CN116133782B - 谐振装置以及谐振装置制造方法 - Google Patents

谐振装置以及谐振装置制造方法

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Publication number
CN116133782B
CN116133782B CN202180063936.7A CN202180063936A CN116133782B CN 116133782 B CN116133782 B CN 116133782B CN 202180063936 A CN202180063936 A CN 202180063936A CN 116133782 B CN116133782 B CN 116133782B
Authority
CN
China
Prior art keywords
layer
substrate
metal
resonator
diffusion preventing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180063936.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN116133782A (zh
Inventor
樋口敬之
福光政和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN116133782A publication Critical patent/CN116133782A/zh
Application granted granted Critical
Publication of CN116133782B publication Critical patent/CN116133782B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/18—Zonal welding by interposing weld-preventing substances between zones not to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/032—Bimorph and unimorph actuators, e.g. piezo and thermo
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
CN202180063936.7A 2020-11-06 2021-07-02 谐振装置以及谐振装置制造方法 Active CN116133782B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020185834 2020-11-06
JP2020-185834 2020-11-06
PCT/JP2021/025075 WO2022097328A1 (ja) 2020-11-06 2021-07-02 共振装置及び共振装置製造方法

Publications (2)

Publication Number Publication Date
CN116133782A CN116133782A (zh) 2023-05-16
CN116133782B true CN116133782B (zh) 2026-03-13

Family

ID=81457684

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180063936.7A Active CN116133782B (zh) 2020-11-06 2021-07-02 谐振装置以及谐振装置制造方法

Country Status (4)

Country Link
US (1) US20230208392A1 (https=)
JP (1) JP7493709B2 (https=)
CN (1) CN116133782B (https=)
WO (1) WO2022097328A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI131276B1 (en) * 2023-07-17 2025-01-22 Kyocera Tech Oy IMPLEMENTATIONS TO SILICON

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683896A (zh) * 2018-02-09 2020-09-18 株式会社村田制作所 Mems设备

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JP4086023B2 (ja) * 2003-12-04 2008-05-14 セイコーエプソン株式会社 マイクロメカニカル静電振動子
JP4458203B2 (ja) * 2007-12-06 2010-04-28 株式会社村田製作所 圧電振動部品
CN102792168B (zh) * 2010-03-09 2014-04-30 阿尔卑斯电气株式会社 Mems传感器
JP6163832B2 (ja) * 2013-03-29 2017-07-19 セイコーエプソン株式会社 振動片、振動片の製造方法、振動子、発振器、電子機器および移動体
JP2017130823A (ja) * 2016-01-21 2017-07-27 京セラ株式会社 圧電発振器及びその製造方法
WO2018008198A1 (ja) * 2016-07-05 2018-01-11 株式会社村田製作所 共振子及び共振装置
WO2019111740A1 (ja) * 2017-12-06 2019-06-13 株式会社村田製作所 電子部品
WO2019159410A1 (ja) * 2018-02-14 2019-08-22 株式会社村田製作所 共振装置及び共振装置製造方法
CN112335178B (zh) * 2018-08-02 2024-02-13 株式会社村田制作所 Mems设备
JP7047922B2 (ja) * 2018-09-04 2022-04-05 株式会社村田製作所 Ｍｅｍｓデバイスの製造方法及びｍｅｍｓデバイス
CN112689957B (zh) * 2018-09-28 2024-05-14 株式会社村田制作所 共振装置和共振装置的制造方法
CN112740550B (zh) * 2018-10-24 2024-03-22 株式会社村田制作所 谐振装置
CN113491069B (zh) * 2019-03-26 2024-05-28 株式会社村田制作所 谐振装置和谐振装置制造方法
CN113632375A (zh) * 2019-06-19 2021-11-09 株式会社村田制作所 谐振装置以及谐振装置制造方法
JP7154487B2 (ja) * 2019-09-05 2022-10-18 株式会社村田製作所 パッケージ構造及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683896A (zh) * 2018-02-09 2020-09-18 株式会社村田制作所 Mems设备

Also Published As

Publication number Publication date
US20230208392A1 (en) 2023-06-29
JPWO2022097328A1 (https=) 2022-05-12
CN116133782A (zh) 2023-05-16
JP7493709B2 (ja) 2024-06-03
WO2022097328A1 (ja) 2022-05-12

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