JP7456436B2 - Exposure equipment, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method.

In lithography processes for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements, an exposure apparatus is used to transfer a pattern formed on a mask (or reticle) onto a substrate (such as a substrate made of glass, plastic, etc., or a semiconductor wafer) using an energy beam.

In this type of exposure apparatus, a substrate transport device is used to transport an exposed substrate onto a stage device that holds the substrate, and to transport a new substrate onto the stage device. As a method for transporting a substrate, for example, the method described in Patent Document 1 is known.

International Publication No. 2013/150787

The exposure apparatus includes an exposure apparatus main body, a chamber that accommodates the exposure apparatus main body, and a substrate holding section provided in the chamber that receives and holds a substrate transported by an external transport robot outside the chamber. Transfer of the substrate from the external transfer robot to the substrate holding unit, Transfer of the substrate from the substrate holding unit onto a holding device included in the exposure apparatus main body, Transfer of the substrate from the holding device to the external transfer robot and a board transfer device that performs the transfer.

Note that the configurations of the embodiments described below may be modified as appropriate, and at least a portion thereof may be replaced with other components. Further, the configuration elements whose arrangement is not particularly limited are not limited to the arrangement disclosed in the embodiments, but can be arranged at a position where the function can be achieved.

FIG. 1(a) is a diagram schematically showing an exposure apparatus according to the first embodiment, and FIG. 1(b) is a cross-sectional view taken along line AA in FIG. 1(a). FIG. 2 is a cross-sectional view of FIG. 1(a). 3(a) is a diagram showing the board loading/unloading unit of FIG. 1(a) taken out, and FIG. 3(b) is a diagram showing the board loading/unloading unit of FIG. 3(a) viewed from the +X side. FIG. 4(a) and 4(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 1). 5(a) and 5(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 2). 6(a) and 6(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 3). 7(a) and 7(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 4). 8(a) and 8(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 5). 9(a) and 9(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 6). 10(a) and 10(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 7). 11(a) and 11(b) are a plan view of the vicinity of the stage device and a sectional view taken along the line AA in FIG. 1(a), and are diagrams for explaining the substrate exchange operation of the first embodiment ( Part 8). FIG. 3 is a diagram (part 1) showing an exposure apparatus according to a second embodiment. FIG. 13 is a second diagram showing the exposure apparatus according to the second embodiment. FIG. 7 is a cross-sectional view of an exposure apparatus according to a third embodiment. FIGS. 15(a) and 15(b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device, and are diagrams (part 1) for explaining the substrate exchange operation of the third embodiment. 16(a) and 16(b) are a plan view and a vertical cross-sectional view of the vicinity of the stage device, and are diagrams (part 2) for explaining the substrate exchange operation of the third embodiment. 17A and 17B are a plan view and a longitudinal sectional view of the vicinity of the stage device, respectively, and are views (part 3) for explaining the substrate exchange operation of the third embodiment. 18A and 18B are a plan view and a longitudinal sectional view of the vicinity of the stage device, and are diagrams (part 4) for explaining the substrate exchange operation of the third embodiment. 19(a) and 19(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device of an exposure apparatus according to the fourth embodiment, and are diagrams (part 1) for explaining the substrate exchange operation. . 20(a) and 20(b) are a plan view and a vertical cross-sectional view of the vicinity of the stage device of the exposure apparatus according to the fourth embodiment, and are diagrams (part 2) for explaining the substrate exchange operation. . FIGS. 21(a) and 21(b) are diagrams for explaining the substrate loading/unloading unit according to the fifth embodiment. 22(a) and 22(b) are a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to a sixth embodiment, and are diagrams (part 1) for explaining a substrate exchange operation. 23(a) and 23(b) are a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to a sixth embodiment, and are diagrams (part 2) for explaining the substrate exchange operation. FIG. 7 is a vertical cross-sectional view of the exposure apparatus according to the sixth embodiment, and is a diagram (part 3) for explaining the substrate exchange operation. FIG. 7 is a longitudinal cross-sectional view of an exposure apparatus according to a seventh embodiment. 26(a) and 26(b) are a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the eighth embodiment, and are diagrams (part 1) for explaining the substrate exchange operation. FIGS. 27(a) and 27(b) are diagrams (part 2) for explaining the board exchange operation of the eighth embodiment. FIGS. 28(a) and 28(b) are diagrams (part 3) for explaining the board exchange operation of the eighth embodiment. FIGS. 29(a) and 29(b) are diagrams (part 4) for explaining the board exchange operation of the eighth embodiment. FIGS. 30(a) and 30(b) are diagrams (part 5) for explaining the board exchange operation of the eighth embodiment. 31(a) and 31(b) are a horizontal sectional view and a vertical sectional view of an exposure apparatus according to a ninth embodiment, and are views (part 1) for explaining a substrate replacement operation. 32(a) and 32(b) are diagrams (part 2) for explaining the substrate exchange operation in the exposure apparatus according to the ninth embodiment. 33(a) and 33(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 1) for explaining the substrate replacement operation. 34(a) and 34(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 2) for explaining the substrate replacement operation. FIGS. 35(a) and 35(b) are a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the eleventh embodiment, and are diagrams (part 1) for explaining the substrate exchange operation. 36(a) and 36(b) are a cross-sectional view and a vertical cross-sectional view of the exposure apparatus according to the eleventh embodiment, and are diagrams (part 2) for explaining the substrate exchange operation. FIGS. 37(a) and 37(b) are a cross-sectional view and a vertical cross-sectional view of the exposure apparatus according to the eleventh embodiment, and are diagrams (part 3) for explaining the substrate exchange operation. 38(a) to 38(c) are vertical cross-sectional views of the exposure apparatus according to the eleventh embodiment, and are views (part 4) for explaining the substrate replacement operation. FIG. 39(a) is a longitudinal cross-sectional view of the vicinity of the screen member according to the twelfth embodiment, and FIG. 39(b) is a cross-sectional view taken along the line BB in FIG. 39(a). FIGS. 40(a) and 40(b) are diagrams (part 1) for explaining the board exchange operation in the twelfth embodiment. FIGS. 41(a) to 41(c) are diagrams (part 2) for explaining the board exchange operation in the twelfth embodiment. It is a figure for explaining the modification (part 1) of a substrate feeder. FIGS. 43(a) and 43(b) are diagrams for explaining a modified example (part 2) of the substrate feeder.

≪First embodiment≫
A first embodiment of the present invention will be described below based on FIGS. 1 to 11.

FIG. 1A is a vertical cross-sectional view schematically showing the configuration of an exposure apparatus 100 according to the first embodiment. Further, FIG. 1(b) shows a cross-sectional view taken along line AA in FIG. 1(a), and FIG. 2 shows a cross-sectional view in FIG. 1(a). Note that in FIG. 1(b), illustration of the chamber 200 and the illumination system 12 is omitted for convenience.

1A, the exposure apparatus 100 includes a chamber 200, an exposure apparatus main body 10, a substrate carry-in/out unit 150, and a substrate slide hand 140, which are housed in the chamber 200. An external transfer robot 300 is provided outside the chamber 200 of the exposure apparatus 100, and the external transfer robot 300 transports a substrate P from an external device (not shown) to the exposure apparatus 100 and transports the substrate P from the exposure apparatus 100 to the external device.

(chamber 200)
The chamber 200 forms a space in which the internal environment (at least one of temperature, humidity, pressure, and cleanliness) is adjusted, and an opening 200a used for carrying in and out of the substrate P is formed in a part of the chamber. has been done.

(Exposure device main body 10)
The exposure apparatus main body 10 is a step-and-scan type exposure apparatus in which the exposure target is a rectangular (square) glass substrate P (hereinafter simply referred to as substrate P) used for, for example, a liquid crystal display device (flat panel display). This is a projection exposure device, a so-called scanner.

The exposure apparatus main body 10 includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, and a resist on the surface (the surface facing +Z side in FIG. 1(a)). It has a stage device 20 that holds a substrate P coated with a (sensitizing agent), a control system for these, and the like. Hereinafter, as shown in FIG. 1(a), an X-axis, a Y-axis, and a Z-axis that are perpendicular to each other are set for the exposure apparatus main body 10, and the mask M and the substrate P are aligned with respect to the projection optical system 16 during exposure. The following description assumes that relative scanning is performed along the X-axis direction, and that the Y-axis is set within a horizontal plane. Further, the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis will be described as θx, θy, and θz directions, respectively. Further, positions in the X-axis, Y-axis, and Z-axis directions will be described as an X position, a Y position, and a Z position, respectively.

The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331, and irradiates the mask M with exposure illumination light (illumination light) IL. As the illumination light IL, for example, light including at least one wavelength of i-line (wavelength: 365 nm), g-line (wavelength: 436 nm), and h-line (wavelength: 405 nm) is used. Further, the light source used in the illumination system 12 and the wavelength of the illumination light IL emitted from the light source are not particularly limited. It may be light or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm).

The mask stage 14 holds a light-transmitting mask M. The mask stage 14 is mounted in a non-contact state on a pair of mask stage guides 218 fixed on a lens barrel base 216. The pair of mask stage guides 218 are rectangular column-shaped members with the X-axis direction as the longitudinal direction, and are arranged at a predetermined interval in the Y-axis direction as shown in FIG. 1B. The mask stage 14 is driven by a mask stage drive system (not shown) including, for example, a linear motor at a predetermined stroke in the scanning direction (X-axis direction). The mask stage 14 is driven by a fine movement drive system that moves the X position or Y position by a stroke in order to adjust the relative position with at least one of the illumination system 12, the stage device 20, and the projection optical system 16. The position information of the mask stage 14 is obtained by a mask stage position measurement system (not shown) including, for example, a linear encoder system and an interferometer system.

The projection optical system 16 is supported by a lens barrel base 216 below the mask stage 14 (-Z side). The projection optical system 16 is a so-called multi-lens projection optical system having a similar configuration to the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775, and forms an erect normal image, for example. It is equipped with multiple optical systems that are telecentric on both sides. Note that the projection optical system 16 does not have to be a multi-lens type. The projection optical system may be configured by one projection optical system such as that used in a semiconductor exposure apparatus.

In the exposure apparatus main body 10, when the mask M located within a predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, a projected image (a partial pattern image) of the pattern of the mask M within the illumination area is generated. ) is formed in the exposure area by the projection optical system 16. Then, as the mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area in the scanning direction, scanning exposure is performed on the substrate P, The pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

The stage device 20 includes a surface plate 22, a substrate table 24, a support device 26, and a substrate holder 28.

The surface plate 22 is provided on a pair of stage frames 212 supported from below by a vibration isolator 210 installed on the floor F. Note that the pair of stage frames 212 support a pair of side columns 214, and a lens barrel base 216 is supported by the pair of side columns 214. The surface plate 22 is made of, for example, a rectangular plate-shaped member in a plan view (as viewed from the +Z side) arranged so that the upper surface (+Z plane) is parallel to the XY plane.

The support device 26 is placed on the surface plate 22 in a non-contact manner, and supports the substrate table 24 from below in a non-contact manner. The substrate holder 28 is arranged on the substrate table 24, and the substrate table 24 and the substrate holder 28 are integrally driven by a stage drive system (not shown) included in the stage device 20. The stage drive system includes, for example, a linear motor, and a coarse movement system that can drive the substrate table 24 with a predetermined stroke in the X-axis and Y-axis directions (along the top surface of the surface plate 22), and a voice coil motor, for example. and a fine movement system that finely moves the substrate table 24 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions. Furthermore, the stage device 20 includes, for example, an optical interferometer system, an encoder system, and the like, and is equipped with a stage measurement system for determining positional information of the substrate table 24 in the directions of the six degrees of freedom. Note that FIG. 1B and FIG. 2 illustrate a Y interferometer 32Y included in the stage measurement system and a Y movable mirror (bar mirror) 34Y having a reflecting surface orthogonal to the Y axis. The Y moving mirror 34Y is fixed to the substrate table 24.

The substrate holder 28 has an upper surface 28u (+Z side surface) that is rectangular in plan view, and the substrate P is placed on the upper surface 28u. As shown in FIG. 2, the upper surface 28u of the substrate holder 28 has approximately the same aspect ratio as the substrate P. As an example, the lengths of the long sides and short sides of the upper surface 28u are set to be somewhat shorter than the lengths of the long sides and short sides of the substrate P, respectively.

