KR102295115B1 - A conveyance apparatus, an exposure apparatus, an exposure method, the manufacturing method of a flat panel display, a device manufacturing method, and a conveyance method - Google Patents

Abstract

The conveyance apparatus which conveys the board|substrate P with respect to the non-contact holder 32 which supports the board|substrate P in a non-contact, the holding|maintenance which holds a part of board|substrate P at the 1st position located above the non-contact holder 32. A driving unit for moving the pad 1084b and the holding pad 1084b holding the substrate P downward so that the substrate P is supported by the non-contact holder 32 in a non-contact manner; and the substrate held by the holding pad 1084b. (P) is moved by the driving unit and provided with a suction pad 44 for holding the substrate P held by the non-contact holder 32 in a non-contact manner, the driving unit moving the holding pad 10044 to the first position The substrate P is moved from the to the second position transferable to the suction pad 44 .

Description

A conveyance apparatus, an exposure apparatus, an exposure method, the manufacturing method of a flat panel display, a device manufacturing method, and a conveyance method

The present invention relates to a conveying apparatus, an exposure apparatus, an exposure method, a manufacturing method for a flat panel display, a device manufacturing method, and a conveying method, and more particularly, to a conveying apparatus and method for conveying an object, comprising the conveying apparatus It relates to an exposure apparatus, an exposure method using a conveyance method, and a flat panel display or device manufacturing method using the exposure apparatus.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), a mask or a reticle (hereinafter, collectively referred to as "mask"), a glass plate or wafer (hereinafter, A step-and-scan exposure apparatus (so-called scanning/stepper (also called a scanner)) that transfers a pattern formed on a mask onto a substrate using an energy beam while synchronously moving the “substrate” in a predetermined scanning direction. )) are used.

In this type of exposure apparatus, the exposed glass substrate on the substrate stage apparatus is unloaded using the substrate exchange apparatus, and then another glass substrate is loaded onto the substrate stage apparatus using the substrate exchange apparatus, thereby to the substrate stage apparatus. It is known to replace the hold|maintained glass substrate one by one, and to perform an exposure process with respect to some glass substrate in order (for example, refer patent document 1).

Here, when exposing a plurality of glass substrates, it is preferable to quickly replace the glass substrates on the substrate stage apparatus also for the improvement of the overall throughput.

Specification of US Patent Application Publication No. 2010/026661

According to a first aspect of the present invention, in a conveying apparatus for conveying the object with respect to a support for supporting the object in a non-contact manner, a first holding portion for holding a part of the object at a first position located above the support portion. and a driving unit for moving the first holding unit holding the object downward so that the object is supported by the supporting unit in a non-contact manner, and the object held in the first holding unit is moved by the driving unit, and the supporting unit a conveying device comprising a second holding unit for holding the object supported in a non-contact manner, wherein the driving unit moves the first holding unit from the first position to a second position capable of transferring the object to the second holding unit; is provided

According to a second aspect of the present invention, there is provided an exposure apparatus comprising the conveying apparatus according to the first aspect and a pattern forming apparatus for forming a predetermined pattern on an object using an energy beam.

According to a third aspect of the present invention, there is provided a method for manufacturing a flat panel display comprising exposing an object using the exposure apparatus according to the second aspect and developing the exposed object.

According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising exposing an object using the exposure apparatus according to the second aspect, and developing the exposed object.

According to a fifth aspect of the present invention, in a conveying method for conveying the object with respect to a support portion that supports the object in a non-contact manner, the first holding portion for holding a part of the object at a first position located above the support portion; moving the object to be supported by the support in a non-contact manner, and holding the object supported by the support in a non-contact manner by a second holding portion, wherein in the moving, from the first position A conveying method is provided for moving the object to a second position deliverable to the second holding unit.

