JP7614855B2 - 光電変換装置、光検出システム - Google Patents

光電変換装置、光検出システム Download PDF

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Publication number
JP7614855B2
JP7614855B2 JP2021008442A JP2021008442A JP7614855B2 JP 7614855 B2 JP7614855 B2 JP 7614855B2 JP 2021008442 A JP2021008442 A JP 2021008442A JP 2021008442 A JP2021008442 A JP 2021008442A JP 7614855 B2 JP7614855 B2 JP 7614855B2
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photoelectric conversion
wiring
semiconductor region
conversion device
conductivity type
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Japanese (ja)
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JP2022112594A5 (enExample
JP2022112594A (ja
Inventor
旬史 岩田
良之 林
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021008442A priority Critical patent/JP7614855B2/ja
Priority to US17/571,993 priority patent/US12148771B2/en
Publication of JP2022112594A publication Critical patent/JP2022112594A/ja
Publication of JP2022112594A5 publication Critical patent/JP2022112594A5/ja
Priority to US18/915,032 priority patent/US20250040268A1/en
Priority to JP2024223947A priority patent/JP2025038171A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R1/00—Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
    • B60R1/20—Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles

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  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Traffic Control Systems (AREA)
JP2021008442A 2021-01-22 2021-01-22 光電変換装置、光検出システム Active JP7614855B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021008442A JP7614855B2 (ja) 2021-01-22 2021-01-22 光電変換装置、光検出システム
US17/571,993 US12148771B2 (en) 2021-01-22 2022-01-10 Photoelectric conversion apparatus and optical detection system
US18/915,032 US20250040268A1 (en) 2021-01-22 2024-10-14 Photoelectric conversion apparatus and optical detection system
JP2024223947A JP2025038171A (ja) 2021-01-22 2024-12-19 光電変換装置、光検出システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021008442A JP7614855B2 (ja) 2021-01-22 2021-01-22 光電変換装置、光検出システム

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JP2024223947A Division JP2025038171A (ja) 2021-01-22 2024-12-19 光電変換装置、光検出システム

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JP2022112594A JP2022112594A (ja) 2022-08-03
JP2022112594A5 JP2022112594A5 (enExample) 2024-01-11
JP7614855B2 true JP7614855B2 (ja) 2025-01-16

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JP2021008442A Active JP7614855B2 (ja) 2021-01-22 2021-01-22 光電変換装置、光検出システム
JP2024223947A Pending JP2025038171A (ja) 2021-01-22 2024-12-19 光電変換装置、光検出システム

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JP (2) JP7614855B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7614855B2 (ja) * 2021-01-22 2025-01-16 キヤノン株式会社 光電変換装置、光検出システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018088488A (ja) 2016-11-29 2018-06-07 ソニーセミコンダクタソリューションズ株式会社 センサチップおよび電子機器
JP2020021889A (ja) 2018-07-18 2020-02-06 浜松ホトニクス株式会社 半導体光検出装置
JP2020057651A (ja) 2018-09-28 2020-04-09 キヤノン株式会社 光検出装置、光検出システム
WO2020179290A1 (ja) 2019-03-06 2020-09-10 ソニーセミコンダクタソリューションズ株式会社 センサおよび測距装置

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GB0216075D0 (en) * 2002-07-11 2002-08-21 Qinetiq Ltd Photodetector circuits
US10153310B2 (en) * 2016-07-18 2018-12-11 Omnivision Technologies, Inc. Stacked-chip backside-illuminated SPAD sensor with high fill-factor
JP7058479B2 (ja) * 2016-10-18 2022-04-22 ソニーセミコンダクタソリューションズ株式会社 光検出器
JP6932580B2 (ja) * 2017-08-04 2021-09-08 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子
US10373999B2 (en) * 2017-09-29 2019-08-06 Taiwan Semiconductor Manufacturing Company Ltd. Image sensor and associated fabricating method
JP7005331B2 (ja) * 2017-12-21 2022-01-21 キヤノン株式会社 撮像装置及び撮像システム
JP2020149987A (ja) * 2019-03-11 2020-09-17 ソニーセミコンダクタソリューションズ株式会社 光検出器
CN113383431B (zh) * 2019-03-19 2025-01-17 索尼半导体解决方案公司 传感器芯片、电子设备和测距装置
CN117747694A (zh) * 2019-03-28 2024-03-22 松下知识产权经营株式会社 光检测器
JP2021052130A (ja) * 2019-09-26 2021-04-01 ソニーセミコンダクタソリューションズ株式会社 半導体装置及びその製造方法、並びに電子機器
JP7570037B2 (ja) * 2020-01-21 2024-10-21 パナソニックＩｐマネジメント株式会社 フォトセンサ及び距離測定システム
JP7745207B2 (ja) * 2020-12-10 2025-09-29 パナソニックＩｐマネジメント株式会社 フォトディテクタ、フォトディテクタアレイおよび距離測定システム
JP2022096830A (ja) * 2020-12-18 2022-06-30 ソニーセミコンダクタソリューションズ株式会社 光検出器および電子機器
JP7614855B2 (ja) * 2021-01-22 2025-01-16 キヤノン株式会社 光電変換装置、光検出システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018088488A (ja) 2016-11-29 2018-06-07 ソニーセミコンダクタソリューションズ株式会社 センサチップおよび電子機器
JP2020021889A (ja) 2018-07-18 2020-02-06 浜松ホトニクス株式会社 半導体光検出装置
JP2020057651A (ja) 2018-09-28 2020-04-09 キヤノン株式会社 光検出装置、光検出システム
WO2020179290A1 (ja) 2019-03-06 2020-09-10 ソニーセミコンダクタソリューションズ株式会社 センサおよび測距装置

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Publication number Publication date
US20220238573A1 (en) 2022-07-28
US12148771B2 (en) 2024-11-19
US20250040268A1 (en) 2025-01-30
JP2025038171A (ja) 2025-03-18
JP2022112594A (ja) 2022-08-03

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