JP7555829B2 - 平坦化装置、平坦化方法及び物品の製造方法 - Google Patents

平坦化装置、平坦化方法及び物品の製造方法 Download PDF

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Publication number
JP7555829B2
JP7555829B2 JP2021001035A JP2021001035A JP7555829B2 JP 7555829 B2 JP7555829 B2 JP 7555829B2 JP 2021001035 A JP2021001035 A JP 2021001035A JP 2021001035 A JP2021001035 A JP 2021001035A JP 7555829 B2 JP7555829 B2 JP 7555829B2
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Japan
Prior art keywords
superstrate
substrate
chuck
peripheral portion
edge
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JP2021001035A
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English (en)
Japanese (ja)
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JP2021125680A (ja
JP2021125680A5 (https=
Inventor
ジェイ バーメスバーガー セス
ウストゥルク ウスカン
エリス ジョーンズ クリストファー
イム セヒュン
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Canon Inc
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Canon Inc
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Publication of JP2021125680A5 publication Critical patent/JP2021125680A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01326—Aspects related to lithography, isolation or planarisation of the conductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Micromachines (AREA)
JP2021001035A 2020-01-31 2021-01-06 平坦化装置、平坦化方法及び物品の製造方法 Active JP7555829B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/779,205 US11562924B2 (en) 2020-01-31 2020-01-31 Planarization apparatus, planarization process, and method of manufacturing an article
US16/779,205 2020-01-31

Publications (3)

Publication Number Publication Date
JP2021125680A JP2021125680A (ja) 2021-08-30
JP2021125680A5 JP2021125680A5 (https=) 2023-09-25
JP7555829B2 true JP7555829B2 (ja) 2024-09-25

Family

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Family Applications (1)

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JP2021001035A Active JP7555829B2 (ja) 2020-01-31 2021-01-06 平坦化装置、平坦化方法及び物品の製造方法

Country Status (4)

Country Link
US (2) US11562924B2 (https=)
JP (1) JP7555829B2 (https=)
KR (1) KR102831923B1 (https=)
TW (1) TWI817064B (https=)

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Also Published As

Publication number Publication date
US11562924B2 (en) 2023-01-24
JP2021125680A (ja) 2021-08-30
TW202143330A (zh) 2021-11-16
KR20210098334A (ko) 2021-08-10
TWI817064B (zh) 2023-10-01
KR102831923B1 (ko) 2025-07-10
US20230061361A1 (en) 2023-03-02
US20210242073A1 (en) 2021-08-05
US12283522B2 (en) 2025-04-22

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