JPWO2022113186A1 - - Google Patents

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Publication number
JPWO2022113186A1
JPWO2022113186A1 JP2022564867A JP2022564867A JPWO2022113186A1 JP WO2022113186 A1 JPWO2022113186 A1 JP WO2022113186A1 JP 2022564867 A JP2022564867 A JP 2022564867A JP 2022564867 A JP2022564867 A JP 2022564867A JP WO2022113186 A1 JPWO2022113186 A1 JP WO2022113186A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022564867A
Other languages
Japanese (ja)
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JP7670731B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2022113186A1 publication Critical patent/JPWO2022113186A1/ja
Application granted granted Critical
Publication of JP7670731B2 publication Critical patent/JP7670731B2/ja
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Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022564867A 2020-11-25 2020-11-25 電気回路形成方法、および電気回路形成装置 Active JP7670731B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/043749 WO2022113186A1 (ja) 2020-11-25 2020-11-25 電気回路形成方法

Publications (2)

Publication Number Publication Date
JPWO2022113186A1 true JPWO2022113186A1 (https=) 2022-06-02
JP7670731B2 JP7670731B2 (ja) 2025-04-30

Family

ID=81754097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022564867A Active JP7670731B2 (ja) 2020-11-25 2020-11-25 電気回路形成方法、および電気回路形成装置

Country Status (2)

Country Link
JP (1) JP7670731B2 (https=)
WO (1) WO2022113186A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023101235A (ja) * 2022-01-07 2023-07-20 キヤノン株式会社 電子モジュール、装置及び電子モジュールの製造方法
JPWO2024062605A1 (https=) * 2022-09-22 2024-03-28
EP4679948A4 (en) 2023-03-09 2026-04-15 Fuji Corp METHOD FOR FORMING AN ELECTRICAL CIRCUIT AND DEVICE FOR FORMING AN ELECTRICAL CIRCUIT
WO2024241533A1 (ja) * 2023-05-24 2024-11-28 株式会社Fuji 電気回路形成方法、および電気回路形成装置
WO2026033712A1 (ja) * 2024-08-08 2026-02-12 株式会社Fuji 回路形成方法、および回路形成装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179293A (ja) * 1984-09-26 1986-04-22 松下電器産業株式会社 電子部品の取付け方法
JPS63124772U (https=) * 1987-02-03 1988-08-15
JPH0236476U (https=) * 1988-08-31 1990-03-09
JP2001244299A (ja) * 2000-02-29 2001-09-07 Sony Corp 配線基板及びその製造方法
JP2002334906A (ja) * 2001-05-09 2002-11-22 Matsushita Electric Ind Co Ltd フリップチップの実装方法
JP2007287953A (ja) * 2006-04-18 2007-11-01 Toray Ind Inc 回路基板およびその製造方法
JP2009260256A (ja) * 2008-01-29 2009-11-05 Kyocera Corp 熱電モジュールおよびその製造方法
JP2011151259A (ja) * 2010-01-22 2011-08-04 Sony Chemical & Information Device Corp 実装体の製造方法および実装装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179293A (ja) * 1984-09-26 1986-04-22 松下電器産業株式会社 電子部品の取付け方法
JPS63124772U (https=) * 1987-02-03 1988-08-15
JPH0236476U (https=) * 1988-08-31 1990-03-09
JP2001244299A (ja) * 2000-02-29 2001-09-07 Sony Corp 配線基板及びその製造方法
JP2002334906A (ja) * 2001-05-09 2002-11-22 Matsushita Electric Ind Co Ltd フリップチップの実装方法
JP2007287953A (ja) * 2006-04-18 2007-11-01 Toray Ind Inc 回路基板およびその製造方法
JP2009260256A (ja) * 2008-01-29 2009-11-05 Kyocera Corp 熱電モジュールおよびその製造方法
JP2011151259A (ja) * 2010-01-22 2011-08-04 Sony Chemical & Information Device Corp 実装体の製造方法および実装装置

Also Published As

Publication number Publication date
WO2022113186A1 (ja) 2022-06-02
JP7670731B2 (ja) 2025-04-30

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