The entire upper surface 28u of the substrate holder 28 is finished flat. Further, on the upper surface 28u of the substrate holder 28, a plurality of minute holes (not shown) for air blowing and a plurality of minute holes (not shown) for vacuum suction are formed. Note that a common hole may be used as the air blowing minute hole and the vacuum suction minute hole. The substrate holder 28 uses vacuum suction power supplied from a vacuum device (not shown) to suck air between the upper surface 28u and the substrate P through the plurality of holes, and places the substrate P on the upper surface 28u. It is possible to adsorb it (flatten it). The substrate holder 28 is a so-called pin chuck type holder, and a plurality of pins (pins having a very small diameter, for example, about 1 mm in diameter) are arranged at approximately equal intervals. By having the plurality of pins, the substrate holder 28 can reduce the possibility of supporting the substrate P by trapping dust or foreign matter on the back surface of the substrate P, and can reduce the possibility of deformation of the substrate P due to the foreign matter being caught. The substrate P is held (supported) on the upper surface of a plurality of pins. The XY plane formed by the upper surfaces of the plurality of pins is the upper surface of the substrate holder 28. The substrate holder 28 also supplies (supplies) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the upper surface 28u and the substrate P through the hole. Accordingly, it is possible to separate the back surface of the substrate P attracted to the substrate holder 28 from the upper surface 28u (float the substrate P). In addition, it is possible to create a time difference in the timing of supplying pressurized gas in each of the plurality of holes formed in the substrate holder 28, or to create a time difference between the holes for vacuum suction and the hole for supplying pressurized gas. The grounding state of the substrate P is controlled by replacing the air as appropriate and changing the air pressure between suction and air supply (for example, to prevent air from forming between the back surface of the substrate P and the top surface 28u of the substrate holder 28). ) can be done to prevent this from occurring.

Note that the substrate holder 28 may correct the plane of the substrate P while floating and supporting the substrate P without adsorbing the substrate P to the upper surface 28u. In this case, the substrate holder 28 supplies (air supply) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) to the back surface of the substrate P through the hole. Gas is interposed between the lower surface of P and the upper surface 28u of the substrate holder 28 (that is, a gas film is formed). Further, the substrate holder 28 uses a vacuum suction device to suck gas between the substrate holder 28 and the substrate P through the vacuum suction hole, and applies a downward force (preload) to the substrate P in the direction of gravity. ) to impart rigidity to the gas film in the direction of gravity. The substrate holder 28 holds (supports) the substrate P in a non-contact manner by floating the substrate P through a small clearance in the Z-axis direction by balancing the pressure and flow rate of the pressurized gas with the vacuum suction force. A force for controlling the flatness of P (for example, a force for correcting or correcting the flatness) may be applied to P. Note that each hole may be formed by processing the substrate holder 28, or the substrate holder 28 may be formed of a porous material so that air can be supplied or sucked. Further, the upper surface 28u of the substrate holder 28 on which the substrate P is supported by floating is not the surface on which the hole is formed, but a virtual surface located above the surface by the above-mentioned clearance, that is, the surface of the substrate whose plane has been corrected. The upper surface is referred to as an upper surface 28u.

As shown in FIGS. 1A and 2, for example, two notches 28a are formed at the -X side end of the upper surface 28u of the substrate holder 28, spaced apart in the Y-axis direction. A substrate carry-in bearer device 25 is provided near the two notches 28a. The substrate carry-in bearer device 25 includes a suction pad 27 that sucks and holds the lower surface of the substrate P by vacuum suction force supplied from a vacuum device (not shown), and a Z drive mechanism 23Z that drives the suction pad 27 along the Z-axis direction. and a Y drive mechanism 23Y that drives the Z drive mechanism 23Z (and the suction pad 27) along the Y-axis direction. The suction pad 27 is located in the notch 28a formed in the substrate holder 28 in a state located on the -Z side. Further, the suction pad 27 is positioned above the substrate holder 28 in a state located furthest to the +Z side.

In the exposure apparatus main body 10, a mask loader (not shown) loads the mask M onto the mask stage 14 under the control of a main controller (not shown), and a substrate loading/unloading unit 150 (described later) and a substrate slide. The hand 140 carries the substrate P onto the substrate holder 28 . Thereafter, the main controller executes alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, exposure is sequentially performed on multiple shot areas set on the substrate P using a step-and-scan method. An action is taken. Since this exposure operation is similar to the conventional step-and-scan exposure operation, the X direction is taken as the scan direction. Note that a detailed explanation of the step-and-scan exposure operation will be omitted. Then, the substrate P on which the exposure process has been completed is carried out from above the substrate holder 28 by the substrate slide hand 140 or the like, and another substrate P to be exposed next is carried into the substrate holder 28. The substrates P are exchanged, and a series of exposure operations for the plurality of substrates P are performed continuously.

(Substrate loading/unloading unit 150)
The substrate loading/unloading unit 150 is provided near the opening 200a of the chamber 200, as shown in FIG. 1(a). 3(a) shows the board loading/unloading unit 150 taken out from FIG. 1(a), and FIG. 3(b) shows the board loading/unloading unit 150 of FIG. 3(a) from the +X side. The view is shown.

As shown in FIG. 3A, the substrate loading/unloading unit 150 includes a screen member 152 having an inverted L-shape in XZ cross section, a loading port shutter 154 and a loading port shutter 156 provided on the screen member 152, and the screen member 152. A substrate feeder 160 fixed to the substrate feeder 160 is provided.

As shown in FIGS. 3(a) and 3(b), the screen member 152 has a rectangular shape when viewed from the X-axis direction, and has an inlet 152U and an outlet formed through the X-axis. It has 152L. The size of the loading port 152U and the loading port 152L is small enough to allow the substrate P to pass through, making it difficult for dust to enter the chamber 200 through the loading port 152U and the loading port 152L. A loading port shutter 154 that opens and closes the loading port 152U by sliding in the vertical direction (Z-axis direction) is provided near the loading port 152U. Further, an exit shutter 156 is provided near the exit 152L to open and close the exit 152L by rotating around a rotating shaft 156a extending in the Y-axis direction.

The substrate feeder 160 is cantilevered by the screen member 152 at a position at a predetermined height from the floor F. Here, the "position at a predetermined height" is a height position at which the stage apparatus 20 can be positioned below the substrate feeder 160 when the stage apparatus 20 moves to the substrate exchange position (see FIG. 8(b)). It is. The substrate feeder 160 includes a plate member whose XZ cross section is approximately a right triangle, and the upper surface of the substrate feeder 160 is inclined with respect to the XY plane. In the example of FIG. 3A, the +X side end of the upper surface of the substrate feeder 160 is parallel to the XY plane. Although not shown, a plurality of small holes (not shown) for blowing air are formed on the upper surface of the substrate feeder 160. In the substrate feeder 160, pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (air supply) to the back surface of the substrate P placed on the upper surface of the substrate feeder 160 through the hole. ), it is possible to separate the back surface of the substrate P from the top surface of the substrate feeder 160 (floating the substrate P). Further, the substrate feeder 160 has a hole for sucking and holding the lower surface of the substrate P using a vacuum suction force supplied from a vacuum device (not shown). Note that the hole for supplying pressurized gas and the hole for vacuum suction may be a common hole. As shown in FIG. 2, the substrate feeder 160 is provided above the +X side and +Y side corners of the surface plate 22. Further, as shown in FIG. 1A, the -X side end of the substrate feeder 160 extends below the lens barrel surface plate 216, and a part of the lens barrel surface plate 216 has the substrate feeder 160 A notch 216a is formed to avoid contact with the substrate P held by the substrate P.

(Board slide hand 140)
The substrate slide hand 140 is provided on the +Y side of the substrate feeder 160, as shown in FIG. The substrate slide hand 140 includes a suction pad 142 and a vertical movement mechanism 144 that moves the suction pad 142 up and down (reciprocates along the Z-axis direction). The vertical movement mechanism 144 is movable in the X-axis direction along a rail 146 installed at a predetermined height from the floor F along the X-axis direction. That is, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 is capable of suctioning and holding the lower surface of the substrate P using a vacuum suction force supplied from a vacuum device (not shown).

The substrate slide hand 140 sucks and holds a part of the lower surface of the substrate P transported by the external transport robot 300 and moves in the −X direction to draw the substrate P from the outside into the chamber 200 . Further, the substrate slide hand 140 transfers the substrate P onto the substrate feeder 160 by moving along the upper surface of the substrate feeder 160 while holding the substrate P drawn into the chamber 200. Further, the substrate slide hand 140 moves the substrate P from inside the chamber 200 to the outside by sucking and holding a part of the lower surface of the exposed substrate P placed on the substrate holder 28 and moving it in the +X direction. send out.

The external transport robot 300 transports the substrate P between the exposure apparatus 100 and an external device (not shown) such as a coater/developer provided outside the exposure apparatus 100 (chamber 200). The external transfer robot 300 has a flat robot hand 300F, as shown in FIGS. 1(a) and 2. Although not shown, a plurality of small holes (not shown) for blowing air are formed on the upper surface of the robot hand 300F. In the robot hand 300F, pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (air supply) to the back surface of the substrate P placed on the top surface of the robot hand 300F through the hole. ), it is possible to separate the back surface of the substrate P from the top surface of the robot hand 300F (floating the substrate P). Further, the robot hand 300F has a hole for suctioning and holding the lower surface of the substrate P using a vacuum suction force from a vacuum device (not shown). Note that the hole for supplying pressurized gas and the hole for vacuum suction may be a common hole.

(Board replacement operation)
The operation of exchanging the substrate P on the substrate holder 28 in the exposure apparatus 100 will be described in detail below with reference to FIGS. 1(a) to 2 and 4(a) to 11(b). The following board exchange operation is controlled by a main control device (not shown). Note that in each of the diagrams in FIGS. 4(a) to 11(b) for explaining the board replacement operation, the operating directions of the components are schematically indicated by white arrows for easy understanding. There is. Further, states in which gas is sucked or supplied (air supply) are schematically shown by black arrows or broken line arrows. Note that FIGS. 4(a) and 4(b) show a plan view of the vicinity of the stage device 20 and a sectional view taken along the line AA in FIG. 1(a) at the same timing, and FIGS. 5(b), FIG. 6(a), FIG. 6(b),...FIG. 11(a) and FIG. 11(b) also show a plan view and a cross-sectional view along the line AA of the vicinity of the stage device at the same timing. It shows. Note that, in FIGS. 4(a) to 11(b), illustrations of the configuration of the exposure apparatus 100 that are unnecessary for explanation are omitted.

Further, as a premise for explaining the substrate exchange operation, it is assumed that the substrate P1 is placed on the substrate holder 28 of the stage device 20 in advance. In addition, in the substrate exchange operation, an operation of carrying out the exposed substrate P1 and an operation of carrying (placing) the substrate P2 to be newly exposed (different from the substrate P1) into the substrate holder 28 are executed. shall be taken as a thing. Note that the substrate P2 may be an unexposed substrate (not exposed even once), or may be a substrate to be exposed for the second time or later.

As shown in FIGS. 1A and 2, while the substrate P1 is being exposed in the exposure apparatus main body 10, the main controller moves the external transfer robot 300 holding the substrate P2 before exposure to the vicinity of the chamber 200. (near the loading port 152U). Note that the robot hand 300F of the external transfer robot 300 is in contact with most of the lower surface (-Z surface) of the substrate P2, but is not in contact with the lower surface of the -X side end of the substrate P2. shall be taken as a thing.

(Operations in Figures 4(a) and 4(b))
From this state, the main control device opens the loading port 152U by sliding the loading port shutter 154 in the +Z direction (see arrow A1 in FIG. 4(b)). Next, the main controller drives the external transfer robot 300 in the −X direction (see arrow A2 in FIGS. 4(a) and 4(b)), and brings the −X side end of the substrate P2 into the chamber 200. Let it enter. As a result, the −X side end of the substrate P2 is positioned above the substrate feeder 160. In the first embodiment, it is assumed that the external transfer robot 300 does not enter the chamber 200. Thereby, entry of dust into the chamber 200 can be suppressed as much as possible.

Next, the main controller drives the substrate slide hand 140 to move the suction pad 142 in the +X direction (direction of arrow A3 in FIG. 4(b)) and +Z direction (direction of arrow A4). is brought into contact with a part of the lower surface (-X side and +Y side edge) of the substrate P2. The main controller also starts suctioning and holding a portion of the lower surface (-Z surface) of the substrate P2 using the suction pad 142 (see black arrow A5 in FIG. 4(b)).

(Operations in Figures 5(a) and 5(b))
Next, the main controller starts supplying pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 160 (see arrows B1 and B2 in FIG. 5(b)). . As a result, the substrate P2 floats above the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160, and the friction between the lower surface of the substrate P2 and the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160 is negligible (low friction state). )become. From this state, the main controller drives the suction pad 142 of the substrate slide hand 140 in the -X direction (direction of arrow B2 in FIG. 5(b)) and -Z direction (direction of arrow B3). That is, the suction pad 142 is moved in the direction along the upper surface of the substrate feeder 160 (in the direction of arrow B5 in FIGS. 5(a) and 5(b), which is the direction inclined to the X-axis and the Z-axis within the XZ plane). let Thereby, the substrate P2 is transported into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160. The substrate P2 is moved by the substrate slide hand 140 while being supported by the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160.

