CN118805069A - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
CN118805069A
CN118805069A CN202380021160.1A CN202380021160A CN118805069A CN 118805069 A CN118805069 A CN 118805069A CN 202380021160 A CN202380021160 A CN 202380021160A CN 118805069 A CN118805069 A CN 118805069A
Authority
CN
China
Prior art keywords
main surface
electronic device
operation panel
sensor
lower main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380021160.1A
Other languages
English (en)
Chinese (zh)
Inventor
北田宏明
加纳英和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118805069A publication Critical patent/CN118805069A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Push-Button Switches (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN202380021160.1A 2022-02-10 2023-02-08 电子设备 Pending CN118805069A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-019249 2022-02-10
JP2022019249 2022-02-10
PCT/JP2023/004156 WO2023153426A1 (ja) 2022-02-10 2023-02-08 電子機器

Publications (1)

Publication Number Publication Date
CN118805069A true CN118805069A (zh) 2024-10-18

Family

ID=87564354

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380021160.1A Pending CN118805069A (zh) 2022-02-10 2023-02-08 电子设备

Country Status (4)

Country Link
US (1) US20240381543A1 (https=)
JP (1) JP7609309B2 (https=)
CN (1) CN118805069A (https=)
WO (1) WO2023153426A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6327334B2 (ja) * 2014-02-26 2018-05-23 ダイキン工業株式会社 バイモルフ型圧電フィルム
JP2015190863A (ja) * 2014-03-28 2015-11-02 日本写真印刷株式会社 圧力検出装置
KR101958324B1 (ko) * 2016-11-24 2019-03-15 주식회사 하이딥 터치 입력 장치
JP6624343B2 (ja) * 2017-06-01 2019-12-25 株式会社村田製作所 センサ、タッチパネル、及び電子機器
US10545581B2 (en) * 2017-10-05 2020-01-28 Advanced Semiconductor Engineering, Inc. Semiconductor package device
CN109240550B (zh) * 2018-08-10 2022-04-15 业泓科技(成都)有限公司 触控显示模组以及应用该触控显示模组的电子装置
CN213120923U (zh) * 2018-12-20 2021-05-04 株式会社村田制作所 按压传感器和按压检测装置
JP7625969B2 (ja) * 2020-06-09 2025-02-04 株式会社村田製作所 電子機器

Also Published As

Publication number Publication date
US20240381543A1 (en) 2024-11-14
JPWO2023153426A1 (https=) 2023-08-17
JP7609309B2 (ja) 2025-01-07
WO2023153426A1 (ja) 2023-08-17

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