KR20210142696A - Exposure apparatus, flat panel display manufacturing method, and device manufacturing method - Google Patents

Abstract

In order to achieve downsizing of the apparatus (smaller footprint), the exposure apparatus 100 includes an exposure apparatus main body 10 , a chamber 200 accommodating the exposure apparatus main body, and external transport outside the chamber 200 . A substrate holding unit 160 formed in the chamber 200 that receives and holds the substrate P conveyed by the robot 300 , and the substrate holding unit 160 from the external transfer robot 300 . transfer of the substrate P to a furnace, transfer of the substrate P from the substrate holding part 160 to the holding apparatus 28 of the exposure apparatus main body 10 , transfer of the substrate P from on the holding apparatus 28 and a substrate transfer device (140) for transferring the substrate (P) to the external transfer robot (300).

Description

Exposure apparatus, flat panel display manufacturing method, and device manufacturing method

The present invention relates to an exposure apparatus, a method for manufacturing a flat panel display, and a method for manufacturing a device.

In a lithography process for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements, a pattern formed on a mask (or reticle) is transferred onto a substrate (a substrate made of glass or plastic, semiconductor wafer, etc.) using an energy beam. An exposure apparatus is being used.

In this type of exposure apparatus, using a substrate transfer apparatus, carrying out of the exposed substrate on the stage apparatus holding the substrate and loading of a new substrate onto the stage apparatus are performed. As a conveyance method of a board|substrate, the method of patent document 1 is known, for example.

International Publication No. 2013/150787

The exposure apparatus includes an exposure apparatus main body, a chamber accommodating the exposure apparatus main body, a substrate holding unit formed in the chamber for receiving and holding a substrate conveyed by an external transfer robot outside the chamber, and the external transfer Transfer of the substrate from the robot to the substrate holding unit, transfer of the substrate from the substrate holding unit onto a holding apparatus of the exposure apparatus main body, and transfer of the substrate from the holding apparatus to the external transfer robot A substrate transfer device is provided.

In addition, the structure of embodiment mentioned later may be improved suitably, and at least one part may be replaced with another structure. In addition, the structural requirements which are not specifically limited with respect to the arrangement|positioning are not limited to the arrangement|positioning disclosed by embodiment, It can arrange|position in the position which can achieve the function.

Fig. 1 (a) is a diagram schematically showing the exposure apparatus according to the first embodiment, and Fig. 1 (b) is a cross-sectional view taken along line AA of Fig. 1 (a).
Figure 2 is a cross-sectional view of Figure 1 (a).
Fig. 3(a) is a view showing the substrate carrying-in/out unit of Fig. 1(a) taken out, and Fig. 3(b) is a diagram showing a state when the substrate carrying-in/out unit of Fig. 3(a) is viewed from the +X side.
4(a) and 4(b) are a plan view of the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and are views (Part 1) for explaining the substrate exchange operation of the first embodiment.
5(a) and 5(b) are a plan view of the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and are views (part 2) for explaining the substrate exchange operation of the first embodiment.
6(a) and 6(b) are a plan view in the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and is a diagram (part 3) for explaining the substrate exchange operation of the first embodiment.
7(a) and 7(b) are a plan view in the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and is a diagram (part 4) for explaining the substrate exchange operation of the first embodiment.
8(a) and 8(b) are a plan view in the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and is a diagram (part 5) for explaining the substrate exchange operation of the first embodiment.
9(a) and 9(b) are a plan view of the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and are views (part 6) for explaining the substrate exchange operation of the first embodiment.
10(a) and 10(b) are a plan view of the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and are views (part 7) for explaining the substrate exchange operation of the first embodiment.
11(a) and 11(b) are a plan view of the vicinity of the stage apparatus and a cross-sectional view taken along line AA of FIG. 1(a), and are diagrams (part 8) for explaining the substrate exchange operation of the first embodiment.
12 is a view (part 1) of an exposure apparatus according to a second embodiment.
13 is a diagram (part 2) of an exposure apparatus according to a second embodiment.
14 is a cross-sectional view of the exposure apparatus according to the third embodiment.
15(a) and 15(b) are a plan view and a longitudinal sectional view in the vicinity of the stage apparatus, and are views (Part 1) for explaining the substrate exchange operation of the third embodiment.
16(a) and 16(b) are a plan view and a longitudinal sectional view in the vicinity of the stage apparatus, and are views (Part 2) for explaining the substrate exchange operation of the third embodiment.
17A and 17B are a plan view and a longitudinal sectional view in the vicinity of the stage apparatus, and are views (part 3) for explaining the substrate exchange operation of the third embodiment.
18A and 18B are a plan view and a longitudinal sectional view in the vicinity of the stage apparatus, and are views (part 4) for explaining the substrate exchange operation of the third embodiment.
19(a) and 19(b) are a plan view and a longitudinal cross-sectional view in the vicinity of a stage apparatus of the exposure apparatus according to the fourth embodiment, and are views (part 1) for explaining the substrate exchange operation.
20(a) and 20(b) are a plan view and a longitudinal cross-sectional view in the vicinity of the stage apparatus of the exposure apparatus according to the fourth embodiment, and are views (part 2) for explaining the substrate exchange operation.
Fig. 21 (a), Fig. 21 (b) is a figure for demonstrating the board|substrate carrying-in/out unit which concerns on 5th Embodiment.
22(a) and 22(b) are a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the sixth embodiment, and are views (part 1) for explaining the operation of replacing the substrate.
23(a) and 23(b) are a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the sixth embodiment, and is a view (part 2) for explaining the operation of replacing the substrate.
Fig. 24 is a longitudinal sectional view of the exposure apparatus according to the sixth embodiment, and is a view (part 3) for explaining a substrate exchange operation.
Fig. 25 is a longitudinal sectional view of the exposure apparatus according to the seventh embodiment.
26(a) and 26(b) are a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eighth embodiment, and are views (part 1) for explaining the operation of replacing the substrate.
27(a) and 27(b) are diagrams (part 2) for explaining the substrate exchange operation of the eighth embodiment.
28(a) and 28(b) are diagrams (part 3) for explaining the substrate exchange operation of the eighth embodiment.
29(a) and 29(b) are diagrams (part 4) for explaining the substrate exchange operation of the eighth embodiment.
30(a) and 30(b) are diagrams (part 5) for explaining the substrate exchange operation of the eighth embodiment.
31(a) and 31(b) are a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the ninth embodiment, and are views (part 1) for explaining the operation of replacing the substrate.
32(a) and 32(b) are diagrams (part 2) for explaining a substrate exchange operation in the exposure apparatus according to the ninth embodiment.
33(a) and 33(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 1) for explaining the operation of replacing the substrate.
34(a) and 34(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are diagrams (part 2) for explaining the operation of replacing the substrate.
Fig. 35(a) and Fig. 35(b) are a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eleventh embodiment, and are views (part 1) for explaining the operation of replacing the substrate.
Fig. 36 (a), Fig. 36 (b) is a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eleventh embodiment, and is a view (part 2) for explaining the operation of replacing the substrate.
37(a) and 37(b) are a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eleventh embodiment, and are views (part 3) for explaining the operation of replacing the substrate.
38(a) to 38(c) are longitudinal sectional views of the exposure apparatus according to the eleventh embodiment, and are views (part 4) for explaining the operation of replacing the substrate.
Fig. 39(a) is a longitudinal cross-sectional view in the vicinity of the partition member according to the twelfth embodiment, and Fig. 39(b) is a cross-sectional view taken along line BB of Fig. 39(a).
40(a) and 40(b) are diagrams (part 1) for explaining the substrate exchange operation in the twelfth embodiment.
41(a) to 41(c) are diagrams (part 2) for explaining the substrate exchange operation in the twelfth embodiment.
Fig. 42 is a diagram for explaining a modified example (Part 1) of the substrate feeder.
43(a) and 43(b) are diagrams for explaining a modified example (2) of the substrate feeder.

«First embodiment»

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment which concerns on this invention is demonstrated based on FIGS.

Fig. 1 (a) is a longitudinal sectional view schematically showing the configuration of an exposure apparatus 100 according to the first embodiment. In addition, in FIG.1(b), the cross-sectional view taken along the line A-A of FIG.1(a) is shown, and in FIG.2, the cross-sectional view of FIG.1(a) is shown. In addition, in FIG.1(b), illustration of the chamber 200 and the illumination system 12 is abbreviate|omitted for convenience.

The exposure apparatus 100 is, as shown in FIG. to provide An external transfer robot 300 is formed outside the chamber 200 of the exposure apparatus 100 , and the substrate P is transferred from the external apparatus (not shown) to the exposure apparatus 100 by the external transfer robot 300 . ) and the transfer of the substrate P from the exposure apparatus 100 to the external apparatus is performed.

(Chamber (200))

The chamber 200 forms a space in which the internal environment (at least one of temperature, humidity, pressure, and cleanliness) is adjusted, and an opening 200a used for carrying in and out of the substrate P is formed in a part of the chamber 200 . has been

(Exposure apparatus body (10))

The exposure apparatus main body 10 uses, for example, a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) etc. as an exposure target. It is an end-scan type projection exposure apparatus, a so-called scanner.

The exposure apparatus main body 10 includes an illumination system 12, a mask stage 14 holding a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, and a surface (+Z side in Fig. 1(a)). It has a stage device 20 holding a substrate P coated with a resist (sensitizer) on its face (surface facing), a control system thereof, and the like. Hereinafter, as shown in Fig. 1(a), the X-axis, Y-axis, and Z-axis orthogonal to each other with respect to the exposure apparatus main body 10 are set, and during exposure, the mask M and the substrate P are connected to the projection optical system ( 16), it is assumed that relative scanning is performed along the X-axis direction, and the Y-axis is set in the horizontal plane. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are θx, θy, and θz directions, respectively. In addition, the X-axis, the Y-axis, and the position regarding the Z-axis direction are respectively described as the X-position, the Y-position, and the Z-position.

The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331 specification and the like, and irradiates the mask M with the illumination light (illumination light) IL for exposure. As the illumination light IL, for example, light containing at least one wavelength of i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) is used. In addition, the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not specifically limited, For example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm) ) may be a vacuum ultraviolet light such as a UV light or, F ₂ laser light (wavelength 157 ㎚) and the like.

The mask stage 14 holds the mask M of the light transmission type. The mask stage 14 is mounted in a non-contact state on a pair of mask stage guides 218 fixed on the barrel base 216 . In addition, the pair of mask stage guides 218 is a prismatic member which makes the X-axis direction a longitudinal direction, and is arrange|positioned at predetermined intervals in the Y-axis direction as shown in FIG.1(b). The mask stage 14 is driven with a predetermined stroke in the scanning direction (X-axis direction) by, for example, a mask stage drive system (not shown) including a linear motor. Moreover, in order to adjust the relative position of the mask stage 14 with at least any one of the illumination system 12, the stage apparatus 20, and the projection optical system 16, the micro-movement drive system which moves the X position and Y position with a stroke. driven by The positional information of the mask stage 14 is calculated|required by the mask stage position measuring system (not shown) containing a linear encoder system or an interferometer system, for example.

The projection optical system 16 is supported by the barrel surface plate 216 below the mask stage 14 (-Z side). The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in US Patent No. 6,552,775, for example, and, for example, a double-sided tele forming an upright image. A plurality of centric optical systems are provided. In addition, the projection optical system 16 does not need to be a multi-lens type. It may be comprised by one projection optical system used for a semiconductor exposure apparatus.

In the exposure apparatus main body 10, when the mask M located in the predetermined illumination area by the illumination light IL from the illumination system 12 is illuminated, the projection image (partial) of the pattern of the mask M in the illumination area. An image of a natural pattern) is formed in the exposure area by the projection optical system 16 . And while the mask M relatively moves in the scanning direction with respect to the illumination area|region (illumination light IL), the board|substrate P relatively moves with respect to the exposure area|region in the scanning direction, so that scanning exposure is carried out on the board|substrate P. This is performed, and the pattern (the entire pattern corresponding to the scanning range of the mask M) formed on the mask M is transferred.

The stage apparatus 20 includes a surface plate 22 , a substrate table 24 , a support apparatus 26 , and a substrate holder 28 .

The surface plate 22 is formed on a pair of stage mounts 212 supported from the lower side by the vibration isolator 210 provided on the floor F. In addition, a pair of stage mounts 212 support a pair of side columns 214 , and the barrel base 216 is supported by a pair of side columns 214 . The surface plate 22 is made of, for example, a rectangular plate-shaped member in a planar view (viewed from the +Z side) arranged so that the upper surface (+Z plane) becomes parallel to the XY plane.

The support device 26 is mounted on the surface plate 22 in a non-contact state, and is supporting the substrate table 24 in a non-contact manner from below. The substrate holder 28 is disposed on the substrate table 24 , and the substrate table 24 and the substrate holder 28 are integrally driven by a stage drive system (not shown) included in the stage device 20 . . The stage drive system includes, for example, a linear motor and the like, and can drive the substrate table 24 with a predetermined stroke in the X-axis and Y-axis directions (along the upper surface of the surface plate 22 ). ) and, for example, a micro-movement system including a voice coil motor and micro-moving the substrate table 24 in 6 degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions. to provide Moreover, the stage apparatus 20 includes, for example, an optical interferometer system, an encoder system, etc., and is equipped with the stage measurement system for calculating|requiring the position information of the said 6-degree-of-freedom direction of the board|substrate table 24. FIG. 1(b) and 2, a Y interferometer 32Y included in the stage measurement system and a Y moving mirror (bar mirror) 34Y having a reflective surface orthogonal to the Y axis are shown. The Y moving mirror 34Y is being fixed to the substrate table 24 .

The substrate holder 28 has a rectangular upper surface 28u (surface on the side of +Z) in plan view, and the board|substrate P is mounted on the upper surface 28u. As shown in FIG. 2 , the upper surface 28u of the substrate holder 28 has substantially the same aspect ratio as that of the substrate P. As shown in FIG. As an example, the length of the long side and the short side of the upper surface 28u are set slightly short with respect to the length of the long side and the short side of the board|substrate P, respectively.