(Operations in Figures 6(a) and 6(b))
As described above, when the substrate P2 is transported along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160 and reaches the positions shown in FIGS. 6(a) and 6(b), the main controller controls the loading port. The shutter 154 is slid in the -Z direction to close the loading port 152U (see arrow C1 in FIG. 6(b)). This can prevent dust from entering the chamber 200 from the outside through the entrance 152U. The main controller drives the external transfer robot 300 in the −X direction (see arrow C2 in FIGS. 6(a) and 6(b)). Note that in the exposure apparatus main body 10, exposure of the substrate P1 is continuously performed.

(Operations in Figures 7(a) and 7(b))
Next, the main controller drives a vacuum device (not shown) of the substrate feeder 160 to attract and hold the substrate P2 by vacuum suction force. Then, the main controller releases the suction holding by the suction pad 142 of the substrate slide hand 140, and drives the suction pad 142 downward in the -Z direction (see arrow D1 in FIG. 7(b)). In addition, the main controller drives the external transfer robot 300 in the -Z direction (see arrow D2) and in the -X direction (see arrow D3), thereby moving the -X end of the robot hand 300F to the exit. Bring it closer to 152L. Further, the main control device opens the exit port 152L by rotationally driving the exit shutter 156 in the counterclockwise direction (direction of arrow D4). This completes the preparation for replacing the substrate on the substrate holder 28. It is assumed that at this stage, the exposure operation for the substrate P1 on the substrate holder 28 is completed.

(Operations in FIGS. 8(a) and 8(b))
After the exposure operation is completed, the main controller drives the stage device 20 to the substrate exchange position (below the substrate feeder 160) (see arrow E1 in FIGS. 8(a) and 8(b)). Next, the main controller slightly raises the suction pad 27 of the substrate carry-in bearer device 25 (see arrow E2), and causes the suction pad 27 to suction and hold the lower surface of the substrate P1 (see arrow E3). The main controller also starts supplying pressurized gas (air supply) from the top surface 28u of the substrate holder 28 (see arrow E4), thereby causing the substrate P1 to float slightly relative to the top surface 28u of the substrate holder 28. . Further, the main controller slightly offsets the substrate P1 from the substrate holder 28 in the +Y direction by moving the suction pad 27 holding the substrate P1 in the +Y direction (see arrow E5). This offset allows the suction pad 142 of the substrate slide hand 140 to hold the -X side and +Y side corners of the lower surface of the substrate P1.

With the substrate P1 offset from the substrate holder 28, the main controller drives the suction pad 142 of the substrate slide hand 140 upward (see arrow E6) to cause the suction pad 142 to suction and hold the lower surface of the substrate P1. It is assumed that the main controller has started supplying pressurized gas (air supply) from the top surface of the robot hand 300F of the external transfer robot 300 at the stages shown in FIGS. 8(a) and 8(b). (see arrow E7). In addition, at the stage of FIG. 7(b), the main controller opens the exit port 152L by rotationally driving the exit shutter 156 in the counterclockwise direction (direction of arrow D4). ), the export port 152L may be opened.

(Operations in FIGS. 9(a) and 9(b))
Next, the main controller drives the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow F1 in FIGS. 9(a) and 9(b)), and moves the substrate P1 from above the substrate holder 28 to the robot hand 300F. Slide it upwards. As a result, the exposed substrate P1 is transferred onto the robot hand 300F. That is, the substrate P1 is moved by the substrate slide hand 140 while being supported by the upper surface of the substrate holder 28 and the upper surface of the robot hand 300F. At the timing when the robot hand 300F receives the substrate P1, the main controller stops the supply (intake) of pressurized gas from the robot hand 300F, drives a vacuum device (not shown), and uses the vacuum suction force to The hand 300F attracts and holds the substrate P1.

Further, the main controller drives the suction pad 27 of the substrate carry-in bearer device 25 upward (see arrow F2), brings it into contact with the -X end of the lower surface of the substrate P2 held by the substrate feeder 160, and causes the suction pad 27 to starts sucking and holding the substrate P2 (see arrow F3).

(Operations in FIGS. 10(a) and 10(b))
Next, the main controller drives the stage device 20 in the -X direction (see arrow G1) with the suction pad 27 of the substrate carry-in bearer device 25 suctioning and holding the substrate P2. In this case, as the stage device 20 moves away from the substrate feeder 160, the area of the substrate P2 held by the substrate feeder 160 gradually decreases, and the area of the substrate P2 supported by the substrate holder 28 gradually increases. . Thereby, as shown in FIG. 10(a), the substrate P2 is transferred from the substrate feeder 160 onto the substrate holder 28.

The main control device lowers the suction pad 142 after transferring the substrate P1 to the robot hand 300F (see arrow G2), and rotates the exit shutter 156 clockwise (see arrow G3). , close the export port 152L. This can prevent dust from entering the chamber 200 from the outside through the outlet 152L. The main controller drives the external transfer robot 300 holding the substrate P1 in the +X direction (see arrow G4) to transfer the substrate P1 to an external device.

(Operations in FIGS. 11(a) and 11(b))
When the main controller completes transferring the substrate P2 from the substrate feeder 160 onto the substrate holder 28, the main controller stops supplying pressurized gas from the upper surface of the substrate feeder 160. Further, the main controller performs alignment (position adjustment) of the substrate P2 by minutely driving the suction pad 27 (see arrow H1). Thereafter, the main controller drives the suction pad 27 downward (see arrow H2), starts sucking and holding the substrate P2 by the substrate holder 28, and starts exposing the substrate P2 newly placed on the substrate holder 28. Start.

After that, by repeatedly performing the processes shown in FIGS. 4(a), 4(b) to 11(a), and 11(b) described above, multiple substrates P can be exposed repeatedly. ing.

As described above in detail, according to the first embodiment, the exposure apparatus 100 comprises the exposure apparatus main body 10, the chamber 200 that houses the exposure apparatus main body 10, the substrate feeder 160 that receives and holds the substrate P transported by the external transport robot 300 outside the chamber 200, and the substrate slide hand 140 and substrate carry-in bearer device 25 that transfer the substrate P from the external transport robot 300 to the substrate feeder 160, transfer the substrate P from the substrate feeder 160 onto the substrate holder 28 of the exposure apparatus main body 10, and transfer the substrate P from the substrate holder 28 to the external transport robot 300. This makes it unnecessary to provide a substrate transfer port section that was previously provided for transferring the substrate P from the external transport robot 300 to the substrate feeder 160 (for example, JP 2001-332600 A). Since the substrate transfer port is provided at a position between the exposure apparatus main body 10 and the external transport robot 300, the exposure apparatus 100 without the substrate transfer port can be made smaller (the footprint is narrowed) by the amount of the substrate transfer port. In addition, the cost of the exposure apparatus 100 can be reduced by omitting the substrate transfer port. Furthermore, in an exposure apparatus having a substrate transfer port, the substrate P undergoes two substrate transfer operations, from the external transport robot 300 to the substrate transfer port and from the substrate transfer port to the substrate holder 28. Each time the substrate is transferred, an extra stress is applied to the substrate P, which may cause the substrate P to be deformed or damaged. Therefore, when the substrate transfer operation occurs only once between the exposure apparatus main body 10 and the external transport robot 300 as in the first embodiment, there is an effect that the substrate P is less likely to be deformed or damaged.

Further, in the first embodiment, the substrate slide hand 140 holds a part of the substrate P and transfers the substrate P from the substrate feeder 160 onto the substrate holder 28 between the substrate feeder 160 and the substrate holder 28. Move in a direction including the X-axis direction where and are lined up. Thereby, the substrate P can be transferred from the substrate feeder 160 onto the substrate holder 28 as the substrate slide hand 140 moves.

Further, in the first embodiment, the upper surface (substrate supporting surface) of the substrate feeder 160 is inclined with respect to the upper surface of the substrate holder 28, and the substrate carry-in bearer device 25 holds a part of the substrate P. By moving the stage device 20 in the -X direction, the substrate P is transferred from the substrate feeder 160 onto the substrate holder 28. As a result, the substrate P can be delivered to the substrate holder 28 while sliding the substrate P along the upper surface of the substrate feeder 160, thereby suppressing bending of the substrate P when delivering the substrate P to the substrate holder 28. can do.

Furthermore, in the first embodiment, since the external transfer robot 300 does not enter the chamber 200 of the exposure apparatus 100, it is possible to prevent dust attached to the external transfer robot 300 from entering the chamber 200. Furthermore, since the volume of the chamber 200 can be reduced, the temperature inside the chamber 200 can be easily controlled. Further, since the external transport robot 300 does not enter the chamber 200, contact between the external transport robot 300 and each part of the exposure apparatus 100 can be suppressed as much as possible. In addition, the only openings that connect the inside of the chamber 200 and the outside of the chamber 200 are the loading inlet 152U and the unloading outlet 152L, which are large enough to move the substrate P, making it possible to prevent dust from entering the chamber.

In the first embodiment, the +X side end of the upper surface of the substrate feeder 160 is parallel to the XY plane. This allows the substrate slide hand 140 to easily receive the substrate P transported by the external transport robot 300.

Further, in the first embodiment, the substrate P on the substrate holder 28 is delivered to the external transfer robot 300 while the substrate P is held on the upper surface of the substrate feeder 160, and immediately after that, the substrate held by the substrate feeder 160 is transferred to the external transfer robot 300. P is transferred onto the substrate holder 28. Thereby, the substrate on the substrate holder 28 can be quickly replaced even without a substrate transfer port section.

Further, in the first embodiment, since the loading inlet 152U and the unloading outlet 152L of the screen member 152 are provided separately, the loading inlet 152U and the unloading outlet 152L are not opened simultaneously during the board exchange operation, and the loading inlet By individually opening and closing 152U and the exit port 152L, it is possible to suppress the entry of dust.

In addition, although the said 1st Embodiment demonstrated the case where the suction pad 27 of the board|substrate carry-in bearer apparatus 25 was movable in the Y-axis direction, it is not limited to this. For example, if the suction pad 142 of the substrate slide hand 140 can suction and hold the lower surface of the substrate P without moving the substrate P on the substrate holder 28 in the Y-axis direction (without offsetting it), the suction pad 27 does not need to be able to move in the Y-axis direction.

In the first embodiment, a case has been described in which the robot hand 300F of the external transfer robot 300 is a flat member capable of air floating the substrate P on its upper surface, but the present invention is not limited to this. For example, the robot hand 300F may be a fork-shaped member, etc., as long as the substrate P can be slid without generating dust. Further, the robot hand 300F may include a rotating roller that sends the substrate P in the X-axis direction by rolling contact. By providing a rotating roller on the robot hand 300F, friction when the substrate P contacts the robot hand 300F can be reduced and dust generation can be suppressed.

Note that in the first embodiment, a mechanism is provided near the loading port 152U and the loading port 152L of the substrate loading/unloading unit 150 to apply a levitation force to the substrate P by supplying pressurized gas (air supply). It's okay. Moreover, a rotating roller that transports the substrate P in the X-axis direction by rolling contact may be provided near the loading port 152U and the loading port 152L of the substrate loading/unloading unit 150.

In addition, although the said 1st Embodiment demonstrated the case where the board|substrate feeder 160 was fixed to the screen member 152 of the board|substrate carry-in/out unit 150, it is not limited to this. The substrate feeder 160 may be fixed to a member different from the screen member 152.

In addition, although the said 1st Embodiment demonstrated the case where the board|substrate feeder 160 was provided above the corner of the +X side and +Y side of the surface plate 22, it is not limited to this. As long as it does not interfere with the exposure operation, the substrate feeder 160 may be provided, for example, at the +X side end of the surface plate 22 and above the center in the Y-axis direction.

In the first embodiment, a case has been described in which the screen member 152 of the substrate carry-in/out unit 150 is provided with the carry-in port shutter 154 and the carry-out port shutter 156, but the present invention is not limited to this. That is, at least one of the loading port shutter 154 and the loading port shutter 156 may be provided in the chamber 200.

《Second embodiment》
Next, an exposure apparatus according to a second embodiment will be explained using FIGS. 12 and 13. The configuration of the exposure apparatus 100A according to the second embodiment is the same as that of the first embodiment, except that the configuration and operation of a part of the substrate feeder are different. Elements having the same configuration and functions as those in the first embodiment are designated by the same reference numerals as in the first embodiment, and the description thereof will be omitted.

FIG. 12 is a diagram (corresponding to FIG. 1A of the first embodiment) showing an exposure apparatus 100A according to the second embodiment.

