JP7634555B2 - 配線板及び配線板の製造方法 - Google Patents

配線板及び配線板の製造方法 Download PDF

Info

Publication number
JP7634555B2
JP7634555B2 JP2022562224A JP2022562224A JP7634555B2 JP 7634555 B2 JP7634555 B2 JP 7634555B2 JP 2022562224 A JP2022562224 A JP 2022562224A JP 2022562224 A JP2022562224 A JP 2022562224A JP 7634555 B2 JP7634555 B2 JP 7634555B2
Authority
JP
Japan
Prior art keywords
wiring
substrate
wiring board
reinforcing plate
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022562224A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022102779A1 (https=
Inventor
和敏 小清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of JPWO2022102779A1 publication Critical patent/JPWO2022102779A1/ja
Application granted granted Critical
Publication of JP7634555B2 publication Critical patent/JP7634555B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022562224A 2020-11-16 2021-11-15 配線板及び配線板の製造方法 Active JP7634555B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020190295 2020-11-16
JP2020190295 2020-11-16
PCT/JP2021/041970 WO2022102779A1 (ja) 2020-11-16 2021-11-15 配線板及び配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022102779A1 JPWO2022102779A1 (https=) 2022-05-19
JP7634555B2 true JP7634555B2 (ja) 2025-02-21

Family

ID=81601369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022562224A Active JP7634555B2 (ja) 2020-11-16 2021-11-15 配線板及び配線板の製造方法

Country Status (6)

Country Link
US (1) US12588139B2 (https=)
EP (1) EP4247124A4 (https=)
JP (1) JP7634555B2 (https=)
CN (1) CN116508397A (https=)
TW (1) TWI802081B (https=)
WO (1) WO2022102779A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311568A (ja) 2006-05-18 2007-11-29 Goo Chemical Co Ltd 端子部付きプリント配線板及びその製造方法
JP2012028745A (ja) 2010-06-23 2012-02-09 Sumitomo Electric Ind Ltd 配線板
JP2018085377A (ja) 2016-11-21 2018-05-31 オムロン株式会社 電子装置およびその製造方法
JP2019165048A (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003284573A1 (en) * 2002-11-27 2004-06-18 Sumitomo Bakelite Company Limited Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board
JP2010164692A (ja) 2009-01-14 2010-07-29 Fujikura Ltd 光ファイバケーブル
JP5342341B2 (ja) * 2009-06-23 2013-11-13 株式会社フジクラ プリント配線基板
WO2013008415A1 (ja) 2011-07-08 2013-01-17 パナソニック株式会社 配線基板および立体配線基板の製造方法
JP2013187380A (ja) 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法
JP5697724B2 (ja) * 2013-09-05 2015-04-08 株式会社フジクラ プリント配線板及び該配線板を接続するコネクタ
CN104582233B (zh) * 2013-10-10 2018-06-05 富士康(昆山)电脑接插件有限公司 扁平线缆组件及其组装方法
JP6574576B2 (ja) 2015-02-02 2019-09-11 株式会社フジクラ 伸縮性配線基板
JP6488189B2 (ja) * 2015-05-18 2019-03-20 日本メクトロン株式会社 伸縮性配線基板
JP5968514B1 (ja) 2015-11-05 2016-08-10 株式会社フジクラ プリント配線板
JP6793510B2 (ja) 2016-09-28 2020-12-02 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
JP6959066B2 (ja) * 2017-08-14 2021-11-02 住友電気工業株式会社 フレキシブルプリント配線板
WO2019045108A1 (ja) 2017-09-04 2019-03-07 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び、それを用いたパッチデバイス
TWI703959B (zh) * 2018-03-19 2020-09-11 日商藤倉股份有限公司 拉伸性配線板以及拉伸性配線板之製造方法
WO2019208091A1 (ja) * 2018-04-27 2019-10-31 住友電気工業株式会社 コネクタおよび基板
JP7103995B2 (ja) 2019-05-22 2022-07-20 Ckd株式会社 真空開閉弁

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311568A (ja) 2006-05-18 2007-11-29 Goo Chemical Co Ltd 端子部付きプリント配線板及びその製造方法
JP2012028745A (ja) 2010-06-23 2012-02-09 Sumitomo Electric Ind Ltd 配線板
JP2018085377A (ja) 2016-11-21 2018-05-31 オムロン株式会社 電子装置およびその製造方法
JP2019165048A (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法

Also Published As

Publication number Publication date
TWI802081B (zh) 2023-05-11
EP4247124A1 (en) 2023-09-20
WO2022102779A1 (ja) 2022-05-19
JPWO2022102779A1 (https=) 2022-05-19
EP4247124A4 (en) 2025-02-19
US12588139B2 (en) 2026-03-24
TW202231141A (zh) 2022-08-01
CN116508397A (zh) 2023-07-28
US20230397328A1 (en) 2023-12-07

Similar Documents

Publication Publication Date Title
CN111816082B (zh) 一种显示组件及其组装方法、显示装置
US9769920B2 (en) Flexible printed circuits with bend retention structures
US8269112B2 (en) Flexible circuit structure
EP3120381B1 (en) Flexible electronics apparatus and associated methods
CN107852823B (zh) 配线电路基板的制造方法
CN107949887A (zh) 弹性配线部件
TW200417929A (en) Narrow frame type touch panel
CN101952115A (zh) 网状片以及电子设备的框体部件
CN107852822A (zh) 配线电路基板
TWI733506B (zh) 觸控裝置及其製造方法
CN106910422B (zh) 一种显示面板和显示设备
CN103853366A (zh) 应用在触控面板的粘合层及其制备方法
CN114220349A (zh) 用于印刷电路板的保护带和包括保护带的显示装置
CN212322555U (zh) 一种显示组件及显示装置
JP7634555B2 (ja) 配線板及び配線板の製造方法
TWI270341B (en) Electronic assembly unit with conductive film, conductive film and method of making the same thereof
JP7551303B2 (ja) 電子機器
CN103324321A (zh) 立体化触控模块及其制造方法
TWM339051U (en) Resistance-type touch panel
JP7249187B2 (ja) フィルムヒータ
KR20120006916A (ko) 인쇄회로 스티커 및 단층 금속 터치패드 제조 방법
JP7144163B2 (ja) 伸縮性配線板
JP2019029515A (ja) 配線デバイスおよびひずみセンサー
TWM620765U (zh) 具有天線線路的封裝結構
JP2005251692A (ja) タッチパネル、フレキシブルケーブル、フレキシブルケーブルの接続方法、及びケーブル付きタッチパネル

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230328

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240403

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240528

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20240820

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241115

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20241125

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250121

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250210

R150 Certificate of patent or registration of utility model

Ref document number: 7634555

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150