The upper surface 28u of the substrate holder 28 is finished flat over the entire surface. Moreover, in the upper surface 28u of the substrate holder 28, the micro-hole part for air blowing (not shown) and the micro-hole part for vacuum suction (not shown) are formed in multiple numbers. Moreover, you may use a common hole part together as the micropore part for air blowing and the micropore part for vacuum suction. The substrate holder 28 uses a vacuum suction force supplied from an unillustrated vacuum apparatus, and draws air between the upper surface 28u and the substrate P through the plurality of holes, and the upper surface 28u It is possible to make the board|substrate P adsorb|suck to (planar calibration). The substrate holder 28 is a so-called pin chuck type holder, in which a plurality of pins (pins having a diameter that are very small, for example, about 1 mm in diameter) are arranged at substantially equal intervals. By having the plurality of pins, the substrate holder 28 can reduce the possibility of supporting the back surface of the substrate P with dust or foreign substances therebetween, and deformation of the substrate P due to the trapping of the foreign substances. can reduce the possibility of The board|substrate P is hold|maintained (supported) by the upper surface of a some fin. Let the XY plane formed by the upper surface of this several pin be the upper surface of the board|substrate holder 28. As shown in FIG. In addition, the substrate holder 28 supplies (supply air) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the upper surface 28u and the substrate P through the hole. , it is possible to separate the back surface of the substrate P adsorbed to the substrate holder 28 with respect to the upper surface 28u (floating the substrate P). Further, in each of the plurality of holes formed in the substrate holder 28, a time difference is generated in the timing of supplying the pressurized gas, or the positions of the hole for performing vacuum suction and the hole for supplying the pressurized gas are appropriately exchanged, By appropriately changing the air pressure for suction and air supply, the ground state of the substrate P is controlled (for example, air stagnation occurs between the back surface of the substrate P and the upper surface 28u of the substrate holder 28 ) not to) can be done.

In addition, the board|substrate holder 28 does not make the upper surface 28u adsorb|suck the board|substrate P, but you may make it planar calibration of the board|substrate P in the state which carried out floating support. In this case, the substrate holder 28 supplies (supply air) a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) to the back surface of the substrate P through the hole, so that the substrate ( A gas is interposed between the lower surface of P) and the upper surface 28u of the substrate holder 28 (that is, a gas film is formed). In addition, the substrate holder 28 uses a vacuum suction device to suck the gas between the substrate holder 28 and the substrate P through a hole for vacuum suction, and is directed downward in the gravitational direction with respect to the substrate P. By applying a force (preload) of Then, the substrate holder 28 floats the substrate P through a minute clearance in the Z-axis direction by the balance of the pressure and flow rate of the pressurized gas and the vacuum suction force, and holds (supports) the substrate (support) in a non-contact manner. A force controlling the flatness (for example, a force for correcting or correcting the flatness) may be applied to P). In addition, each hole may process and form the board|substrate holder 28, and you may make it supply air or make it suck|suck by forming the board|substrate holder 28 with a porous material. Moreover, the upper surface 28u in the board|substrate holder 28 by which the board|substrate P is floated is not a surface in which a hole part is formed, but an imaginary surface located above the above-mentioned clearance from the surface, that is, a flat surface. Let the upper surface of the corrected board|substrate be the upper surface 28u.

In the edge part on the -X side in the upper surface 28u of the substrate holder 28, as shown to Fig.1 (a), FIG. 2, for example, two cutouts 28a are spaced apart in the Y-axis direction, and are formed. has been In the vicinity of the two notch 28a, the board|substrate carrying-in bearer apparatus 25 is formed. The substrate carrying-in bearer device 25 is a vacuum suction force supplied from an unillustrated vacuum device, and the suction pad 27 for adsorbing and holding the lower surface of the substrate P, and the suction pad 27 in the Z-axis direction. A Z drive mechanism 23Z for driving along the , and a Y drive mechanism 23Y for driving the Z drive mechanism 23Z (and the suction pad 27) along the Y-axis direction are provided. The suction pad 27 is in the state located most on the -Z side, and it will be in the state which entered into the cutout 28a formed in the board|substrate holder 28. As shown in FIG. Moreover, the suction pad 27 is located above the substrate holder 28 in the state located most on the +Z side.

In the exposure apparatus main body 10, the mask M is loaded onto the mask stage 14 by a mask loader (not illustrated) under the management of a main controller (not illustrated), and a substrate described later. Carry-in of the board|substrate P on the board|substrate holder 28 is performed by the carrying-in/out unit 150 or the board|substrate slide hand 140. As shown in FIG. Thereafter, alignment measurement is performed by the main controller using an alignment detection system not shown, and after the alignment measurement is finished, a plurality of shot regions set on the substrate P are sequentially step-and-scanned. The exposure operation of the method is performed. Since this exposure operation is the same as the exposure operation of the conventional step-and-scan method, the X direction is set as the scanning direction. In addition, detailed description regarding the exposure operation|movement of a step-and-scan method shall be abbreviate|omitted. Then, the substrate P on which the exposure process has been completed is taken out from the substrate holder 28 by the substrate slide hand 140 or the like, and another substrate P to be exposed next is loaded into the substrate holder 28, The substrate P on the substrate holder 28 is exchanged, and a series of exposure operations with respect to the plurality of substrates P are continuously performed.

(substrate loading/unloading unit (150))

The board|substrate carrying-in unit 150 is provided in the opening 200a vicinity of the chamber 200, as shown to Fig.1 (a). In FIG.3(a), the state which took out the board|substrate carrying-in/out unit 150 from FIG.1(a) is shown, and to FIG.3(b), the board|substrate carrying-in/out unit 150 of FIG.3(a) is +X side. This state is shown.

As shown to Fig.3 (a), the board|substrate carrying-in/out unit 150 includes the partition member 152 of an XZ cross-section inverted L-shape, the carry-in shutter 154 and the half formed in the partition member 152. An exit shutter 156 and a substrate feeder 160 fixed to the partition member 152 are provided.

In the partition member 152, as shown to FIG.3(a), FIG.3(b), the shape seen from the X-axis direction is rectangular, and the inlet 152U and export port 152L penetratingly formed in the X-axis direction. ) has The size of the inlet 152U and the outlet 152L is a small opening through which the substrate P can pass, and dust enters the chamber 200 through the inlet 152U and the outlet 152L. It became difficult to enter. In the vicinity of 152U of carry-in openings, the carry-in shutter 154 which opens and closes 152U of carry-in ports by sliding in an up-down direction (Z-axis direction) is provided. Moreover, the carrying-out shutter 156 which opens and closes the carrying-out port 152L by rotating centering around the rotating shaft 156a extended in the Y-axis direction is provided in the vicinity of the carrying-out port 152L.

The substrate feeder 160 is cantilevered by the partition member 152 at a position of a predetermined height from the floor F by the partition member 152 . Here, the "position of a predetermined height" refers to the extent to which the stage device 20 can be positioned below the substrate feeder 160 when the stage device 20 is moved to the substrate exchange position (refer to Fig. 8(b)). is the height position of The board|substrate feeder 160 contains the plate-shaped member whose XZ cross section is substantially right-angled triangle shape, and the upper surface of the board|substrate feeder 160 inclines with respect to the XY plane. In addition, in the example of FIG.3(a), about the +X side edge part of the upper surface of the board|substrate feeder 160, it becomes parallel with respect to XY plane. Although illustration was abbreviate|omitted on the upper surface of the board|substrate feeder 160, the micro hole part (not shown) for air blowing is formed in multiple numbers. In the substrate feeder 160, a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied to the back surface of the substrate P placed on the upper surface of the substrate feeder 160 through the hole ( By supplying air), it is possible to space the back surface of the board|substrate P with respect to the upper surface of the board|substrate feeder 160 (floating the board|substrate P). Moreover, the board|substrate feeder 160 has a hole part for adsorbing-holding the lower surface of the board|substrate P with the vacuum suction force supplied from the vacuum apparatus which was abbreviate|omitted. Moreover, the hole part for supplying pressurized gas and the hole part for vacuum suction may be provided with a common hole. As shown in FIG. 2, the board|substrate feeder 160 is formed in the +X side of the surface plate 22, and the upper part of the +Y side edge part. Moreover, as shown in FIG.1(a), the edge part of the -X side of the board|substrate feeder 160 is extended to the downward direction of the barrel base plate 216, and the board|substrate feeder 160 is part of the barrel base plate 216. ) is formed with a notch 216a for avoiding contact with the substrate P held by it.

(Substrate slide hand (140))

The board|substrate slide hand 140 is provided in the +Y side of the board|substrate feeder 160, as shown in FIG. The substrate slide hand 140 has a suction pad 142 and a vertical movement mechanism 144 for vertically moving the suction pad 142 (reciprocating along the Z-axis direction). The vertical movement mechanism 144 is movable in the X-axis direction along the rail 146 provided at a position of a predetermined height from the floor F along the X-axis direction. That is, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 is capable of adsorbing and holding the lower surface of the substrate P by the vacuum suction force supplied from the vacuum apparatus not shown.

The substrate slide hand 140 adsorbs and holds a part of the lower surface of the substrate P conveyed by the external transfer robot 300 and moves the substrate P from the outside of the chamber 200 by moving it in the -X direction. get inside Further, the substrate slide hand 140 moves along the upper surface of the substrate feeder 160 while holding the substrate P drawn into the chamber 200 , thereby transferring the substrate P onto the substrate feeder 160 . transmit Further, the substrate slide hand 140 adsorbs and holds a part of the lower surface of the exposed substrate P placed on the substrate holder 28 and moves the substrate P in the +X direction to move the substrate P into the chamber 200 . from the inside out to the outside.

The external transfer robot 300 transfers the substrate P between the exposure apparatus 100 and an external apparatus (not shown) such as a coater/developer formed outside the exposure apparatus 100 (chamber 200 ). do. The external transfer robot 300 has a flat-panel robot hand 300F, as shown in Fig. 1(a) or Fig. 2 . Although illustration is abbreviate|omitted on the upper surface of the robot hand 300F, the micro hole part (not shown) for air blowing is formed in multiple numbers. In the robot hand 300F, pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied through the hole to the back surface of the substrate P placed on the upper surface of the robot hand 300F ( By supplying air), it is possible to space the back surface of the board|substrate P with respect to the upper surface of the robot hand 300F (floating the board|substrate P). Moreover, the robot hand 300F has the hole part for adsorbing-holding the lower surface of the board|substrate P by the vacuum suction force by the vacuum apparatus which was abbreviate|omitted. Moreover, the hole part for supplying pressurized gas and the hole part for vacuum suction may be provided with a common hole.

(substrate exchange operation)

Hereinafter, about the exchange operation|movement of the board|substrate P on the board|substrate holder 28 in the exposure apparatus 100, using FIG.1(a) - FIG.2, FIG.4(a) - FIG. explain in detail The following substrate exchange operation is controlled by a main controller (not shown). In addition, in each figure of FIG.4(a) - FIG.11(b) for demonstrating a board|substrate exchange operation|movement, in order to make understanding easy, the operation direction of a component is shown typically with white arrow. In addition, the state in which gas is sucked or supplied (supplied air) is schematically represented by a black arrow or a broken-line arrow. 4(a) and 4(b) are a plan view of the vicinity of the stage device 20 at the same timing and a cross-sectional view taken along line AA of FIG. 1(a), FIG. 5(a) and FIG. 5 (b), FIGS. 6(a) and 6(b), ... 11(a) and 11(b) also show a plan view and a cross-sectional view taken along the line A-A in the vicinity of the stage device at the same timing. In addition, in FIG.4(a) - FIG.11(b), illustration of the structure unnecessary for description is abbreviate|omitted among the structures of the exposure apparatus 100. As shown in FIG.

In addition, it is assumed that the board|substrate P1 is previously mounted in the board|substrate holder 28 of the stage apparatus 20 as a premise of description of a board|substrate exchange operation|movement. Moreover, in the board|substrate exchange operation|movement, the operation|movement of carrying out the board|substrate P1 which has completed exposure, and the operation|movement of carrying in (mounting) the board|substrate P2 (different from the board|substrate P1) newly exposed in the board|substrate holder 28. It is assumed that this is executed. In addition, the board|substrate P2 may be an unexposed (it has never been exposed) board|substrate, and the board|substrate which performs exposure after the 2nd time may be sufficient as it.

As shown in Fig. 1(a) or Fig. 2 , in the exposure apparatus main body 10, in a state in which the substrate P1 is exposed, the main controller includes an external transfer robot that holds the substrate P2 before exposure ( 300) is driven to the vicinity of the chamber 200 (near the carry-in port 152U). Further, the robot hand 300F of the external transfer robot 300 is in a state in contact with most of the lower surface (-Z surface) of the substrate P2, but on the lower surface of the -X side end of the substrate P2. Assume that there is no contact.

(Operation of Fig. 4(a), Fig. 4(b))

From this state, the main controller opens the carry-in opening 152U by sliding the carry-in shutter 154 in the +Z direction (refer arrow A1 of FIG.4(b)). Next, the main controller drives the external transfer robot 300 in the -X direction (refer to arrow A2 in Figs. 4(a) and 4(b)), and moves the end of the substrate P2 on the -X side to the chamber ( 200) is entered. Thereby, the edge part of the -X side of the board|substrate P2 is positioned above the board|substrate feeder 160. As shown in FIG. In addition, it is assumed that the external transfer robot 300 does not enter the chamber 200 in this 1st Embodiment. Thereby, the entry of dust into the chamber 200 can be suppressed as much as possible.

