JP7646029B2 - 圧電振動素子及び圧電デバイス - Google Patents

圧電振動素子及び圧電デバイス Download PDF

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Publication number
JP7646029B2
JP7646029B2 JP2023564993A JP2023564993A JP7646029B2 JP 7646029 B2 JP7646029 B2 JP 7646029B2 JP 2023564993 A JP2023564993 A JP 2023564993A JP 2023564993 A JP2023564993 A JP 2023564993A JP 7646029 B2 JP7646029 B2 JP 7646029B2
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Prior art keywords
recess
edge portion
vibration
plan
view
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JP2023564993A
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Japanese (ja)
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JPWO2023100851A1 (https=
JPWO2023100851A5 (https=
Inventor
正彦 後藤
智紀 村山
翔平 内田
広幸 石川
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Kyocera Corp
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Kyocera Corp
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Publication of JPWO2023100851A5 publication Critical patent/JPWO2023100851A5/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2023564993A 2021-11-30 2022-11-29 圧電振動素子及び圧電デバイス Active JP7646029B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021194001 2021-11-30
JP2021194001 2021-11-30
PCT/JP2022/043912 WO2023100851A1 (ja) 2021-11-30 2022-11-29 圧電振動素子及び圧電デバイス

Publications (3)

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JPWO2023100851A1 JPWO2023100851A1 (https=) 2023-06-08
JPWO2023100851A5 JPWO2023100851A5 (https=) 2024-07-24
JP7646029B2 true JP7646029B2 (ja) 2025-03-14

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JP2023564993A Active JP7646029B2 (ja) 2021-11-30 2022-11-29 圧電振動素子及び圧電デバイス

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US (1) US20250023549A1 (https=)
JP (1) JP7646029B2 (https=)
CN (1) CN118251839A (https=)
WO (1) WO2023100851A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025075025A1 (ja) * 2023-10-06 2025-04-10 京セラ株式会社 圧電振動素子及び圧電デバイス
WO2025234414A1 (ja) * 2024-05-10 2025-11-13 京セラ株式会社 圧電振動素子及び圧電デバイス

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374135A (ja) 2001-06-14 2002-12-26 Seiko Epson Corp 圧電振動片の製造方法および圧電振動片、ならびに圧電振動子
JP2002374146A (ja) 2001-06-13 2002-12-26 Seiko Epson Corp 圧電振動片及び圧電デバイス
JP2003060480A (ja) 2001-08-21 2003-02-28 Toyo Commun Equip Co Ltd 超薄板ａｔカット水晶共振素子
JP2003073200A (ja) 2001-08-31 2003-03-12 Daishinku Corp エッチング方法及びその方法によって成形されたエッチング成形品
JP2006140887A (ja) 2004-11-15 2006-06-01 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2018006901A (ja) 2016-06-29 2018-01-11 株式会社大真空 水晶振動板、および水晶振動デバイス
JP2020191579A (ja) 2019-05-23 2020-11-26 京セラ株式会社 振動素子用圧電片、圧電振動素子及び圧電デバイス

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374146A (ja) 2001-06-13 2002-12-26 Seiko Epson Corp 圧電振動片及び圧電デバイス
JP2002374135A (ja) 2001-06-14 2002-12-26 Seiko Epson Corp 圧電振動片の製造方法および圧電振動片、ならびに圧電振動子
JP2003060480A (ja) 2001-08-21 2003-02-28 Toyo Commun Equip Co Ltd 超薄板ａｔカット水晶共振素子
JP2003073200A (ja) 2001-08-31 2003-03-12 Daishinku Corp エッチング方法及びその方法によって成形されたエッチング成形品
JP2006140887A (ja) 2004-11-15 2006-06-01 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2018006901A (ja) 2016-06-29 2018-01-11 株式会社大真空 水晶振動板、および水晶振動デバイス
JP2020191579A (ja) 2019-05-23 2020-11-26 京セラ株式会社 振動素子用圧電片、圧電振動素子及び圧電デバイス

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JPWO2023100851A1 (https=) 2023-06-08
CN118251839A (zh) 2024-06-25
WO2023100851A1 (ja) 2023-06-08
US20250023549A1 (en) 2025-01-16

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