JP7599872B2 - エッチング方法及びプラズマ処理装置 - Google Patents

エッチング方法及びプラズマ処理装置 Download PDF

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JP7599872B2
JP7599872B2 JP2020148214A JP2020148214A JP7599872B2 JP 7599872 B2 JP7599872 B2 JP 7599872B2 JP 2020148214 A JP2020148214 A JP 2020148214A JP 2020148214 A JP2020148214 A JP 2020148214A JP 7599872 B2 JP7599872 B2 JP 7599872B2
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silicon
gas
film
mask
substrate
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JP2021077865A (ja
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喬大 横山
幕樹 戸村
嘉英 木原
聡 大内田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to KR1020200145268A priority Critical patent/KR102893533B1/ko
Priority to TW114119470A priority patent/TW202536933A/zh
Priority to CN202011216388.0A priority patent/CN112786441B/xx
Priority to TW109138386A priority patent/TWI887291B/zh
Priority to US17/090,964 priority patent/US11417535B2/en
Publication of JP2021077865A publication Critical patent/JP2021077865A/ja
Priority to US17/852,395 priority patent/US12387941B2/en
Priority to JP2024211136A priority patent/JP7793741B2/ja
Application granted granted Critical
Publication of JP7599872B2 publication Critical patent/JP7599872B2/ja
Priority to US19/271,820 priority patent/US20250349552A1/en
Priority to KR1020250182004A priority patent/KR20250171242A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H10P14/40—
    • H10P14/416—
    • H10P14/69215—
    • H10P14/69433—
    • H10P50/268—
    • H10P50/283—
    • H10P50/71—
    • H10P50/73—
    • H10P72/00—
    • H10P72/0421—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Photovoltaic Devices (AREA)
JP2020148214A 2019-11-08 2020-09-03 エッチング方法及びプラズマ処理装置 Active JP7599872B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020200145268A KR102893533B1 (ko) 2019-11-08 2020-11-03 에칭 방법 및 플라즈마 처리 장치
CN202011216388.0A CN112786441B (en) 2019-11-08 2020-11-04 Etching method and plasma processing apparatus
TW109138386A TWI887291B (zh) 2019-11-08 2020-11-04 蝕刻方法及電漿處理裝置
TW114119470A TW202536933A (zh) 2019-11-08 2020-11-04 蝕刻方法及電漿處理裝置
US17/090,964 US11417535B2 (en) 2019-11-08 2020-11-06 Etching method and plasma processing apparatus
US17/852,395 US12387941B2 (en) 2019-11-08 2022-06-29 Etching method and plasma processing apparatus
JP2024211136A JP7793741B2 (ja) 2019-11-08 2024-12-04 エッチング方法及びプラズマ処理装置
US19/271,820 US20250349552A1 (en) 2019-11-08 2025-07-17 Etching method and plasma processing apparatus
KR1020250182004A KR20250171242A (ko) 2019-11-08 2025-11-26 에칭 방법 및 플라즈마 처리 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019203326 2019-11-08
JP2019203326 2019-11-08

Related Child Applications (1)

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JP2024211136A Division JP7793741B2 (ja) 2019-11-08 2024-12-04 エッチング方法及びプラズマ処理装置

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JP2021077865A JP2021077865A (ja) 2021-05-20
JP7599872B2 true JP7599872B2 (ja) 2024-12-16

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JP2024211136A Active JP7793741B2 (ja) 2019-11-08 2024-12-04 エッチング方法及びプラズマ処理装置

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US (2) US12387941B2 (enExample)
JP (2) JP7599872B2 (enExample)
KR (2) KR102893533B1 (enExample)
TW (2) TWI887291B (enExample)
WO (1) WO2021090516A1 (enExample)

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JP7763251B2 (ja) * 2021-07-27 2025-10-31 東京エレクトロン株式会社 エッチング方法、半導体装置の製造方法、エッチングプログラムおよびプラズマ処理装置
JP7667060B2 (ja) * 2021-10-22 2025-04-22 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理システム
JP7674223B2 (ja) 2021-11-01 2025-05-09 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理システム
JP2023082809A (ja) * 2021-12-03 2023-06-15 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US11694876B2 (en) * 2021-12-08 2023-07-04 Applied Materials, Inc. Apparatus and method for delivering a plurality of waveform signals during plasma processing
JPWO2023233673A1 (enExample) * 2022-06-01 2023-12-07
TW202425121A (zh) * 2022-08-25 2024-06-16 日商東京威力科創股份有限公司 蝕刻方法及電漿處理裝置
JP2025529122A (ja) * 2022-08-31 2025-09-04 ラム リサーチ コーポレーション 窒化物熱原子層エッチング
JP2025530844A (ja) * 2022-09-13 2025-09-17 ラム リサーチ コーポレーション スタック内にフィーチャをエッチングするための方法
JP7773971B2 (ja) * 2022-12-27 2025-11-20 東京エレクトロン株式会社 エッチング方法及びプラズマ処理装置
KR20250150572A (ko) * 2023-02-13 2025-10-20 도쿄엘렉트론가부시키가이샤 에칭 방법 및 플라즈마 처리 장치
KR20240128194A (ko) * 2023-02-17 2024-08-26 피에스케이 주식회사 기판 처리 방법 및 장치
WO2025150427A1 (ja) * 2024-01-09 2025-07-17 東京エレクトロン株式会社 エッチング方法及びプラズマ処理システム
WO2025204638A1 (ja) * 2024-03-25 2025-10-02 東京エレクトロン株式会社 プラズマ処理装置、電源システム、及びプラズマ処理方法

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WO2021090516A1 (ja) 2021-05-14
TW202125583A (zh) 2021-07-01
KR102893533B1 (ko) 2025-12-01
JP2025029128A (ja) 2025-03-05
JP2021077865A (ja) 2021-05-20
KR20250171242A (ko) 2025-12-08
US20250349552A1 (en) 2025-11-13
KR20210056240A (ko) 2021-05-18
TWI887291B (zh) 2025-06-21
JP7793741B2 (ja) 2026-01-05
TW202536933A (zh) 2025-09-16
US20220328323A1 (en) 2022-10-13
US12387941B2 (en) 2025-08-12

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