JP2006066368A - ドナー基板の製造方法 - Google Patents
ドナー基板の製造方法 Download PDFInfo
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- JP2006066368A JP2006066368A JP2004366723A JP2004366723A JP2006066368A JP 2006066368 A JP2006066368 A JP 2006066368A JP 2004366723 A JP2004366723 A JP 2004366723A JP 2004366723 A JP2004366723 A JP 2004366723A JP 2006066368 A JP2006066368 A JP 2006066368A
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- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims abstract description 25
- 238000004381 surface treatment Methods 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 230000005525 hole transport Effects 0.000 claims description 2
- 230000001629 suppression Effects 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000000059 patterning Methods 0.000 abstract description 7
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/42—Intermediate, backcoat, or covering layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/12—Preparation of material for subsequent imaging, e.g. corona treatment, simultaneous coating, pre-treatments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/38—Intermediate layers; Layers between substrate and imaging layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】 ドナー基板のベース基板を準備する段階と、該ベース基板上に光熱変換層を形成する段階と、該光熱変換層上にバッファ層を形成する段階と、前記バッファ層の表面を処理して粗さを増加させる段階と、前記表面処理されたバッファ層上に転写層を形成する段階と、を含む有機電界発光表示装置の製造方法を提供する。
【選択図】 図1B
Description
110 プライマー層
120 光熱変換層
130 バッファ層
140 転写層
200 ラジカル系列気体
Claims (5)
- ドナー基板としてベース基板を備える段階と、
該ベース基板上に光熱変換層を形成する段階と、
該光熱変換層上にバッファ層を形成する段階と、
該バッファ層の表面を処理して粗さを増加させる段階と、
該表面処理されたバッファ上に転写層を形成する段階と、
を含むことを特徴とする有機電界発光表示装置の製造方法。 - 前記バッファ層の表面を処理する段階は、酸素を含むイオンまたはラジカル系列の気体で表面処理をすることを特徴とする請求項1に記載の有機電界発光表示装置の製造方法。
- 前記ベース基板は、柔軟性のあるフィルムまたは堅い材質の基板であることを特徴とする請求項1に記載の有機電界発光表示装置の製造方法。
- 前記ドナー基板の転写層は、有機電界発光素子の発光層であることを特徴とする請求項1に記載の有機電界発光表示装置の製造方法。
- 前記ドナー基板の転写層は、正孔注入層、正孔輸送層、正孔抑制層、及び電子注入層からなる一群から選択された、少なくとも一つの層をさらに含むことを特徴とする請求項4に記載の有機電界発光表示装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040068757A KR20060020030A (ko) | 2004-08-30 | 2004-08-30 | 도너 기판의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006066368A true JP2006066368A (ja) | 2006-03-09 |
Family
ID=36099735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004366723A Pending JP2006066368A (ja) | 2004-08-30 | 2004-12-17 | ドナー基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7598115B2 (ja) |
EP (1) | EP1630868A1 (ja) |
JP (1) | JP2006066368A (ja) |
KR (1) | KR20060020030A (ja) |
CN (1) | CN1744783A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010506771A (ja) * | 2006-10-20 | 2010-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | 構造化熱転写ドナー |
CN102668704A (zh) * | 2009-12-03 | 2012-09-12 | 东丽株式会社 | 供体基板、图案化方法和器件的制造方法 |
JP2013143377A (ja) * | 2012-01-09 | 2013-07-22 | Samsung Display Co Ltd | ドナーフィルム及びこれを用いた有機発光表示装置の製造方法、並びにこれを用いて製造された有機発光表示装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100645712B1 (ko) * | 2005-09-12 | 2006-11-14 | 삼성에스디아이 주식회사 | 레이저 열전사법을 이용한 유기전계발광소자의 제조방법 |
KR100731755B1 (ko) * | 2006-05-03 | 2007-06-22 | 삼성에스디아이 주식회사 | 평판표시소자용 도너 기판 및 그를 이용한유기전계발광소자의 제조방법 |
JP2008235010A (ja) * | 2007-03-20 | 2008-10-02 | Sony Corp | 表示装置の製造方法 |
KR101307549B1 (ko) * | 2007-12-31 | 2013-09-12 | 엘지디스플레이 주식회사 | 유기전계발광표시장치의 제조방법 |
GB2462591B (en) * | 2008-08-05 | 2013-04-03 | Cambridge Display Tech Ltd | Organic thin film transistors and methods of making the same |
KR101097330B1 (ko) | 2010-01-19 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 및 이를 제조 하는 방법 |
CN102336082B (zh) * | 2010-07-19 | 2014-03-12 | 元太科技工业股份有限公司 | 转印结构及制造转印结构的方法 |
JP5731711B2 (ja) * | 2011-06-15 | 2015-06-10 | コーロン インダストリーズ インク | レーザ熱転写法用ドナーフィルム |