According to a sixth aspect of the present invention, there is provided an exposure method comprising conveying an object to the support unit and exposing the object conveyed to the support unit by the conveyance method according to the fifth aspect.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematically the structure of the liquid crystal exposure apparatus which concerns on 1st Embodiment.
FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 .
3 : is a figure which shows the detail of the board|substrate stage apparatus with which the liquid crystal exposure apparatus of FIG. 1 is equipped.
Fig. 4 is an enlarged view of the main part of the substrate stage apparatus.
5 : is a conceptual diagram of the board|substrate position measuring system with which the liquid crystal exposure apparatus of FIG. 1 is equipped.
Fig. 6 is a block diagram showing the input/output relationship of the main controller which centrally constitutes the control system of the liquid crystal exposure apparatus.
7(a) and 7(b) are views (a plan view and a front view, respectively) for explaining the operation (part 1) of the substrate stage apparatus at the time of the exposure operation.
8(a) and 8(b) are views (a plan view and a front view, respectively) for explaining the operation (part 2) of the substrate stage apparatus at the time of the exposure operation.
9(a) and 9(b) are views (a plan view and a front view, respectively) for explaining the operation (part 3) of the substrate stage apparatus at the time of the exposure operation.
10A and 10B are views (a plan view and a front view, respectively) showing a substrate carrier according to a first modification of the first embodiment.
11 is a diagram showing a substrate stage apparatus according to a second modification of the first embodiment.
Fig. 12(a) is a plan view of a substrate carrier according to a second modification, and Fig. 12(b) is a plan view of a substrate table according to a second modification.
13A and 13B are views (a plan view and a cross-sectional view, respectively) of a substrate stage apparatus according to a third modification of the first embodiment.
14 is a diagram showing a substrate stage apparatus according to a second embodiment.
15A and 15B are views (a plan view and a side view, respectively) showing a Y guide bar, a weight canceling device, and the like included in the substrate stage device of FIG. 14 .
16A and 16B are views (a plan view and a side view, respectively) showing a base frame, a coarse motion stage, and the like of the substrate stage apparatus of FIG. 14 .
17A and 17B are views (a plan view and a side view, respectively) showing a non-contact holder, an auxiliary table, and the like of the substrate stage apparatus of FIG. 14 .
18A and 18B are views (a plan view and a side view, respectively) showing a substrate carrier etc. included in the substrate stage apparatus of FIG. 14 .
19A and 19B are views (a plan view and a side view, respectively) for explaining the operation during scan exposure of the substrate stage apparatus according to the second embodiment.
20(a) and 20(b) are diagrams (Part 1 and Part 2) for explaining the Y step operation of the substrate stage apparatus according to the second embodiment.
Fig. 21 is a diagram showing a substrate stage apparatus according to a modification (fourth modification) of the second embodiment.
22A and 22B are views (a plan view and a side view, respectively) showing a Y guide bar, a weight canceling device, and the like of the substrate stage device of FIG. 21 .
23(a) and 23(b) are views (a plan view and a side view, respectively) showing a base frame, a coarse motion stage, and the like included in the substrate stage apparatus of FIG. 21 .
24A and 24B are views (a plan view and a side view, respectively) showing a non-contact holder, an auxiliary table, and the like of the substrate stage apparatus of FIG. 21 .
25A and 25B are views (a plan view and a side view, respectively) showing a substrate carrier and the like included in the substrate stage apparatus of FIG. 21 .
Fig. 26(a) is a diagram for explaining the operation of the substrate stage apparatus according to the fourth modification at the time of discharging the substrate, and Fig. 26(b) is a cross-sectional view taken along line BB of Fig. 26(a) .
27 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to a third embodiment.
Fig. 28 is a plan view of a substrate stage apparatus and a substrate exchange apparatus included in the liquid crystal exposure apparatus of Fig. 27;
Fig. 29(a) is a plan view of the substrate stage apparatus, and Fig. 29(b) is a cross-sectional view taken along line 29b-29b of Fig. 29(a).
Fig. 30(a) is a plan view of the substrate exchange apparatus, and Fig. 30(b) is a cross-sectional view taken along line 30b-30b of Fig. 30(a).
31(a) and 31(b) are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 1), respectively.
32(a) and 32(b) are a top view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 2), respectively.
33(a) and 33(b) are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 3), respectively.
34(a) and 34(b) are a top view and a side view of a liquid crystal exposure apparatus for demonstrating the board|substrate exchange operation|movement (Part 4), respectively, respectively.
35(a) and 35(b) are a top view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 5), respectively.
36(a) and 36(b) are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 6), respectively.