Next, the main controller drives the substrate slide hand 140 and moves the suction pad 142 in the +X direction (arrow A3 direction in Fig. 4(b)) and +Z direction (arrow A4 direction), whereby the suction pad ( 142) is brought into contact with a part of the lower surface of the substrate P2 (the end of the -X side and the +Y side). Moreover, the main controller starts the adsorption|suction holding|maintenance of a part of the lower surface (-Z surface) of the board|substrate P2 by the suction pad 142 (refer black arrow A5 of FIG.4(b)).

(Operation of Fig. 5(a), Fig. 5(b))

Next, the main controller starts supplying (supplying air) of the pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 160 (arrow B1 in Fig. 5(b) , see B2). Thereby, the substrate P2 floats from the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160, and between the lower surface of the substrate P2 and the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160. The friction becomes negligible (low friction state). From this state, the main controller drives the suction pad 142 of the substrate slide hand 140 in the -X direction (the arrow B2 direction in Fig. 5(b)) and the -Z direction (the arrow B3 direction). That is, the suction pad 142 is moved in the direction along the upper surface of the substrate feeder 160 (in the direction of arrow B5 in FIGS. move to Accordingly, the substrate P2 is conveyed in the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160 . The substrate P2 is moved by the substrate slide hand 140 in a state supported by the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160 .

(Operation of Fig. 6(a), Fig. 6(b))

As described above, the substrate P2 is conveyed along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160, and reaches the positions shown in Figs. 6(a) and 6(b), the main control The apparatus slides the carry-in opening shutter 154 in the -Z direction, and closes the carry-in opening 152U (refer arrow C1 of FIG.6(b)). Accordingly, it is possible to prevent dust from entering the chamber 200 from the outside through the inlet 152U. The main controller drives the external transfer robot 300 in the -X direction (refer to arrow C2 in FIGS. 6(a) and 6(b) ). In addition, in the exposure apparatus main body 10, exposure with respect to the board|substrate P1 is performed continuously.

(Operation of Fig. 7(a), Fig. 7(b))

Next, the main controller drives the vacuum device (not shown) of the substrate feeder 160, and adsorbs and holds the substrate P2 by vacuum suction force. And the main controller cancels|releases the suction holding|maintenance by the suction pad 142 of the board|substrate slide hand 140, and drives the suction pad 142 downward in -Z direction (refer arrow D1 of FIG.7(b)). . In addition, the main controller drives the external transfer robot 300 in the -Z direction (refer to arrow D2) and drives it in the -X direction (refer to arrow D3), thereby turning the -X end of the robot hand 300F in half. Close to the outlet 152L. Moreover, the main controller opens the export port 152L by rotationally driving the unloading exit shutter 156 in the counterclockwise rotation direction (arrow D4 direction). Thereby, preparation for exchange of the substrate on the substrate holder 28 is completed. In addition, it is assumed that the exposure operation|movement with respect to the board|substrate P1 on the board|substrate holder 28 is complete|finished at this stage.

(Operation of Fig. 8(a), Fig. 8(b))

After the exposure operation is completed, the main controller drives the stage device 20 to the substrate exchange position (below the substrate feeder 160) (refer to arrow E1 in FIGS. 8(a) and 8(b)). Next, the main controller raises the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 slightly (refer arrow E2), and makes the suction pad 27 adsorb|suck and hold the lower surface of the board|substrate P1 (arrow E3). Reference). Further, the main controller starts supplying (supply air) of the pressurized gas from the upper surface 28u of the substrate holder 28 (see arrow E4 ), thereby moving the substrate P1 to the upper surface 28u of the substrate holder 28 . slightly injured. In addition, the main controller slightly offsets the substrate P1 from the substrate holder 28 in the +Y direction by moving the suction pad 27 holding the substrate P1 in the +Y direction (refer to arrow E5). By this offset, the suction pad 142 of the board|substrate slide hand 140 becomes able to hold|maintain the -X side and the +Y side edge part of the lower surface of the board|substrate P1.

The main controller raises the suction pad 142 of the substrate slide hand 140 in a state where the substrate P1 is offset from the substrate holder 28 (see arrow E6), and attaches the substrate ( The lower surface of P1) is adsorbed and held. It is assumed that the main controller starts supplying (supply air) of the pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 in the steps of FIGS. 8(a) and 8(b). (see arrow E7). In addition, in the step of Fig. 7(b), the main control device opened the export port 152L by rotationally driving the unloading exit shutter 156 in the counterclockwise direction (arrow D4 direction), but Fig. 8(b). ), the discharge port 152L may be opened.

(Operation of Fig. 9(a), Fig. 9(b))

Next, the main controller drives the suction pad 142 of the substrate slide hand 140 in the +X direction (refer to arrow F1 in FIGS. 9(a) and 9(b)), and holds the substrate P1 into the substrate holder 28) The slide transfer is carried out from the top onto the robot hand 300F. As a result, the exposed substrate P1 is transferred onto the robot hand 300F. In other words, the substrate P1 is moved by the substrate slide hand 140 in a state supported by the upper surface of the substrate holder 28 and the upper surface of the robot hand 300F. The main controller stops the supply (intake) of the pressurized gas from the robot hand 300F at the timing when the robot hand 300F receives the substrate P1, and drives the vacuum device (not shown), , the substrate P1 is adsorbed and held by the robot hand 300F by the vacuum suction force.

Moreover, the main controller drives the suction pad 27 of the substrate carry-in bearer device 25 upward (refer to arrow F2), and contacts the -X end of the lower surface of the substrate P2 held by the substrate feeder 160 . and the adsorption|suction holding|maintenance of the board|substrate P2 by the adsorption|suction pad 27 is started (refer arrow F3).

(Operation of Fig. 10(a), Fig. 10(b))

Next, the main controller drives the stage device 20 in the -X direction in a state where the suction pad 27 of the substrate carry-in bearer device 25 adsorbs and holds the substrate P2 (see arrow G1). In this case, as the stage apparatus 20 moves away from the substrate feeder 160 , the area of the substrate P2 held by the substrate feeder 160 gradually decreases, and the substrate P2 supported by the substrate holder 28 . area is gradually increased. Thereby, as shown to Fig.10 (a), the board|substrate P2 is transmitted on the board|substrate holder 28 from the board|substrate feeder 160 top.

Further, the main controller lowers the suction pad 142 after transferring the substrate P1 to the robot hand 300F (refer to arrow G2), and moves the exit shutter 156 in a clockwise direction (refer to arrow G3). By rotationally driving, the carrying-out port 152L is closed. Accordingly, it is possible to prevent dust from entering the chamber 200 from the outside through the discharge port 152L. The main controller drives the external transfer robot 300 holding the substrate P1 in the +X direction (refer to arrow G4), and transfers the substrate P1 to the external device.

(Operation of Fig. 11(a), Fig. 11(b))

The main controller stops supply (supply air) of the pressurized gas from the upper surface of the substrate feeder 160 when the transfer of the substrate P2 from the substrate feeder 160 onto the substrate holder 28 is completed. Moreover, the main controller performs alignment (position adjustment) of the board|substrate P2 by driving the suction pad 27 microscopically (refer arrow H1). After that, the main controller drives the suction pad 27 down (refer to arrow H2), starts the suction holding of the substrate P2 by the substrate holder 28, and is newly placed on the substrate holder 28. The exposure to the substrate P2 is started.

Next, by repeatedly executing the processing of Figs. 4(a), 4(b) to 11(a) and 11(b) described above, the exposure to the plurality of substrates P is repeated. is to be implemented.

As described above in detail, according to the first embodiment, the exposure apparatus 100 includes an exposure apparatus main body 10 , a chamber 200 accommodating the exposure apparatus main body 10 , and a chamber 200 . A substrate feeder 160 that receives and holds the substrate P conveyed by the external external transfer robot 300 , and transfer of the substrate P from the external transfer robot 300 to the substrate feeder 160 , the substrate The transfer of the substrate P from the feeder 160 to the substrate holder 28 of the exposure apparatus main body 10 and the transfer of the substrate P from the substrate holder 28 to the external transfer robot 300 It is provided with the board|substrate slide hand 140 and the board|substrate carrying-in bearer apparatus 25 which implement. Thereby, the board|substrate delivery port part formed in order to transfer the board|substrate P from the external transfer robot 300 to the board|substrate feeder 160 in the past (for example, Unexamined-Japanese-Patent No. 2001-332600) becomes unnecessary. . Since the substrate transfer port portion is formed at a position between the exposure apparatus main body 10 and the external transfer robot 300, in the exposure apparatus 100 that does not form the substrate transfer port portion, the size of the apparatus is reduced by the size of the substrate transfer port portion. (reduction in footprint) can be achieved. Moreover, cost reduction of the exposure apparatus 100 can also be aimed at by omitting a board|substrate delivery port part. Further, in the exposure apparatus having the substrate transfer port portion, the substrate P is transferred twice from the external transfer robot 300 to the substrate transfer port portion and from the substrate transfer port portion to the substrate holder 28 . . Whenever the transfer operation of the substrate is performed, unnecessary stress is applied to the substrate P, and there is a fear that the substrate P is deformed or damaged. Therefore, as in the first embodiment, when the substrate transfer operation occurs only once between the exposure apparatus main body 10 and the external transfer robot 300, deformation or damage of the substrate P is unlikely to occur. It works.

In addition, in the present first embodiment, the substrate slide hand 140 holds a part of the substrate P when transferring the substrate P from the substrate feeder 160 onto the substrate holder 28 . The substrate feeder 160 and the substrate holder 28 move in a direction including the X-axis direction in which they are aligned. Thereby, with the movement of the board|substrate slide hand 140, the board|substrate P can be moved and mounted on the board|substrate holder 28 from the board|substrate feeder 160. As shown in FIG.

Moreover, in this 1st Embodiment, the upper surface (substrate support surface) of the substrate feeder 160 is inclined with respect to the upper surface of the substrate holder 28, and the board|substrate carry-in bearer apparatus 25 is a part of the board|substrate P. The transfer of the substrate P from the substrate feeder 160 onto the substrate holder 28 is performed by the stage device 20 moving in the -X direction in the state holding the . Thereby, since the substrate P can be transferred to the substrate holder 28 while sliding the substrate P along the upper surface of the substrate feeder 160 , the substrate P at the time of transferring the substrate P to the substrate holder 28 . (P) curvature, etc. can be suppressed.

In addition, in the first embodiment, since the external transport robot 300 does not enter the chamber 200 of the exposure apparatus 100 , the dust attached to the external transport robot 300 enters the chamber 200 . it can be prevented Moreover, since the volume of the chamber 200 can be made small, temperature control in the chamber 200 becomes easy. In addition, since the external transport robot 300 does not enter the chamber 200 , contact between the external transport robot 300 and each part of the exposure apparatus 100 can be suppressed as much as possible. In addition, the opening connecting the inside of the chamber 200 and the outside of the chamber 200 has only an inlet 152U and an outlet 152L having a size large enough to move the substrate P, so that the dust into the chamber is removed. entry can be prevented.

Moreover, in this 1st Embodiment, the +X side edge part of the upper surface of the board|substrate feeder 160 is parallel with respect to the XY plane. Thereby, the board|substrate slide hand 140 can receive the board|substrate P conveyed by the external transfer robot 300 easily.

Further, in the first embodiment, the substrate P on the substrate holder 28 is transferred to the external transfer robot 300 in a state where the substrate P is held on the upper surface of the substrate feeder 160, and immediately thereafter It is supposed that the board|substrate P hold|maintained by the board|substrate feeder 160 is delivered on the board|substrate holder 28. Thereby, the board|substrate on the board|substrate holder 28 can be exchanged quickly even if there is no board|substrate transfer port part.

Moreover, in this 1st Embodiment, since the carry-in port 152U and the carry-out port 152L of the partition member 152 are formed separately, the carry-in port 152U and the carry-out port 152L are separated during a board|substrate exchange operation|movement. It is possible to suppress entry of a particle|grain by opening and closing individually 152U of import ports and 152L of export ports without opening simultaneously.

Moreover, although the said 1st Embodiment demonstrated the case where the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 is movable in a Y-axis direction, it is not limited to this. For example, even if the substrate P on the substrate holder 28 is not moved in the Y-axis direction (even if not offset), the suction pad 142 of the substrate slide hand 140 will attract and hold the lower surface of the substrate P. In this case, the suction pad 27 may not be able to move in the Y-axis direction.

Moreover, although the said 1st Embodiment demonstrated the case where the robot hand 300F of the external transfer robot 300 is a flat-panel-shaped member which can air-float the board|substrate P from an upper surface, it is not limited to this. For example, the robot hand 300F may be a fork-shaped member etc. as long as the board|substrate P can be slid without oscillation. Moreover, the robot hand 300F may have the rotation roller which sends the board|substrate P to the X-axis direction by rolling contact. By providing the rotating roller in the robot hand 300F, the friction when the board|substrate P contacts the robot hand 300F can be reduced, and a dust generation can be suppressed.

Further, in the first embodiment, a mechanism for imparting a levitation force to the substrate P by supplying (supplying air) of pressurized gas to the vicinity of the inlet 152U and the outlet 152L of the substrate carrying-in/out unit 150 is provided. may be formed. Moreover, the rotation roller which sends the board|substrate P to the X-axis direction by rolling contact may be provided in 152U of carrying-in openings and 152L vicinity of the carrying-in/out port of the board|substrate carrying-in/out unit 150.

Moreover, although the said 1st Embodiment demonstrated the case where the board|substrate feeder 160 is being fixed to the partition member 152 of the board|substrate carrying-in/out unit 150, it is not limited to this. The substrate feeder 160 may be fixed to a member different from the partition member 152 .

Moreover, although the said 1st Embodiment demonstrated the case where the board|substrate feeder 160 was formed above the edge part of the +X side of the surface plate 22, and the +Y side, it is not limited to this. Unless the exposure operation is obstructed, the substrate feeder 160 may be formed, for example, above the +X side end portion of the surface plate 22 and the Y axis direction central portion.

