2 (https=)
CN (1) CN119790717A (https=)
WO (1) WO2025027749A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001506154A (ja) 1996-12-17 2001-05-15 エヌディーエム・インコーポレーテッド 使い捨て電極及び標準のリード線コネクタとインターフェイス接続する再使用可能なリード線アダプタを有する生医学電極
JP2013252180A (ja) 2012-06-05 2013-12-19 Nippon Koden Corp 生体電極および生体電極ロール
JP7149448B1 (ja) 2021-03-12 2022-10-06 信越化学工業株式会社 生体電極、生体電極の製造方法、及び生体信号の測定方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6457355B2 (ja) * 2015-08-27 2019-01-23 日本電信電話株式会社 ウェアラブル電極および生体信号モニタシステム
JP6932060B2 (ja) * 2017-10-18 2021-09-08 日本メクトロン株式会社 伸縮性配線基板、伸縮性配線基板の製造方法及び電子部品付伸縮性配線基板
JP7107667B2 (ja) * 2017-11-27 2022-07-27 日本メクトロン株式会社 伸縮性基板、伸縮性基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001506154A (ja) 1996-12-17 2001-05-15 エヌディーエム・インコーポレーテッド 使い捨て電極及び標準のリード線コネクタとインターフェイス接続する再使用可能なリード線アダプタを有する生医学電極
JP2013252180A (ja) 2012-06-05 2013-12-19 Nippon Koden Corp 生体電極および生体電極ロール
JP7149448B1 (ja) 2021-03-12 2022-10-06 信越化学工業株式会社 生体電極、生体電極の製造方法、及び生体信号の測定方法

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Publication number Publication date
WO2025027749A1 (ja) 2025-02-06
JP2025129307A (ja) 2025-09-04
JPWO2025027749A1 (https=) 2025-02-06
CN119790717A (zh) 2025-04-08

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