JP7561139B2 - 非平衡熱硬化プロセス - Google Patents

非平衡熱硬化プロセス Download PDF

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Publication number
JP7561139B2
JP7561139B2 JP2021560165A JP2021560165A JP7561139B2 JP 7561139 B2 JP7561139 B2 JP 7561139B2 JP 2021560165 A JP2021560165 A JP 2021560165A JP 2021560165 A JP2021560165 A JP 2021560165A JP 7561139 B2 JP7561139 B2 JP 7561139B2
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layer
stack
layers
temperature
thermosetting
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JP2022528267A (ja
JP2022528267A5 (https=
Inventor
ブルクハルト，ジョージ
スロッカベージ，ダニエル
ゲイナー，ホイットニー
リウ，バン－ヤン
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シノヴィア テクノロジーズ
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Publication of JP2022528267A5 publication Critical patent/JP2022528267A5/ja
Priority to JP2024163591A priority patent/JP2025000720A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H10K50/171—Electron injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/441—Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
JP2021560165A 2019-03-25 2020-03-10 非平衡熱硬化プロセス Active JP7561139B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023018809A JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962823425P 2019-03-25 2019-03-25
US62/823,425 2019-03-25
US201962863038P 2019-06-18 2019-06-18
US62/863,038 2019-06-18
PCT/US2020/021812 WO2020197753A1 (en) 2019-03-25 2020-03-10 Non-equilibrium thermal curing processes

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2023018809A Division JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A Division JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Publications (3)

Publication Number Publication Date
JP2022528267A JP2022528267A (ja) 2022-06-09
JP2022528267A5 JP2022528267A5 (https=) 2023-02-20
JP7561139B2 true JP7561139B2 (ja) 2024-10-03

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Family Applications (3)

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JP2021560165A Active JP7561139B2 (ja) 2019-03-25 2020-03-10 非平衡熱硬化プロセス
JP2023018809A Active JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A Pending JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

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JP2023018809A Active JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A Pending JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Country Status (4)

Country Link
US (3) US11276845B2 (https=)
JP (3) JP7561139B2 (https=)
KR (2) KR20230019506A (https=)
WO (1) WO2020197753A1 (https=)

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JP7561139B2 (ja) * 2019-03-25 2024-10-03 シノヴィア テクノロジーズ 非平衡熱硬化プロセス
US11785830B2 (en) * 2021-01-29 2023-10-10 Hongyi Optical Co., Ltd. Method of manufacturing electroluminescent device having light emitting layer by using transfer printing process

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WO2017056814A1 (ja) 2015-09-30 2017-04-06 コニカミノルタ株式会社 透明有機エレクトロルミネッセンス素子及びその製造方法
WO2017087475A1 (en) 2015-11-16 2017-05-26 Western Michigan University Research Foundation Process for binding conductive ink to glass

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WO2017056814A1 (ja) 2015-09-30 2017-04-06 コニカミノルタ株式会社 透明有機エレクトロルミネッセンス素子及びその製造方法
WO2017087475A1 (en) 2015-11-16 2017-05-26 Western Michigan University Research Foundation Process for binding conductive ink to glass

Also Published As

Publication number Publication date
US11276845B2 (en) 2022-03-15
WO2020197753A1 (en) 2020-10-01
US20200381647A1 (en) 2020-12-03
JP2025000720A (ja) 2025-01-07
US20230071687A1 (en) 2023-03-09
KR20210143789A (ko) 2021-11-29
US20200381677A1 (en) 2020-12-03
KR20230019506A (ko) 2023-02-08
KR102922728B1 (ko) 2026-02-03
JP2022528267A (ja) 2022-06-09
JP2023062029A (ja) 2023-05-02
JP7315801B2 (ja) 2023-07-26
US12193313B2 (en) 2025-01-07

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