JP7602637B2 - 積層セラミック電子部品およびその製造方法 - Google Patents

積層セラミック電子部品およびその製造方法 Download PDF

Info

Publication number
JP7602637B2
JP7602637B2 JP2023529807A JP2023529807A JP7602637B2 JP 7602637 B2 JP7602637 B2 JP 7602637B2 JP 2023529807 A JP2023529807 A JP 2023529807A JP 2023529807 A JP2023529807 A JP 2023529807A JP 7602637 B2 JP7602637 B2 JP 7602637B2
Authority
JP
Japan
Prior art keywords
external electrode
rod
ceramic
cut
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023529807A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022270299A1 (https=
Inventor
恒 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022270299A1 publication Critical patent/JPWO2022270299A1/ja
Application granted granted Critical
Publication of JP7602637B2 publication Critical patent/JP7602637B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/248Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2023529807A 2021-06-23 2022-06-07 積層セラミック電子部品およびその製造方法 Active JP7602637B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021104419 2021-06-23
JP2021104419 2021-06-23
PCT/JP2022/023004 WO2022270299A1 (ja) 2021-06-23 2022-06-07 積層セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022270299A1 JPWO2022270299A1 (https=) 2022-12-29
JP7602637B2 true JP7602637B2 (ja) 2024-12-18

Family

ID=84544552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529807A Active JP7602637B2 (ja) 2021-06-23 2022-06-07 積層セラミック電子部品およびその製造方法

Country Status (4)

Country Link
US (1) US12437928B2 (https=)
JP (1) JP7602637B2 (https=)
CN (1) CN117642831A (https=)
WO (1) WO2022270299A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7602637B2 (ja) * 2021-06-23 2024-12-18 京セラ株式会社 積層セラミック電子部品およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187216A (ja) 2013-03-23 2014-10-02 Kyocera Corp 積層セラミックコンデンサの製造方法
JP2021015950A (ja) 2019-07-16 2021-02-12 株式会社村田製作所 積層セラミックコンデンサ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086882A (ja) * 1983-10-18 1985-05-16 Nec Corp 電歪効果素子の製造方法
JPH11340081A (ja) * 1998-05-21 1999-12-10 Murata Mfg Co Ltd 積層セラミック電子部品及びその製造方法
JP2013058558A (ja) * 2011-09-07 2013-03-28 Tdk Corp 電子部品
KR101376921B1 (ko) * 2012-12-11 2014-03-20 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
KR101525662B1 (ko) * 2013-04-26 2015-06-03 삼성전기주식회사 적층 세라믹 전자부품 및 적층 세라믹 전자부품 실장 기판
KR102057913B1 (ko) * 2013-07-04 2019-12-20 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
KR101884392B1 (ko) 2015-03-30 2018-08-02 다이요 유덴 가부시키가이샤 적층 세라믹 콘덴서
JP6436921B2 (ja) 2015-03-30 2018-12-12 太陽誘電株式会社 積層セラミックコンデンサ
JP7358692B2 (ja) * 2018-06-15 2023-10-11 サムソン エレクトロ-メカニックス カンパニーリミテッド. キャパシタ部品及びキャパシタ部品の製造方法
JP7401320B2 (ja) * 2020-01-24 2023-12-19 株式会社村田製作所 積層セラミック電子部品
JP7602637B2 (ja) * 2021-06-23 2024-12-18 京セラ株式会社 積層セラミック電子部品およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187216A (ja) 2013-03-23 2014-10-02 Kyocera Corp 積層セラミックコンデンサの製造方法
JP2021015950A (ja) 2019-07-16 2021-02-12 株式会社村田製作所 積層セラミックコンデンサ

Also Published As

Publication number Publication date
US12437928B2 (en) 2025-10-07
CN117642831A (zh) 2024-03-01
US20240274359A1 (en) 2024-08-15
WO2022270299A1 (ja) 2022-12-29
JPWO2022270299A1 (https=) 2022-12-29

Similar Documents

Publication Publication Date Title
JP5293506B2 (ja) セラミック電子部品及びセラミック電子部品の製造方法
JP2012227198A (ja) 積層セラミックコンデンサ
CN103050278A (zh) 多层陶瓷电容器及其制备方法
JP2001267453A (ja) 積層型セラミック電子部品およびその製造方法ならびに電子装置
JP7696860B2 (ja) 積層セラミック電子部品およびその製造方法
JP6502205B2 (ja) 多層配線基板およびその製造方法
JP7602637B2 (ja) 積層セラミック電子部品およびその製造方法
JP5195820B2 (ja) 積層コンデンサの製造方法及び積層コンデンサ
JP2010021386A (ja) セラミック部品の製造方法
JP2000340448A (ja) 積層セラミックコンデンサ
TWI869882B (zh) 積層陶瓷電子零件
JP7746404B2 (ja) 積層セラミック電子部品及びその製造方法
JP2005268672A (ja) 基板
JPWO2006040941A1 (ja) 積層セラミック部品とその製造方法
WO2023100517A1 (ja) 回路モジュール
KR100956212B1 (ko) 다층 세라믹 기판의 제조 방법
TWI869872B (zh) 積層陶瓷電子零件及積層陶瓷電子零件之製造方法
JPH11340082A (ja) 積層チップ部品とその製造方法
JP3962714B2 (ja) セラミック電子部品の製造方法
KR20140013289A (ko) 세라믹 전자 부품 및 그 제조 방법
US20090230596A1 (en) Method of manufacturing multi-layered ceramic substrate
JP2006041319A (ja) 表面実装型多連コンデンサ及びその実装構造
JP2007053294A (ja) 積層型セラミック電子部品の製造方法
JP2004128135A (ja) セラミック積層体
JPH08203773A (ja) チップ型積層セラミックコンデンサの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231208

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241206

R150 Certificate of patent or registration of utility model

Ref document number: 7602637

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150