JP7579072B2 - 搬送装置、基板処理装置、および物品製造方法 - Google Patents

搬送装置、基板処理装置、および物品製造方法 Download PDF

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Publication number
JP7579072B2
JP7579072B2 JP2020111911A JP2020111911A JP7579072B2 JP 7579072 B2 JP7579072 B2 JP 7579072B2 JP 2020111911 A JP2020111911 A JP 2020111911A JP 2020111911 A JP2020111911 A JP 2020111911A JP 7579072 B2 JP7579072 B2 JP 7579072B2
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Japan
Prior art keywords
hand
substrate
substrate chuck
main body
transport device
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Application number
JP2020111911A
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English (en)
Japanese (ja)
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JP2022011045A5 (https=
JP2022011045A (ja
Inventor
健太郎 牛久
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Canon Inc
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Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020111911A priority Critical patent/JP7579072B2/ja
Priority to EP21175861.0A priority patent/EP3933507A1/en
Priority to US17/338,836 priority patent/US11569119B2/en
Priority to CN202110709764.8A priority patent/CN113937042B/zh
Publication of JP2022011045A publication Critical patent/JP2022011045A/ja
Publication of JP2022011045A5 publication Critical patent/JP2022011045A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manipulator (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2020111911A 2020-06-29 2020-06-29 搬送装置、基板処理装置、および物品製造方法 Active JP7579072B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020111911A JP7579072B2 (ja) 2020-06-29 2020-06-29 搬送装置、基板処理装置、および物品製造方法
EP21175861.0A EP3933507A1 (en) 2020-06-29 2021-05-26 Conveyance apparatus, substrate processing apparatus, and method of manufacturing article
US17/338,836 US11569119B2 (en) 2020-06-29 2021-06-04 Conveyance apparatus, substrate processing apparatus, and method of manufacturing article
CN202110709764.8A CN113937042B (zh) 2020-06-29 2021-06-25 输送设备、基板处理设备以及制造制品的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020111911A JP7579072B2 (ja) 2020-06-29 2020-06-29 搬送装置、基板処理装置、および物品製造方法

Publications (3)

Publication Number Publication Date
JP2022011045A JP2022011045A (ja) 2022-01-17
JP2022011045A5 JP2022011045A5 (https=) 2023-07-04
JP7579072B2 true JP7579072B2 (ja) 2024-11-07

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Country Status (4)

Country Link
US (1) US11569119B2 (https=)
EP (1) EP3933507A1 (https=)
JP (1) JP7579072B2 (https=)
CN (1) CN113937042B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004193344A (ja) 2002-12-11 2004-07-08 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法
WO2004077531A1 (de) 2003-02-25 2004-09-10 Technische Universität München Vorrichtung zum berührungsarmen greifen, halten und ausrichten von berührungsempfindlichen flachbauteilen
JP2016501003A (ja) 2012-10-05 2016-01-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 回転ポジショニング装置
WO2017037976A1 (ja) 2015-09-03 2017-03-09 川崎重工業株式会社 基板移載装置
JP2017511499A (ja) 2014-03-12 2017-04-20 エーエスエムエル ネザーランズ ビー．ブイ． センサシステム、基板ハンドリングシステムおよびリソグラフィ装置
JP2019201112A (ja) 2018-05-16 2019-11-21 東京エレクトロン株式会社 搬送方法および搬送装置

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JP2000021956A (ja) 1998-07-02 2000-01-21 Mecs Corp ノッチ合わせ機
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
JP4014031B2 (ja) * 2002-06-05 2007-11-28 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
KR20060078016A (ko) * 2004-12-30 2006-07-05 삼성전자주식회사 웨이퍼 에지 노광 장치
US7706908B2 (en) * 2005-02-22 2010-04-27 Oc Oerlikon Balzers Ag Method for positioning a wafer
JP2006351863A (ja) * 2005-06-16 2006-12-28 Nikon Corp 物体搬送装置及び露光装置
JP5721453B2 (ja) 2011-01-28 2015-05-20 リンテック株式会社 アライメント装置及びアライメント方法
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JP6263017B2 (ja) * 2013-12-16 2018-01-17 川崎重工業株式会社 基板位置合わせ装置及び基板位置合わせ装置の制御方法
CN104449949A (zh) * 2014-12-02 2015-03-25 湖南东博墨烯科技有限公司 一种石墨烯基纳米零价钴-铁-铜系润滑油及其制备方法
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Publication number Priority date Publication date Assignee Title
JP2004193344A (ja) 2002-12-11 2004-07-08 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法
WO2004077531A1 (de) 2003-02-25 2004-09-10 Technische Universität München Vorrichtung zum berührungsarmen greifen, halten und ausrichten von berührungsempfindlichen flachbauteilen
JP2016501003A (ja) 2012-10-05 2016-01-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 回転ポジショニング装置
JP2017511499A (ja) 2014-03-12 2017-04-20 エーエスエムエル ネザーランズ ビー．ブイ． センサシステム、基板ハンドリングシステムおよびリソグラフィ装置
WO2017037976A1 (ja) 2015-09-03 2017-03-09 川崎重工業株式会社 基板移載装置
JP2019201112A (ja) 2018-05-16 2019-11-21 東京エレクトロン株式会社 搬送方法および搬送装置

Also Published As

Publication number Publication date
US20210407844A1 (en) 2021-12-30
CN113937042B (zh) 2025-05-23
JP2022011045A (ja) 2022-01-17
CN113937042A (zh) 2022-01-14
EP3933507A1 (en) 2022-01-05
US11569119B2 (en) 2023-01-31

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