Moreover, although the said 1st Embodiment demonstrated the case where the carrying-in shutter 154 and the carrying-out shutter 156 were provided in the partition member 152 of the board|substrate carrying-in/out unit 150, it is not limited to this. . That is, at least one of the inlet shutter 154 and the export outlet shutter 156 may be provided in the chamber 200 .

《Second Embodiment》

Next, the exposure apparatus which concerns on 2nd Embodiment is demonstrated using FIG. 12, FIG. The configuration of the exposure apparatus 100A according to the second embodiment is the same as that of the first embodiment, except that the configuration and operation of a part of the substrate feeder are the same. About the element which has the structure and function similar to embodiment, the same code|symbol as said 1st Embodiment is attached|subjected, and the description is abbreviate|omitted.

Fig. 12 is a view showing an exposure apparatus 100A according to the second embodiment (a view corresponding to Fig. 1(a) of the first embodiment).

In 1st Embodiment, although the board|substrate feeder 160 was fixed to the partition member 152 of the board|substrate carrying-in/out unit 150, in 150A of board|substrate carrying-in/out units of this 2nd Embodiment, as shown in FIG. Similarly, the substrate feeder 161 is attached to the rotation shaft 162 formed in the partition member 152 .

The shape and function of the substrate feeder 161 are the same as those of the substrate feeder 160 of the first embodiment, but since the substrate feeder 161 is attached to a rotation shaft 162 extending in the Y-axis direction, the rotation shaft ( 162) is free to rotate around. In addition, although illustration was abbreviate|omitted in FIG. 12, FIG. 13, the board|substrate feeder 161 is rotated by the drive mechanism (a motor etc. are included) which illustration abbreviate|omitted.

Moreover, in this 2nd Embodiment, with the board|substrate feeder 161 being able to rotate freely, the cutout 216b formed in the barrel surface plate 216 is with the board|substrate feeder 161 and the board|substrate slide hand 140. In order to avoid mechanical interference, it is set larger than the cutout 216a of the first embodiment.

As shown in FIG. 12, the upper surface (substrate support surface) of the board|substrate feeder 161 is parallel to the XY plane, and as shown in FIG. 13, the state (first) in which the board|substrate support surface is inclined with respect to the XY plane. the same state as in the embodiment).

(substrate exchange operation)

In the second embodiment, the main controller controls the drive mechanism when the substrate P(P2) is carried in from the outside of the chamber 200 by the substrate slide hand 140, and as shown in FIG. 12 . , to keep the substrate support surface (top surface) parallel to the XY plane. In addition, the main controller includes the upper surface of the external transfer robot 300 and the substrate support surface of the substrate feeder 161 when the substrate slide hand 140 pulls the substrate P (P2) onto the substrate feeder 161 . Supply (supply) pressurized gas from Thereby, the board|substrate support surface (upper surface) of the board|substrate feeder 161 and the support surface of an external transfer robot can be made to be flush (in the same plane). In this state, since the main controller moves the board|substrate P2 by the board|substrate slide hand 140, the deformation|transformation and damage|damage of the board|substrate by unnecessary stress being applied to the board|substrate P2 can be prevented.

And as shown in FIG. 12, when the board|substrate P(P2) is delivered on the board|substrate feeder 161, the main controller starts adsorption|suction holding of the board|substrate P(P2) by the board|substrate feeder 161. . Further, the main controller controls the drive mechanism to rotate the substrate feeder 161 counterclockwise as shown in FIG. 13 to incline the substrate support surface of the substrate feeder 161 with respect to the XY plane, Similar to the first embodiment, the substrate on the substrate holder 28 is replaced.

As described above, according to the second embodiment, the substrate feeder 161 is capable of transitioning between a state in which the substrate support surface is parallel to the XY plane and a state in which it is inclined. When receiving from the external transfer robot 300 or when transferring to the substrate holder 28, it can be set to an appropriate state (posture). Thereby, the possibility that the carry-in opening 152U, the board|substrate feeder 161, and the board|substrate P contact can be reduced.

In addition, when the substrate slide hand 140 carries the substrate P(P2) from the external transfer robot 300 into the chamber 200, the height position of the suction pad 142 (the position in the Z-axis direction) is Since it is not necessary to change, control of the suction pad 142 can be simplified.

Moreover, in this 2nd Embodiment, at the time of board|substrate exchange, the -X end of the board|substrate P(P2) newly mounted on the board|substrate holder 28 by inclining the board|substrate support surface of the board|substrate feeder 161 is a board|substrate holder. Since the upper surface of the 28 can be brought close, the stroke in the Z direction of the suction pad 142 of the substrate carry-in bearer device 25 can be shortened (or set to zero), and the The transfer of the substrate P (P2) can be performed smoothly without impact.

In addition, in said 2nd Embodiment, although the case where the rotation shaft 162 was located in the +X edge part of the board|substrate feeder 161 was demonstrated, it is not limited to this, For example, the X-axis direction middle of the board|substrate feeder 161. The rotating shaft 162 may be located in a part etc.

《Third embodiment》

Next, the exposure apparatus which concerns on 3rd Embodiment is demonstrated using FIGS. 14-18. Fig. 14 shows a cross-sectional view (a view corresponding to Fig. 2 of the first embodiment) of the exposure apparatus 100B according to the third embodiment.

Although the exposure apparatus 100 of 1st Embodiment mentioned above was equipped with the board|substrate slide hand 140, the exposure apparatus 100B of this 3rd Embodiment replaces the board|substrate slide hand 140, and the 1st A slide hand 240 and a second slide hand 340 are provided.

The first slide hand 240 is formed on the upper surface (substrate support surface) of the substrate feeder 163 . In addition, the board|substrate feeder 163 has the structure and function similar to the board|substrate feeder 160 of 1st Embodiment. The first slide hand 240 has a rail 246 formed on the substrate support surface of the substrate feeder 163 , and a suction pad 242 that moves along the rail 246 . In addition, it is assumed that the rail 246 is in the state embedded in the board|substrate feeder 163, and there is no level|step difference between the upper surface of the rail 246 and the upper surface (substrate support surface) of the board|substrate feeder 163. As shown in FIG. The first slide hand 240 adsorbs and holds a part of the substrate P conveyed by the external transfer robot 300 and moves the substrate P in the -X direction to move the substrate P into the chamber 200 (the substrate). on the feeder 163).

The 2nd slide hand 340 is formed in the +X side surface of the stage apparatus 20 (substrate table 24). The second slide hand 340 has the same configuration as the substrate slide hand 140 of the first embodiment, and has a rail 346 extending in the X-axis direction, and a rail 346 that moves in the X-axis direction along the rail 346 . It has a Z drive mechanism 344 and the suction pad 342 driven by the Z drive mechanism 344 in the Z-axis direction. The second slide hand 340 adsorbs and holds a part of the substrate P placed on the substrate holder 28 and moves the substrate P in the +X direction, thereby moving the substrate P from the substrate holder 28 to an external transfer robot ( 300) can be forwarded.

That is, in the third embodiment, the same functions as those of the substrate slide hand 140 of the first embodiment are realized by the first slide hand 240 and the second slide hand 340 .

About the other structure of the exposure apparatus 100B, it is the same as that of the exposure apparatus 100 of 1st Embodiment.

(substrate exchange operation)

Hereinafter, the exchange operation|movement of the board|substrate P on the board|substrate holder 28 in exposure apparatus 100B is demonstrated in detail using FIG.14-18(b). 15(a) and 15(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device 20 at the same timing, and Figs. 16(a), 16(b), and 17( Fig. 17(b), Fig. 18(a) and Fig. 18(b) also show a plan view and a longitudinal sectional view of the vicinity of the stage device at the same timing. In addition, in FIG.15(a) - FIG.18(b), illustration of the structure unnecessary for description is abbreviate|omitted among the structures of the exposure apparatus 100B.

In the substrate exchange operation, an operation of carrying out the exposed substrate P1 and an operation of carrying in (mounting) the newly exposed substrate P2 (different from the substrate P1) into the substrate holder 28 are performed. make it to be The main controller is, as shown in FIG. 14 , in the state in which the exposure of the substrate P1 on the substrate holder 28 is performed in the exposure apparatus main body 10, the external conveyance holding the substrate P2 before exposure The robot 300 is driven to the vicinity of the chamber 200 (in the vicinity of the carry-in port 152U). In addition, it is assumed that the suction pad 242 of the 1st slide hand 240 is located at the +X end of the rail 246 at this stage.

(Operation of Fig. 15(a), Fig. 15(b))

From this state, the main controller opens the carry-in opening 152U by sliding the carry-in shutter 154 in the +Z direction (refer arrow J1 of FIG. 15(b)). Next, the main controller drives the external transfer robot 300 in the -X direction (see arrow J2 in Figs. 15(a) and 15(b)), and moves the end of the substrate P2 on the -X side to the chamber ( 200) is entered. Thereby, the edge part of the -X side of the lower surface of the board|substrate P2 is made to adjoin or contact the suction pad 242. Moreover, the main controller starts the adsorption|suction hold|maintenance of a part of the lower surface of the board|substrate P2 by the suction pad 242 (refer arrow J3 of FIG.15(b)).

(Operation of Fig. 16(a), Fig. 16(b))

Then, the main controller starts supplying (supply air) of the pressurized gas from the upper surface of the robot hand 300F and the upper surface of the substrate feeder 163 of the external transfer robot 300, and the first slide hand 240 is adsorbed. The pad 242 is driven along the rail 246 to the -X side (in the direction of arrow K1 in Figs. 16(a) and 16(b)). Accordingly, the substrate P2 is conveyed in the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 163 . In addition, the main controller stops the supply of pressurized gas from the substrate feeder 163 and the robot hand 300F, after transferring the substrate P2 onto the substrate feeder 163, and the substrate feeder 163. The adsorption|suction holding of the board|substrate P2 by this is started. And the main controller opens the export exit shutter 156 while closing the carry-in shutter 154. Moreover, when the exposure with respect to the board|substrate P1 in the stage apparatus 20 is complete|finished, the main control apparatus moves the stage apparatus 20 to the position (substrate exchange position) shown in FIGS. 16(a) and 16(b). actuate (see arrow K2).

When the stage apparatus 20 moves to the vicinity of the substrate exchange position, the main controller starts supply of the pressurized gas from the upper surface 28u of the substrate holder 28 , and the suction pad 27 of the substrate carry-in bearer apparatus 25 . ) is driven in the +Z direction and the +Y direction, and the substrate P1 is offset from the substrate holder 28 to the +Y side (refer to arrow K3 in Fig. 16(a) ). Moreover, the main controller drives the external transfer robot 300 in the +X direction (refer to arrow K4).

(Operation of Fig. 17(a), Fig. 17(b))

The main controller drives the external transfer robot 300 in the -Z direction and the -X direction (refer to arrows L1 and L2 in Fig. 17(b) ), and transfers the -X end of the robot hand 300F to the discharge port 152L. close to Then, the main controller starts supplying the pressurized gas (supply air) from the upper surface of the robot hand 300F.

Moreover, the main controller causes the suction pad 342 of the second slide hand 340 to be driven upward, and the suction pad 342 adsorbs and holds the lower surface of the substrate P1. Then, the main controller drives the suction pad 342 in the +X direction along the rail 346 (see arrow L3), and slides the substrate P1 from the substrate holder 28 onto the robot hand 300F. do. In addition, after the substrate P1 is slide-transferred to the robot hand 300F, the main controller drives the robot hand 300F in the +X direction to retract the substrate P1 to the outside of the chamber 200, The exit shutter 156 is closed.

Moreover, the main controller drives the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 upward (refer arrow L4), and starts the suction holding|maintenance of the -X edge part of the board|substrate P2 by the suction pad 27. (see arrow L5). In addition, the main controller starts supply of the pressurized gas from the upper surface of the substrate feeder 163 .

(Operation of Figs. 18(a) and 18(b))

The main controller drives the stage device 20 in the -X direction in a state where the suction pad 27 of the substrate carry-in bearer device 25 adsorbs and holds the substrate P2 (see arrow N1). As a result, the substrate P2 is transferred from the substrate feeder 163 onto the substrate holder 28 . Further, while the substrate P2 is being transferred from the substrate feeder 163 onto the substrate holder 28 , pressurized gas is supplied from the upper surface of the substrate holder 28 .

On the other hand, the main controller stops supply of the pressurized gas from the upper surface of the substrate feeder 163 when the entire substrate P2 is transferred from the substrate feeder 163 onto the substrate holder 28 . Moreover, the main controller aligns the board|substrate P2 (position adjustment) by driving the suction pad 27 microscopically. Then, the main controller drives the suction pad 27 down (refer to arrow N2), and starts exposure with respect to the board|substrate P2 newly mounted on the board|substrate holder 28. FIG.

Moreover, the main controller drives the external transfer robot 300 in the +X direction (refer to arrow N3) to transfer the substrate P1 to the external apparatus.

Next, by repeating the processing of Figs. 15(a), 15(b) to 18(a) and 18(b) described above, exposure to the plurality of substrates P is repeated. has been

As described above in detail, according to the third embodiment, the first slide hand 240 for drawing the substrate P into the chamber 200 from the outside of the chamber 200, and the inside of the chamber 200 A second slide hand 340 for carrying the substrate P out of the chamber 200 is provided. Thereby, since the degree of freedom in design increases, for example, the board|substrate exchange position of the stage apparatus 20 can be made into the +X side edge part of the surface plate 22, the Y-axis direction center part vicinity, etc.

Moreover, in this 3rd Embodiment, since the 1st slide hand 240 is formed in the Y-axis direction central part of the board|substrate feeder 163, so that a space may arise on the +Y side and -Y side of the board|substrate feeder 163. has been Thereby, it becomes possible to implement a design change, such as hold|maintaining the board|substrate feeder 163 in a Y-axis direction.

Further, in the third embodiment, since the second slide hand 340 is provided on the stage device 20, the substrate unloading operation can be started before the stage device 20 arrives at the substrate exchange position. .

