JP7472601B2 - 配線電極付き基板の製造方法 - Google Patents

配線電極付き基板の製造方法 Download PDF

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JP7472601B2
JP7472601B2 JP2020062554A JP2020062554A JP7472601B2 JP 7472601 B2 JP7472601 B2 JP 7472601B2 JP 2020062554 A JP2020062554 A JP 2020062554A JP 2020062554 A JP2020062554 A JP 2020062554A JP 7472601 B2 JP7472601 B2 JP 7472601B2
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wiring electrode
opaque wiring
photosensitive composition
positive photosensitive
substrate
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JP2021162666A (ja
JP2021162666A5 (https=
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修平 山村
年矢 兒玉
龍太郎 池田
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Toray Industries Inc
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Toray Industries Inc
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  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020062554A 2020-03-31 2020-03-31 配線電極付き基板の製造方法 Active JP7472601B2 (ja)

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JP2020062554A JP7472601B2 (ja) 2020-03-31 2020-03-31 配線電極付き基板の製造方法

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JP2020062554A JP7472601B2 (ja) 2020-03-31 2020-03-31 配線電極付き基板の製造方法

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JP2021162666A JP2021162666A (ja) 2021-10-11
JP2021162666A5 JP2021162666A5 (https=) 2022-08-18
JP7472601B2 true JP7472601B2 (ja) 2024-04-23

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* Cited by examiner, † Cited by third party
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JPWO2024004318A1 (https=) * 2022-06-27 2024-01-04

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264811A (ja) 2000-03-22 2001-09-26 Fujitsu Ltd 液晶表示装置の製造方法及び露光装置
WO2018168325A1 (ja) 2017-03-17 2018-09-20 東レ株式会社 配線電極付き基板の製造方法および配線電極付き基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2943331B2 (ja) * 1990-12-25 1999-08-30 富士通株式会社 露光方法及び露光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264811A (ja) 2000-03-22 2001-09-26 Fujitsu Ltd 液晶表示装置の製造方法及び露光装置
WO2018168325A1 (ja) 2017-03-17 2018-09-20 東レ株式会社 配線電極付き基板の製造方法および配線電極付き基板

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