In the first embodiment, the substrate feeder 160 was fixed to the screen member 152 of the substrate loading/unloading unit 150, but in the substrate loading/unloading unit 150A of the second embodiment, as shown in FIG. A substrate feeder 161 is attached to a rotating shaft 162 provided in the substrate feeder 152 .

The shape and function of the substrate feeder 161 are similar to the substrate feeder 160 of the first embodiment, but since the substrate feeder 161 is attached to a rotation shaft 162 extending in the Y-axis direction, It can be rotated freely. Although not shown in FIGS. 12 and 13, the substrate feeder 161 is rotated by a drive mechanism (including a motor, etc.) not shown.

Further, in the second embodiment, since the substrate feeder 161 is rotatable, the notch 216b formed in the lens barrel surface plate 216 prevents mechanical interference with the substrate feeder 161 and the substrate slide hand 140. In order to avoid this, the cutout 216a is set larger than the cutout 216a of the first embodiment.

The substrate feeder 161 has two states: the top surface (substrate support surface) is parallel to the XY plane as shown in FIG. 12, and the substrate support surface is inclined with respect to the XY plane as shown in FIG. (form and similar state).

(Board replacement operation)
In the second embodiment, when the substrate P (P2) is carried in from the outside of the chamber 200 by the substrate slide hand 140, the main controller controls the drive mechanism to move the substrate supporting surface as shown in FIG. (Top surface) should be kept parallel to the XY plane. Furthermore, when the substrate slide hand 140 pulls the substrate P (P2) onto the substrate feeder 161, the main controller supplies pressurized gas (air supply) from the upper surface of the external transfer robot 300 and the substrate support surface of the substrate feeder 161. )do. Thereby, the substrate support surface (upper surface) of the substrate feeder 161 and the support surface of the external transfer robot can be flush with each other (within the same plane). In this state, the main controller moves the substrate P2 using the substrate slide hand 140, thereby preventing deformation or damage of the substrate due to unnecessary stress being applied to the substrate P2.

Then, as shown in FIG. 12, when the substrate P (P2) is delivered onto the substrate feeder 161, the main controller starts suction and holding of the substrate P (P2) by the substrate feeder 161. Further, the main controller controls the drive mechanism to rotate the substrate feeder 161 counterclockwise as shown in FIG. 13, and after tilting the substrate support surface of the substrate feeder 161 with respect to the XY plane, Similar to the first embodiment, the substrate on the substrate holder 28 is replaced.

As explained above, according to the second embodiment, the substrate feeder 161 can transition between a state in which the substrate support surface is parallel to the XY plane and a state in which it is inclined. When receiving P from the external transfer robot 300 or transferring it to the substrate holder 28, it is possible to set it in an appropriate state (posture). Thereby, the possibility that the substrate P will come into contact with the loading port 152U or the substrate feeder 161 can be reduced.

Further, when the substrate slide hand 140 carries the substrate P (P2) from the external transfer robot 300 into the chamber 200, there is no need to change the height position (position in the Z-axis direction) of the suction pad 142. Control of the suction pad 142 can be simplified.

Further, in the second embodiment, when exchanging the substrate, the substrate support surface of the substrate feeder 161 is tilted, and the -X end of the substrate P (P2) to be newly placed on the substrate holder 28 is placed on the substrate holder 28. 28, the Z-direction stroke of the suction pad 142 of the substrate carry-in bearer device 25 can be shortened (or zeroed), and the substrate P (P2) can be placed close to the top surface of the substrate holder 28. Delivery can be carried out smoothly without any shock.

In the second embodiment, a case has been described in which the rotating shaft 162 is located at the +X end of the substrate feeder 161, but the present invention is not limited to this. It may be located.

《Third embodiment》
Next, an exposure apparatus according to a third embodiment will be explained using FIGS. 14 to 18. FIG. 14 shows a cross-sectional view (corresponding to FIG. 2 of the first embodiment) of an exposure apparatus 100B according to the third embodiment.

The exposure apparatus 100 of the first embodiment described above was equipped with the substrate slide hand 140, but the exposure apparatus 100B of the third embodiment has a first slide hand 240 and a second slide hand 240 instead of the substrate slide hand 140. A slide hand 340 is provided.

The first slide hand 240 is provided on the upper surface (substrate support surface) of the substrate feeder 163. The substrate feeder 163 has the same configuration and function as the substrate feeder 160 of the first embodiment. The first slide hand 240 has a rail 246 provided on the substrate support surface of the substrate feeder 163, and a suction pad 242 that moves along the rail 246. The rail 246 is embedded in the substrate feeder 163, and there is no step between the upper surface of the rail 246 and the upper surface (substrate support surface) of the substrate feeder 163. The first slide hand 240 can suck and hold a part of the substrate P transported by the external transport robot 300 and move in the -X direction to draw the substrate P into the chamber 200 (on the substrate feeder 163).

The second slide hand 340 is provided on the +X side surface of the stage device 20 (substrate table 24). The second slide hand 340 has the same configuration as the substrate slide hand 140 of the first embodiment, and includes a rail 346 extending in the X-axis direction, a Z drive mechanism 344 that moves in the X-axis direction along the rail 346, It has a suction pad 342 that is driven in the Z-axis direction by a Z drive mechanism 344. The second slide hand 340 adsorbs and holds a part of the substrate P placed on the substrate holder 28 and moves in the +X direction to transfer the substrate P from the substrate holder 28 to the external transfer robot 300. I can do it.

That is, in the third embodiment, the first slide hand 240 and the second slide hand 340 realize the same function as the substrate slide hand 140 of the first embodiment.

The other configuration of exposure apparatus 100B is similar to exposure apparatus 100 of the first embodiment.

(Board replacement operation)
The operation of exchanging the substrate P on the substrate holder 28 in the exposure apparatus 100B will be described in detail below with reference to FIGS. 14 to 18(b). Note that FIGS. 15(a) and 15(b) show a plan view and a vertical cross-sectional view of the vicinity of the stage device 20 at the same timing, and FIGS. 16(a), 16(b), and 17( a), FIG. 17(b), FIG. 18(a), and FIG. 18(b) also show a plan view and a vertical cross-sectional view of the vicinity of the stage device at the same timing. Note that in FIGS. 15(a) to 18(b), illustrations of the configuration of the exposure apparatus 100B that are unnecessary for explanation are omitted.

In the substrate exchange operation, an operation of carrying out the exposed substrate P1 and an operation of carrying (placing) the substrate P2 to be newly exposed (different from the substrate P1) into the substrate holder 28 are performed. do. The main controller moves the external transfer robot 300 holding the substrate P2 before exposure to the vicinity of the chamber 200, as shown in FIG. (near the loading port 152U). Note that, at this stage, the suction pad 242 of the first slide hand 240 is located at the +X end of the rail 246.

(Operations in FIGS. 15(a) and 15(b))
From this state, the main controller opens the loading port 152U by sliding the loading port shutter 154 in the +Z direction (see arrow J1 in FIG. 15(b)). Next, the main controller drives the external transfer robot 300 in the −X direction (see arrow J2 in FIGS. 15(a) and 15(b)), and brings the −X side end of the substrate P2 into the chamber 200. Let it enter. As a result, the −X side end of the lower surface of the substrate P2 is brought close to or in contact with the suction pad 242. The main controller also starts suctioning and holding a portion of the lower surface of the substrate P2 using the suction pad 242 (see arrow J3 in FIG. 15(b)).

(Operations in FIGS. 16(a) and 16(b))
Next, the main controller starts supplying pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 163, and moves the suction pad 242 of the first slide hand 240 onto the rail 246. along the −X side (direction of arrow K1 in FIGS. 16(a) and 16(b)). Thereby, the substrate P2 is transported into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 163. Note that, after transporting the substrate P2 onto the substrate feeder 163, the main controller stops the supply of pressurized gas from the substrate feeder 163 and the robot hand 300F, and starts suction and holding of the substrate P2 by the substrate feeder 163. . The main controller then closes the loading port shutter 154 and opens the loading port shutter 156. Further, when the exposure of the substrate P1 in the stage device 20 is completed, the main controller drives the stage device 20 to the position (substrate exchange position) shown in FIGS. 16(a) and 16(b) (see arrow K2). .

When the stage device 20 moves to the vicinity of the substrate exchange position, the main controller starts supplying pressurized gas from the upper surface 28u of the substrate holder 28, and moves the suction pad 27 of the substrate carry-in bearer device 25 in the +Z direction and the +Y direction. The substrate P1 is driven to be offset from the substrate holder 28 to the +Y side (see arrow K3 in FIG. 16(a)). The main controller also drives the external transfer robot 300 in the +X direction (see arrow K4).

(Operations in FIGS. 17(a) and 17(b))
The main controller drives the external transfer robot 300 in the -Z direction and the -X direction (see arrows L1 and L2 in FIG. 17(b)) to bring the -X end of the robot hand 300F closer to the exit 152L. . Then, the main controller starts supplying pressurized gas (air supply) from the upper surface of the robot hand 300F.

Further, the main controller drives the suction pad 342 of the second slide hand 340 upward to cause the suction pad 342 to suction and hold the lower surface of the substrate P1. The main controller then drives the suction pad 342 in the +X direction along the rail 346 (see arrow L3) to slide and transport the substrate P1 from the substrate holder 28 onto the robot hand 300F. Note that after the substrate P1 is slid and transferred to the robot hand 300F, the main controller drives the robot hand 300F in the +X direction, evacuates the substrate P1 to the outside of the chamber 200, and closes the exit shutter 156.

Further, the main controller drives the suction pad 27 of the substrate carry-in bearer device 25 upward (see arrow L4), and starts sucking and holding the -X end of the substrate P2 by the suction pad 27 (see arrow L5). Further, the main controller starts supplying pressurized gas from the upper surface of the substrate feeder 163.

(Operations in FIGS. 18(a) and 18(b))
The main controller drives the stage device 20 in the -X direction (see arrow N1) with the suction pad 27 of the substrate carry-in bearer device 25 suctioning and holding the substrate P2. Thereby, the substrate P2 is transferred from the substrate feeder 163 onto the substrate holder 28. Note that while the substrate P2 is being transferred from the substrate feeder 163 onto the substrate holder 28, pressurized gas is supplied from the upper surface of the substrate holder 28.

On the other hand, when the entire substrate P2 is transferred from the substrate feeder 163 onto the substrate holder 28, the main controller stops supplying pressurized gas from the top surface of the substrate feeder 163. Further, the main controller performs alignment (position adjustment) of the substrate P2 by minutely driving the suction pad 27. Thereafter, the main controller drives the suction pad 27 downward (see arrow N2) and starts exposing the substrate P2 newly placed on the substrate holder 28.

Furthermore, the main control device drives the external transport robot 300 in the +X direction (see arrow N3), thereby causing the substrate P1 to be transported to an external device.

Thereafter, by repeatedly performing the processes shown in FIGS. 15(a), 15(b) to 18(a), and 18(b) described above, exposure to multiple substrates P is repeated. There is.

As described above in detail, according to the third embodiment, the first slide hand 240 pulls the substrate P into the chamber 200 from outside the chamber 200, and the first slide hand 240 carries the substrate P from the inside of the chamber 200 to the outside of the chamber 200. 2 slide hand 340. This increases the degree of freedom in design, so that, for example, the substrate exchange position of the stage device 20 can be set at the +X side end of the surface plate 22 and near the center in the Y-axis direction.

Further, in the third embodiment, since the first slide hand 240 is provided at the center of the substrate feeder 163 in the Y-axis direction, a space is created on the +Y side and -Y side of the substrate feeder 163. . This makes it possible to make design changes such as holding the substrate feeder 163 from the Y-axis direction.

Furthermore, in the third embodiment, since the second slide hand 340 is provided on the stage device 20, the substrate unloading operation can be started before the stage device 20 arrives at the substrate exchange position.

Furthermore, in the third embodiment, since the rail 246 of the first slide hand 240 is provided along the upper surface (substrate support surface) of the substrate feeder 163, the drive of the suction pad 242 is controlled as in the first embodiment. In this case, the control can be simplified compared to the case where control is performed in the two-axis directions of the X-axis and the Z-axis. Further, unlike the first and second embodiments, there is no need to provide the rail 146, and the number of parts can be reduced.

Furthermore, in the third embodiment, since the second slide hand 340 is provided on the stage device 20, the substrate unloading operation can be started before the stage device 20 arrives at the substrate exchange position.

In the third embodiment, the attitude of the substrate feeder 163 (the inclination of the substrate support surface) may be changed as in the second embodiment.

《Fourth embodiment》
Next, an exposure apparatus 100C according to the fourth embodiment will be described using FIGS. 19 and 20. As shown in FIGS. 19(a) and 19(b), the exposure apparatus 100C of the fourth embodiment has almost the same configuration as the exposure apparatus 100 of the first embodiment, except that the substrate feeder 160 is The difference is that it has a function of suspending and holding the substrate P in a non-contact manner.

