JP7573051B2 - パワー半導体用アルミニウムボンディングワイヤ - Google Patents

パワー半導体用アルミニウムボンディングワイヤ Download PDF

Info

Publication number
JP7573051B2
JP7573051B2 JP2022578387A JP2022578387A JP7573051B2 JP 7573051 B2 JP7573051 B2 JP 7573051B2 JP 2022578387 A JP2022578387 A JP 2022578387A JP 2022578387 A JP2022578387 A JP 2022578387A JP 7573051 B2 JP7573051 B2 JP 7573051B2
Authority
JP
Japan
Prior art keywords
wire
aluminum
mass
less
aluminum wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022578387A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022163606A1 (https=
JPWO2022163606A5 (https=
Inventor
修一 三苫
司 市川
剛史 浦地
辰則 柳本
泰 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Mitsubishi Electric Corp
Original Assignee
Tanaka Denshi Kogyo KK
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK, Mitsubishi Electric Corp filed Critical Tanaka Denshi Kogyo KK
Publication of JPWO2022163606A1 publication Critical patent/JPWO2022163606A1/ja
Publication of JPWO2022163606A5 publication Critical patent/JPWO2022163606A5/ja
Application granted granted Critical
Publication of JP7573051B2 publication Critical patent/JP7573051B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0211—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in cutting
    • B23K35/0216—Rods, electrodes or wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
JP2022578387A 2021-01-28 2022-01-25 パワー半導体用アルミニウムボンディングワイヤ Active JP7573051B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021011625 2021-01-28
JP2021011625 2021-01-28
PCT/JP2022/002523 WO2022163606A1 (ja) 2021-01-28 2022-01-25 パワー半導体用アルミニウムボンディングワイヤ

Publications (3)

Publication Number Publication Date
JPWO2022163606A1 JPWO2022163606A1 (https=) 2022-08-04
JPWO2022163606A5 JPWO2022163606A5 (https=) 2023-10-18
JP7573051B2 true JP7573051B2 (ja) 2024-10-24

Family

ID=82654564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022578387A Active JP7573051B2 (ja) 2021-01-28 2022-01-25 パワー半導体用アルミニウムボンディングワイヤ

Country Status (7)

Country Link
US (1) US20240105667A1 (https=)
JP (1) JP7573051B2 (https=)
KR (1) KR20230116044A (https=)
CN (1) CN116848623A (https=)
DE (1) DE112022000793T5 (https=)
TW (1) TWI854187B (https=)
WO (1) WO2022163606A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025028382A1 (ja) 2023-07-31 2025-02-06 田中電子工業株式会社 アルミニウム配線材及びその製造方法
JPWO2025028381A1 (https=) 2023-07-31 2025-02-06
WO2025211239A1 (ja) * 2024-04-03 2025-10-09 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
CN121023316B (zh) * 2025-10-28 2026-01-13 烟台一诺电子材料有限公司 一种集成电路封装用键合铝丝及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011252185A (ja) 2010-05-31 2011-12-15 Fujikura Ltd Ａｌ合金導電線
JP2013258324A (ja) 2012-06-13 2013-12-26 Tanaka Electronics Ind Co Ltd 半導体装置接続用アルミニウム合金細線
JP2014129578A (ja) 2012-12-28 2014-07-10 Tanaka Electronics Ind Co Ltd パワ−半導体装置用アルミニウム合金細線
WO2019188452A1 (ja) 2018-03-27 2019-10-03 古河電気工業株式会社 アルミニウム合金材ならびにこれを用いた導電部材、電池用部材、締結部品、バネ用部品および構造用部品
JP2020059886A (ja) 2018-10-10 2020-04-16 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353073A (en) * 1964-09-10 1967-11-14 Nippon Electric Co Magnesium-aluminum alloy contacts for semiconductor devices
KR100723454B1 (ko) * 2004-08-21 2007-05-30 페어차일드코리아반도체 주식회사 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
TWI237334B (en) * 2002-04-05 2005-08-01 Nippon Steel Corp A gold bonding wire for a semiconductor device and a method for producing the same
JP2011253950A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp 電力半導体装置
CN103003456B (zh) * 2010-07-15 2015-06-10 古河电气工业株式会社 铝合金导体
TWI455217B (zh) * 2011-12-27 2014-10-01 萬國半導體開曼股份有限公司 應用在功率半導體元器件中的鋁合金引線框架
JP6090721B2 (ja) * 2012-05-29 2017-03-08 国立大学法人茨城大学 パワー半導体用アルミニウムワイヤ及び該アルミニウムワイヤを用いた半導体装置、並びに該アルミニウムワイヤの探索方法
JP6368087B2 (ja) * 2013-12-26 2018-08-01 住友電気工業株式会社 アルミニウム合金線材、アルミニウム合金線材の製造方法、及びアルミニウム合金部材
EP3363025B1 (en) * 2015-10-14 2021-12-08 General Cable Technologies Corporation Cables and wires having conductive elements formed from improved aluminum-zirconium alloys
TWI581273B (zh) * 2015-11-30 2017-05-01 財團法人金屬工業研究發展中心 鋁合金導線及其製造方法
JP6927685B2 (ja) * 2016-10-25 2021-09-01 矢崎総業株式会社 アルミニウム素線、並びにそれを用いたアルミニウム電線及びワイヤーハーネス
KR102801396B1 (ko) 2019-03-13 2025-04-30 닛데쓰마이크로메탈가부시키가이샤 Al 본딩 와이어