Further, in the third embodiment, since the rail 246 of the first slide hand 240 is formed along the upper surface (substrate support surface) of the substrate feeder 163, the suction pad ( 242), the control can be simplified compared to the case where control in the X-axis and Z-axis directions is performed. Moreover, it is not necessary to form the rail 146 like the said 1st and 2nd embodiment, and the number of parts can be reduced.

Further, in the third embodiment, since the second slide hand 340 is provided on the stage device 20, the substrate unloading operation can be started before the stage device 20 arrives at the substrate exchange position. .

Moreover, in the said 3rd Embodiment, you may make it possible to change the attitude|position (the inclination of the board|substrate support surface) of the board|substrate feeder 163 like 2nd Embodiment.

《Fourth embodiment》

Next, the exposure apparatus 100C of 4th Embodiment is demonstrated using FIG.19, FIG.20. The exposure apparatus 100C of this fourth embodiment has substantially the same configuration as that of the exposure apparatus 100 of the first embodiment, as shown in Figs. 19A and 19B , but has a substrate feeder 160 ) differs in that it has a function of holding the board|substrate P in a non-contact suspension in a lower surface.

For example, a hole for evacuating pressurized gas is formed in the lower surface of the substrate feeder 160, and by performing air evacuation by the known Bernoulli chuck, the upper surface of the substrate P and the substrate feeder 160 It is designed to generate a negative pressure between the lower surfaces. Accordingly, in the fourth embodiment, the negative pressure generated between the upper surface of the substrate P and the lower surface of the substrate feeder 160 maintains the substrate P in non-contact suspension (that is, the upper surface of the substrate P is the substrate feeder). (160) to be maintained in a non-contact manner). However, it is not limited to this, and a hole for vacuum suction and a hole for pressurized gas exhaust are formed on the lower surface of the substrate feeder 160, and the balance between vacuum suction and air exhaust using these holes causes the substrate (P) (P) ) is good also as a non-contact suspension holding|maintenance.

(substrate exchange operation)

Figs. 19(a) and 19(b) show diagrams corresponding to Figs. 8(a) and 8(b) of the first embodiment. In the state of FIGS. 19( a ) and 19 ( b ), the substrate P2 before exposure is held on the upper surface of the substrate feeder 160 , and the stage device 20 is positioned opposite to the lower surface of the substrate feeder 160 . ) and the exposed substrate P1 are positioned. In this state, the substrate P1 is slightly offset in the +Y direction with respect to the substrate holder 28, and pressurized gas is supplied from the upper surface 28u of the substrate holder 28, whereby the lower surface of the substrate P1 and the substrate The upper surfaces of the holder 28 are in a non-contact state. Moreover, the suction pad 142 of the board|substrate slide hand 140 is in the state which adsorb|sucked hold|maintained a part of the lower surface of the board|substrate P1.

From this state, the main controller exhausts the pressurized gas from the lower surface of the substrate feeder 160 to hold the substrate P1 in a non-contact suspended manner on the lower surface of the substrate feeder 160 according to the principle of the Bernoulli chuck.

Next, the main controller adsorbs and holds a part of the substrate P2 on the substrate feeder 160 on the suction pad 27 of the substrate carry-in bearer device 25 and pressurized gas from the upper surface of the substrate feeder 160 . start the supply of Then, as shown in Figs. 20(a) and 20(b), the main controller moves the suction pad 142 of the substrate slide hand 140 in the +X direction (refer to the arrow Q1), the substrate P1 while starting the transfer to the external transfer robot 300 and driving the stage device 20 in the -X direction (refer to arrow Q2), the substrate P2 is moved from the substrate feeder 160 to the substrate holder 28 transfer to the top. In addition, as described above, negative pressure is generated on the lower surface of the substrate feeder 160 to hold the substrate P1 in a non-contact manner, so as shown in FIG. 25), even if the substrate holder 28 does not exist below the board|substrate P1, slide conveyance of the board|substrate P1 to the external conveyance robot 300 is made possible smoothly.

As described above, according to the fourth embodiment, the lower surface of the substrate feeder 160 WHEREIN: Since the board|substrate P1 carried out to the outside is suspended and hold|maintained non-contact, the board|substrate P1 is moved from the board|substrate holder 28 top. Until it is transferred onto the external transfer robot 300 , the stage device 20 does not have to stand by at the substrate exchange position. As a result, as shown in FIG. 20(b) , in the stage before the substrate P1 is transferred to the external transfer robot 300, the operation of placing a new substrate P2 on the substrate holder 28 can be started. have. Therefore, according to this 4th Embodiment, it becomes possible to shorten the time required for board|substrate exchange. Moreover, after the board|substrate P2 is mounted on the board|substrate holder 28 and the stage apparatus 20 is moved in -X direction, the board|substrate P1 hold|maintained on the lower surface of the board|substrate feeder 160 in a non-contact external transport robot. (300) You may make it transmit to the phase. As a result, when the stage device 20 is located in the vicinity of the discharge port 152L, the exit shutter 156 can be kept closed, even if dust enters the chamber 200 from the discharge port 152L. , the risk of dust adhering to the stage device 20 is low.

In addition, similarly to the said 2nd embodiment, the board|substrate feeder 160 of said 4th Embodiment is good also as what is formed in the partition member 152 rotatably. That is, you may make it transition between the state horizontal to the XY plane, and the state inclined to the upper surface of the board|substrate feeder 160. As shown in FIG.

In the fourth embodiment, similarly to the third embodiment, the first slide hand 240 and the second slide hand 340 may be provided instead of the substrate slide hand 140 .

《Fifth embodiment》

Next, a fifth embodiment will be described with reference to FIG. 21 . Fig. 21 (a) shows a substrate carrying-in/out unit 150' according to the fifth embodiment. The board|substrate carrying-in/out unit 150' has a board|substrate feeder 165 instead of the board|substrate feeder 160 of the board|substrate carrying-in/out unit 150 of 1st Embodiment, and instead of the carrying-out shutter 156, the carrying-out shutter. (156').

The substrate feeder 165 has a first part 165a fixed to the -X side surface of the partition member 152, and a second part 165b slidable with respect to the first part 165a. It is assumed that the sliding direction of the second part 165b is the same as the inclination direction (the direction inclined with respect to the X and Z axes in the XZ plane) of the upper surface (substrate support surface) of the second part 165b. . Between the 1st part 165a and the 2nd part 165b, as shown in FIG.21(b), the drive mechanism 165c of a feed screw system is formed, for example. The drive mechanism 165c drives the second part 165b to change the distance between the second part 165b and the first part 165a. In addition, the drive mechanism 165c is not limited to a feed screw method, The drive mechanism of other systems, such as a drive mechanism containing a linear motor, may be sufficient.

In the fifth embodiment, as the substrate feeder 165, the structure as described above is adopted, so that the first part 165a and the second part 165b are as shown in Fig. 21(a) except at the time of replacing the substrate. ) is approached. Thereby, it can prevent the board|substrate feeder 165 from obstructing work, such as exposure operation|movement and maintenance. Moreover, at the time of board|substrate replacement|exchange, by moving the 2nd part 165b of the board|substrate feeder 165 like FIG.21(b), a board|substrate replacement|exchange position can be set to the position on the -X side more. Thereby, the stroke of the X-axis direction when the stage apparatus 20 moves to a board|substrate exchange position can be shortened.

By the way, in this fifth embodiment, by employing the substrate feeder 165 as described above, the substrate exchange position is set to the -X side rather than in the first embodiment or the like. Therefore, when replacing the substrate, the substrate holder 28 ) and the distance between the external transfer robot 300 may increase. Nevertheless, in the present fifth embodiment, as shown in Fig. 21(b), the length of the export shutter 156' in the X-axis direction when the discharge port 152L is opened is shown in Fig. 1(b). It is set longer than the carry-out shutter 156 shown in the back, and the carrying-out shutter 156' is provided with a levitation force imparting mechanism for supplying pressurized gas upward from the surface on the +Z side in the state of Fig. 21(b). making it In addition, when the export door 152L is opened and closed, the carry-out shutter 156' moves in a reverse direction to that of the carry-out shutter 156 (clockwise when the carrying-out port 152L is opened, and counterclockwise when closing the carrying-out door 152L). moves to). Thereby, the exit shutter 156' can mediate the board|substrate P between the board|substrate holder 28 and the external transfer robot 300. As shown in FIG. Accordingly, according to the fifth embodiment, the substrate P can be transferred from the substrate holder 28 to the external transfer robot 300 without bending the substrate.

Further, in the fifth embodiment, when the export shutter 156' opens the export port 152L (FIG. 21(b)), the +X end of the export shutter 156' is the exit port 152L. ) is located at the same position as the +X end of As a result, the external transfer robot 300 can receive the substrate from the substrate holder 28 at a position on the +X side of the discharge port 152L, so that the entry of dust into the chamber 200 can be suppressed as much as possible. have.

In addition, in the said 5th embodiment, instead of the carrying-out shutter 156', it is good also considering using the carrying-out shutter 156 similar to the said 1st - 4th embodiment.

Further, like the export shutter 156' of the fifth embodiment, from the upper surface in the state where the exit port 152L is opened to the exit shutter 156 described in the first to fourth embodiments. It is good also as providing the function of supplying pressurized gas.

In addition, also in said 5th Embodiment, you may make the board|substrate feeder 165 to form so that rotation is possible similarly to 2nd Embodiment.

《Sixth Embodiment》

Next, a 6th embodiment is demonstrated using FIGS. 22-24. 22(a) and 22(b) show a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the sixth embodiment. This sixth embodiment is a modification of the third embodiment ( FIGS. 14 to 18 ), and, as shown in FIG. It is set wider than the width|variety of the Y-axis direction of the feeder 163. As shown in FIG. Moreover, the board|substrate feeder 166 is supported so that rotation is possible by the rotation shaft 176 extended in the Y-axis direction in the +X edge part vicinity, as shown to FIG.22(b). Moreover, the board|substrate feeder 166 is suspended and supported by the suspension mechanism 186 provided in the partition member 152 in two points|pieces in the Y-axis direction both end vicinity. Moreover, in the partition member 152 of this 6th embodiment, unlike the partition member 152 of the said 1st - 5th embodiment, the holding part 155 which holds the suspension mechanism 186 is formed. .

The suspension mechanism 186 has two ropes 196 for hanging and supporting the substrate feeder 166, and adjusts the length by winding or feeding the two ropes 196, so that the upper surface of the substrate feeder 166 is Adjust the inclination of (substrate support surface). In the sixth embodiment, by adopting the above configuration as the substrate feeder 166, even when the rigidity in the vicinity of the rotation axis 176 of the substrate feeder 166 is low, the small force of the suspension mechanism 186 is By this, the attitude|position of the board|substrate feeder 166 is controllable accurately, suppressing the curvature of the board|substrate feeder 166.

(substrate exchange operation)

In the sixth embodiment, when performing a substrate exchange operation, the main controller controls the suspension mechanism 186, and as shown in FIG. 22(b) , the upper surface of the substrate feeder 166 (substrate support surface) keep it horizontal Then, the main controller slides the carry-in shutter 154 in the +Z direction to open the carry-in port 152U (refer to arrow R1), and brings the external transfer robot 300 close to the carry-in port 152U (arrow R2). reference), the -X end of the substrate P2 is positioned in the vicinity of the +X end of the substrate support surface of the substrate feeder 166 . In addition, it is assumed that the suction pad 242 of the 1st slide hand 240 is located at the +X end of the rail 246 at this stage.

Next, the main controller starts adsorption-holding of a part of the lower surface of the substrate P2 by the suction pad 242 (refer to arrow R3 in FIG. 22(b) ).

Next, the main controller starts supplying (supply air) of pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 166, in Figs. 23 (a) and 23 ( As shown in b), the suction pad 242 of the first slide hand 240 is driven along the rail 246 to the -X side (refer to arrow R4). Accordingly, the substrate P2 is drawn into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 166 . Further, the main controller stops the supply of pressurized gas from the substrate feeder 166 and the robot hand 300F after transferring the substrate P2 onto the substrate feeder 166, and the substrate feeder 166. The adsorption|suction holding of the board|substrate P2 by this is started.

Next, the main controller opens the export exit shutter 156 while closing the inlet shutter 154 . Moreover, when the exposure with respect to the board|substrate P1 in the stage apparatus 20 is complete|finished, the main control apparatus drives the stage apparatus 20 to the position (substrate exchange position) shown in FIG. 24 (refer arrow R5).

Then, as shown in FIG. 24, a main controller inclines the board|substrate support surface of the board|substrate feeder 166 by controlling the suspension mechanism 186 and adjusting the length of the rope 196 (refer arrow R6). Moreover, the main controller starts supply of the pressurized gas from the upper surface 28u of the substrate holder 28, drives the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 to +Z direction and +Y direction, and a board|substrate (P1) is offset from the substrate holder 28 to the +Y side. Moreover, the main controller positions the external transfer robot 300 at a position near the discharge port 152L shown in FIG. 24 , and starts supplying the pressurized gas (supply air) from the upper surface of the robot hand 300F.

Moreover, the main controller causes the suction pad 342 of the second slide hand 340 to be driven upward, and the suction pad 342 adsorbs and holds the lower surface of the substrate P1. And the main controller drives the suction pad 342 along the rail 346 in the +X direction, and slides and conveys the board|substrate P1 on the robot hand 300F from the board|substrate holder 28 top. In addition, after the substrate P1 is slide-transferred to the robot hand 300F, the main controller drives the robot hand 300F in the +X direction to retract the substrate P1 to the outside of the chamber 200, The exit shutter 156 is closed. In addition, the main controller drives the external transfer robot 300 in the +X direction to transfer the substrate P1 to the external apparatus.