For example, a hole is formed in the lower surface of the substrate feeder 160 to exhaust pressurized gas, and by performing air exhaust in the manner of a known Bernoulli chuck, the upper surface of the substrate P and the lower surface of the substrate feeder 160 are Negative pressure can be generated between the two. Therefore, in the fourth embodiment, the substrate P is suspended and held in a non-contact manner by the negative pressure generated between the upper surface of the substrate P and the lower surface of the substrate feeder 160 (that is, the upper surface of the substrate P is the lower surface of the substrate feeder 160). (held in a non-contact manner). However, the present invention is not limited to this. A vacuum suction hole and a pressurized gas exhaust hole are provided on the bottom surface of the substrate feeder 160, and the substrate P is It may also be held in suspension without contact.

(Board replacement operation)
FIGS. 19(a) and 19(b) show diagrams corresponding to FIGS. 8(a) and 8(b) of the first embodiment. 19(a) and 19(b), the substrate P2 before exposure is held on the upper surface of the substrate feeder 160, and the stage device 20 and the exposed substrate P1 are placed at a position facing the lower surface of the substrate feeder 160. It is in a state where it is located. In this state, the substrate P1 is slightly offset in the +Y direction with respect to the substrate holder 28, and pressurized gas is supplied from the upper surface 28u of the substrate holder 28, so that the lower surface of the substrate P1 and the substrate holder 28 are There is no contact between the top surface and the top surface. Further, the suction pad 142 of the substrate slide hand 140 is in a state of suctioning and holding a part of the lower surface of the substrate P1.

From this state, the main controller exhausts the pressurized gas from the lower surface of the substrate feeder 160 to suspend and hold the substrate P1 on the lower surface of the substrate feeder 160 in a non-contact manner based on the Bernoulli chuck principle.

Next, the main controller causes the suction pad 27 of the substrate carry-in bearer device 25 to suction-hold a part of the substrate P2 on the substrate feeder 160, and starts supplying pressurized gas from the upper surface of the substrate feeder 160. Then, as shown in FIGS. 20(a) and 20(b), the main controller moves the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow Q1) to transport the substrate P1 to the outside. By starting the transfer to the robot 300 and driving the stage device 20 in the -X direction (see arrow Q2), the substrate P2 is transferred from the substrate feeder 160 onto the substrate holder 28. As described above, since negative pressure is generated on the lower surface of the substrate feeder 160 and the substrate P1 is held suspended in a non-contact manner, the substrate P1 is slide-transported by the substrate carry-in bearer device 25 as shown in FIG. 20(b). In this case, even if the substrate holder 28 is not present below the substrate P1, the substrate P1 can be smoothly slid and transferred to the external transfer robot 300.

As explained above, according to the fourth embodiment, the substrate P1 to be carried out to the outside is suspended and held in a non-contact manner on the lower surface of the substrate feeder 160, so that the substrate P1 is received from above the substrate holder 28 onto the external transfer robot 300. There is no need for the stage device 20 to wait at the substrate exchange position until the substrate is handed over. Thereby, as shown in FIG. 20(b), the operation of placing a new substrate P2 on the substrate holder 28 can be started before the substrate P1 is delivered to the external transfer robot 300. Therefore, according to the fourth embodiment, it is possible to shorten the time required for board replacement. Further, after the substrate P2 is placed on the substrate holder 28 and the stage device 20 is moved in the −X direction, the substrate P1 held on the lower surface of the substrate feeder 160 in a non-contact manner is transferred onto the external transfer robot 300. You may also do so. As a result, when the stage device 20 is located near the discharge port 152L, the discharge port shutter 156 can be kept in a closed state, and even if dirt enters the chamber 200 from the discharge port 152L, the stage device 20 is less likely to have dust attached to it.

In addition, the substrate feeder 160 of the said 4th Embodiment is good also as rotatably provided in the screen member 152 similarly to the said 2nd Embodiment. That is, the upper surface of the substrate feeder 160 may be made to transition between a state parallel to the XY plane and a state inclined.

Note that, in the fourth embodiment, a first slide hand 240 and a second slide hand 340 may be provided in place of the substrate slide hand 140, as in the third embodiment.

《Fifth embodiment》
Next, a fifth embodiment will be described using FIG. 21. FIG. 21(a) shows a substrate loading/unloading unit 150' according to the fifth embodiment. The substrate loading/unloading unit 150' has a substrate feeder 165 in place of the substrate feeder 160 of the substrate loading/unloading unit 150 of the first embodiment, and has a loading port shutter 156' in place of the loading port shutter 156. are doing.

The substrate feeder 165 has a first portion 165a fixed to the −X side surface of the screen member 152, and a second portion 165b that is slidable relative to the first portion 165a. It is assumed that the sliding direction of the second portion 165b is the same direction as the inclination direction of the upper surface (substrate support surface) of the second portion 165b (the direction inclining with respect to the X-axis and the Z-axis within the XZ plane). As shown in FIG. 21(b), a drive mechanism 165c of a feed screw type, for example, is provided between the first portion 165a and the second portion 165b. The drive mechanism 165c drives the second portion 165b to change the distance between the second portion 165b and the first portion 165a. Note that the drive mechanism 165c is not limited to the feed screw type, but may be a drive mechanism of another type, such as a drive mechanism including a linear motor.

In the fifth embodiment, by adopting the above configuration as the substrate feeder 165, the first portion 165a and the second portion 165b are brought close to each other as shown in FIG. 21(a) except when replacing the substrate. . Thereby, the substrate feeder 165 can be prevented from interfering with work such as exposure operation and maintenance. Further, when exchanging the substrate, by moving the second portion 165b of the substrate feeder 165 as shown in FIG. 21(b), the substrate exchanging position can be set to a position closer to the −X side. Thereby, the stroke in the X-axis direction when the stage device 20 moves to the substrate exchange position can be shortened.

By the way, in the fifth embodiment, by employing the substrate feeder 165 as described above, the board exchange position is set on the −X side compared to the first embodiment, etc., so that when replacing the board, There is a possibility that the distance between the holder 28 and the external transfer robot 300 becomes long. However, in the fifth embodiment, as shown in FIG. 21(b), the length of the exit shutter 156' in the X-axis direction when the exit port 152L is opened is as shown in FIG. It is set longer than the outlet shutter 156, and the outlet shutter 156' is provided with a levitation force applying mechanism that supplies pressurized gas upward from the +Z side surface in the state shown in FIG. 21(b). . Further, the export exit shutter 156' moves in the opposite direction to the export exit shutter 156 when opening and closing the exit exit 152L (moves clockwise when opening the exit exit 152L, and counterclockwise when closing the exit exit 152L). . This allows the unloading port shutter 156' to bridge the substrate P between the substrate holder 28 and the external transfer robot 300. Therefore, according to the fifth embodiment, the substrate P can be transferred from the substrate holder 28 to the external transfer robot 300 without bending the substrate.

Furthermore, in the fifth embodiment, when the outlet shutter 156' opens the outlet 152L (FIG. 21(b)), the +X end of the outlet shutter 156' is connected to the +X end of the outlet 152L. located at almost the same location. Thereby, the external transfer robot 300 can receive the substrate from the substrate holder 28 at a position on the +X side of the carry-out port 152L, so that dust can be prevented from entering the chamber 200 as much as possible.

In the fifth embodiment, the same outlet shutter 156 as in the first to fourth embodiments may be used instead of the outlet shutter 156'.

Note that, like the outlet shutter 156' of the fifth embodiment, pressurized gas is supplied from the upper surface to the outlet shutter 156 described in the first to fourth embodiments with the outlet 152L open. It is also possible to provide a function to supply the information.

In addition, also in the said 5th Embodiment, it is good also considering the board|substrate feeder 165 as rotatably provided similarly to 2nd Embodiment.

《Sixth embodiment》
Next, a sixth embodiment will be described using FIGS. 22 to 24. 22(a) and 22(b) show a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to a sixth embodiment. The sixth embodiment is a modification of the third embodiment (FIGS. 14 to 18), and as shown in FIG. 22(a), the width of the substrate feeder 166 in the Y-axis direction is The width is set wider than the width of the feeder 163 in the Y-axis direction. Further, as shown in FIG. 22(b), the substrate feeder 166 is rotatably supported near its +X end by a rotating shaft 176 extending in the Y-axis direction. Further, the substrate feeder 166 is suspended and supported by a hanging mechanism 186 provided on the screen member 152 at two locations near both ends in the Y-axis direction. Note that the screen member 152 of the sixth embodiment is provided with a holding portion 155 that holds a hanging mechanism 186, unlike the screen member 152 of the first to fifth embodiments described above.

The hanging mechanism 186 has two ropes 196 that suspend and support the substrate feeder 166, and by adjusting the length by winding or letting out the two ropes 196, the upper surface of the substrate feeder 166 ( (board support surface). In the sixth embodiment, by adopting the above configuration as the substrate feeder 166, even when the rigidity near the rotation axis 176 of the substrate feeder 166 is low, the small force of the hanging mechanism 186 allows the substrate feeder 166 to The attitude of the substrate feeder 166 can be accurately controlled while suppressing the deflection of the substrate feeder 166.

(Board replacement operation)
In the sixth embodiment, when performing a substrate exchange operation, the main controller controls the hanging mechanism 186 to maintain the upper surface (substrate support surface) of the substrate feeder 166 horizontally as shown in FIG. 22(b). do. Then, the main controller slides the loading port shutter 154 in the +Z direction to open the loading port 152U (see arrow R1), and brings the external transfer robot 300 closer to the loading port 152U (see arrow R2), thereby moving the substrate P2. The −X end of the substrate feeder 166 is positioned near the +X end of the substrate support surface of the substrate feeder 166. Note that, at this stage, the suction pad 242 of the first slide hand 240 is located at the +X end of the rail 246.

Next, the main controller starts sucking and holding a portion of the lower surface of the substrate P2 using the suction pad 242 (see arrow R3 in FIG. 22(b)).

Next, the main controller starts supplying pressurized gas (air supply) from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 166. As shown, the suction pad 242 of the first slide hand 240 is driven toward the −X side along the rail 246 (see arrow R4). Thereby, the substrate P2 is drawn into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 166. Note that, after transporting the substrate P2 onto the substrate feeder 166, the main controller stops the supply of pressurized gas from the substrate feeder 166 and the robot hand 300F, and starts suction and holding of the substrate P2 by the substrate feeder 166. .

Next, the main controller closes the loading port shutter 154 and opens the loading port shutter 156. Further, when the exposure of the substrate P1 in the stage device 20 is completed, the main controller drives the stage device 20 to the position shown in FIG. 24 (substrate exchange position) (see arrow R5).

Next, as shown in FIG. 24, the main controller controls the hanging mechanism 186 to adjust the length of the rope 196 (see arrow R6), thereby tilting the substrate support surface of the substrate feeder 166. Further, the main controller starts supplying pressurized gas from the upper surface 28u of the substrate holder 28, drives the suction pad 27 of the substrate carry-in bearer device 25 in the +Z direction and +Y direction, and moves the substrate P1 to the substrate holder 28. Offset from +Y side. Further, the main controller positions the external transfer robot 300 at a position near the outlet 152L shown in FIG. 24, and starts supplying pressurized gas (air supply) from the upper surface of the robot hand 300F.

Further, the main controller drives the suction pad 342 of the second slide hand 340 upward to cause the suction pad 342 to suction and hold the lower surface of the substrate P1. Then, the main controller drives the suction pad 342 in the +X direction along the rail 346, and slides the substrate P1 from above the substrate holder 28 onto the robot hand 300F. Note that after the substrate P1 is slid and transferred to the robot hand 300F, the main controller drives the robot hand 300F in the +X direction, evacuates the substrate P1 to the outside of the chamber 200, and closes the exit shutter 156. Note that the main control device transports the substrate P1 to the external device by driving the external transport robot 300 in the +X direction.

Further, the main controller drives the suction pad 27 of the substrate carry-in bearer device 25 upward (see arrow R7), and starts sucking and holding the -X end of the substrate P2 by the suction pad 27 (see arrow R8). Furthermore, the main controller starts supplying pressurized gas from the top surface of the substrate feeder 166.

Then, the main controller drives the stage device 20 in the -X direction with the suction pad 27 of the substrate carry-in bearer device 25 suctioning and holding the substrate P2. Thereby, the substrate P2 is transferred from the substrate feeder 166 onto the substrate holder 28, similarly to FIG. 18(b). Note that while the substrate P2 is being transferred from the substrate feeder 166 onto the substrate holder 28, pressurized gas is supplied from the upper surface of the substrate holder 28.

