JP2022528267A5 - - Google Patents

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Publication number
JP2022528267A5
JP2022528267A5 JP2021560165A JP2021560165A JP2022528267A5 JP 2022528267 A5 JP2022528267 A5 JP 2022528267A5 JP 2021560165 A JP2021560165 A JP 2021560165A JP 2021560165 A JP2021560165 A JP 2021560165A JP 2022528267 A5 JP2022528267 A5 JP 2022528267A5
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JP
Japan
Prior art keywords
layer
temperature
thermosetting
stack
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021560165A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022528267A (ja
JP7561139B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2020/021812 external-priority patent/WO2020197753A1/en
Publication of JP2022528267A publication Critical patent/JP2022528267A/ja
Priority to JP2023018809A priority Critical patent/JP7315801B2/ja
Publication of JP2022528267A5 publication Critical patent/JP2022528267A5/ja
Priority to JP2024163591A priority patent/JP2025000720A/ja
Application granted granted Critical
Publication of JP7561139B2 publication Critical patent/JP7561139B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021560165A 2019-03-25 2020-03-10 非平衡熱硬化プロセス Active JP7561139B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023018809A JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962823425P 2019-03-25 2019-03-25
US62/823,425 2019-03-25
US201962863038P 2019-06-18 2019-06-18
US62/863,038 2019-06-18
PCT/US2020/021812 WO2020197753A1 (en) 2019-03-25 2020-03-10 Non-equilibrium thermal curing processes

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2023018809A Division JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A Division JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Publications (3)

Publication Number Publication Date
JP2022528267A JP2022528267A (ja) 2022-06-09
JP2022528267A5 true JP2022528267A5 (https=) 2023-02-20
JP7561139B2 JP7561139B2 (ja) 2024-10-03

Family

ID=72609112

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021560165A Active JP7561139B2 (ja) 2019-03-25 2020-03-10 非平衡熱硬化プロセス
JP2023018809A Active JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A Pending JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023018809A Active JP7315801B2 (ja) 2019-03-25 2023-02-10 非平衡熱硬化プロセス
JP2024163591A Pending JP2025000720A (ja) 2019-03-25 2024-09-20 非平衡熱硬化プロセス

Country Status (4)

Country Link
US (3) US11276845B2 (https=)
JP (3) JP7561139B2 (https=)
KR (2) KR20230019506A (https=)
WO (1) WO2020197753A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7561139B2 (ja) * 2019-03-25 2024-10-03 シノヴィア テクノロジーズ 非平衡熱硬化プロセス
US11785830B2 (en) * 2021-01-29 2023-10-10 Hongyi Optical Co., Ltd. Method of manufacturing electroluminescent device having light emitting layer by using transfer printing process

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WO2009134697A2 (en) * 2008-04-30 2009-11-05 Applied Materials, Inc. Roll to roll oled production system
JP5216716B2 (ja) * 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
WO2010068205A1 (en) * 2008-12-10 2010-06-17 Hcf Partners, L.P. Cross linked organic conductive layer
US8399889B2 (en) * 2009-11-09 2013-03-19 Solarmer Energy, Inc. Organic light emitting diode and organic solar cell stack
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
JP6296701B2 (ja) * 2012-10-15 2018-03-20 住友化学株式会社 電子デバイスの製造方法
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DE102015112048A1 (de) 2015-07-23 2017-01-26 Osram Oled Gmbh Optoelektronisches Bauteil und Verfahren zum Betrieb eines optoelektronischen Bauteils
WO2017056814A1 (ja) 2015-09-30 2017-04-06 コニカミノルタ株式会社 透明有機エレクトロルミネッセンス素子及びその製造方法
WO2017087475A1 (en) 2015-11-16 2017-05-26 Western Michigan University Research Foundation Process for binding conductive ink to glass
JP6440654B2 (ja) * 2016-06-17 2018-12-19 住友化学株式会社 有機電子素子の製造方法及び機能層の製造方法
GB2555844B (en) * 2016-11-11 2020-04-15 The Univ Of Hull An OLED device and a method of manufacture
CN107623076B (zh) 2017-09-29 2019-12-06 深圳市华星光电半导体显示技术有限公司 全溶液oled器件及其制作方法
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JP7169126B2 (ja) * 2018-08-30 2022-11-10 エルジー ディスプレイ カンパニー リミテッド 塗布型有機電界発光素子
CN109616586A (zh) 2018-11-12 2019-04-12 华南理工大学 一种高分辨率oled显示屏的制备方法
JP7561139B2 (ja) * 2019-03-25 2024-10-03 シノヴィア テクノロジーズ 非平衡熱硬化プロセス

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