Moreover, the main controller drives the suction pad 27 of the board|substrate carry-in bearer apparatus 25 upward (refer arrow R7), and the suction pad 27 starts the suction holding|maintenance of the -X edge part of the board|substrate P2. (see arrow R8). In addition, the main controller starts supply of the pressurized gas from the upper surface of the substrate feeder 166 .

And the main controller drives the stage apparatus 20 to the -X direction in the state in which the suction pad 27 of the board|substrate carry-in bearer apparatus 25 adsorb|sucked hold|maintained the board|substrate P2. Thereby, similarly to FIG. 18(b), the board|substrate P2 is delivered on the board|substrate holder 28 from the board|substrate feeder 166. Further, while the substrate P2 is being transferred from the substrate feeder 166 onto the substrate holder 28 , pressurized gas is supplied from the upper surface of the substrate holder 28 .

On the other hand, the main controller stops supply of the pressurized gas from the upper surface of the substrate feeder 166 when the substrate P2 is transferred from the substrate feeder 166 onto the substrate holder 28 . Moreover, after performing alignment (position adjustment) of the board|substrate P2, a main controller drives the suction pad 27 down and starts exposure with respect to the board|substrate P2 newly mounted on the board|substrate holder 28. .

Next, the exposure with respect to the some board|substrate P is repeated by performing the process mentioned above repeatedly.

In addition, in said 6th Embodiment, although the board|substrate feeder 166 was supposed to be suspended and supported by a pair of rope 196, it is not limited to this. For example, you may suspend and support by the mechanism which does not have flexibility. For example, you may suspend and support the board|substrate feeder 166 with an air cylinder etc.

In addition, the board|substrate feeder 166 may have a 1st part and a 2nd part similar to 5th Embodiment (refer FIG.21(a)).

《Seventh Embodiment》

Next, 7th Embodiment is demonstrated using FIG. In the exposure apparatus which concerns on 7th Embodiment by FIG. 25, the state in which the stage apparatus 20 was positioned at the board|substrate exchange position is shown.

In this 7th Embodiment, the board|substrate feeder 167 is supported by the support frame 78 formed in the +Y side of the board|substrate feeder 167 in the upper surface. Moreover, the board|substrate feeder 167 has a characteristic in the point which holds the board|substrate P(P2) newly carried in on the board|substrate holder 28 in a non-contact suspension from the lower surface side. About the mechanism for non-contact suspension holding, it is the same as that of 4th Embodiment. Moreover, in this 7th Embodiment, there is no partition member 152 which existed in the said 1st - 6th Embodiment, and opening/closing door 198a, 198b which opens and closes the opening 200a is formed in the chamber 200. has been

In this 7th Embodiment, since the partition member 152 is abbreviate|omitted as mentioned above, the footprint of the whole exposure apparatus can be narrowed. Moreover, since the board|substrate feeder 167 is supported from the upper surface side, compared with the case where the board|substrate feeder 167 is cantilevered, generation|occurrence|production of the curvature in the board|substrate feeder 167 can be suppressed.

(substrate exchange operation)

The main controller opens the opening/closing doors 198a and 198b (refer to arrow S1) while performing the exposure operation in the stage device 20, and controls the external transfer robot 300, and a substrate P2 to be newly loaded. ), the -X end is positioned below the +X end of the lower surface of the substrate feeder 167 . And the main controller starts the non-contact suspension holding of the board|substrate P2 in the lower surface of the board|substrate feeder 167, and uses the board|substrate slide hand 140, The position which shows the board|substrate P2 in FIG. return until

In addition, the main controller is the same as in the previous embodiment, the substrate slide hand 140 holds the substrate P1 on the substrate holder 28 and drives it in the +X direction, and the exposed substrate P1 ) from the substrate holder 28 onto the robot hand 300F of the external transfer robot 300 (see arrow S2).

Thereafter, the main controller adsorbs and holds the substrate P2 on the suction pad 27 of the substrate carry-in bearer device 25 , and drives the stage device 20 in the -X direction to move the substrate P2 to the substrate feeder. (167) transfer onto the substrate holder (28) from above.

In addition, about the subsequent operation|movement, it is the same as that of the said 3rd Embodiment.

《Eighth Embodiment》

Next, 8th Embodiment is demonstrated in detail using FIGS. 26-30. Fig. 26(a) and Fig. 26(b) show a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eighth embodiment. In addition, in FIGS. 26-30, illustration of the chamber 200 is abbreviate|omitted for convenience.

In the eighth embodiment, the robot hand 300F' of the external transfer robot 300' has a flat plate-like member whose end on the -X side is processed into a comb-tooth shape. However, the robot hand 300F' can support the board|substrate P by air by supplying pressurized gas from the upper surface similarly to the previous embodiment, and while being able to air-float the board|substrate P, it is possible to vacuum-suck the board|substrate P. made possible.

In the eighth embodiment, the partition member 172 is used instead of the partition member 152 described in the first embodiment or the like. The partition member 172 has a box-shaped portion that forms the space 173 , and a substrate feeder 168 is provided on the upper surface of the upper wall (+Z side wall) of the box-shaped portion. Moreover, the carrying out port 172L is formed in the wall by the side of +X of the box-shaped part, and the board|substrate passage opening 172M is formed in the wall by the side of -X of the box-shaped part. Moreover, 172U of carrying-in ports are formed in the upper side of the carrying-out port 172L of the partition member 172. As shown in FIG. In the vicinity of 172L of the export ports, the exit shutter 156 is formed, and the entrance shutter 154 is formed in the vicinity of 172U of entrances. In addition, although FIG. 26(b) is sectional drawing, since it is not shown in figure, the +Y side and -Y side of a box-shaped part are blocked|occluded by a wall.

The substrate feeder 168 is capable of reciprocating in the X-axis direction along a pair of rails 174 laid along the X-axis direction on the upper surface of the upper wall of the box-like portion of the partition member 172 . In addition, the movable range of the X-axis direction of the board|substrate feeder 168 is about half of the X-axis direction length of the board|substrate P.

Further, in the eighth embodiment, a plurality of rod-shaped air floating members 29 (four in Fig. 26(a)) are arranged at a predetermined interval in the Y-axis direction on the end surface of the substrate holder 28 on the +X side. is formed with An opening (not shown) is formed in the upper surface (+Z surface) of the air floating member 29 , and pressurized gas is supplied from the opening.

(substrate exchange operation)

Next, the board|substrate exchange operation|movement in this 8th Embodiment is demonstrated using FIGS. 26-30. 26(a) and 26(b), FIGS. 27(a) and 27(b), and FIGS. 28(a) and 28(b) are cross-sectional views of the vicinity of the stage device at the same timing; A longitudinal cross-sectional view is shown. In addition, in FIG.26(a) - FIG.30(b), illustration of the structure unnecessary for description is abbreviate|omitted among the structures of an exposure apparatus.

(Operation of Figs. 26(a) and 26(b))

In the state of FIG.26(a), FIG.26(b), in the stage apparatus 20, exposure is performed with respect to the board|substrate P1. On the other hand, the main controller opens the carry-in opening 152U by sliding the carry-in shutter 154 in the +Z direction in order to accommodate the next-exposed substrate P2 in the chamber 200 (FIG. 26). See arrow T1 in (b)). Next, the main controller drives the external transfer robot 300' in the -X direction (refer to arrow T2 in Figs. 26(a) and 26(b)), and moves the end of the substrate P2 on the -X side to the chamber. (200) is entered. Thereby, the -X side edge part of the board|substrate P2 is located above the +X edge part of the board|substrate feeder 168. As shown in FIG. And the main controller makes the suction pad 142 of the board|substrate slide hand 140 contact a part of the lower surface of the board|substrate P2, and starts adsorption|suction holding|maintenance. Moreover, the main controller starts supply of the pressurized gas from the upper surface of the robot hand 300F' of the external transfer robot 300' and the upper surface of the substrate feeder 168. As shown in FIG.

(Operation of Figs. 27(a) and 27(b))

The main controller moves the substrate P2 along the substrate support surface (upper surface) of the substrate feeder 168 by driving the suction pad 142 (see arrow T3).

(Operation of Figs. 28(a) and 28(b))

When the substrate P2 moves to the position shown in Figs. 28(a) and 28(b) by the movement of the suction pad 142, the main controller moves the external transfer robot 300' downward (-Z direction). ) (refer to arrow T4), and position it in the vicinity of the discharge port 172L. Moreover, the main controller closes the carry-in opening 172U by sliding the carrying-in opening shutter 154 in -Z direction (refer arrow T5).

(Operation of Fig. 29(a))

After that, when the exposure of the substrate P1 in the stage device 20 is finished, the main controller moves the stage device 20 to the substrate exchange position (refer to arrow T6). In a state where the stage apparatus 20 is positioned at the substrate exchange position, the air floating member 29 enters the space 173 through the substrate passage port 172M as shown in Fig. 29(a) . Moreover, the main controller starts the adsorption|suction holding of the board|substrate P2 by the board|substrate feeder 168, and drives the board|substrate feeder 168 along the rail 174 in -X direction (refer arrow T7). In addition, in synchronization with the movement of the substrate feeder 168, the suction pad 142 holding the substrate P2 may be moved to the -X direction, and when the substrate feeder 168 is moved, the suction pad 142 The adsorption|suction holding|maintenance of the board|substrate P2 may be cancelled|released, and the adsorption|suction pad 142 may be previously moved to -X direction.

Moreover, the main controller opens the export port 172L by sliding the export exit shutter 156 in -Z direction (refer arrow T8). Further, the main controller drives the external transport robot 300' in the -X direction, thereby causing the external transport robot 300 to enter the space 173 formed by the partition member 172 (refer to arrow T9). In this state, the height of the substrate holder 28 and the air floating member 29 and the upper surface of the robot hand 300F' of the external transfer robot 300' substantially coincide. Moreover, since the comb-tooth-shaped part of the air floating member 29 and robot hand 300F' will be in a superimposed state, mechanical interference (contact) is avoided.

(Operation of Fig. 29(b))

Next, while raising the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 slightly, a main controller makes the suction pad 27 adsorb|suck and hold the lower surface of the board|substrate P1. Moreover, the main controller starts supply (supply air) of pressurized gas from the upper surface of the substrate holder 28, and moves the suction pad 27 which adsorbed and held the substrate P1 in the +Y direction to move the substrate P1. It is slightly offset from the substrate holder 28 in the +Y direction. By this offset, the suction pad 142 of the board|substrate slide hand 140 becomes able to hold|maintain the -X side and the +Y side edge part of the lower surface of the board|substrate P1.

Next, the main controller adsorbs and holds a part of the lower surface of the substrate P1 by the suction pad 142 of the substrate slide hand 140 . It is assumed that the main controller starts supplying (supply air) of the pressurized gas from the upper surfaces of the air floating member 29 and the robot hand 300F' in the step of Fig. 29(b) .

Next, the main controller starts the movement of the suction pad 142 of the substrate slide hand 140 in the +X direction (refer to arrow T10). Moreover, the main controller drives the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 to +Z direction at the timing that the board|substrate P1 moved only a predetermined distance in -X direction (refer arrow T11), and a suction pad By (27), the adsorption|suction holding|maintenance of the -X edge part of the board|substrate P2 on the board|substrate feeder 168 is started.

(Operation of Fig. 30(a))

Next, the main controller starts supply (supply air) of the pressurized gas from the upper surface of the substrate feeder 168 . And the main controller drives the stage apparatus 20 in the -X direction in the state in which the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 adsorb|sucked hold|maintained the board|substrate P2 (refer arrow T12). Moreover, while driving the stage apparatus 20 to -X direction, a main controller moves the board|substrate feeder 168 to +X direction. Thereby, as shown to Fig.10 (a), the board|substrate P2 is transmitted on the board|substrate holder 28 from the board|substrate feeder 168 top. Thereby, the stage apparatus 20 and the substrate feeder 168 move away from each other with respect to the X direction rather than carrying the board|substrate P2 on the substrate holder 28 only by driving in the -X direction of the stage apparatus 20. By driving in the direction, the substrate P2 can be loaded onto the substrate holder 28 at a higher speed. This is possible because the substrate feeder 168 can be driven in the +X direction by providing the space 173 in the chamber 200 . Moreover, you may make the timing which drives the stage apparatus 20 -X direction different from the timing which moves the board|substrate feeder 168 to +X direction. In addition, the main controller may make it move the board|substrate feeder 168 after transmitting the board|substrate P2 to the board|substrate holder 28 to +X direction.

(Operation of Fig. 30(b))

By continuing the movement of the suction pad 142 in the +X direction, the main controller transfers the substrate P1 onto the robot hand 300F' of the external transfer robot 300' as shown in Fig. 30(b). transmit When this transfer is completed, the main controller stops the suction holding of the substrate P1 by the suction pad 142 . Moreover, the main controller drives the external transfer robot 300' holding the substrate P1 in the +X direction (refer to arrow T13), and transfers the substrate P1 to the external apparatus. Moreover, the main controller closes the export port 172L by sliding the export exit shutter 156 in the +Z direction (refer arrow T14).

The subsequent operation is the same as in the first embodiment and the like.

As described in detail above, according to the eighth embodiment, the carrying-in operation of the substrate P2 to the substrate holder 28 and the carrying-out operation of the substrate P1 from the substrate holder 28 are performed in parallel. Therefore, the time required for the substrate exchange operation can be shortened.

Further, in the eighth embodiment, the air floating member 29 is provided on the +X side of the substrate holder 28, and the -X side end of the robot hand 300F' of the external transfer robot 300' is removed. I'm doing it with a comb. Thereby, since the air floating member 29 and robot hand 300F' become the overlapping shape, the curvature of the board|substrate P at the time of delivering the board|substrate P can be suppressed.

Moreover, in the said 8th Embodiment, you may make it support the board|substrate (substrate to carry out) non-contact in the lower surface of the board|substrate feeder 168 similarly to the said 4th Embodiment.