On the other hand, when the substrate P2 is transferred from the substrate feeder 166 onto the substrate holder 28, the main controller stops supplying pressurized gas from the upper surface of the substrate feeder 166. Further, after aligning (positioning) the substrate P2, the main controller drives the suction pad 27 downward and starts exposing the substrate P2 newly placed on the substrate holder 28.

Thereafter, by repeatedly performing the above-described process, exposure to a plurality of substrates P is repeated.

In the sixth embodiment, the substrate feeder 166 is suspended and supported by a pair of ropes 196, but the present invention is not limited to this. For example, it may be suspended and supported by a mechanism that does not have flexibility. For example, the substrate feeder 166 may be suspended and supported by an air cylinder or the like.

Note that the substrate feeder 166 may have a first portion and a second portion as in the fifth embodiment (see FIG. 21(a)).

《Seventh embodiment》
Next, a seventh embodiment will be described using FIG. 25. FIG. 25 shows a state in which the stage device 20 is positioned at the substrate exchange position in the exposure apparatus according to the seventh embodiment.

In the seventh embodiment, the substrate feeder 167 is supported on its upper surface by a support frame 78 provided on the +Y side of the substrate feeder 167. Further, the substrate feeder 167 is characterized in that it suspends and holds a newly loaded substrate P (P2) onto the substrate holder 28 on the lower surface side in a non-contact manner. The mechanism for non-contact suspension holding is the same as in the fourth embodiment. In the seventh embodiment, the screen member 152 that existed in the first to sixth embodiments is not provided, and the chamber 200 is provided with opening/closing doors 198a and 198b for opening and closing the opening 200a.

In the seventh embodiment, since the screen member 152 is omitted as described above, the footprint of the entire exposure apparatus can be reduced. Further, since the substrate feeder 167 is supported on the upper surface side, the occurrence of deflection in the substrate feeder 167 can be suppressed compared to the case where the substrate feeder 167 is supported in a cantilevered manner.

(Board replacement operation)
While performing the exposure operation in the stage device 20, the main controller opens the opening/closing doors 198a and 198b (see arrow S1), controls the external transfer robot 300, and controls the -X of the newly loaded substrate P2. The end portion is positioned below the +X end on the bottom surface of the substrate feeder 167. Then, the main controller starts non-contact suspension holding of the substrate P2 on the lower surface of the substrate feeder 167, and uses the substrate slide hand 140 to transport the substrate P2 to the position shown in FIG.

Further, the main controller causes the substrate slide hand 140 to hold the substrate P1 on the substrate holder 28 and drives it in the +X direction, as in the previous embodiments, and moves the exposed substrate P1 from above the substrate holder 28. Slide transfer onto the robot hand 300F of the external transfer robot 300 (see arrow S2).

Thereafter, the main controller causes the suction pad 27 of the substrate carry-in bearer device 25 to adsorb and hold the substrate P2, and drives the stage device 20 in the −X direction to move the substrate P2 from the substrate feeder 167 onto the substrate holder 28. Hand over.

Note that the subsequent operations are similar to those in the third embodiment.

《Eighth embodiment》
Next, the eighth embodiment will be described in detail using FIGS. 26 to 30. 26(a) and 26(b) show a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the eighth embodiment. Note that in FIGS. 26 to 30, illustration of the chamber 200 is omitted for convenience.

In the eighth embodiment, the robot hand 300F' of the external transfer robot 300' has a flat member whose end on the -X side is processed into a comb-teeth shape. However, as in the previous embodiments, the robot hand 300F' is capable of air floating support of the substrate P by supplying pressurized gas from the top surface, and is also capable of vacuum suctioning the substrate P. It becomes.

Further, in the eighth embodiment, a screen member 172 is used in place of the screen member 152 described in the first embodiment and the like. The screen member 172 has a box-shaped portion forming a space 173, and a substrate feeder 168 is provided on the upper surface of the upper wall (+Z side wall) of the box-shaped portion. Further, a carry-out port 172L is provided on the wall on the +X side of the box-shaped portion, and a substrate passage port 172M is provided on the wall on the −X side of the box-shaped portion. Further, above the carry-out port 172L of the screen member 172, a carry-in port 172U is provided. A carry-out port shutter 156 is provided near the carry-in port 172L, and a carry-in port shutter 154 is provided near the carry-in port 172U. Note that since FIG. 26(b) is a cross-sectional view, the +Y side and −Y side of the box-shaped portion are closed off by walls, although they are not shown.

Board feeder 168 is capable of reciprocating movement in the X-axis direction along a pair of rails 174 laid along the X-axis direction on the upper surface of the upper wall of the box-shaped portion of partition member 172. The movable range of board feeder 168 in the X-axis direction is approximately half the length of board P in the X-axis direction.

In the eighth embodiment, a plurality of (four in FIG. 26(a) ) rod-shaped air floating members 29 are provided at predetermined intervals in the Y-axis direction on the +X side end face of substrate holder 28. An opening (not shown) is provided on the upper face (+Z face) of air floating member 29, and pressurized gas is supplied from this opening.

(Board replacement operation)
Next, the board exchange operation in the eighth embodiment will be explained using FIGS. 26 to 30. Note that FIGS. 26(a) and 26(b), FIGS. 27(a) and 27(b), and FIGS. 28(a) and 28(b) are cross-sectional views of the vicinity of the stage device at the same timing. and a vertical cross-sectional view. Note that, in FIGS. 26(a) to 30(b), illustrations of components of the exposure apparatus that are unnecessary for explanation are omitted.

(Operations in FIGS. 26(a) and 26(b))
In the states shown in FIGS. 26A and 26B, the stage device 20 is exposing the substrate P1. On the other hand, in order to receive the substrate P2 to be exposed next into the chamber 200, the main controller opens the loading port 152U by sliding the loading port shutter 154 in the +Z direction (arrow T1 in FIG. 26(b) reference). Next, the main controller drives the external transfer robot 300' in the -X direction (see arrow T2 in FIGS. 26(a) and 26(b)), and moves the -X side end of the substrate P2 into the chamber 200. to enter. As a result, the -X side end of the substrate P2 is positioned above the +X end of the substrate feeder 168. Then, the main controller brings the suction pad 142 of the substrate slide hand 140 into contact with a part of the lower surface of the substrate P2 to start suction and holding. Further, the main controller starts supplying pressurized gas from the upper surface of the robot hand 300F' of the external transfer robot 300' and the upper surface of the substrate feeder 168.

(Operations in Figs. 27(a) and 27(b))
The main controller drives suction pad 142 to move substrate P2 along the substrate support surface (upper surface) of substrate feeder 168 (see arrow T3).

(Operations in FIGS. 28(a) and 28(b))
When the substrate P2 moves to the position shown in FIGS. 28(a) and 28(b) due to the movement of the suction pad 142, the main controller drives the external transfer robot 300' downward (in the -Z direction) (in the direction of the arrow (see T4), and position it near the exit 172L. Further, the main controller closes the loading port 172U by sliding the loading port shutter 154 in the −Z direction (see arrow T5).

(Operation in Figure 29(a))
Thereafter, when the exposure of the substrate P1 in the stage device 20 is completed, the main controller moves the stage device 20 to the substrate exchange position (see arrow T6). When the stage device 20 is positioned at the substrate exchange position, the air floating member 29 enters the space 173 via the substrate passage port 172M, as shown in FIG. 29(a). Further, the main controller starts sucking and holding the substrate P2 by the substrate feeder 168, and drives the substrate feeder 168 in the -X direction along the rail 174 (see arrow T7). Note that in synchronization with the movement of the substrate feeder 168, the suction pad 142 holding the substrate P2 may be moved in the -X direction, or when the substrate feeder 168 is moved, the suction pad 142 may adsorb the substrate P2. The holding may be released and the suction pad 142 may be moved in the -X direction in advance.

Further, the main controller opens the export exit 172L by sliding the exit shutter 156 in the -Z direction (see arrow T8). Further, the main controller drives the external transfer robot 300' in the −X direction, thereby causing the external transfer robot 300 to enter the space 173 formed by the screen member 172 (see arrow T9). In this state, the heights of the substrate holder 28 and the air floating member 29 and the upper surface of the robot hand 300F' of the external transfer robot 300' are substantially the same. Further, the air floating member 29 and the comb-like portions of the robot hand 300F' are nested, so that mechanical interference (contact) is avoided.

(Operation in Figure 29(b))
Next, the main controller slightly raises the suction pad 27 of the substrate carry-in bearer device 25, and causes the suction pad 27 to suction and hold the lower surface of the substrate P1. The main controller also starts supplying pressurized gas (air supply) from the top surface of the substrate holder 28 and moves the suction pad 27 holding the substrate P1 by suction in the +Y direction, thereby moving the substrate P1 to the substrate holder 28. offset slightly in the +Y direction. This offset allows the suction pad 142 of the substrate slide hand 140 to hold the -X side and +Y side corners of the lower surface of the substrate P1.

Next, the main controller causes the suction pad 142 of the substrate slide hand 140 to suction and hold a part of the lower surface of the substrate P1. It is assumed that the main controller has started supplying pressurized gas from the upper surface of the air floating member 29 and the robot hand 300F' at the stage shown in FIG. 29(b).

Next, the main controller starts moving the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow T10). Further, the main controller drives the suction pad 27 of the substrate carry-in bearer device 25 in the +Z direction (see arrow T11) at the timing when the substrate P1 has moved by a predetermined distance in the −X direction, and the suction pad 27 moves the substrate feeder. The -X end of the substrate P2 on the substrate P2 is started to be held by suction.

(Operation in Figure 30(a))
Next, the main controller starts supplying pressurized gas (air supply) from the upper surface of the substrate feeder 168. Then, the main controller drives the stage device 20 in the -X direction (see arrow T12) with the suction pad 27 of the substrate carry-in bearer device 25 suctioning and holding the substrate P2. Further, the main controller drives the stage device 20 in the −X direction and simultaneously moves the substrate feeder 168 in the +X direction. Thereby, as shown in FIG. 10(a), the substrate P2 is transferred from the substrate feeder 168 onto the substrate holder 28. As a result, rather than loading the substrate P2 onto the substrate holder 28 by only driving the stage device 20 in the −X direction, the substrate P2 can be loaded onto the substrate holder 28 by driving the stage device 20 and the substrate feeder 168 in a direction away from each other in the X direction. P2 can be carried onto the substrate holder 28 at a higher speed. This is possible because the space 173 is provided in the chamber 200, and the apparatus is configured such that the substrate feeder 168 can be driven in the +X direction. Note that the timing for driving the stage device 20 in the -X direction and the timing for moving the substrate feeder 168 in the +X direction may be different. Note that the main controller may move the substrate feeder 168 in the +X direction after delivering the substrate P2 to the substrate holder 28.

(Operation in Figure 30(b))
By continuing to move the suction pad 142 in the +X direction, the main controller transfers the substrate P1 onto the robot hand 300F' of the external transfer robot 300', as shown in FIG. 30(b). When this transfer is completed, the main controller stops the suction pad 142 from suctioning and holding the substrate P1. The main controller also drives the external transfer robot 300' holding the substrate P1 in the +X direction (see arrow T13) to transfer the substrate P1 to the external device. Further, the main controller closes the exit port 172L by sliding the exit shutter 156 in the +Z direction (see arrow T14).

The subsequent operations are similar to those in the first embodiment and the like.

As described in detail above, according to the eighth embodiment, the operation of loading the substrate P2 into the substrate holder 28 and the operation of unloading the substrate P1 from the substrate holder 28 can be performed in parallel, so that the substrate can be replaced. The time required for operation can be shortened.

Further, in the eighth embodiment, an air floating member 29 is provided on the +X side of the substrate holder 28, and the -X side end of the robot hand 300F' of the external transfer robot 300' is shaped like a comb. As a result, the air floating member 29 and the robot hand 300F' are nested, so that deflection of the substrate P when the substrate P is delivered can be suppressed.

Note that in the eighth embodiment, the substrate (the substrate to be carried out) may be supported in a non-contact manner on the lower surface of the substrate feeder 168, as in the fourth embodiment.

In the eighth embodiment, a shutter may be provided to open and close the substrate passage port 172M. Further, a shutter may be provided to open and close the substrate passage port 172M, and the unloading port shutter 156 may be omitted.

In the eighth embodiment, the rail 146 of the substrate slide hand 140 may be provided on the substrate feeder 168. In this case, since the substrate feeder 168 is movable in the X-axis direction, the length of the rail 146, that is, the X stroke of the suction pad 142 can be shortened.

《Ninth embodiment》
Next, a ninth embodiment will be described using FIGS. 31 and 32. 31(a) and 31(b) show a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the ninth embodiment.