37(a) and 37(b) are a top view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 7), respectively.
38(a) and 38(b) are a top view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 8), respectively.
39(a) and 39(b) are a top view and a side view of a liquid crystal exposure apparatus for demonstrating the board|substrate exchange operation|movement (Part 9), respectively, respectively.
40(a) and 40(b) are a top view and a side view of a liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 10), respectively.
41A and 41B are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 11), respectively.
42(a) and 42(b) are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 12), respectively.
43(a) and 43(b) are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 13), respectively.
44(a) and 44(b) are a top view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 14), respectively.
45(a) and 45(b) are a top view and a side view of a liquid crystal exposure apparatus for explaining the substrate exchange operation (Part 15), respectively.
46(a) and 46(b) are a plan view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (No. 16), respectively.
47(a) and 47(b) are a top view and a side view of the liquid crystal exposure apparatus for explaining the substrate exchange operation (the 17), respectively.
Fig. 48 is a diagram for explaining the third embodiment.
49(a) and 49(b) are diagrams (part 1) for explaining the fourth embodiment.
50(a) and 50(b) are diagrams (part 2) for explaining the fourth embodiment.
51(a) and 51(b) are diagrams (part 3) for explaining the fourth embodiment.
52(a) and 52(b) are diagrams (part 4) for explaining the fourth embodiment.
53(a) and 53(b) are diagrams (part 5) for explaining the fourth embodiment.
54(a) and 54(b) are diagrams (part 6) for explaining the fourth embodiment.
55(a) and 55(b) are diagrams (part 7) for explaining the fourth embodiment.
56(a) and 56(b) are diagrams (part 8) for explaining the fourth embodiment.
57(a) and 57(b) are diagrams for explaining a modified example of the fourth embodiment.
Fig. 58 is a diagram (Part 1) for explaining the fifth embodiment.
Fig. 59 is a diagram (part 2) for explaining the fifth embodiment.
Fig. 60 is a diagram (part 3) for explaining the fifth embodiment.
Fig. 61 is a diagram (part 4) for explaining the fifth embodiment.
Fig. 62 is a diagram (Part 5) for explaining the fifth embodiment.
Fig. 63 is a diagram (part 6) for explaining the fifth embodiment.
Fig. 64 is a diagram (part 7) for explaining the fifth embodiment.
Fig. 65 is a diagram (Part 8) for explaining the fifth embodiment.
66(a) and 66(b) are diagrams (part 1) for explaining the sixth embodiment.
67(a) and 67(b) are diagrams (part 2) for explaining the sixth embodiment.
68(a) and 68(b) are diagrams (part 3) for explaining the sixth embodiment.
69(a) and 69(b) are diagrams (part 4) for explaining the sixth embodiment.
70(a) and 70(b) are diagrams (part 5) for explaining the sixth embodiment.
Fig. 71 is a diagram (Part 1) for explaining the seventh embodiment.
Fig. 72 is a diagram (part 2) for explaining the seventh embodiment.
Fig. 73 is a diagram (part 3) for explaining the seventh embodiment.
Fig. 74 is a diagram (part 4) for explaining the seventh embodiment.
Figs. 75(a) to 75(c) are diagrams (part 5 to part 7) for explaining the seventh embodiment.
Fig. 76 is a diagram (part 1) for explaining the eighth embodiment.
Figs. 77(a) to 77(c) are diagrams (Part 2 to Part 4) for explaining the eighth embodiment.
Fig. 78 is a diagram (part 1) for explaining the ninth embodiment.
79(a) to 79(d) are diagrams (Part 2 to Part 5) for explaining the ninth embodiment.
Fig. 80 is a diagram (part 6) for explaining the ninth embodiment.
Fig. 81 is a diagram (part 7) for explaining the ninth embodiment.
Fig. 82 is a diagram (part 8) for explaining the ninth embodiment.
Fig. 83 is a diagram (part 9) for explaining the ninth embodiment.
84 is a diagram for explaining a modification of the ninth embodiment.
85(a) and 85(b) are diagrams (Part 1 and Part 2) for explaining the first modification.
86(a) and 86(b) are diagrams (Part 1 and Part 2) for explaining the second modification.
87(a) and 87(b) are diagrams (part 1 and part 2) for explaining the carrying-in operation of the substrate in the fourth embodiment, and FIGS. 87(c) and 87(d) are , are diagrams (Part 1 and Part 2) showing an example of the retaining pad shift prevention structure according to the second modification.
88(a) and 88(b) are diagrams (Part 1 and Part 2) for explaining the third modification.
89(a) to 89(c) are diagrams (Part 1 to Part 3) for explaining the fourth modification.
90(a) and 90(b) are views (Part 1 and Part 2) for explaining the fifth modification.
Fig. 91 is a diagram (part 1) for explaining a sixth modification.
92(a) and 92(b) are diagrams (Part 1 and Part 2) for explaining the seventh modification.
93(a) and 93(b) are diagrams (Part 1 and Part 2) for explaining the eighth modification.
94(a) to 94(c) are diagrams (Part 1 to Part 3) for explaining the ninth modification.
95 is a diagram for explaining a tenth modification.
96 is a diagram for explaining an eleventh modification.
97 is a diagram for explaining a twelfth modification.
98 is a diagram for explaining a thirteenth modification.
99 is a diagram for explaining a fourteenth modification.
Fig. 100 is a diagram for explaining a fifteenth modification.
101 is a diagram for explaining a sixteenth modification.
102(a) and 102(b) are diagrams (Part 2 and Part 3) for explaining the sixth modification.

