JPWO2022195800A1 - - Google Patents
Info
- Publication number
- JPWO2022195800A1 JPWO2022195800A1 JP2023506622A JP2023506622A JPWO2022195800A1 JP WO2022195800 A1 JPWO2022195800 A1 JP WO2022195800A1 JP 2023506622 A JP2023506622 A JP 2023506622A JP 2023506622 A JP2023506622 A JP 2023506622A JP WO2022195800 A1 JPWO2022195800 A1 JP WO2022195800A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/011050 WO2022195800A1 (ja) | 2021-03-18 | 2021-03-18 | 電子部品装着方法、および電子部品装着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022195800A1 true JPWO2022195800A1 (https=) | 2022-09-22 |
| JP7624059B2 JP7624059B2 (ja) | 2025-01-29 |
Family
ID=83321991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506622A Active JP7624059B2 (ja) | 2021-03-18 | 2021-03-18 | 電子部品装着方法、および電子部品装着装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7624059B2 (https=) |
| WO (1) | WO2022195800A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4679948A4 (en) * | 2023-03-09 | 2026-04-15 | Fuji Corp | METHOD FOR FORMING AN ELECTRICAL CIRCUIT AND DEVICE FOR FORMING AN ELECTRICAL CIRCUIT |
| WO2024241533A1 (ja) * | 2023-05-24 | 2024-11-28 | 株式会社Fuji | 電気回路形成方法、および電気回路形成装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174165A (ja) | 1998-12-08 | 2000-06-23 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2005032742A (ja) * | 2003-07-07 | 2005-02-03 | Matsushita Electric Ind Co Ltd | 電子部品実装構造および電子部品実装方法 |
| JP4386008B2 (ja) | 2004-11-11 | 2009-12-16 | セイコーエプソン株式会社 | 実装基板及び電子機器 |
| JP2007115904A (ja) * | 2005-10-20 | 2007-05-10 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2017216312A (ja) * | 2016-05-31 | 2017-12-07 | パナソニックＩｐマネジメント株式会社 | 電子部品実装方法 |
-
2021
- 2021-03-18 JP JP2023506622A patent/JP7624059B2/ja active Active
- 2021-03-18 WO PCT/JP2021/011050 patent/WO2022195800A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP7624059B2 (ja) | 2025-01-29 |
| WO2022195800A1 (ja) | 2022-09-22 |
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