KR102831923B1 - 평탄화 장치, 평탄화 공정, 및 물품 제조 방법 - Google Patents

평탄화 장치, 평탄화 공정, 및 물품 제조 방법 Download PDF

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Publication number
KR102831923B1
KR102831923B1 KR1020210007179A KR20210007179A KR102831923B1 KR 102831923 B1 KR102831923 B1 KR 102831923B1 KR 1020210007179 A KR1020210007179 A KR 1020210007179A KR 20210007179 A KR20210007179 A KR 20210007179A KR 102831923 B1 KR102831923 B1 KR 102831923B1
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South Korea
Prior art keywords
top plate
substrate
edge
chuck
mesa
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Korean (ko)
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KR20210098334A (ko
Inventor
제이 세스 베임스버거
오즈칸 오즈투르크
엘리스 크리스토퍼 존스
임세혁
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H01L21/28123—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01326—Aspects related to lithography, isolation or planarisation of the conductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Micromachines (AREA)
KR1020210007179A 2020-01-31 2021-01-19 평탄화 장치, 평탄화 공정, 및 물품 제조 방법 Active KR102831923B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/779,205 US11562924B2 (en) 2020-01-31 2020-01-31 Planarization apparatus, planarization process, and method of manufacturing an article
US16/779,205 2020-01-31

Publications (2)

Publication Number Publication Date
KR20210098334A KR20210098334A (ko) 2021-08-10
KR102831923B1 true KR102831923B1 (ko) 2025-07-10

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ID=77062134

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210007179A Active KR102831923B1 (ko) 2020-01-31 2021-01-19 평탄화 장치, 평탄화 공정, 및 물품 제조 방법

Country Status (4)

Country Link
US (2) US11562924B2 (https=)
JP (1) JP7555829B2 (https=)
KR (1) KR102831923B1 (https=)
TW (1) TWI817064B (https=)

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US11908711B2 (en) * 2020-09-30 2024-02-20 Canon Kabushiki Kaisha Planarization process, planarization system and method of manufacturing an article
US12282251B2 (en) 2021-09-24 2025-04-22 Canon Kabushiki Kaisha Method of shaping a surface, shaping system, and method of manufacturing an article
US12195382B2 (en) * 2021-12-01 2025-01-14 Canon Kabushiki Kaisha Superstrate and a method of using the same
US20250269438A1 (en) * 2024-02-27 2025-08-28 Canon Kabushiki Kaisha Chuck assembly, planarization process, apparatus and method of manufacturing an article

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Also Published As

Publication number Publication date
JP7555829B2 (ja) 2024-09-25
US11562924B2 (en) 2023-01-24
JP2021125680A (ja) 2021-08-30
TW202143330A (zh) 2021-11-16
KR20210098334A (ko) 2021-08-10
TWI817064B (zh) 2023-10-01
US20230061361A1 (en) 2023-03-02
US20210242073A1 (en) 2021-08-05
US12283522B2 (en) 2025-04-22

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