《First embodiment》

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment is demonstrated using FIGS. 1-9(b).

Fig. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 uses, for example, a rectangular (rectangular) glass substrate P (hereinafter simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) etc. as an exposure target. It is an end-scan type projection exposure apparatus, a so-called scanner.

The liquid crystal exposure apparatus 10 includes an illumination system 12 , a mask stage 14 holding a mask M having a pattern such as a circuit pattern formed thereon, a projection optical system 16 , an apparatus body 18 , and a surface (in FIG. 1 ). It has a substrate stage device 20 holding a substrate P coated with a resist (sensitizer) on a surface facing the +Z side, a control system thereof, and the like. Hereinafter, the direction in which the mask M and the substrate P are scanned relative to the projection optical system 16 during exposure is set as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction and the X-axis and a direction orthogonal to the Y-axis will be described as the Z-axis direction. In addition, the rotation directions around the X axis, the Y axis, and the Z axis are described as θx, θy, and θz directions, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, US Patent No. 5,729,331. That is, the illumination system 12 transmits light emitted from an unillustrated light source (for example, a mercury lamp) through a reflector, a dichroic mirror, a shutter, a wavelength selective filter, various lenses, etc. which are not shown respectively, The mask M is irradiated as the illumination light (illumination light) IL for exposure. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm) (or the above-mentioned i-line, g-line, and h-line synthetic light) ) is used.

The mask stage 14 holds the mask M of the light transmission type. The main controller 50 (refer to FIG. 6) transmits the mask stage 14 (that is, the mask M) to the illumination system 12 via a mask stage drive system 52 (refer to FIG. 6) including, for example, a linear motor. ) (illumination light IL) with a predetermined long stroke in the X-axis direction (scan direction), and micro-drive in the Y-axis direction and the θz direction. The positional information in the horizontal plane of the mask stage 14 is calculated|required by the mask stage position measuring system 54 (refer FIG. 6) containing a laser interferometer, for example.

The projection optical system 16 is disposed below the mask stage 14 . The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in US Patent No. 6,552,775 specification and the like, and for example, a double-sided telesensor forming an upright image. It has multiple optical systems that are tricks. The optical axis AX of the illumination light IL projected from the projection optical system 16 to the substrate P is substantially parallel to the Z axis.

In the liquid crystal exposure apparatus 10, when the mask M located in the predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, it is projected by the illumination light IL which passed through the mask M A projection image (image of a partial pattern) of the pattern of the mask M in the illumination region is formed in the exposure region on the substrate P via the optical system 16 . Then, as the mask M moves relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure region (illumination light IL) in the scanning direction, the substrate ( Scanning exposure of one shot region on P) is performed, and the pattern (the entire pattern corresponding to the scan range of the mask M) formed on the mask M is transferred to the shot region. Here, the illumination region on the mask M and the exposure region (irradiation region of the illumination light) on the substrate P are optically conjugated to each other by the projection optical system 16 .

