JP7609309B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP7609309B2
JP7609309B2 JP2023580284A JP2023580284A JP7609309B2 JP 7609309 B2 JP7609309 B2 JP 7609309B2 JP 2023580284 A JP2023580284 A JP 2023580284A JP 2023580284 A JP2023580284 A JP 2023580284A JP 7609309 B2 JP7609309 B2 JP 7609309B2
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JP
Japan
Prior art keywords
main surface
operation panel
electronic device
sensor
piezoelectric film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023580284A
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English (en)
Japanese (ja)
Other versions
JPWO2023153426A5 (https=
JPWO2023153426A1 (https=
Inventor
宏明 北田
英和 加納
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023153426A1 publication Critical patent/JPWO2023153426A1/ja
Publication of JPWO2023153426A5 publication Critical patent/JPWO2023153426A5/ja
Application granted granted Critical
Publication of JP7609309B2 publication Critical patent/JP7609309B2/ja
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Push-Button Switches (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2023580284A 2022-02-10 2023-02-08 電子機器 Active JP7609309B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022019249 2022-02-10
JP2022019249 2022-02-10
PCT/JP2023/004156 WO2023153426A1 (ja) 2022-02-10 2023-02-08 電子機器

Publications (3)

Publication Number Publication Date
JPWO2023153426A1 JPWO2023153426A1 (https=) 2023-08-17
JPWO2023153426A5 JPWO2023153426A5 (https=) 2024-09-30
JP7609309B2 true JP7609309B2 (ja) 2025-01-07

Family

ID=87564354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023580284A Active JP7609309B2 (ja) 2022-02-10 2023-02-08 電子機器

Country Status (4)

Country Link
US (1) US20240381543A1 (https=)
JP (1) JP7609309B2 (https=)
CN (1) CN118805069A (https=)
WO (1) WO2023153426A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129829A1 (ja) 2014-02-26 2015-09-03 ダイキン工業株式会社 バイモルフ型圧電フィルム
JP2015190863A (ja) 2014-03-28 2015-11-02 日本写真印刷株式会社 圧力検出装置
JP2018085097A (ja) 2016-11-24 2018-05-31 株式会社 ハイディープＨｉＤｅｅｐ Ｉｎｃ． タッチ入力装置
WO2018221288A1 (ja) 2017-06-01 2018-12-06 株式会社村田製作所 センサ、タッチパネル、及び電子機器
US20190107897A1 (en) 2017-10-05 2019-04-11 Advanced Semiconductor Engineering, Inc. Semiconductor package device
JP2020027596A (ja) 2018-08-10 2020-02-20 業成科技(成都)有限公司 タッチディスプレイモジュール及びこのタッチディスプレイモジュールを応用した電子装置
WO2020129346A1 (ja) 2018-12-20 2020-06-25 株式会社村田製作所 押圧センサおよび押圧検出装置
JP2021197167A (ja) 2020-06-09 2021-12-27 株式会社村田製作所 電子機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129829A1 (ja) 2014-02-26 2015-09-03 ダイキン工業株式会社 バイモルフ型圧電フィルム
JP2015190863A (ja) 2014-03-28 2015-11-02 日本写真印刷株式会社 圧力検出装置
JP2018085097A (ja) 2016-11-24 2018-05-31 株式会社 ハイディープＨｉＤｅｅｐ Ｉｎｃ． タッチ入力装置
WO2018221288A1 (ja) 2017-06-01 2018-12-06 株式会社村田製作所 センサ、タッチパネル、及び電子機器
US20190107897A1 (en) 2017-10-05 2019-04-11 Advanced Semiconductor Engineering, Inc. Semiconductor package device
JP2020027596A (ja) 2018-08-10 2020-02-20 業成科技(成都)有限公司 タッチディスプレイモジュール及びこのタッチディスプレイモジュールを応用した電子装置
WO2020129346A1 (ja) 2018-12-20 2020-06-25 株式会社村田製作所 押圧センサおよび押圧検出装置
JP2021197167A (ja) 2020-06-09 2021-12-27 株式会社村田製作所 電子機器

Also Published As

Publication number Publication date
US20240381543A1 (en) 2024-11-14
JPWO2023153426A1 (https=) 2023-08-17
CN118805069A (zh) 2024-10-18
WO2023153426A1 (ja) 2023-08-17

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