JPWO2023100851A1 - - Google Patents
Info
- Publication number
- JPWO2023100851A1 JPWO2023100851A1 JP2023564993A JP2023564993A JPWO2023100851A1 JP WO2023100851 A1 JPWO2023100851 A1 JP WO2023100851A1 JP 2023564993 A JP2023564993 A JP 2023564993A JP 2023564993 A JP2023564993 A JP 2023564993A JP WO2023100851 A1 JPWO2023100851 A1 JP WO2023100851A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021194001 | 2021-11-30 | ||
| JP2021194001 | 2021-11-30 | ||
| PCT/JP2022/043912 WO2023100851A1 (ja) | 2021-11-30 | 2022-11-29 | 圧電振動素子及び圧電デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100851A1 true JPWO2023100851A1 (https=) | 2023-06-08 |
| JPWO2023100851A5 JPWO2023100851A5 (https=) | 2024-07-24 |
| JP7646029B2 JP7646029B2 (ja) | 2025-03-14 |
Family
ID=86612360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564993A Active JP7646029B2 (ja) | 2021-11-30 | 2022-11-29 | 圧電振動素子及び圧電デバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250023549A1 (https=) |
| JP (1) | JP7646029B2 (https=) |
| CN (1) | CN118251839A (https=) |
| WO (1) | WO2023100851A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025075025A1 (ja) * | 2023-10-06 | 2025-04-10 | 京セラ株式会社 | 圧電振動素子及び圧電デバイス |
| WO2025234414A1 (ja) * | 2024-05-10 | 2025-11-13 | 京セラ株式会社 | 圧電振動素子及び圧電デバイス |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374135A (ja) * | 2001-06-14 | 2002-12-26 | Seiko Epson Corp | 圧電振動片の製造方法および圧電振動片、ならびに圧電振動子 |
| JP2002374146A (ja) * | 2001-06-13 | 2002-12-26 | Seiko Epson Corp | 圧電振動片及び圧電デバイス |
| JP2003060480A (ja) * | 2001-08-21 | 2003-02-28 | Toyo Commun Equip Co Ltd | 超薄板atカット水晶共振素子 |
| JP2003073200A (ja) * | 2001-08-31 | 2003-03-12 | Daishinku Corp | エッチング方法及びその方法によって成形されたエッチング成形品 |
| JP2006140887A (ja) * | 2004-11-15 | 2006-06-01 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
| JP2018006901A (ja) * | 2016-06-29 | 2018-01-11 | 株式会社大真空 | 水晶振動板、および水晶振動デバイス |
| JP2020191579A (ja) * | 2019-05-23 | 2020-11-26 | 京セラ株式会社 | 振動素子用圧電片、圧電振動素子及び圧電デバイス |
-
2022
- 2022-11-29 JP JP2023564993A patent/JP7646029B2/ja active Active
- 2022-11-29 CN CN202280075090.3A patent/CN118251839A/zh active Pending
- 2022-11-29 US US18/709,618 patent/US20250023549A1/en active Pending
- 2022-11-29 WO PCT/JP2022/043912 patent/WO2023100851A1/ja not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374146A (ja) * | 2001-06-13 | 2002-12-26 | Seiko Epson Corp | 圧電振動片及び圧電デバイス |
| JP2002374135A (ja) * | 2001-06-14 | 2002-12-26 | Seiko Epson Corp | 圧電振動片の製造方法および圧電振動片、ならびに圧電振動子 |
| JP2003060480A (ja) * | 2001-08-21 | 2003-02-28 | Toyo Commun Equip Co Ltd | 超薄板atカット水晶共振素子 |
| JP2003073200A (ja) * | 2001-08-31 | 2003-03-12 | Daishinku Corp | エッチング方法及びその方法によって成形されたエッチング成形品 |
| JP2006140887A (ja) * | 2004-11-15 | 2006-06-01 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
| JP2018006901A (ja) * | 2016-06-29 | 2018-01-11 | 株式会社大真空 | 水晶振動板、および水晶振動デバイス |
| JP2020191579A (ja) * | 2019-05-23 | 2020-11-26 | 京セラ株式会社 | 振動素子用圧電片、圧電振動素子及び圧電デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7646029B2 (ja) | 2025-03-14 |
| CN118251839A (zh) | 2024-06-25 |
| WO2023100851A1 (ja) | 2023-06-08 |
| US20250023549A1 (en) | 2025-01-16 |
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