The apparatus main body 18 is a part which supports the said mask stage 14 and the projection optical system 16, and is provided on the floor F of a clean room via the some vibration isolator 18d. The apparatus main body 18 is configured, for example, in the same manner as the apparatus main body disclosed in the specification of US Patent Application Laid-Open No. 2008/0030702, and includes an upper stand portion 18a that supports the projection optical system 16 . (also referred to as an optical surface plate or the like), a pair of lower mount portions 18b (in Fig. 1, one of them is omitted because it overlaps in the paper depth direction; see Fig. 2), and a pair of middle mount portions 18c; have.

The substrate stage apparatus 20 is a part for high-precision positioning of the substrate P with respect to the projection optical system 16 (illumination light IL), and sets the substrate P in a horizontal plane (X-axis direction and Y-axis direction) While driving with a predetermined long stroke along The substrate stage device 20 includes a base frame 22 , a coarse motion stage 24 , a weight canceling device 26 , an X guide bar 28 , a substrate table 30 , a non-contact holder 32 , a pair of auxiliary A table 34, a substrate carrier 40, and the like are provided.

The base frame 22 is provided with a pair of X-beams 22a. The X-beam 22a is made of a YZ cross-sectional quadrangular member extending in the X-axis direction. A pair of X-beams 22a are arranged at predetermined intervals in the Y-axis direction, and are physically separated (vibrationally insulated) from the apparatus body 18 via a leg portion 22b on the floor ( It is installed on F). The pair of X-beams 22a and the leg portion 22b are integrally connected by a connecting member 22c, respectively.

The coarse motion stage 24 is a part for driving the board|substrate P with a long stroke in the X-axis direction, and is provided with a pair of X carriage 24a corresponding to the said pair of X beam 22a. . The X carriage 24a is formed in the YZ cross-section inverted L-shape, and is mounted on the corresponding X beam 22a via a plurality of mechanical linear guide devices 24c.

Each of the pair of X carriages 24a is driven by a main controller 50 (see FIG. 6) via an X linear actuator that is a part of a substrate table drive system 56 (see FIG. 6) for driving the substrate table 30. , synchronously driven with a predetermined long stroke (about 1-1.5 times the length of the substrate P in the X-axis direction) in the X-axis direction along the corresponding X-beam 22a. The type of the X linear actuator for driving the X carriage 24a can be appropriately changed, and in FIG. 2 , for example, a mover included in the X carriage 24a and a stator included in the corresponding X beam 22a are Although the included linear motor 24d is used, it is not limited to this, For example, it is also possible to use a feed screw (ball screw) device etc.

Moreover, as shown in FIG. 2, the coarse motion stage 24 has a pair of Y stator 62a. The Y stator 62a consists of a member extending in the Y-axis direction (refer to FIG. 1). One Y stator 62a is in the vicinity of the +X side end of the coarse movement stage 24, and the other Y stator 62a is in the vicinity of the -X side end of the coarse movement stage 24, each 1 It is erected on a pair of X carriages 24a (see FIG. 1 ). The function of the Y stator 62a will be described later.

The weight canceling device 26 is inserted between a pair of X carriages 24a included in the coarse motion stage 24 , and removes the weight of the system including the substrate table 30 and the non-contact holder 32 from below. are supporting About the detail of the weight canceling apparatus 26, since it is disclosed by the specification of US 2010/0018950, for example, description is abbreviate|omitted. The weight canceling device 26 is mechanically connected to the coarse motion stage 24 via a plurality of connecting devices 26a (also referred to as flexure devices) extending radially from the weight canceling device 26 , , it moves in the X-axis direction integrally with the coarse motion stage 24 by being pulled by the coarse motion stage 24 . In addition, although the weight canceling device 26 is connected to the coarse motion stage 24 via a connection device 26a extending radially from the weight canceling device 26, since it moves only in the X-axis direction It is good also as a structure connected to the coarse motion stage 24 by the connection device 26a extended in the X direction.