Moreover, in the said eighth embodiment, you may provide the shutter which opens and closes the board|substrate passage opening 172M. Moreover, the shutter which opens and closes the board|substrate passage opening 172M may be provided, and you may abbreviate|omit the carrying out exit shutter 156.

Further, in the eighth embodiment, the rail 146 of the substrate slide hand 140 may be provided on the substrate feeder 168 . In this case, since the substrate feeder 168 is movable in the X-axis direction, the length of the rail 146 , that is, the X stroke of the suction pad 142 can be shortened.

《Ninth Embodiment》

Next, a ninth embodiment will be described using FIGS. 31 and 32 . Fig. 31(a) and Fig. 31(b) show a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the ninth embodiment.

In the exposure apparatus of this 9th Embodiment, it has the characteristic in the point which employ|adopts the board|substrate feeder 169 instead of the board|substrate feeder 168 of 8th Embodiment mentioned above. On the +X side of the upper surface of the substrate feeder 169, a plurality of (three in Fig. 31(a)) grooves 169a are formed. The dimensions and spacing of the grooves 169a are determined by the substrate feeder 169 and the robot hand 300F' even when the robot hand 300F' of the external transfer robot 300' enters from the carry-in port 172U. It is set not to touch. Other configurations are the same as those of the eighth embodiment.

(substrate exchange operation)

Next, based on FIGS. 31 and 32, the board|substrate exchange operation|movement in this 9th Embodiment is demonstrated. 31A and 31B, 32A and 32B show a cross-sectional view and a longitudinal cross-sectional view in the vicinity of the stage device at the same timing. In addition, in FIG.31(a) - FIG.32(b), illustration of the structure unnecessary for description is abbreviate|omitted among the structures of an exposure apparatus.

In the state of FIG. 31(a) and FIG. 31(b), it is assumed that exposure with respect to the board|substrate P1 mounted on the board|substrate holder 28 in the stage apparatus 20 is performed. In this state, the main controller slides the carry-in shutter 154 in the +Z direction in order to accommodate the substrate P2 to be exposed next in the chamber 200, thereby opening the carry-in opening 172U ( See arrow U1 in Fig. 31(b)). Next, the main controller drives the external transfer robot 300' in the -X direction (refer to arrow U2 in FIGS. 31(a) and 31(b) ). By the operation of this external transfer robot 300', as shown in Figs. 32(a) and 32(b), about half of the -X side of the robot hand 300F' and -X of the substrate P2 About half of the side is positioned above the substrate feeder 169 .

Next, the main controller transfers a part of the substrate P2 to the substrate feeder 169 by lowering the robot hand 300F'.

And the main controller starts supply of the pressurized gas from the board|substrate support surface (upper surface) of the board|substrate feeder 169, and the upper surface of robot hand 300F'. Moreover, a main controller drives the suction pad 142, and makes the suction pad 142 adsorb|suck and hold the edge part of the +Y side and -X side of the board|substrate P2.

Next, the main controller performs the substrate exchange on the substrate holder 28 by performing the same operation as in the eighth embodiment.

As described above, according to the ninth embodiment, the external transfer robot 300' enters the chamber 200 and delivers about half of the -X side of the substrate P2 to the substrate feeder 169. , it is possible to shorten the movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (adsorption pad 142 ) for drawing the substrate P2 into the chamber 200 . Moreover, with this, the movement time of the suction pad 142 can be shortened.

In addition, when the substrate is transferred from the external transfer robot 300' to the substrate feeder 169, since it is transferred from above, the substrate is caused by bending (sagging) at the tip of the substrate compared to the case of transferring the substrate by sliding it. The possibility that the substrate feeder 169 and the substrate feeder 169 can be reduced can be reduced.

《10th embodiment》

Next, a tenth embodiment will be described with reference to FIGS. 33 and 34 . Figs. 33(a) to 34(b) show cross-sectional views of the exposure apparatus according to the tenth embodiment. As shown to Fig.33(a), in the exposure apparatus of this 10th Embodiment, the rail 146 of the board|substrate slide hand 140 is fixed to the board|substrate feeder 169, unlike 9th Embodiment mentioned above. It is characterized in that there is In addition, about the other structure, it is the same as that of 9th Embodiment.

(substrate exchange operation)

Hereinafter, the board|substrate exchange operation|movement in the exposure apparatus of 10th Embodiment is demonstrated using FIG.33(a) - FIG.34(b).

In FIG. 33(a), it is assumed that exposure with respect to the board|substrate P1 mounted on the board|substrate holder 28 in the stage apparatus 20 is performed. In this state, in order to accommodate the board|substrate P2 which exposes next in the chamber 200, a main controller opens 172U of carry-in openings by sliding the carrying-in shutter 154 to +Z direction. Next, the main controller drives the external transfer robot 300' in the -X direction (refer to arrow V1). By the operation of this external transfer robot 300', as shown in FIG. It is positioned above (169).

Then, the main controller lowers the robot hand 300F' to a height at which the upper surface of the robot hand 300F' substantially coincides with the upper surface of the substrate feeder 169, thereby lowering a part of the substrate P2 to the substrate feeder ( 169) to Next, the main controller starts supplying the pressurized gas from the substrate support surface (upper surface) of the substrate feeder 169 and the upper surface of the robot hand 300F'. Moreover, a main controller drives the suction pad 142, and makes the suction pad 142 adsorb|suck and hold the edge part of the +Y side and -X side of the board|substrate P2.

Next, the main controller moves the substrate P2 along the substrate support surface of the substrate feeder 169 by driving the suction pad 142 in the -X direction, as shown in Fig. 34(a) (arrow V2). Reference). After that, when the exposure to the substrate P1 in the stage device 20 is finished, the main controller drives the substrate feeder 169 in the -X direction as shown in Fig. 34(b) and ( arrow V3), the external transfer robot 300' is driven in the +X direction, and retracted from the inside of the chamber 200 (refer arrow V4). Next, the main controller exchanges the substrate on the substrate holder 28 by executing the same operation as the operation of the above-described eighth embodiment (operations in Figs. 29(a) to 30).

As described above, according to the tenth embodiment, the external transfer robot 300 ′ enters the chamber 200 and delivers about half of the -X side of the substrate P2 to the substrate feeder 169 . , it is possible to shorten the movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (adsorption pad 142 ) for drawing the substrate P2 into the chamber 200 . Moreover, with this, the movement time of the suction pad 142 can be shortened.

In addition, when the substrate is transferred from the external transfer robot 300' to the substrate feeder 169, since it is transferred from above, the substrate is caused by bending (sagging) at the tip of the substrate compared to the case of transferring the substrate by sliding it. The possibility that the substrate feeder 169 and the substrate feeder 169 can be reduced can be reduced.

Further, in the tenth embodiment, since the rail 146 of the substrate slide hand 140 is formed on the substrate feeder 169, the movement range (stroke) of the substrate slide hand 140 in the X-axis direction is reduced. It is possible to make it shorter than that of the ninth embodiment.

<Eleventh Embodiment>

Next, the exposure apparatus which concerns on 11th Embodiment is demonstrated using FIGS. 35-38.

Fig. 35(a) and Fig. 35(b) show a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eleventh embodiment. In addition, in FIG.35(a), FIG.35(b), etc., illustration of the chamber 200 is abbreviate|omitted for convenience.

35(a) and 35(b), in the eleventh embodiment, an external transport robot 301 is used instead of the external transport robot 300' of the ninth embodiment. . Moreover, the enclosure member 182 which forms the space 171 which covers the board|substrate feeder 169 is formed in the partition member 172. As shown in FIG.

The external transport robot 301 has a plurality (for example, five) of branches 301F, as shown in Fig. 35(a) , but unlike the external transport robots 300 and 300', . Moreover, the length of the X-axis direction of the groove|channel 169a of the board|substrate feeder 169 is set longer than 9th Embodiment according to the branch part 301F of the external transfer robot 301. As shown in FIG. In addition, an uneven member, such as a board|substrate support pad, may exist on the upper surface of the support part 301F of the external transfer robot 301. As shown in FIG.

An opening 172N is formed in the enclosure member 182 formed in the partition member 172 . Further, in the eleventh embodiment, the branch 301F of the external transfer robot 301 enters the chamber 200 , but the entry range is limited to the space 171 and the space 173 . Further, in the eleventh embodiment, an air exhaust device 183 that exhausts air toward the +Z direction is provided in the space 173 . To the air exhaust device 183 , high-pressure air may be supplied from a compressor generally used as factory equipment. Moreover, the air exhaust device 183 may use the fan as disclosed in Unexamined-Japanese-Patent No. 2009-073660, for example.

Other configurations are the same as those of the ninth embodiment.

(substrate exchange operation)

Next, the board|substrate exchange operation|movement in this 11th Embodiment is demonstrated in detail using FIG.35(a) - FIG.38(c). Figs. 35(a) and 35(b), Figs. 36(a) and 36(b), Figs. 37(a) and 37(b) are cross-sectional views in the vicinity of the stage device at the same timing and A longitudinal cross-sectional view is shown. In addition, in FIG.35(a) - FIG.38(c), illustration of the structure unnecessary for description is abbreviate|omitted among the structures of an exposure apparatus.

(Operation of Figs. 35(a) and 35(b))

In the state of FIG.35(a), FIG.35(b), in the stage apparatus 20, exposure is performed with respect to the board|substrate P1. On the other hand, the main controller slides the inlet shutter 154 in the +Z direction in order to accommodate the substrate P2 to be exposed next in the chamber 200 (in the space 171). 152U) (see arrow α1 in Fig. 35(b)).

(Operation of Figs. 36(a) and 36(b))

Next, the main controller drives the external transfer robot 301 in the -X direction (refer to arrow α2 in FIGS. 36(a) and 36(b) ). By the operation of this external transfer robot 301, as shown in Figs. 36(a) and 36(b), about half of the -X side of the branch 301F of the external transfer robot 301 and the substrate P2 ) about half of the -X side is positioned above the substrate feeder 169 . In this state, the main controller transfers a part of the substrate P2 to the substrate feeder 169 by lowering the external transfer robot 301 . And the main controller starts supply of the pressurized gas from the board|substrate feeder 169. FIG. Moreover, a main controller drives the suction pad 142, and makes the suction pad 142 adsorb|suck and hold the edge part of the +Y side and -X side of the board|substrate P2.

(Operation of FIGS. 37(a) and 37(b))

Then, the main controller drives the suction pad 142 in the direction intersecting the X and Z axes in the XZ plane (the inclination direction of the substrate support surface of the substrate feeder 169) (see arrow α3), the substrate ( P2) is moved to the position shown in FIGS. 37(a) and 37(b). Moreover, the main controller drives the external transfer robot 301 in the +X direction to take out the branch 301F to the outside of the space 171 . And the +X end of the board|substrate P2 is located on the -X side rather than the carry-in shutter 154, and the -X end of the branch part 301F of the external transfer robot 301 is located on the +X side rather than the carry-in shutter 154. On the other hand, the main controller closes the carry-in opening 172U by sliding the carry-in shutter 154 in the -Z direction (refer to arrow α4). Moreover, the main controller drives the external transfer robot 301 in the -Z direction, and positions the -X end of the branch 301F in the vicinity of the discharge port 172L (refer to arrow α5).

(Operation of Fig. 38(a))

Next, the main controller starts adsorption-holding of the substrate P2 by the substrate feeder 169, and drives the substrate feeder 169 in the -X direction (refer to arrow α6). In addition, in synchronization with the movement of the substrate feeder 169, the suction pad 142 holding the substrate P2 may be moved in the -X direction, and when the substrate feeder 169 is moved, the suction pad 142 The adsorption|suction holding|maintenance of the board|substrate P2 may be cancelled|released, and the adsorption|suction pad 142 may be previously moved to -X direction. Moreover, the main controller opens the export port 172L by sliding the export exit shutter 156 in -Z direction (refer arrow alpha7). In addition, the main controller drives the external transfer robot 301 in the -X direction (refer to arrow α8), so that the branch 301F passes through the discharge port 172L and the substrate passage port 172M.

(Operation of Fig. 38(b))

After that, when the exposure of the substrate P1 in the stage device 20 is finished, the main controller moves the stage device 20 to the substrate exchange position below the substrate feeder 169 (see arrow α9). ). At this time, the air floating member 29 formed in the substrate holder 28 and the branch 301F of the external transfer robot 301 are superimposed.

Moreover, the main controller controls the air exhaust device 183 to start exhausting the high-pressure air directed upward (refer to the broken-line arrow α10). Moreover, the main controller starts supplying the pressurized gas from the upper surface of the substrate holder 28 and the upper surface of the air floating member 29 . Moreover, while offsetting the board|substrate P1 to +Y direction using the board|substrate carrying-in bearer apparatus 25, a main control apparatus makes the suction pad 27 adsorb|suck and hold a part of the board|substrate P2, and the suction pad 27 ) is driven in the +X direction (see arrow α11 in Fig. 38(c)).

Then, the main controller drives the suction pad 27 of the board|substrate carrying-in bearer apparatus 25 upward, and the -X edge part of the board|substrate P2 is adsorbed and held by the suction pad 27. Moreover, the main controller starts supply (supply air) of the pressurized gas from the upper surface of the substrate feeder 169 . Then, the main controller drives the stage device 20 in the -X direction while the suction pad 27 of the substrate carry-in bearer device 25 adsorbs and holds the substrate P2 (see arrow α12). , move the substrate feeder 169 in the +X direction (see arrow α13). Thereby, as shown in FIG.38(c), the board|substrate P2 is delivered on the board|substrate holder 28 from the board|substrate feeder 169 top. Thereby, the stage device 20 and the substrate feeder 169 are moved away from each other with respect to the X direction rather than carrying the substrate P2 onto the substrate holder 28 only by driving the stage device 20 in the -X direction. By driving in the direction, the substrate P2 can be loaded onto the substrate holder 28 at a higher speed. This is possible because the substrate feeder 169 can be driven in the +X direction by providing the space 173 in the chamber 200 . Moreover, you may make the timing which drives the stage apparatus 20 -X direction different from the timing which moves the board|substrate feeder 168 to +X direction. In addition, the main controller may make it move the board|substrate feeder 169 after transmitting the board|substrate P2 to the board|substrate holder 28 to +X direction. Moreover, the main controller aligns the board|substrate P2 (position adjustment) by driving the suction pad 27 microscopically. Then, the main controller drives the suction pad 27 down, starts the suction holding of the board|substrate P2 by the board|substrate holder 28, and to the board|substrate P2 newly mounted on the board|substrate holder 28. exposure is initiated. In addition, the main controller may make it move the board|substrate feeder 169 after transmitting the board|substrate P2 to the board|substrate holder 28 to +X direction (refer arrow alpha13).