US9991463B2 (en) * | 2012-06-14 | 2018-06-05 | Universal Display Corporation | Electronic devices with improved shelf lives |
KR20140000565A (ko) * | 2012-06-25 | 2014-01-03 | 삼성디스플레이 주식회사 | 도너 기판, 도너 기판을 이용한 레이저 열전사 방법 및 도너 기판을 이용한 유기 발광 표시 장치의 제조 방법 |
KR20150007837A (ko) * | 2013-07-12 | 2015-01-21 | 삼성디스플레이 주식회사 | 도너 기판 및 이를 이용한 유기 발광 표시 장치의 제조방법 |
KR102352406B1 (ko) | 2015-03-02 | 2022-01-19 | 삼성디스플레이 주식회사 | 표시 장치의 제조 방법 및 표시 장치 |
Family Cites Families (15)
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JPH02253988A (ja) | 1989-03-29 | 1990-10-12 | Asahi Chem Ind Co Ltd | レーザ記録用熱転写シートおよびそれを使用した画像記録法 |
US5353498A (en) | 1993-02-08 | 1994-10-11 | General Electric Company | Method for fabricating an integrated circuit module |
US5556806A (en) * | 1995-06-28 | 1996-09-17 | Taiwan Semiconductor Manufacturing Company | Spin-on-glass nonetchback planarization process using oxygen plasma treatment |
JP3252781B2 (ja) | 1998-01-09 | 2002-02-04 | 日本電気株式会社 | 半導体装置の製造方法 |
US6153523A (en) * | 1998-12-09 | 2000-11-28 | Advanced Micro Devices, Inc. | Method of forming high density capping layers for copper interconnects with improved adhesion |
JP4590663B2 (ja) | 1999-10-29 | 2010-12-01 | セイコーエプソン株式会社 | カラーフィルタの製造方法 |
KR100451415B1 (ko) | 2000-06-01 | 2004-10-07 | 한국과학기술연구원 | 반도체 기판과 백금 전극간의 접착력 향상 방법 및반도체용 백금 전극 구조 |
US6855384B1 (en) | 2000-09-15 | 2005-02-15 | 3M Innovative Properties Company | Selective thermal transfer of light emitting polymer blends |
US6852355B2 (en) | 2001-03-01 | 2005-02-08 | E. I. Du Pont De Nemours And Company | Thermal imaging processes and products of electroactive organic material |
US6485884B2 (en) | 2001-04-27 | 2002-11-26 | 3M Innovative Properties Company | Method for patterning oriented materials for organic electronic displays and devices |
JP2002343565A (ja) * | 2001-05-18 | 2002-11-29 | Sharp Corp | 有機led表示パネルの製造方法、その方法により製造された有機led表示パネル、並びに、その方法に用いられるベースフィルム及び基板 |
US6699597B2 (en) | 2001-08-16 | 2004-03-02 | 3M Innovative Properties Company | Method and materials for patterning of an amorphous, non-polymeric, organic matrix with electrically active material disposed therein |
JP2003158194A (ja) | 2001-11-20 | 2003-05-30 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
US20030124265A1 (en) * | 2001-12-04 | 2003-07-03 | 3M Innovative Properties Company | Method and materials for transferring a material onto a plasma treated surface according to a pattern |
ATE383733T1 (de) * | 2003-11-18 | 2008-01-15 | 3M Innovative Properties Co | Elektrolumineszenzbauelemente und verfahren zur herstellung von elektrolumineszenzbauelementen mit einem farbwandlungselement |
-
2004
- 2004-08-30 KR KR1020040068757A patent/KR20060020030A/ko active Search and Examination
- 2004-12-17 JP JP2004366723A patent/JP2006066368A/ja active Pending
-
2005
- 2005-08-26 EP EP05107828A patent/EP1630868A1/en not_active Withdrawn
- 2005-08-30 US US11/214,059 patent/US7598115B2/en not_active Expired - Fee Related
- 2005-08-30 CN CNA2005100996085A patent/CN1744783A/zh active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010506771A (ja) * | 2006-10-20 | 2010-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | 構造化熱転写ドナー |
CN102668704A (zh) * | 2009-12-03 | 2012-09-12 | 东丽株式会社 | 供体基板、图案化方法和器件的制造方法 |
JP2013143377A (ja) * | 2012-01-09 | 2013-07-22 | Samsung Display Co Ltd | ドナーフィルム及びこれを用いた有機発光表示装置の製造方法、並びにこれを用いて製造された有機発光表示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1744783A (zh) | 2006-03-08 |
EP1630868A1 (en) | 2006-03-01 |
US7598115B2 (en) | 2009-10-06 |
KR20060020030A (ko) | 2006-03-06 |
US20060068520A1 (en) | 2006-03-30 |
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