JP7624059B2 - 電子部品装着方法、および電子部品装着装置 - Google Patents

電子部品装着方法、および電子部品装着装置 Download PDF

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Publication number
JP7624059B2
JP7624059B2 JP2023506622A JP2023506622A JP7624059B2 JP 7624059 B2 JP7624059 B2 JP 7624059B2 JP 2023506622 A JP2023506622 A JP 2023506622A JP 2023506622 A JP2023506622 A JP 2023506622A JP 7624059 B2 JP7624059 B2 JP 7624059B2
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electronic component
conductive paste
conductive fluid
resin
curing
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Japanese (ja)
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JPWO2022195800A1 (https=
Inventor
亮二郎 富永
謙磁 塚田
良崇 橋本
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023506622A 2021-03-18 2021-03-18 電子部品装着方法、および電子部品装着装置 Active JP7624059B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/011050 WO2022195800A1 (ja) 2021-03-18 2021-03-18 電子部品装着方法、および電子部品装着装置

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JPWO2022195800A1 JPWO2022195800A1 (https=) 2022-09-22
JP7624059B2 true JP7624059B2 (ja) 2025-01-29

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JP2023506622A Active JP7624059B2 (ja) 2021-03-18 2021-03-18 電子部品装着方法、および電子部品装着装置

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JP (1) JP7624059B2 (https=)
WO (1) WO2022195800A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4679948A4 (en) * 2023-03-09 2026-04-15 Fuji Corp METHOD FOR FORMING AN ELECTRICAL CIRCUIT AND DEVICE FOR FORMING AN ELECTRICAL CIRCUIT
WO2024241533A1 (ja) * 2023-05-24 2024-11-28 株式会社Fuji 電気回路形成方法、および電気回路形成装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174165A (ja) 1998-12-08 2000-06-23 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005032742A (ja) 2003-07-07 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品実装構造および電子部品実装方法
JP2006165506A (ja) 2004-11-11 2006-06-22 Seiko Epson Corp 実装基板及び電子機器
JP2007115904A (ja) 2005-10-20 2007-05-10 Renesas Technology Corp 半導体装置の製造方法
JP2017216312A (ja) 2016-05-31 2017-12-07 パナソニックＩｐマネジメント株式会社 電子部品実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174165A (ja) 1998-12-08 2000-06-23 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005032742A (ja) 2003-07-07 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品実装構造および電子部品実装方法
JP2006165506A (ja) 2004-11-11 2006-06-22 Seiko Epson Corp 実装基板及び電子機器
JP2007115904A (ja) 2005-10-20 2007-05-10 Renesas Technology Corp 半導体装置の製造方法
JP2017216312A (ja) 2016-05-31 2017-12-07 パナソニックＩｐマネジメント株式会社 電子部品実装方法

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WO2022195800A1 (ja) 2022-09-22
JPWO2022195800A1 (https=) 2022-09-22

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