The X guide bar 28 is a part functioning as a surface plate when the weight canceling device 26 moves. The X guide bar 28 is made of a member extending in the X-axis direction, and is inserted between a pair of X-beams 22a included in the base frame 22 as shown in FIG. 1 , and the device body 18 ) is fixed on a pair of lower pedestals 18b. With respect to the Y-axis direction, the center of the X guide bar 28 substantially coincides with the center of the exposure area generated on the substrate P by the illumination light IL. The upper surface of the X guide bar 28 is set parallel to the XY plane (horizontal plane). The said weight canceling apparatus 26 is mounted on the X guide bar 28 in a non-contact state via the air bearing 26b, for example. When the coarse motion stage 24 moves on the base frame 22 in the X-axis direction, the weight canceling device 26 moves on the X guide bar 28 in the X-axis direction.

The board|substrate table 30 consists of a rectangular plate-shaped (or box-shaped) member whose longitudinal direction is the X-axis direction in planar view, and, as shown in FIG. 2, the center part is interposed through the spherical bearing device 26c It is supported in a non-contact manner by the weight canceling device 26 from below in a state capable of freely swinging with respect to the XY plane. Moreover, as shown in FIG. 1, a pair of auxiliary table 34 (not shown in FIG. 2) is connected to the board|substrate table 30. As shown in FIG. The function of the pair of auxiliary tables 34 will be described later.

Returning to Fig. 2, the substrate table 30 is a part of the substrate table drive system 56 (refer to Fig. 6), and includes a stator included in the coarse motion stage 24 and a mover included in the substrate table 30 itself. with respect to the coarse motion stage 24 by the linear motor 30a (for example, a voice coil motor) of It is appropriately micro-driven in the Z-tilt direction).

The substrate table 30 is mechanically connected to the coarse motion stage 24 via a plurality of connecting devices 30b (flexure devices) radially extending from the substrate table 30 . The connecting device 30b includes, for example, a ball joint, so as not to inhibit the relative movement of the substrate table 30 with respect to the coarse motion stage 24 in a minute stroke in the Z-tilt direction. Moreover, when the coarse motion stage 24 moves with a long stroke in the X-axis direction, it is pulled to the coarse motion stage 24 via the said some connection device 30b, and the coarse motion stage 24 and the board|substrate table 30 are carried out. ) moves in the X-axis direction integrally. In addition, since the board|substrate table 30 does not move in the Y-axis direction, it is not the connection device 30b which extends radially with respect to the coarse motion stage 24, but the some connection device 30b parallel to the X-axis direction. You may make it connected to the coarse motion stage 24 via

The non-contact holder 32 consists of a rectangular plate-shaped (or box-shaped) member whose longitudinal direction is the X-axis direction in planar view, and supports the board|substrate P from below on the upper surface. The non-contact holder 32 has a function to prevent sagging, wrinkles, etc. from occurring in the substrate P (planar correction). The non-contact holder 32 is fixed to the upper surface of the substrate table 30 , and moves with a long stroke in the X-axis direction integrally with the substrate table 30 , and minutely moves in the Z-tilt direction.

The length of each of the four sides in the upper surface (substrate support surface) of the non-contact holder 32 is set to be substantially equal to the length of each of the four sides of the substrate P (actually, slightly shorter). Accordingly, the non-contact holder 32 supports substantially the entirety of the substrate P from below, specifically, the exposure target region on the substrate P (a blank formed in the vicinity of the end portion of the substrate P). area excluding the area) can be supported from below.

A pressurized gas supply device and a vacuum suction device (not shown) provided outside the substrate stage device 20 are connected to the non-contact holder 32 via a piping member such as a tube, for example. Moreover, in the upper surface (substrate mounting surface) of the non-contact holder 32, a plurality of minute holes communicating with the piping member are formed. The non-contact holder 32 floats the substrate P by blowing pressurized gas (for example, compressed air) supplied from the pressurized gas supply device to the lower surface of the substrate P through (part of) the hole. . Moreover, the non-contact holder 32 uses together with the ejection of the said pressurized gas, and the air between the lower surface of the board|substrate P and the board|substrate support surface is sucked by the vacuum suction force supplied from the said vacuum suction device. Thereby, a load (preload) acts on the board|substrate P, and plane-correction is carried out along the upper surface of the non-contact holder 32. As shown in FIG. However, since the clearance gap is formed between the board|substrate P and the non-contact holder 32, the relative movement of the direction parallel to the horizontal plane of the board|substrate P and the non-contact holder 32 is not inhibited.