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011252185A (ja) 2010-05-31 2011-12-15 Fujikura Ltd Ａｌ合金導電線
JP2013258324A (ja) 2012-06-13 2013-12-26 Tanaka Electronics Ind Co Ltd 半導体装置接続用アルミニウム合金細線
JP2014129578A (ja) 2012-12-28 2014-07-10 Tanaka Electronics Ind Co Ltd パワ−半導体装置用アルミニウム合金細線
WO2019188452A1 (ja) 2018-03-27 2019-10-03 古河電気工業株式会社 アルミニウム合金材ならびにこれを用いた導電部材、電池用部材、締結部品、バネ用部品および構造用部品
JP2020059886A (ja) 2018-10-10 2020-04-16 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ

Also Published As

Publication number Publication date
JPWO2022163606A1 (https=) 2022-08-04
WO2022163606A1 (ja) 2022-08-04
DE112022000793T5 (de) 2023-11-30
CN116848623A (zh) 2023-10-03
TWI854187B (zh) 2024-09-01
TW202232691A (zh) 2022-08-16
KR20230116044A (ko) 2023-08-03
US20240105667A1 (en) 2024-03-28

Similar Documents

Publication Publication Date Title
JP7573051B2 (ja) パワー半導体用アルミニウムボンディングワイヤ
TWI517271B (zh) Copper bonding wire for semiconductor and its joining structure
TWI496900B (zh) Copper alloy bonding wire for semiconductors
JP5343069B2 (ja) ボンディングワイヤの接合構造
WO2015163297A1 (ja) 半導体装置用ボンディングワイヤ
CN103295993A (zh) 用于半导体装置中的连接的铜-铂合金线
JP7518305B1 (ja) Ａｌ合金ボンディングワイヤ
JP7126321B2 (ja) Ａｌボンディングワイヤ
CN101525702A (zh) 划片加工性优异的qfn封装用铜合金板和qfc封装
JP7126322B2 (ja) Ａｌボンディングワイヤ
WO2020059856A9 (ja) 半導体装置用Ｃｕ合金ボンディングワイヤ
JP5755892B2 (ja) 銅合金板の製造方法
JPH1167812A (ja) 半導体素子用金銀合金細線
JPH10183274A (ja) 電子機器用銅合金
EP4589643A1 (en) Copper bonding wire, method for manufacturing copper bonding wire, and semiconductor device
TWI853006B (zh) 接合線
JP7600475B1 (ja) Ａｌ接続材
JPH11243171A (ja) リードフレーム用銅合金
WO2025028381A1 (ja) アルミニウム配線材及びその製造方法
JP5236973B2 (ja) ダイシング加工性に優れるｑｆｎパッケージ用銅合金板
WO2025134698A1 (ja) 銀合金線及びこれを用いた導電線、接合用線、半導体用線並びに構造用線
TW202409305A (zh) 半導體裝置用接合導線
TW202511510A (zh) 鋁配線材及其製造方法
JPS6294969A (ja) 半導体装置用ボンデイングワイヤ
TW202132581A (zh) 半導體裝置用Cu合金接合導線

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230725

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230725

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20230726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240820

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241001

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241011

R150 Certificate of patent or registration of utility model

Ref document number: 7573051

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150