The exposure apparatus of the ninth embodiment is characterized in that a substrate feeder 169 is used in place of the substrate feeder 168 of the eighth embodiment described above. A plurality of (three in FIG. 31(a)) grooves 169a are formed on the +X side of the upper surface of the substrate feeder 169. The dimensions and intervals of the grooves 169a are set so that the substrate feeder 169 and the robot hand 300F' do not come into contact even when the robot hand 300F' of the external transfer robot 300' enters from the loading port 172U. Other configurations are similar to those of the eighth embodiment.

(Board replacement operation)
Next, the board exchange operation in the ninth embodiment will be described based on FIGS. 31 and 32. Note that FIGS. 31(a), 31(b), 32(a), and 32(b) show a cross-sectional view and a vertical cross-sectional view of the vicinity of the stage device at the same timing. Note that in FIGS. 31(a) to 32(b), illustrations of the configuration of the exposure apparatus that are unnecessary for explanation are omitted.

In the states shown in FIGS. 31(a) and 31(b), it is assumed that exposure is being performed on the substrate P1 placed on the substrate holder 28 in the stage device 20. In this state, the main controller opens the loading port 172U by sliding the loading port shutter 154 in the +Z direction in order to receive the substrate P2 to be exposed next into the chamber 200 (see FIG. 31(b)). (see arrow U1). Next, the main controller drives the external transfer robot 300' in the -X direction (see arrow U2 in FIGS. 31(a) and 31(b)). Due to this operation of the external transfer robot 300', as shown in FIGS. 32(a) and 32(b), approximately half of the robot hand 300F' on the -X side and approximately half of the substrate P2 on the -X side are transferred to the substrate feeder 169. is positioned above.

Next, the main controller transfers a portion of the substrate P2 to the substrate feeder 169 by driving the robot hand 300F' downward.

Then, the main controller starts supplying pressurized gas from the substrate support surface (top surface) of the substrate feeder 169 and the top surface of the robot hand 300F'. The main controller also drives the suction pad 142 to cause the suction pad 142 to suction and hold the +Y side and -X side end portion of the substrate P2.

After that, the main controller replaces the substrate on the substrate holder 28 by executing the same operation as in the eighth embodiment.

As described above, according to the ninth embodiment, the external transfer robot 300' enters the chamber 200 and delivers about half of the -X side of the substrate P2 to the substrate feeder 169. The movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (suction pad 142) that is pulled into the chamber 200 can be shortened. Moreover, in connection with this, the moving time of the suction pad 142 can be shortened.

In addition, when transferring the substrate from the external transfer robot 300' to the substrate feeder 169, it is transferred from above, so compared to the case where the substrate is transferred by sliding, the tip of the substrate bends (sags) and the substrate is transferred. The possibility of contact with the substrate feeder 169 can be reduced.

《10th embodiment》
Next, a tenth embodiment will be described using FIGS. 33 and 34. 33(a) to 34(b) show cross-sectional views of an exposure apparatus according to a tenth embodiment. As shown in FIG. 33(a), unlike the ninth embodiment described above, the exposure apparatus of the tenth embodiment is characterized in that the rail 146 of the substrate slide hand 140 is fixed to the substrate feeder 169. . Note that the other configurations are the same as those in the ninth embodiment.

(Board replacement operation)
The substrate exchange operation in the exposure apparatus of the tenth embodiment will be described below with reference to FIGS. 33(a) to 34(b).

In FIG. 33(a), it is assumed that exposure is being performed on the substrate P1 placed on the substrate holder 28 in the stage device 20. In this state, the main controller opens the loading port 172U by sliding the loading port shutter 154 in the +Z direction in order to receive the substrate P2 to be exposed next into the chamber 200. Next, the main controller drives the external transfer robot 300' in the -X direction (see arrow V1). By this operation of the external transfer robot 300', as shown in FIG. 33(b), about half of the robot hand 300F' on the -X side and about half of the substrate P2 on the -X side are positioned above the substrate feeder 169. .

Next, the main controller transfers a portion of the substrate P2 to the substrate feeder 169 by driving the robot hand 300F' downward until the upper surface of the robot hand 300F' substantially matches the upper surface of the substrate feeder 169. Next, the main controller starts supplying pressurized gas from the substrate support surface (upper surface) of the substrate feeder 169 and the upper surface of the robot hand 300F'. The main controller also drives the suction pad 142 to cause the suction pad 142 to suction and hold the +Y side and -X side end portion of the substrate P2.

Next, as shown in FIG. 34(a), the main controller moves the substrate P2 along the substrate support surface of the substrate feeder 169 by driving the suction pad 142 in the −X direction (see arrow V2). . Thereafter, when the exposure of the substrate P1 is completed in the stage device 20, the main controller drives the substrate feeder 169 in the -X direction (see arrow V3), as shown in FIG. ' is driven in the +X direction to retreat from the chamber 200 (see arrow V4). Thereafter, the main control device replaces the substrate on the substrate holder 28 by executing the same operations as those in the eighth embodiment described above (the operations shown in FIGS. 29(a) to 30).

As described above, according to the tenth embodiment, the external transfer robot 300' enters the chamber 200 and delivers about half of the -X side of the substrate P2 to the substrate feeder 169. The movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (suction pad 142) that is pulled into the chamber 200 can be shortened. Moreover, in connection with this, the moving time of the suction pad 142 can be shortened.

In addition, when transferring the substrate from the external transfer robot 300' to the substrate feeder 169, it is transferred from above, so compared to the case where the substrate is transferred by sliding, the tip of the substrate bends (sags) and the substrate is transferred. The possibility of contact with the substrate feeder 169 can be reduced.

Furthermore, in the tenth embodiment, since the rail 146 of the substrate slide hand 140 is provided on the substrate feeder 169, the movement range (stroke) of the substrate slide hand 140 in the X-axis direction can be made shorter than in the ninth embodiment. is possible.

《Eleventh embodiment》
Next, an exposure apparatus according to an eleventh embodiment will be described using FIGS. 35 to 38.

35(a) and 35(b) show a cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the eleventh embodiment. Note that in FIGS. 35(a), 35(b), etc., illustration of the chamber 200 is omitted for convenience.

As shown in FIGS. 35(a) and 35(b), in the eleventh embodiment, an external transfer robot 301 is used in place of the external transfer robot 300' of the ninth embodiment. Further, the screen member 172 is provided with a surrounding member 182 that forms a space 171 that covers the substrate feeder 169.

As shown in FIG. 35(a), the external transfer robot 301 has a plurality of (for example, five) finger sections 301F, but unlike the external transfer robots 300 and 300', it has a function of air levitating the substrate P. shall not have. Further, in accordance with the finger portion 301F of the external transfer robot 301, the length of the groove 169a of the substrate feeder 169 in the X-axis direction is set longer than in the ninth embodiment. Note that an uneven member such as a substrate support pad may be present on the upper surface of the finger portion 301F of the external transfer robot 301.

An opening 172N is formed in the surrounding member 182 provided on the screen member 172. In the eleventh embodiment, the finger portion 301F of the external transfer robot 301 enters the chamber 200, but the range of its entry is limited to the space 171 and the space 173. Furthermore, in the eleventh embodiment, an air exhaust device 183 is provided in the space 173 to exhaust air in the +Z direction. High pressure air may be supplied to the air exhaust device 183 from a compressor commonly used as factory equipment. Further, the air exhaust device 183 may use a fan as disclosed in, for example, Japanese Patent Laid-Open No. 2009-073660.

The other configurations are the same as those of the ninth embodiment.

(Board replacement operation)
Next, the board exchange operation in the eleventh embodiment will be explained in detail using FIGS. 35(a) to 38(c). Note that FIGS. 35(a) and 35(b), FIGS. 36(a) and 36(b), and FIGS. 37(a) and 37(b) are cross-sectional views of the vicinity of the stage device at the same timing. and a vertical cross-sectional view. Note that, in FIGS. 35(a) to 38(c), illustrations of components of the exposure apparatus that are unnecessary for explanation are omitted.

(Operations in Figures 35(a) and 35(b))
In the states shown in FIGS. 35A and 35B, the stage device 20 is exposing the substrate P1. On the other hand, the main controller opens the loading port 152U by sliding the loading port shutter 154 in the +Z direction in order to receive the substrate P2 to be exposed next into the chamber 200 (inside the space 171) (see FIG. 35). (See arrow α1 in b)).

(Operations in Figures 36(a) and 36(b))
Next, the main controller drives the external transfer robot 301 in the −X direction (see arrow α2 in FIGS. 36(a) and 36(b)). Due to this operation of the external transfer robot 301, as shown in FIGS. 36(a) and 36(b), about half of the finger portion 301F of the external transfer robot 301 on the -X side and about half of the substrate P2 on the -X side are removed. It is positioned above the substrate feeder 169. In this state, the main controller transfers a portion of the substrate P2 to the substrate feeder 169 by driving the external transfer robot 301 downward. The main controller then starts supplying pressurized gas from the substrate feeder 169. The main controller also drives the suction pad 142 to cause the suction pad 142 to suction and hold the +Y side and -X side end portion of the substrate P2.

(Operations in Figures 37(a) and 37(b))
Next, the main controller drives the suction pad 142 in the direction intersecting the X-axis and the Z-axis within the XZ plane (in the direction of inclination of the substrate support surface of the substrate feeder 169) (see arrow α3) to move the substrate P2. It is moved to the positions shown in FIGS. 37(a) and 37(b). Further, the main controller moves the finger portion 301F out of the space 171 by driving the external transfer robot 301 in the +X direction. When the +X end of the substrate P2 is located on the −X side of the loading port shutter 154, and the −X end of the finger portion 301F of the external transfer robot 301 is located on the +X side of the loading port shutter 154, the main control The device closes the loading port 172U by sliding the loading port shutter 154 in the −Z direction (see arrow α4). Further, the main controller drives the external transfer robot 301 in the −Z direction, and positions the −X end of the finger portion 301F near the outlet 172L (see arrow α5).

(Operation in Figure 38(a))
Next, the main controller starts sucking and holding the substrate P2 by the substrate feeder 169, and drives the substrate feeder 169 in the −X direction (see arrow α6). Note that in synchronization with the movement of the substrate feeder 169, the suction pad 142 holding the substrate P2 may be moved in the -X direction, or when the substrate feeder 169 is moved, the suction pad 142 may adsorb the substrate P2. The holding may be released and the suction pad 142 may be moved in the -X direction in advance. Further, the main controller opens the outlet 172L by sliding the outlet shutter 156 in the −Z direction (see arrow α7). Further, the main controller drives the external transfer robot 301 in the −X direction (see arrow α8), so that the finger portion 301F passes through the carry-out port 172L and the substrate passage port 172M.

(Operation in Figure 38(b))
Thereafter, when the exposure of the substrate P1 in the stage device 20 is completed, the main controller moves the stage device 20 to the substrate exchange position below the substrate feeder 169 (see arrow α9). At this time, the air floating member 29 provided on the substrate holder 28 and the finger portion 301F of the external transfer robot 301 become nested.

The main controller also controls the air exhaust device 183 to start exhausting high-pressure air upward (see broken line arrow α10). Further, the main controller starts supplying pressurized gas from the upper surface of the substrate holder 28 and the upper surface of the air floating member 29. Further, the main controller uses the substrate carry-in bearer device 25 to offset the substrate P1 in the +Y direction, causes the suction pad 27 to suction and hold a part of the substrate P2, and drives the suction pad 27 in the +X direction (Fig. 38(c) arrow α11).

Thereafter, the main controller drives the suction pad 27 of the substrate carry-in bearer device 25 upward, and the suction pad 27 suction-holds the -X end of the substrate P2. Further, the main controller starts supplying pressurized gas (air supply) from the upper surface of the substrate feeder 169. Then, the main controller drives the stage device 20 in the −X direction (see arrow α12) while the suction pad 27 of the substrate carry-in bearer device 25 suction-holds the substrate P2, and at the same time drives the substrate feeder 169 in the +X direction. (see arrow α13). Thereby, as shown in FIG. 38(c), the substrate P2 is transferred from the substrate feeder 169 onto the substrate holder 28. As a result, rather than loading the substrate P2 onto the substrate holder 28 by only driving the stage device 20 in the -X direction, the substrate P2 can be loaded onto the substrate holder 28 by driving the stage device 20 and the substrate feeder 169 in the direction away from each other in the X direction. P2 can be carried onto the substrate holder 28 at a higher speed. This is possible because the space 173 is provided in the chamber 200, and the apparatus is configured such that the substrate feeder 169 can be driven in the +X direction. Note that the timing for driving the stage device 20 in the -X direction and the timing for moving the substrate feeder 168 in the +X direction may be different. Note that the main controller may move the substrate feeder 169 in the +X direction after delivering the substrate P2 to the substrate holder 28. Further, the main controller performs alignment (position adjustment) of the substrate P2 by minutely driving the suction pad 27. Thereafter, the main controller drives the suction pad 27 downward, starts sucking and holding the substrate P2 by the substrate holder 28, and starts exposing the substrate P2 newly placed on the substrate holder 28. Note that the main controller may move the substrate feeder 169 in the +X direction after delivering the substrate P2 to the substrate holder 28 (see arrow α13).

