JP7493709B2 - 共振装置及び共振装置製造方法 - Google Patents

共振装置及び共振装置製造方法 Download PDF

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Publication number
JP7493709B2
JP7493709B2 JP2022560644A JP2022560644A JP7493709B2 JP 7493709 B2 JP7493709 B2 JP 7493709B2 JP 2022560644 A JP2022560644 A JP 2022560644A JP 2022560644 A JP2022560644 A JP 2022560644A JP 7493709 B2 JP7493709 B2 JP 7493709B2
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Japan
Prior art keywords
layer
resonator
substrate
metal
metal layer
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Japanese (ja)
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JPWO2022097328A5 (https=
JPWO2022097328A1 (https=
Inventor
敬之 樋口
政和 福光
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/18—Zonal welding by interposing weld-preventing substances between zones not to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/032—Bimorph and unimorph actuators, e.g. piezo and thermo
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
JP2022560644A 2020-11-06 2021-07-02 共振装置及び共振装置製造方法 Active JP7493709B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020185834 2020-11-06
JP2020185834 2020-11-06
PCT/JP2021/025075 WO2022097328A1 (ja) 2020-11-06 2021-07-02 共振装置及び共振装置製造方法

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JPWO2022097328A1 JPWO2022097328A1 (https=) 2022-05-12
JPWO2022097328A5 JPWO2022097328A5 (https=) 2023-06-08
JP7493709B2 true JP7493709B2 (ja) 2024-06-03

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US (1) US20230208392A1 (https=)
JP (1) JP7493709B2 (https=)
CN (1) CN116133782B (https=)
WO (1) WO2022097328A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI131276B1 (en) * 2023-07-17 2025-01-22 Kyocera Tech Oy IMPLEMENTATIONS TO SILICON

Citations (12)

* Cited by examiner, † Cited by third party
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WO2011111541A1 (ja) 2010-03-09 2011-09-15 アルプス電気株式会社 Ｍｅｍｓセンサ
JP2014200041A (ja) 2013-03-29 2014-10-23 セイコーエプソン株式会社 振動片の電極構造、振動片の製造方法、振動子、発振器、電子機器および移動体
WO2018008480A1 (ja) 2016-07-05 2018-01-11 株式会社村田製作所 共振子及び共振装置
WO2019155663A1 (ja) 2018-02-09 2019-08-15 株式会社村田製作所 Ｍｅｍｓデバイス
WO2019159410A1 (ja) 2018-02-14 2019-08-22 株式会社村田製作所 共振装置及び共振装置製造方法
WO2020027121A1 (ja) 2018-08-02 2020-02-06 株式会社村田製作所 Ｍｅｍｓデバイス
WO2020049814A1 (ja) 2018-09-04 2020-03-12 株式会社村田製作所 Ｍｅｍｓデバイスの製造方法及びｍｅｍｓデバイス
WO2020066126A1 (ja) 2018-09-28 2020-04-02 株式会社村田製作所 共振装置及び共振装置製造方法
WO2020085188A1 (ja) 2018-10-24 2020-04-30 株式会社村田製作所 共振装置
WO2020194810A1 (ja) 2019-03-26 2020-10-01 株式会社村田製作所 共振装置及び共振装置製造方法
WO2020255474A1 (ja) 2019-06-19 2020-12-24 株式会社村田製作所 共振装置及び共振装置製造方法
WO2021044663A1 (ja) 2019-09-05 2021-03-11 株式会社村田製作所 パッケージ構造及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4086023B2 (ja) * 2003-12-04 2008-05-14 セイコーエプソン株式会社 マイクロメカニカル静電振動子
JP4458203B2 (ja) * 2007-12-06 2010-04-28 株式会社村田製作所 圧電振動部品
JP2017130823A (ja) * 2016-01-21 2017-07-27 京セラ株式会社 圧電発振器及びその製造方法
WO2019111740A1 (ja) * 2017-12-06 2019-06-13 株式会社村田製作所 電子部品

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111541A1 (ja) 2010-03-09 2011-09-15 アルプス電気株式会社 Ｍｅｍｓセンサ
JP2014200041A (ja) 2013-03-29 2014-10-23 セイコーエプソン株式会社 振動片の電極構造、振動片の製造方法、振動子、発振器、電子機器および移動体
WO2018008480A1 (ja) 2016-07-05 2018-01-11 株式会社村田製作所 共振子及び共振装置
WO2019155663A1 (ja) 2018-02-09 2019-08-15 株式会社村田製作所 Ｍｅｍｓデバイス
WO2019159410A1 (ja) 2018-02-14 2019-08-22 株式会社村田製作所 共振装置及び共振装置製造方法
WO2020027121A1 (ja) 2018-08-02 2020-02-06 株式会社村田製作所 Ｍｅｍｓデバイス
WO2020049814A1 (ja) 2018-09-04 2020-03-12 株式会社村田製作所 Ｍｅｍｓデバイスの製造方法及びｍｅｍｓデバイス
WO2020066126A1 (ja) 2018-09-28 2020-04-02 株式会社村田製作所 共振装置及び共振装置製造方法
WO2020085188A1 (ja) 2018-10-24 2020-04-30 株式会社村田製作所 共振装置
WO2020194810A1 (ja) 2019-03-26 2020-10-01 株式会社村田製作所 共振装置及び共振装置製造方法
WO2020255474A1 (ja) 2019-06-19 2020-12-24 株式会社村田製作所 共振装置及び共振装置製造方法
WO2021044663A1 (ja) 2019-09-05 2021-03-11 株式会社村田製作所 パッケージ構造及びその製造方法

Also Published As

Publication number Publication date
US20230208392A1 (en) 2023-06-29
JPWO2022097328A1 (https=) 2022-05-12
CN116133782A (zh) 2023-05-16
CN116133782B (zh) 2026-03-13
WO2022097328A1 (ja) 2022-05-12

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