Further, when the main controller continues to drive the suction pad 142 in the +X direction (see arrow α11 ), the substrate P1 is transferred from the substrate holder 28 and the air floating member 29 to the external transfer robot 301 . do. In addition, since high-pressure air is blown upward from the air exhaust device 183 while the substrate P1 is being transferred, even if the external transfer robot 301 does not have a function of supplying pressurized gas, it is transferred outside. Contact between the branch 301F of the robot 301 and the substrate P1 can be prevented. After that, the main controller stops the air exhaust device 183 and starts adsorption holding of the substrate P1 by the branch 301F. And the main controller drives the external transfer robot 301 in the +X direction, carries out the board|substrate P1 out of the chamber 200, and closes the carrying-out shutter 156.

By the above, the board|substrate exchange operation|movement is complete|finished.

As described above, in addition to obtaining the same effects as those of the ninth embodiment, by using the air exhaust device 183, even if the external transfer robot 301 does not have a mechanism for supplying pressurized gas, the branch 301F and the substrate P1 can be prevented from coming into contact with each other. Moreover, when the partition member 172 has the spaces 171 and 173, the entry of dust to the exposure apparatus main body 10 vicinity can be suppressed.

Further, in the eleventh embodiment, a shutter may be provided in the substrate passage opening 172M or the opening 172N. Thereby, entry of dust into the chamber 200 can be suppressed.

《Twelfth Embodiment》

Next, 12th Embodiment is demonstrated in detail using FIGS. 39-41. Fig. 39(a) is a longitudinal cross-sectional view in the vicinity of the partition member 172 according to the twelfth embodiment, and Fig. 39(b) is a cross-sectional view taken along the line B-B in Fig. 39(a).

In addition to the structure of 11th Embodiment mentioned above, this 12th Embodiment has the characteristic in the point in which the belt feeding mechanism 40 is formed in the air exhaust apparatus 183 formed in the space 173.

The belt feeding mechanism 40 includes a pair of rails 41 formed in the air exhaust device 183 in the longitudinal direction in the X-axis direction, and a pair of movable bodies movable along the rails 41 in the X-axis direction. (43) and a movable member (42) connected to each of the movable bodies (43) in the Y-axis direction in the longitudinal direction. In the moving member 42 , a plurality of (for example, four) convex portions protruding in the Z direction are formed at predetermined intervals in the Y-axis direction. In addition, the belt feeding mechanism 40 includes a plurality of (for example, four) belts 45 having one end fixed to each of the convex portions of the moving member 42 , and a plurality of belts 45 having one end fixed to the other end of each of the belts 45 . It has a weight member (47). Further, each of the belts 45 is in a state of being caught by a pulley 48 fixed to a shaft member extending in the Y-axis direction formed in the air exhaust device 183 .

In the belt feeding mechanism 40, when the driving force of the -X direction is not provided to the movable body 43, as shown in FIG. 39(a), the weight member 47 is the bottom surface of the space 173. Because it is in contact with , the state of Fig. 39(a) is maintained. On the other hand, when the -X-direction driving force is provided to the movable body 43, since the moving member 42 moves in -X direction, the length of the part extended in the X-axis direction among the belt 45 becomes long.

(substrate exchange operation)

Next, based on FIG.40(a) - FIG.41(c), the board|substrate exchange operation|movement in the exposure apparatus of this 12th Embodiment is demonstrated in detail.

In FIG. 40(a) , in the stage apparatus 20, the exposure to the substrate P1 is finished, and in the same manner as in the eleventh embodiment described above, the substrate P2 is transferred to the external transfer robot 301 . It is conveyed on the board|substrate feeder 169, and the state which the board|substrate feeder 169 moved in -X direction is shown. In this case, the weight member 47 of the belt feeding mechanism 40 is in a state in contact with the bottom surface of the space 173 .

The main controller opens the export port 172L by sliding the export exit shutter 156 in the -Z direction in Fig. 40(a) (see arrow β1 in Fig. 40(a) ). Then, as shown in Fig. 40(b) , the main controller causes the branch 301F of the external transfer robot 301 to enter from the discharge port 172L (refer to the arrow β2) and the stage device 20 It is driven to the substrate exchange position (below the substrate feeder 169) (see arrow β3). In this case, each of the air floating members 29 formed in the board|substrate holder 28 is arranged in line with each belt 45 on the same straight line as shown to Fig.41 (a). In addition, since the branch 301F of the external transfer robot 301 is superimposed on the belt 45 and the air floating member 29, the branch 301F, the belt 45, and the air floating member 29 are superimposed on each other. ) to avoid contact with In addition, since many small holes are formed in the belt 45, by supplying high-pressure air from the air exhaust device 183, a part of high-pressure air passes through the hole. Therefore, it is possible to give the belt 45 the same function as the air floating member 29 . Thereby, the board|substrate P1 can be slid in the state which floated with respect to the belt 45, or the semi-floated state.

That is, in the state of Fig. 41 (a), by sliding the substrate P1 placed on the substrate holder 28 in the +X direction using the substrate slide hand 140, the branch 301F of the external transfer robot 301 is ), it is possible to move the substrate P1 above the branch 301F of the external transfer robot 301 without bending the substrate P1 even if there is no function for air flotation.

Next, similarly to the eleventh embodiment, transfer of the substrate P2 from the substrate feeder 169 onto the substrate holder 28 and the substrate ( The transfer of P1) is carried out. In this operation, the main controller drives the stage device 20 in the -X direction, but moves the moving member 42 in the -X direction to follow the drive of the stage device 20 in the -X direction. making it happen As a result, as shown in FIG. 41(b) , the air floating member 29 or the belt 45 is disposed in the gap between the branches 301F of the external transfer robot 301 with almost no gap. thing is made possible

41( c ) shows a state in which the substrate P2 is placed on the substrate holder 28 and the substrate P1 is positioned above the branch 301F of the external transfer robot 301 . The main controller transfers the substrate P1 to the external transfer robot 301 by driving the external transfer robot 301 upward from this state. After that, the main controller stops the air exhaust device 183 and starts adsorption holding of the substrate P1 by the branch 301F. And the main controller drives the external transfer robot 301 in the +X direction to retract from the inside of the space 173, and slides the export exit shutter 156 in the +Z direction to close the export port 172L.

In addition, although the said description demonstrated the case where the board|substrate P1 was slide-transferred in the space 173 in the state which made the external transfer robot 301 enter into the space 173, it is not limited to this. For example, after slide conveying the board|substrate P1 in the space 173, you may make the external conveyance robot 301 enter into the space 173.

(variant example)

In addition, in each said embodiment, although the case where the carrying-out shutter and carrying-in shutter are provided in the vicinity of the carrying-out and carrying-in ports of the partition members 152 and 172 was demonstrated, it is not limited to this, In the chamber 200 It is good also as providing a carrying-in/outlet shutter and a carrying-in/outlet shutter.

In addition, a pair of block-shaped members formed in the +Y side surface and -Y side surface of the board|substrate feeder 264 as the board|substrate feeder 264 as shown in FIG. 42 as the board|substrate feeder of each said embodiment. By fixing the cover 199 to the 265 , the upper surface of the substrate feeder 264 may be covered. Moreover, in the case of the board|substrate feeder in which the groove|channel is formed in the upper surface, you may make it provide the cover 199 so that it may cover other than the upper side of the groove|channel.

The cover 199 has an inverted U-shaped cross section in YZ, and between the cover 199 and the substrate feeder 264, the substrate can be slid in from the +X side and the substrate can be slid out from the -X side. it is made to be In addition, although the case where the cover 199 is transparent is shown in FIG. 42, the cover 199 does not need to be transparent. In this modification, by providing the cover 199, while being able to prevent adhesion of the dust to the board|substrate P, the temperature of the board|substrate P can be made constant.

Further, in the sixth embodiment (FIG. 22(a), FIG. 22(b), etc.), when the substrate feeder 264 of FIG. 42 is employed, the upper surface of the cover 199 is suspended from the mechanism 186 It is good also as being suspended and supported by Moreover, in 7th Embodiment (FIG. 25), when employ|adopting the board|substrate feeder 264 of FIG. 42, it is good also considering providing the cover 199 on the lower surface side of the board|substrate feeder.

Moreover, you may employ|adopt the board|substrate feeder 364 as shown to Fig.43 (a) as a board|substrate feeder of each said embodiment. As for the board|substrate feeder 364, the upper surface is in the curved state. Thus, by curving the upper surface (substrate support surface) of the substrate feeder 364, the section modulus of a board|substrate can be enlarged. That is, with respect to the warpage of the substrate, it is possible to obtain an effect such that the thickness of the substrate is several times to several hundred times larger than the actual thickness.

By doing in this way, even if the substrate P is placed on the substrate feeder 364 in a state where the -X end protrudes as shown in Fig. 43(b), warpage (sagging) occurs at the -X end of the substrate P can be restrained Moreover, since generation|occurrence|production of the curvature (sagging) of the board|substrate P is suppressed, when making the board|substrate P contact with the board|substrate holder 28, the board|substrate P is contacted from the Y-axis direction center part of the side on the -X side. Since it can make it do it, it can make it hard to produce a wrinkle in the -X edge part of the board|substrate P.

In addition, you may provide an ionizer in the vicinity of a board|substrate feeder. Thereby, static elimination as a countermeasure against static electricity of the board|substrate before mounting on the board|substrate holder 28 can be performed.

The above-mentioned embodiment is an example of preferable implementation of this invention. However, it is not limited to this, and various deformation|transformation implementation is possible within the range which does not deviate from the summary of this invention.

10: exposure apparatus body
100: exposure device
200: chamber
300: external transfer robot
28: substrate holder
160: substrate feeder

Claims (16)

an exposure apparatus body;
a chamber accommodating the exposure apparatus body;
a substrate holding unit formed in the chamber for receiving and holding the substrate transferred by an external transfer robot outside the chamber;
transfer of the substrate from the external transfer robot to the substrate holding unit, transfer of the substrate from the substrate holding unit onto a holding apparatus of the exposure apparatus main body, and transfer of the substrate from the holding apparatus to the external transfer robot. An exposure apparatus comprising a substrate transfer apparatus that transfers. The method of claim 1,
The substrate transfer device,
a holding portion formed in the holding device for holding a part of the substrate on the substrate holding portion;
In a state in which the holding part holds a part of the substrate on the substrate holding part, the holding device moves in a first direction away from the substrate holding part, thereby transferring the substrate from the substrate holding part onto the holding device. To carry out, exposure apparatus. 3. The method of claim 2,
the first surface of the substrate holding unit holding the substrate before transfer to the holding device is inclined with respect to the upper surface of the holding device at least during the transfer of the substrate from the substrate holding unit onto the holding device, exposure device. 4. The method of claim 3,
and the substrate holding unit transitions between a state in which the first surface is inclined with respect to the upper surface of the holding device and a state in which it is not inclined. 5. The method according to any one of claims 1 to 4,
The substrate transfer device,
An exposure apparatus for transferring the substrate to the substrate holding unit from a state in which the external transfer robot is located outside the chamber, and a part of the substrate held by the external transfer robot is located in the chamber. 6. The method according to any one of claims 1 to 5,
The substrate transfer device transfers the substrate on the holding device to the external transfer robot in a state where the substrate is held by the substrate holding unit, and after the transfer, the substrate held by the substrate holding unit is transferred to the holding device , exposure apparatus. 7. The method according to any one of claims 1 to 6,
The substrate transfer device,
a first transfer mechanism formed in the substrate holding unit and configured to transfer the substrate from the external transfer robot to the substrate holding unit;
and a second transfer mechanism formed in the holding device and configured to transfer the substrate from the holding device to the external transfer robot. 8. The method according to any one of claims 1 to 7,
The exposure apparatus according to claim 1, wherein a non-contact suspension holding mechanism for holding the substrate in a non-contact manner is formed on a lower surface of the substrate holder. 9. The method of claim 8,
and the non-contact suspension holding mechanism holds the substrate transferred from the holding device to the external transfer robot in a non-contact suspension. 9. The method of claim 8,
The exposure apparatus, wherein the non-contact suspension holding mechanism holds the substrate before being transferred to the holding device in a non-contact suspension. 11. The method according to any one of claims 1 to 10,
An opening and closing door is formed in the vicinity of the opening through which the substrate is taken out of the chamber,
and a first levitation force imparting mechanism for imparting levitation force to the substrate is formed at a position opposite to the lower surface of the substrate passing through the opening in the opening/closing door. 12. The method according to any one of claims 1 to 11,
The exposure apparatus wherein the substrate holding unit is capable of reciprocating between a first position above the movement region of the holding device and a second position above the movement region of the holding device. 13. The method according to any one of claims 1 to 12,
The exposure apparatus, wherein the substrate is transferred by relative movement in the vertical direction of the external transfer robot and the substrate holding unit. 14. The method according to any one of claims 1 to 13,
and a second levitating force applying mechanism for applying levitating force from below to the substrate transferred from the holding device to the external transfer robot. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 14;
and developing the exposed substrate. A device manufacturing method comprising:
Exposing the substrate using the exposure apparatus according to any one of claims 1 to 14;
and developing the exposed substrate.

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