JP7693344B2 - 電子モジュール及び電子機器 - Google Patents

電子モジュール及び電子機器 Download PDF

Info

Publication number
JP7693344B2
JP7693344B2 JP2021046854A JP2021046854A JP7693344B2 JP 7693344 B2 JP7693344 B2 JP 7693344B2 JP 2021046854 A JP2021046854 A JP 2021046854A JP 2021046854 A JP2021046854 A JP 2021046854A JP 7693344 B2 JP7693344 B2 JP 7693344B2
Authority
JP
Japan
Prior art keywords
power supply
ground
capacitor
electrode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021046854A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022146063A (ja
JP2022146063A5 (https=
Inventor
琢也 近藤
貴志 沼生
展輝 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021046854A priority Critical patent/JP7693344B2/ja
Priority to US17/694,070 priority patent/US11792917B2/en
Publication of JP2022146063A publication Critical patent/JP2022146063A/ja
Publication of JP2022146063A5 publication Critical patent/JP2022146063A5/ja
Application granted granted Critical
Publication of JP7693344B2 publication Critical patent/JP7693344B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2021046854A 2021-03-22 2021-03-22 電子モジュール及び電子機器 Active JP7693344B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021046854A JP7693344B2 (ja) 2021-03-22 2021-03-22 電子モジュール及び電子機器
US17/694,070 US11792917B2 (en) 2021-03-22 2022-03-14 Electronic module and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021046854A JP7693344B2 (ja) 2021-03-22 2021-03-22 電子モジュール及び電子機器

Publications (3)

Publication Number Publication Date
JP2022146063A JP2022146063A (ja) 2022-10-05
JP2022146063A5 JP2022146063A5 (https=) 2024-03-26
JP7693344B2 true JP7693344B2 (ja) 2025-06-17

Family

ID=83285379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021046854A Active JP7693344B2 (ja) 2021-03-22 2021-03-22 電子モジュール及び電子機器

Country Status (2)

Country Link
US (1) US11792917B2 (https=)
JP (1) JP7693344B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7414768B2 (ja) 2021-04-01 2024-01-16 キヤノン株式会社 電気回路及び電子機器
JP7840675B2 (ja) 2021-12-13 2026-04-06 キヤノン株式会社 電子モジュール及び電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003069169A (ja) 2001-08-22 2003-03-07 Nec Corp 回路基板
JP2008021969A (ja) 2006-06-16 2008-01-31 Canon Inc プリント回路板および電源供給用回路構造
JP2009027140A (ja) 2007-06-19 2009-02-05 Canon Inc プリント回路板
JP2014022654A (ja) 2012-07-20 2014-02-03 Ricoh Co Ltd プリント基板及び電子機器
JP2017059696A (ja) 2015-09-17 2017-03-23 キヤノン株式会社 プリント回路板及び半導体パッケージ
JP2020057714A (ja) 2018-10-03 2020-04-09 株式会社デンソー 駆動回路および当該回路を備える回路基板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3414342B2 (ja) * 1999-11-25 2003-06-09 日本電気株式会社 集積回路チップの実装構造および実装方法
US6577490B2 (en) * 2000-12-12 2003-06-10 Ngk Spark Plug Co., Ltd. Wiring board
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
US7317622B2 (en) * 2002-12-31 2008-01-08 Intel Corporation Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt
JP4734282B2 (ja) * 2007-04-23 2011-07-27 株式会社日立製作所 半導体チップおよび半導体装置
JPWO2010038489A1 (ja) * 2008-09-30 2012-03-01 イビデン株式会社 電子部品内蔵配線板及びその製造方法
JP5524715B2 (ja) * 2009-06-01 2014-06-18 日本特殊陶業株式会社 セラミックコンデンサ、配線基板
JP5893484B2 (ja) * 2012-04-09 2016-03-23 キヤノン株式会社 プリント回路板及びプリント配線板
JP5904856B2 (ja) 2012-04-23 2016-04-20 キヤノン株式会社 プリント配線板、半導体パッケージ及びプリント回路板
US9084364B2 (en) 2012-06-20 2015-07-14 Canon Kabushiki Kaisha Printed circuit board and printed wiring board
KR101472628B1 (ko) * 2012-07-02 2014-12-15 삼성전기주식회사 커패시터 내장형 기판
JP6176917B2 (ja) 2012-11-20 2017-08-09 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
JP6818534B2 (ja) 2016-12-13 2021-01-20 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
US10548249B2 (en) * 2017-09-27 2020-01-28 Intel Corporation Shielding in electronic assemblies
US10716211B2 (en) 2018-02-08 2020-07-14 Canon Kabushiki Kaisha Printed circuit board, printed wiring board, electronic device, and camera
US11495545B2 (en) * 2019-02-22 2022-11-08 SK Hynix Inc. Semiconductor package including a bridge die
US20200373285A1 (en) * 2019-05-24 2020-11-26 Microsoft Technology Licensing, Llc Power pass-through decoupling capacitance arrangements for integrated circuit devices
US11480910B2 (en) 2019-06-11 2022-10-25 Canon Kabushiki Kaisha Printed circuit board, printed wiring board, electronic device, and image forming apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003069169A (ja) 2001-08-22 2003-03-07 Nec Corp 回路基板
JP2008021969A (ja) 2006-06-16 2008-01-31 Canon Inc プリント回路板および電源供給用回路構造
JP2009027140A (ja) 2007-06-19 2009-02-05 Canon Inc プリント回路板
JP2014022654A (ja) 2012-07-20 2014-02-03 Ricoh Co Ltd プリント基板及び電子機器
JP2017059696A (ja) 2015-09-17 2017-03-23 キヤノン株式会社 プリント回路板及び半導体パッケージ
JP2020057714A (ja) 2018-10-03 2020-04-09 株式会社デンソー 駆動回路および当該回路を備える回路基板

Also Published As

Publication number Publication date
JP2022146063A (ja) 2022-10-05
US11792917B2 (en) 2023-10-17
US20220304144A1 (en) 2022-09-22

Similar Documents

Publication Publication Date Title
JP7693344B2 (ja) 電子モジュール及び電子機器
JP2004112468A (ja) 電子装置
JP7133516B2 (ja) 信号伝送回路、電子制御装置
JPWO2018151134A1 (ja) 電子機器
KR20200014231A (ko) 회로 기판 및 이를 포함하는 전자 기기
US12219246B2 (en) Electric circuit and electronic apparatus
CN112351577A (zh) 印刷电路板、印刷布线板和电子设备
WO2001005201A1 (en) Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus
JP5711178B2 (ja) 撮像装置及びこの撮像装置を用いた内視鏡
US11839019B2 (en) Communication module and electronic device
CN210443547U (zh) 电子设备
JP7654376B2 (ja) 撮像モジュール及び電子機器
JP2022146063A5 (https=)
JP7282523B2 (ja) プリント回路板、プリント配線板、電子機器、及びカメラ
JP7781571B2 (ja) モジュールおよび機器
JP4716951B2 (ja) 電気回路装置
JP7793394B2 (ja) 通信モジュール及び電子機器
JP2013120070A (ja) プローブカード
US11950364B2 (en) Module and equipment
JP7584997B2 (ja) 電子モジュール及び電子機器
JP7693428B2 (ja) 回路モジュール及び電子機器
US20260032822A1 (en) Electronic module
US10888217B2 (en) Imaging module applicable to head-swing endoscope
JP7731775B2 (ja) 電子モジュール、及び電子機器
US20250309214A1 (en) Module

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240315

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240315

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20241121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241126

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250123

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250507

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250605

R150 Certificate of patent or registration of utility model

Ref document number: 7693344

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150