JPWO2023153426A1 - - Google Patents

Info

Publication number
JPWO2023153426A1
JPWO2023153426A1 JP2023580284A JP2023580284A JPWO2023153426A1 JP WO2023153426 A1 JPWO2023153426 A1 JP WO2023153426A1 JP 2023580284 A JP2023580284 A JP 2023580284A JP 2023580284 A JP2023580284 A JP 2023580284A JP WO2023153426 A1 JPWO2023153426 A1 JP WO2023153426A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023580284A
Other languages
Japanese (ja)
Other versions
JPWO2023153426A5 (https=
JP7609309B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023153426A1 publication Critical patent/JPWO2023153426A1/ja
Publication of JPWO2023153426A5 publication Critical patent/JPWO2023153426A5/ja
Application granted granted Critical
Publication of JP7609309B2 publication Critical patent/JP7609309B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Push-Button Switches (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2023580284A 2022-02-10 2023-02-08 電子機器 Active JP7609309B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022019249 2022-02-10
JP2022019249 2022-02-10
PCT/JP2023/004156 WO2023153426A1 (ja) 2022-02-10 2023-02-08 電子機器

Publications (3)

Publication Number Publication Date
JPWO2023153426A1 true JPWO2023153426A1 (https=) 2023-08-17
JPWO2023153426A5 JPWO2023153426A5 (https=) 2024-09-30
JP7609309B2 JP7609309B2 (ja) 2025-01-07

Family

ID=87564354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023580284A Active JP7609309B2 (ja) 2022-02-10 2023-02-08 電子機器

Country Status (4)

Country Link
US (1) US20240381543A1 (https=)
JP (1) JP7609309B2 (https=)
CN (1) CN118805069A (https=)
WO (1) WO2023153426A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129829A1 (ja) * 2014-02-26 2015-09-03 ダイキン工業株式会社 バイモルフ型圧電フィルム
JP2015190863A (ja) * 2014-03-28 2015-11-02 日本写真印刷株式会社 圧力検出装置
JP2018085097A (ja) * 2016-11-24 2018-05-31 株式会社 ハイディープＨｉＤｅｅｐ Ｉｎｃ． タッチ入力装置
WO2018221288A1 (ja) * 2017-06-01 2018-12-06 株式会社村田製作所 センサ、タッチパネル、及び電子機器
US20190107897A1 (en) * 2017-10-05 2019-04-11 Advanced Semiconductor Engineering, Inc. Semiconductor package device
JP2020027596A (ja) * 2018-08-10 2020-02-20 業成科技(成都)有限公司 タッチディスプレイモジュール及びこのタッチディスプレイモジュールを応用した電子装置
WO2020129346A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 押圧センサおよび押圧検出装置
JP2021197167A (ja) * 2020-06-09 2021-12-27 株式会社村田製作所 電子機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129829A1 (ja) * 2014-02-26 2015-09-03 ダイキン工業株式会社 バイモルフ型圧電フィルム
JP2015190863A (ja) * 2014-03-28 2015-11-02 日本写真印刷株式会社 圧力検出装置
JP2018085097A (ja) * 2016-11-24 2018-05-31 株式会社 ハイディープＨｉＤｅｅｐ Ｉｎｃ． タッチ入力装置
WO2018221288A1 (ja) * 2017-06-01 2018-12-06 株式会社村田製作所 センサ、タッチパネル、及び電子機器
US20190107897A1 (en) * 2017-10-05 2019-04-11 Advanced Semiconductor Engineering, Inc. Semiconductor package device
JP2020027596A (ja) * 2018-08-10 2020-02-20 業成科技(成都)有限公司 タッチディスプレイモジュール及びこのタッチディスプレイモジュールを応用した電子装置
WO2020129346A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 押圧センサおよび押圧検出装置
JP2021197167A (ja) * 2020-06-09 2021-12-27 株式会社村田製作所 電子機器

Also Published As

Publication number Publication date
US20240381543A1 (en) 2024-11-14
JP7609309B2 (ja) 2025-01-07
CN118805069A (zh) 2024-10-18
WO2023153426A1 (ja) 2023-08-17

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