The substrate carrier 40 is a part that holds the substrate P, and holds the substrate P in three degrees of freedom in a horizontal plane (X-axis direction, Y-axis direction, and θz direction). The substrate carrier 40 is formed in a rectangular frame shape (frame shape) in a plan view, and holds a region (blank region) near an end (outer periphery) of the substrate P, and a non-contact holder ( 32) moves along the XY plane with respect to . Hereinafter, the detail of the substrate carrier 40 is demonstrated using FIG.

The substrate carrier 40 is provided with a pair of X frames 42x and a pair of Y frames 42y, as shown in FIG. 3 . The pair of X frames 42x are each made of a plate-like member extending in the X-axis direction, and are predetermined in the Y-axis direction (wider than the dimensions in the Y-axis direction of the substrate P and the non-contact holder 32) placed at intervals. In addition, the pair of Y frames 42y are each made of a flat member extending in the Y-axis direction, and have a predetermined dimension in the X-axis direction (the X-axis direction of the substrate P and the non-contact holder 32 ). wide) spaced apart.

The Y frame 42y on the +X side is connected to the lower surface in the vicinity of the end portion on the +X side of each of the pair of X frames 42x via a spacer 42a. Similarly, the -X side Y frame 42y is connected to the lower surface in the vicinity of the -X side edge part of each pair of X frame 42x via the spacer 42a. Accordingly, the height position (position in the Z-axis direction) of the upper surfaces of the pair of Y frames 42y is set lower (on the -Z side) than the height positions of the lower surfaces of the pair of X frames 42x.

Moreover, a pair of suction pads 44 are spaced apart in the X-axis direction, and are attached to the lower surface of each of a pair of X flame|frames 42x. Accordingly, the substrate carrier 40 has, for example, four suction pads 44 in total. The suction pad 44 is arranged to protrude from the surface where the pair of X frames 42x face each other in the mutually opposing direction (inside of the substrate carrier 40 ). For example, the four suction pads 44 support the vicinity of the four corners (blank area) of the substrate P from below in a state where the substrate P is inserted between the pair of X frames 42x. A position in the horizontal plane (a mounting position with respect to the X frame 42x) is set so as to be able to do so. For example, a vacuum suction device (not shown) is connected to each of the four suction pads 44 . The suction pad 44 adsorbs and holds the lower surface of the board|substrate P with the vacuum suction force supplied from the said vacuum suction device. In addition, the number of the suction pads 44 is not limited to this, A change is possible suitably.

Here, as shown in FIG. 2, in the state in which the non-contact holder 32 and the board|substrate carrier 40 were combined, the board|substrate P is four-corner vicinity by the suction pad 44 which the board|substrate carrier 40 has. While being supported (adsorbed and held) from below, substantially the entire surface including the central portion is supported by the non-contact holder 32 in a non-contact manner from below. In this state, the +X side and -X side ends of the substrate P protrude from the +X side and -X side ends of the non-contact holder 32, respectively, and, for example, the four suction pads 44 ) (partly not shown in FIG. 2) adsorbs and holds the part which protruded from the non-contact holder 32 of the board|substrate P. That is, the attachment position with respect to the X frame 42x is set so that the suction pad 44 may be located outside the non-contact holder 32 with respect to the X-axis direction.

Next, the substrate carrier drive system 60 (refer FIG. 6) for driving the substrate carrier 40 is demonstrated. In the present embodiment, the main controller 50 (see FIG. 6 ) drives the substrate carrier 40 with respect to the non-contact holder 32 with a long stroke in the Y-axis direction via the substrate carrier drive system 60 . together with a micro-drive in the three-degree-of-freedom direction in the horizontal plane. Moreover, the main controller 50 integrates the non-contact holder 32 and the substrate carrier 40 in the X-axis direction via the above-described substrate table driving system 56 (refer to FIG. 6 ) and the substrate carrier driving system 60 . Operates (synchronically)

As shown in FIG. 2, the board|substrate carrier drive system 60 cooperates with the Y stator 62a which the coarse motion stage 24 has, and the Y stator 62a, and generates the thrust of the Y-axis direction. A pair of Y linear actuators 62 including a mover 62b is provided. As shown in FIG. 4 , a Y stator 64a and an X stator 66a are attached to the Y mover 62b of each of the pair of Y linear actuators 62 .