Further, by the main controller continuing to drive the suction pad 142 in the +X direction (see arrow α11), the substrate P1 is transferred from the substrate holder 28 and the air floating member 29 to the external transfer robot 301. Note that during the transfer of the substrate P1, high-pressure air is blown upward from the air exhaust device 183, so even if the external transfer robot 301 does not have the function of supplying pressurized gas, the external transfer It is possible to prevent the fingers 301F of the robot 301 from coming into contact with the substrate P1. Thereafter, the main controller stops the air exhaust device 183 and starts sucking and holding the substrate P1 with the fingers 301F. The main controller then drives the external transport robot 301 in the +X direction to transport the substrate P1 out of the chamber 200 and closes the transport port shutter 156.

This completes the substrate replacement operation.

As described above, in addition to obtaining the same effects as in the ninth embodiment, by using the air exhaust device 183, even if the external transfer robot 301 does not have a mechanism for supplying pressurized gas, it is possible to Contact between the portion 301F and the substrate P1 can be prevented. Further, since the screen member 172 has the spaces 171 and 173, it is possible to suppress dust from entering the vicinity of the exposure apparatus main body 10.

In the eleventh embodiment, a shutter may be provided at the substrate passage port 172M and the opening 172N. Thereby, entry of dust into the chamber 200 can be suppressed.

《12th embodiment》
Next, the twelfth embodiment will be described in detail using FIGS. 39 to 41. FIG. 39(a) shows a longitudinal cross-sectional view of the vicinity of the screen member 172 according to the twelfth embodiment, and FIG. 39(b) shows a cross-sectional view taken along the line BB in FIG. 39(a). ing.

The twelfth embodiment is characterized in that, in addition to the configuration of the eleventh embodiment described above, an air exhaust device 183 provided in the space 173 is provided with a belt feeding mechanism 40.

The belt feeding mechanism 40 includes a pair of rails 41 provided in the air exhaust device 183 and having a longitudinal direction in the X-axis direction, a pair of movable bodies 43 movable in the X-axis direction along the rails 41, and a movable body 43. A moving member 42 whose longitudinal direction is in the Y-axis direction is connected to each member. The moving member 42 is provided with a plurality of (for example, four) convex portions protruding in the Z direction and spaced apart from each other by a predetermined interval in the Y-axis direction. Further, the belt feeding mechanism 40 includes a plurality of belts 45 (for example, four belts) having one end fixed to each of the convex portions of the moving member 42, and a weight member 47 fixed to the other end of each of the belts 45. . Note that each of the belts 45 is suspended around a pulley 48 fixed to a shaft member provided in the air exhaust device 183 and extending in the Y-axis direction.

In the belt feeding mechanism 40, when a driving force in the −X direction is not applied to the movable body 43, the weight member 47 comes into contact with the bottom surface of the space 173 as shown in FIG. 39(a). The state in (a) is maintained. On the other hand, when a driving force in the −X direction is applied to the movable body 43, the moving member 42 moves in the −X direction, so that the length of the portion of the belt 45 that extends in the X-axis direction becomes longer.

(Board replacement operation)
Next, the substrate exchange operation in the exposure apparatus of the twelfth embodiment will be described in detail based on FIGS. 40(a) to 41(c).

In FIG. 40(a), the exposure of the substrate P1 has been completed in the stage device 20, and the substrate P2 is transferred onto the substrate feeder 169 by the external transfer robot 301 in the same manner as in the eleventh embodiment described above. A state in which the substrate feeder 169 has moved in the -X direction is shown. In this case, the weight member 47 of the belt feeding mechanism 40 is in contact with the bottom surface of the space 173.

In FIG. 40(a), the main controller opens the outlet 172L by sliding the outlet shutter 156 in the −Z direction (see arrow β1 in FIG. 40(a)). Then, as shown in FIG. 40(b), the main controller causes the finger portion 301F of the external transfer robot 301 to enter from the export port 172L (see arrow β2), and moves the stage device 20 to the substrate exchange position (substrate feeder 169). (see arrow β3). In this case, each of the air floating members 29 provided on the substrate holder 28 is aligned with each belt 45 in the same straight line as shown in FIG. 41(a). Further, the finger portion 301F of the external transfer robot 301 is nested with the belt 45 and the air floating member 29, so that the finger portion 301F does not come into contact with the belt 45 and the air floating member 29. Note that since the belt 45 is provided with a large number of small holes, by supplying high pressure air from the air exhaust device 183, a portion of the high pressure air passes through the holes. Therefore, it is possible to provide the belt 45 with the same function as the air floating member 29. Thereby, the substrate P1 can be slid in a floating state or a semi-floating state with respect to the belt 45.

That is, in the state shown in FIG. 41(a), by sliding the substrate P1 placed on the substrate holder 28 in the +X direction using the substrate slide hand 140, the finger portion 301F of the external transfer robot 301 receives air floating. Even without this function, the substrate P1 can be moved above the finger portion 301F of the external transfer robot 301 without bending the substrate P1.

After that, similarly to the eleventh embodiment, the substrate P2 is transferred from the substrate feeder 169 onto the substrate holder 28, and the substrate P1 is transferred from the substrate holder 28 to the external transfer robot 300. In this operation, the main controller drives the stage device 20 in the −X direction, and moves the moving member 42 in the −X direction to follow the driving of the stage device 20 in the −X direction. ing. As a result, as shown in FIG. 41(b), it is possible to maintain a state in which the air floating member 29 or the belt 45 is arranged with almost no gap between the fingers 301F of the external transfer robot 301. It has become.

FIG. 41(c) shows a state in which the substrate P2 is placed on the substrate holder 28 and the substrate P1 is positioned above the finger portion 301F of the external transfer robot 301. From this state, the main control device transfers the substrate P1 to the external transfer robot 301 by driving the external transfer robot 301 upward. Thereafter, the main controller stops the air exhaust device 183 and starts sucking and holding the substrate P1 with the fingers 301F. Then, the main controller drives the external transfer robot 301 in the +X direction to retreat from the space 173, and slides the exit shutter 156 in the +Z direction to close the exit 172L.

In the above description, the substrate P1 is slidably transported into the space 173 with the external transport robot 301 having entered the space 173, but this is not limited to the above. For example, the external transport robot 301 may be caused to enter the space 173 after the substrate P1 has been slidably transported into the space 173.

(Modification)
In each of the above embodiments, the case where an unloading outlet shutter and an inlet shutter are provided near the unloading outlet and inlet of the partition members 152, 172 has been described. However, this is not limited to this, and the unloading outlet shutter and the inlet shutter may be provided in the chamber 200.

Note that the substrate feeder of each of the above embodiments is a substrate feeder 264 as shown in FIG. 42, and a cover 199 is fixed to a pair of block-shaped members 265 provided on the +Y side surface and −Y side surface of the substrate feeder 264. By doing so, the upper surface of the substrate feeder 264 may be covered. Further, in the case of a substrate feeder having a groove formed on the upper surface, a cover 199 may be provided to cover the area other than the upper part of the groove.

The cover 199 has an inverted U-shape in YZ cross section, and between the cover 199 and the substrate feeder 264, a substrate can be slid in from the +X side, and a substrate can be slid out from the -X side. It is now possible to do so. Note that although FIG. 42 shows a case where the cover 199 is transparent, the cover 199 does not have to be transparent. In this modification, by providing the cover 199, it is possible to prevent dust from adhering to the substrate P and to keep the temperature of the substrate P constant.

In addition, in the sixth embodiment (FIGS. 22(a), 22(b), etc.), when the substrate feeder 264 shown in FIG. You can also use it as Further, in the seventh embodiment (FIG. 25), when the substrate feeder 264 of FIG. 42 is employed, a cover 199 may be provided on the lower surface side of the substrate feeder.

Further, as the substrate feeder in each of the above embodiments, a substrate feeder 364 as shown in FIG. 43(a) may be employed. The substrate feeder 364 has a curved upper surface. By curving the upper surface (substrate supporting surface) of the substrate feeder 364 in this manner, the section modulus of the substrate can be increased. In other words, with respect to the deflection of the substrate, the same effect as if the thickness of the substrate were several to several hundred times larger than the actual thickness can be obtained.

By doing this, even if the substrate P is placed on the substrate feeder 364 with the -X end protruding as shown in FIG. can be suppressed from occurring. Furthermore, since the occurrence of bending (sagging) of the substrate P is suppressed, when the substrate P is brought into contact with the substrate holder 28, the substrate P can be brought into contact from the center of the -X side in the Y-axis direction. Therefore, it is possible to make wrinkles less likely to occur at the −X end of the substrate P.

An ionizer may be installed near the substrate feeder, which can eliminate static electricity before the substrate is placed on the substrate holder 28.

The embodiments described above are examples of preferred implementations of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.

REFERENCE SIGNS LIST 10 Exposure apparatus main body 100 Exposure apparatus 200 Chamber 300 External transfer robot 28 Substrate holder 160 Substrate feeder

Claims (16)

An exposure device main body,
a chamber accommodating the exposure apparatus main body;
a substrate holding section provided in the chamber that receives and holds a substrate transferred by an external transfer robot outside the chamber;
Transferring the substrate from the external transfer robot to the substrate holder, transferring the substrate from the substrate holder onto a holding device included in the exposure apparatus main body, and transferring the substrate from the holding device to the external transfer robot. a board transfer device that performs the transfer of the
An exposure apparatus comprising: The substrate transfer device includes:
a holding part provided in the holding device for holding a part of the substrate on the substrate holding part;
With the holding part holding a part of the substrate on the substrate holding part, the holding apparatus moves in a first direction away from the substrate holding part, thereby moving the substrate from the substrate holding part onto the holding apparatus. The exposure apparatus according to claim 1, wherein the exposure apparatus transfers the substrate. 3. The exposure apparatus according to claim 2, wherein a first surface of the substrate holding part that holds the substrate before it is transferred to the holding device is inclined with respect to an upper surface of the holding device at least when the substrate is transferred from the substrate holding part onto the holding device. 4. The exposure apparatus according to claim 3, wherein the substrate holder transitions between a state in which the first surface is inclined with respect to an upper surface of the holding device and a state in which it is not inclined. The substrate transfer device includes:
The external transfer robot is located outside the chamber, and the substrate is transferred to the substrate holding unit from a state where a part of the substrate held by the external transfer robot is located inside the chamber. The exposure apparatus according to any one of the items. The substrate transfer device transfers the substrate on the holding device to the external transfer robot with the substrate held by the substrate holding portion, and after the transfer, transfers the substrate held by the substrate holding portion to the holding device. The exposure apparatus according to any one of claims 1 to 5, which is delivered to. The substrate transfer device includes:
a first transfer mechanism that is provided in the substrate holder and transfers the substrate from the external transfer robot to the substrate holder;
a second transfer mechanism that is provided on the holding device and transfers the substrate from above the holding device to the external transfer robot;
The exposure apparatus according to any one of claims 1 to 6, comprising: The exposure apparatus according to any one of claims 1 to 7, wherein a non-contact suspension holding mechanism for holding the substrate suspended in a non-contact manner is provided on a lower surface of the substrate holder. 9. The exposure apparatus according to claim 8, wherein the non-contact suspension holding mechanism holds the substrate transferred from the holding device to the external transfer robot in a non-contact suspension manner. 9. The exposure apparatus according to claim 8, wherein the non-contact suspension holding mechanism holds the substrate in a non-contact suspension manner before being delivered to the holding device. An opening/closing door is provided near the opening of the chamber through which the substrate is carried out,
11. Any one of claims 1 to 10, wherein a first levitation force applying mechanism for applying levitation force to the substrate is provided at a position of the opening/closing door facing the lower surface of the substrate passing through the opening. The exposure apparatus described in . The substrate holding section is capable of reciprocating between a first position above a movement area of the holding device and a second position above outside the movement area of the holding device. Exposure device described in Section. 13. The exposure apparatus according to claim 1, wherein the substrate is transferred by vertical relative movement between the external transfer robot and the substrate holder. The exposure apparatus according to any one of claims 1 to 13, further comprising a second levitation force applying mechanism that applies levitation force from below to the substrate transferred from above the holding device to the external transfer robot. . exposing a substrate using the exposure apparatus according to any one of claims 1 to 14;
Developing the exposed substrate. A method for manufacturing a flat panel display. A device manufacturing method, the method comprising:
exposing a substrate using the exposure apparatus according to any one of claims 1 to 14;
A device manufacturing method comprising: developing the exposed substrate.

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