JP7667373B2 - 表示装置、及び表示装置の製造方法 - Google Patents

表示装置、及び表示装置の製造方法 Download PDF

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Publication number
JP7667373B2
JP7667373B2 JP2024511664A JP2024511664A JP7667373B2 JP 7667373 B2 JP7667373 B2 JP 7667373B2 JP 2024511664 A JP2024511664 A JP 2024511664A JP 2024511664 A JP2024511664 A JP 2024511664A JP 7667373 B2 JP7667373 B2 JP 7667373B2
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Japan
Prior art keywords
led chip
adhesive layer
pixel circuit
light
display device
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JP2024511664A
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English (en)
Japanese (ja)
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JPWO2023189420A1 (https=
JPWO2023189420A5 (https=
Inventor
陽一 上條
佳克 今関
光一 宮坂
修一 大澤
義史 亀井
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Japan Display Inc
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Japan Display Inc
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Publication of JPWO2023189420A5 publication Critical patent/JPWO2023189420A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/855—Optical field-shaping means, e.g. lenses
    • H10H29/8552—Light absorbing arrangements, e.g. black matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/39—Connection of the pixel electrodes to the driving transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP2024511664A 2022-03-29 2023-03-10 表示装置、及び表示装置の製造方法 Active JP7667373B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022054243 2022-03-29
JP2022054243 2022-03-29
PCT/JP2023/009301 WO2023189420A1 (ja) 2022-03-29 2023-03-10 表示装置、及び表示装置の製造方法

Publications (3)

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JPWO2023189420A1 JPWO2023189420A1 (https=) 2023-10-05
JPWO2023189420A5 JPWO2023189420A5 (https=) 2024-09-09
JP7667373B2 true JP7667373B2 (ja) 2025-04-22

Family

ID=88200804

Family Applications (1)

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JP2024511664A Active JP7667373B2 (ja) 2022-03-29 2023-03-10 表示装置、及び表示装置の製造方法

Country Status (4)

Country Link
US (1) US20250022865A1 (https=)
JP (1) JP7667373B2 (https=)
CN (1) CN118922877A (https=)
WO (1) WO2023189420A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004184978A (ja) 2002-11-19 2004-07-02 Hideki Matsumura 平面ディスプレイ基板
US10199362B1 (en) 2018-01-15 2019-02-05 Prilit Optronics, Inc. MicroLED display panel
US20200083280A1 (en) 2018-09-11 2020-03-12 Prilit Optronics, Inc. Top emission microled display and bottom emission microled display and a method of forming the same
US20200309357A1 (en) 2019-03-29 2020-10-01 Cree, Inc. Active control of light emitting diodes and light emitting diode displays
JP2020205336A (ja) 2019-06-17 2020-12-24 キヤノン株式会社 発光素子、発光素子の製造方法
CN112310142A (zh) 2020-10-29 2021-02-02 厦门天马微电子有限公司 一种显示装置、显示面板及其制作方法
US20210111324A1 (en) 2019-10-11 2021-04-15 Samsung Electronics Co., Ltd. Display module and manufacturing method thereof
WO2021132106A1 (ja) 2019-12-26 2021-07-01 Ａｇｃ株式会社 フレキシブル透明電子デバイスの製造方法及び物品
US20210242180A1 (en) 2020-01-31 2021-08-05 X Display Company Technology Limited Led color displays with multi-led sub-pixels
JP2021136335A (ja) 2020-02-27 2021-09-13 株式会社ジャパンディスプレイ 表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7360272B2 (ja) * 2019-08-19 2023-10-12 株式会社ジャパンディスプレイ 表示装置
JP2021056386A (ja) * 2019-09-30 2021-04-08 株式会社ブイ・テクノロジー Ｌｅｄ表示装置の製造方法及びｌｅｄ表示装置
CN116014051A (zh) * 2021-10-22 2023-04-25 隆达电子股份有限公司 微型发光二极管封装结构

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004184978A (ja) 2002-11-19 2004-07-02 Hideki Matsumura 平面ディスプレイ基板
US10199362B1 (en) 2018-01-15 2019-02-05 Prilit Optronics, Inc. MicroLED display panel
US20200083280A1 (en) 2018-09-11 2020-03-12 Prilit Optronics, Inc. Top emission microled display and bottom emission microled display and a method of forming the same
US20200309357A1 (en) 2019-03-29 2020-10-01 Cree, Inc. Active control of light emitting diodes and light emitting diode displays
JP2020205336A (ja) 2019-06-17 2020-12-24 キヤノン株式会社 発光素子、発光素子の製造方法
US20210111324A1 (en) 2019-10-11 2021-04-15 Samsung Electronics Co., Ltd. Display module and manufacturing method thereof
WO2021132106A1 (ja) 2019-12-26 2021-07-01 Ａｇｃ株式会社 フレキシブル透明電子デバイスの製造方法及び物品
US20210242180A1 (en) 2020-01-31 2021-08-05 X Display Company Technology Limited Led color displays with multi-led sub-pixels
JP2021136335A (ja) 2020-02-27 2021-09-13 株式会社ジャパンディスプレイ 表示装置
CN112310142A (zh) 2020-10-29 2021-02-02 厦门天马微电子有限公司 一种显示装置、显示面板及其制作方法

Also Published As

Publication number Publication date
WO2023189420A1 (ja) 2023-10-05
US20250022865A1 (en) 2025-01-16
JPWO2023189420A1 (https=) 2023-10-05
CN118922877A (zh) 2024-11-08

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