JP7510431B2 - 記憶装置 - Google Patents

記憶装置 Download PDF

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Publication number
JP7510431B2
JP7510431B2 JP2021550719A JP2021550719A JP7510431B2 JP 7510431 B2 JP7510431 B2 JP 7510431B2 JP 2021550719 A JP2021550719 A JP 2021550719A JP 2021550719 A JP2021550719 A JP 2021550719A JP 7510431 B2 JP7510431 B2 JP 7510431B2
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JP
Japan
Prior art keywords
transistor
insulator
oxide
conductor
wiring
Prior art date
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Active
Application number
JP2021550719A
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English (en)
Japanese (ja)
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JPWO2021069998A1 (https=
JPWO2021069998A5 (https=
Inventor
智 大下
寛司 國武
一樹 津田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of JPWO2021069998A1 publication Critical patent/JPWO2021069998A1/ja
Publication of JPWO2021069998A5 publication Critical patent/JPWO2021069998A5/ja
Priority to JP2024100616A priority Critical patent/JP7711271B2/ja
Application granted granted Critical
Publication of JP7510431B2 publication Critical patent/JP7510431B2/ja
Priority to JP2025116148A priority patent/JP2025137576A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/405—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Dram (AREA)
JP2021550719A 2019-10-11 2020-09-25 記憶装置 Active JP7510431B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024100616A JP7711271B2 (ja) 2019-10-11 2024-06-21 記憶装置
JP2025116148A JP2025137576A (ja) 2019-10-11 2025-07-09 記憶装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019187386 2019-10-11
JP2019187386 2019-10-11
PCT/IB2020/058976 WO2021069998A1 (ja) 2019-10-11 2020-09-25 記憶装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024100616A Division JP7711271B2 (ja) 2019-10-11 2024-06-21 記憶装置

Publications (3)

Publication Number Publication Date
JPWO2021069998A1 JPWO2021069998A1 (https=) 2021-04-15
JPWO2021069998A5 JPWO2021069998A5 (https=) 2023-07-26
JP7510431B2 true JP7510431B2 (ja) 2024-07-03

Family

ID=75438027

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021550719A Active JP7510431B2 (ja) 2019-10-11 2020-09-25 記憶装置
JP2024100616A Active JP7711271B2 (ja) 2019-10-11 2024-06-21 記憶装置
JP2025116148A Pending JP2025137576A (ja) 2019-10-11 2025-07-09 記憶装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024100616A Active JP7711271B2 (ja) 2019-10-11 2024-06-21 記憶装置
JP2025116148A Pending JP2025137576A (ja) 2019-10-11 2025-07-09 記憶装置

Country Status (5)

Country Link
US (1) US12082391B2 (https=)
JP (3) JP7510431B2 (https=)
KR (1) KR20220079567A (https=)
CN (1) CN114503202A (https=)
WO (1) WO2021069998A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7195068B2 (ja) * 2017-06-26 2022-12-23 株式会社半導体エネルギー研究所 半導体装置、電子機器
US11984165B2 (en) 2022-05-24 2024-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device with reduced area
CN116209253B (zh) * 2022-09-23 2024-02-20 北京超弦存储器研究院 存储单元、动态存储器、其读取方法及电子设备
US20250086443A1 (en) * 2023-09-11 2025-03-13 Macronix International Co., Ltd. Universal memories for in-memory computing
WO2025109451A1 (ja) * 2023-11-24 2025-05-30 株式会社半導体エネルギー研究所 半導体装置及び記憶装置
CN119418747A (zh) * 2024-11-08 2025-02-11 华中科技大学 一种动态存储器结构及其操作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115387A (ja) 2014-12-11 2016-06-23 株式会社半導体エネルギー研究所 半導体装置、記憶装置及び電子機器
JP2017168809A (ja) 2015-10-22 2017-09-21 株式会社半導体エネルギー研究所 半導体装置、又は該半導体装置を有する記憶装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1998373A3 (en) 2005-09-29 2012-10-31 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device having oxide semiconductor layer and manufacturing method thereof
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
KR101870119B1 (ko) 2009-12-25 2018-06-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101891065B1 (ko) 2010-03-19 2018-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 구동 방법
KR101853516B1 (ko) * 2010-07-27 2018-04-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9978879B2 (en) * 2016-08-31 2018-05-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6693907B2 (ja) 2017-06-08 2020-05-13 株式会社半導体エネルギー研究所 半導体装置、記憶装置、及び電子機器
JP7195068B2 (ja) * 2017-06-26 2022-12-23 株式会社半導体エネルギー研究所 半導体装置、電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115387A (ja) 2014-12-11 2016-06-23 株式会社半導体エネルギー研究所 半導体装置、記憶装置及び電子機器
JP2017168809A (ja) 2015-10-22 2017-09-21 株式会社半導体エネルギー研究所 半導体装置、又は該半導体装置を有する記憶装置

Also Published As

Publication number Publication date
WO2021069998A1 (ja) 2021-04-15
KR20220079567A (ko) 2022-06-13
US20220344334A1 (en) 2022-10-27
JPWO2021069998A1 (https=) 2021-04-15
JP2025137576A (ja) 2025-09-19
JP2024117815A (ja) 2024-08-29
US12082391B2 (en) 2024-09-03
JP7711271B2 (ja) 2025-07-22
CN114503202A (zh) 2022-05-13

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