JPWO2023100851A1 - - Google Patents

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Publication number
JPWO2023100851A1
JPWO2023100851A1 JP2023564993A JP2023564993A JPWO2023100851A1 JP WO2023100851 A1 JPWO2023100851 A1 JP WO2023100851A1 JP 2023564993 A JP2023564993 A JP 2023564993A JP 2023564993 A JP2023564993 A JP 2023564993A JP WO2023100851 A1 JPWO2023100851 A1 JP WO2023100851A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023564993A
Other languages
Japanese (ja)
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JP7646029B2 (ja
JPWO2023100851A5 (https=
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Publication of JPWO2023100851A1 publication Critical patent/JPWO2023100851A1/ja
Publication of JPWO2023100851A5 publication Critical patent/JPWO2023100851A5/ja
Application granted granted Critical
Publication of JP7646029B2 publication Critical patent/JP7646029B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2023564993A 2021-11-30 2022-11-29 圧電振動素子及び圧電デバイス Active JP7646029B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021194001 2021-11-30
JP2021194001 2021-11-30
PCT/JP2022/043912 WO2023100851A1 (ja) 2021-11-30 2022-11-29 圧電振動素子及び圧電デバイス

Publications (3)

Publication Number Publication Date
JPWO2023100851A1 true JPWO2023100851A1 (https=) 2023-06-08
JPWO2023100851A5 JPWO2023100851A5 (https=) 2024-07-24
JP7646029B2 JP7646029B2 (ja) 2025-03-14

Family

ID=86612360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564993A Active JP7646029B2 (ja) 2021-11-30 2022-11-29 圧電振動素子及び圧電デバイス

Country Status (4)

Country Link
US (1) US20250023549A1 (https=)
JP (1) JP7646029B2 (https=)
CN (1) CN118251839A (https=)
WO (1) WO2023100851A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025075025A1 (ja) * 2023-10-06 2025-04-10 京セラ株式会社 圧電振動素子及び圧電デバイス
WO2025234414A1 (ja) * 2024-05-10 2025-11-13 京セラ株式会社 圧電振動素子及び圧電デバイス

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374135A (ja) * 2001-06-14 2002-12-26 Seiko Epson Corp 圧電振動片の製造方法および圧電振動片、ならびに圧電振動子
JP2002374146A (ja) * 2001-06-13 2002-12-26 Seiko Epson Corp 圧電振動片及び圧電デバイス
JP2003060480A (ja) * 2001-08-21 2003-02-28 Toyo Commun Equip Co Ltd 超薄板atカット水晶共振素子
JP2003073200A (ja) * 2001-08-31 2003-03-12 Daishinku Corp エッチング方法及びその方法によって成形されたエッチング成形品
JP2006140887A (ja) * 2004-11-15 2006-06-01 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2018006901A (ja) * 2016-06-29 2018-01-11 株式会社大真空 水晶振動板、および水晶振動デバイス
JP2020191579A (ja) * 2019-05-23 2020-11-26 京セラ株式会社 振動素子用圧電片、圧電振動素子及び圧電デバイス

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374146A (ja) * 2001-06-13 2002-12-26 Seiko Epson Corp 圧電振動片及び圧電デバイス
JP2002374135A (ja) * 2001-06-14 2002-12-26 Seiko Epson Corp 圧電振動片の製造方法および圧電振動片、ならびに圧電振動子
JP2003060480A (ja) * 2001-08-21 2003-02-28 Toyo Commun Equip Co Ltd 超薄板atカット水晶共振素子
JP2003073200A (ja) * 2001-08-31 2003-03-12 Daishinku Corp エッチング方法及びその方法によって成形されたエッチング成形品
JP2006140887A (ja) * 2004-11-15 2006-06-01 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2018006901A (ja) * 2016-06-29 2018-01-11 株式会社大真空 水晶振動板、および水晶振動デバイス
JP2020191579A (ja) * 2019-05-23 2020-11-26 京セラ株式会社 振動素子用圧電片、圧電振動素子及び圧電デバイス

Also Published As

Publication number Publication date
JP7646029B2 (ja) 2025-03-14
CN118251839A (zh) 2024-06-25
WO2023100851A1 (ja) 2023-06-08
US20250023549A1 (en) 2025-01-16

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