JP7624331B2 - 測定ツール、基板処理装置及び基板製造方法 - Google Patents

測定ツール、基板処理装置及び基板製造方法 Download PDF

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JP7624331B2
JP7624331B2 JP2021043559A JP2021043559A JP7624331B2 JP 7624331 B2 JP7624331 B2 JP 7624331B2 JP 2021043559 A JP2021043559 A JP 2021043559A JP 2021043559 A JP2021043559 A JP 2021043559A JP 7624331 B2 JP7624331 B2 JP 7624331B2
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substrate
contact
load
holding
holding member
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Japanese (ja)
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JP2022143176A5 (enrdf_load_stackoverflow
JP2022143176A (ja
Inventor
正明 古矢
浩秋 小林
秀樹 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2021043559A priority Critical patent/JP7624331B2/ja
Priority to KR1020220031280A priority patent/KR102719872B1/ko
Priority to CN202210252820.4A priority patent/CN115112280B/zh
Priority to TW111109728A priority patent/TWI818470B/zh
Publication of JP2022143176A publication Critical patent/JP2022143176A/ja
Publication of JP2022143176A5 publication Critical patent/JP2022143176A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0028—Force sensors associated with force applying means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP2021043559A 2021-03-17 2021-03-17 測定ツール、基板処理装置及び基板製造方法 Active JP7624331B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021043559A JP7624331B2 (ja) 2021-03-17 2021-03-17 測定ツール、基板処理装置及び基板製造方法
KR1020220031280A KR102719872B1 (ko) 2021-03-17 2022-03-14 측정 툴, 기판 처리 장치 및 기판 제조 방법
CN202210252820.4A CN115112280B (zh) 2021-03-17 2022-03-15 测定工具、基板处理装置以及基板制造方法
TW111109728A TWI818470B (zh) 2021-03-17 2022-03-17 測定工具、基板處理裝置以及基板製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021043559A JP7624331B2 (ja) 2021-03-17 2021-03-17 測定ツール、基板処理装置及び基板製造方法

Publications (3)

Publication Number Publication Date
JP2022143176A JP2022143176A (ja) 2022-10-03
JP2022143176A5 JP2022143176A5 (enrdf_load_stackoverflow) 2024-03-21
JP7624331B2 true JP7624331B2 (ja) 2025-01-30

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JP (1) JP7624331B2 (enrdf_load_stackoverflow)
KR (1) KR102719872B1 (enrdf_load_stackoverflow)
CN (1) CN115112280B (enrdf_load_stackoverflow)
TW (1) TWI818470B (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023123066A1 (de) * 2023-08-28 2025-03-06 SmarAct Holding GmbH Kraftbestimmungsvorrichtung, Kraftbestimmungsverfahren, System und Verfahren zur Ausrichtung eines ersten Objekts zu einem zweiten Objekt

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044159A (ja) 1999-07-27 2001-02-16 Shibaura Mechatronics Corp スピン処理装置
JP2012043985A (ja) 2010-08-19 2012-03-01 Shin Etsu Polymer Co Ltd 半導体ウェーハの支持構造検討装置
JP2018098383A (ja) 2016-12-14 2018-06-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2020117201A1 (en) 2018-12-03 2020-06-11 Lam Research Corporation Pin-lifter test substrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629751B2 (ja) * 1995-04-14 2005-03-16 ソニー株式会社 自動バフ研磨装置
JPH10199845A (ja) * 1997-01-14 1998-07-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2004079587A (ja) * 2002-08-09 2004-03-11 Reitetsukusu:Kk ウエハ回転装置とこれを有する端部傷検査装置
TWI601199B (zh) * 2002-11-15 2017-10-01 荏原製作所股份有限公司 基板處理裝置及基板處理方法
JP2007220952A (ja) * 2006-02-17 2007-08-30 Dainippon Screen Mfg Co Ltd 基板位置決め方法、基板位置決め装置および基板処理装置
JP2008216014A (ja) * 2007-03-02 2008-09-18 Honda Motor Co Ltd 回転角度算出装置及び変位量算出装置
JP4367669B2 (ja) * 2008-04-01 2009-11-18 株式会社アドウェルズ 保持装置
JP5524139B2 (ja) * 2010-09-28 2014-06-18 東京エレクトロン株式会社 基板位置検出装置、これを備える成膜装置、および基板位置検出方法
JP6114708B2 (ja) * 2013-05-27 2017-04-12 東京エレクトロン株式会社 基板脱離検出装置及び基板脱離検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
JP6143572B2 (ja) * 2013-06-18 2017-06-07 株式会社Ｓｃｒｅｅｎホールディングス 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法
TWI661479B (zh) * 2015-02-12 2019-06-01 日商思可林集團股份有限公司 基板處理裝置、基板處理系統以及基板處理方法
JP6523991B2 (ja) * 2015-04-14 2019-06-05 株式会社荏原製作所 基板処理装置および基板処理方法
KR101703904B1 (ko) * 2015-08-28 2017-02-22 (주)오로스 테크놀로지 웨이퍼 그립핑 장치 및 이를 포함하는 양면 웨이퍼 스트레스 검사장치
KR102596608B1 (ko) * 2016-07-26 2023-11-01 주식회사 케이씨텍 기판 스피닝 장치 및 그 제어방법
DE102016116180B4 (de) * 2016-08-01 2019-03-28 Nuton GmbH Verfahren und Kraftmessplatte zur mehrachsigen Erfassung einwirkender Kräfte und Momente
JP6764288B2 (ja) * 2016-09-12 2020-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6789048B2 (ja) * 2016-09-23 2020-11-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2018063190A (ja) * 2016-10-13 2018-04-19 澁谷工業株式会社 重量計測装置および重量計測方法
JP7000054B2 (ja) * 2017-07-12 2022-01-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044159A (ja) 1999-07-27 2001-02-16 Shibaura Mechatronics Corp スピン処理装置
JP2012043985A (ja) 2010-08-19 2012-03-01 Shin Etsu Polymer Co Ltd 半導体ウェーハの支持構造検討装置
JP2018098383A (ja) 2016-12-14 2018-06-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2020117201A1 (en) 2018-12-03 2020-06-11 Lam Research Corporation Pin-lifter test substrate

Also Published As

Publication number Publication date
CN115112280A (zh) 2022-09-27
CN115112280B (zh) 2025-01-03
TW202238772A (zh) 2022-10-01
TWI818470B (zh) 2023-10-11
KR102719872B1 (ko) 2024-10-22
KR20220130029A (ko) 2022-09-26
JP2022143176A (ja) 2022-10-03

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