The Y stator 64a cooperates with the Y mover 64b mounted on the substrate carrier 40 (the lower surface of the Y frame 42y) to provide a Y-axis direction thrust to the substrate carrier 40. Y voice coil The motor 64 is constituted. In addition, the X stator 66a cooperates with the X mover 66b mounted on the substrate carrier 40 (the lower surface of the Y frame 42y) to provide the substrate carrier 40 with a thrust in the X-axis direction. A voice coil motor 66 is constituted. In this way, the substrate stage apparatus 20 has one Y voice coil motor 64 and one X voice coil motor 66 respectively on the +X side and the -X side of the substrate carrier 40 .

Here, on the +X side and the -X side of the substrate carrier 40, the Y voice coil motor 64 and the X voice coil motor 66 are respectively arranged point-symmetrically around the center of gravity position of the substrate P. has been Therefore, by using the X voice coil motor 66 on the +X side of the substrate carrier 40 and the X voice coil motor 66 on the -X side of the substrate carrier 40, the X-axis direction is applied to the substrate carrier 40 . When thrust is applied to the substrate P, the same effect as when the thrust is applied parallel to the X-axis direction at the position of the center of gravity of the substrate P is obtained, that is, the moment in the θz direction on the substrate carrier 40 (substrate P) It is possible to inhibit the action of In addition, as for the pair of Y voice coil motors 64, since they are disposed with the center of gravity (line) of the substrate P in the X-axis direction interposed therebetween, the moment in the θz direction is applied to the substrate carrier 40 . does not work

The substrate carrier 40 is transferred to the coarse motion stage 24 by the main controller 50 (refer to FIG. 6 ) via the pair of Y voice coil motors 64 and the pair of X voice coil motors 66 . ) (that is, the non-contact holder 32) is micro-driven in the three-degree-of-freedom direction in the horizontal plane. Moreover, as for the main controller 50, when the coarse motion stage 24 (that is, the non-contact holder 32) moves with a long stroke in the X-axis direction, the non-contact holder 32 and the substrate carrier 40 are integrally X-axis. Thrust in the X-axis direction is applied to the substrate carrier 40 using the pair of X voice coil motors 66 so as to move in the direction with a long stroke.

Moreover, the main controller 50 (refer FIG. 6) uses the said pair of Y linear actuators 62 and the pair of Y voice coil motors 64, The board|substrate carrier 40 is held by the non-contact holder 32. ) relative to the Y axis in a long stroke. Specifically, the main controller 50 moves the Y mover 62b of the pair of Y linear actuators 62 in the Y-axis direction, while the Y stator 64a attached to the Y mover 62b. ) to apply a thrust in the Y-axis direction to the substrate carrier 40 using a Y voice coil motor 64 including Thereby, the substrate carrier 40 becomes independent (separated) from the non-contact holder 32, and moves with a long stroke in the Y-axis direction.

As described above, in the substrate stage apparatus 20 of the present embodiment, the substrate carrier 40 holding the substrate P is integrally mounted with the non-contact holder 32 in the X-axis (scanning) direction. It moves with a stroke, and moves with a long stroke independently of the non-contact holder 32 with respect to the Y-axis direction. Moreover, although the Z position of the suction pad 44 and the Z position of the non-contact holder 32 partially overlap so that FIG. 2 may show, the board|substrate carrier 40 has a long stroke with respect to the non-contact holder 32. Since the relative movement is only in the Y-axis direction, there is no fear that the suction pad 44 and the non-contact holder 32 contact each other.

Further, when the substrate table 30 (that is, the non-contact holder 32) is driven in the Z-tilt direction, the substrate P plane-corrected by the non-contact holder 32 is moved together with the non-contact holder 32 in the Z-tilt direction. In order to change an attitude|position, the attitude|position of the board|substrate carrier 40 which adsorb|sucks hold|maintains the board|substrate P changes in a Z tilt direction with the board|substrate P. Further, the posture of the substrate carrier 40 may not change due to the elastic deformation of the suction pad 44 .

1 , the pair of auxiliary tables 34 cooperates with the non-contact holder 32 when the substrate carrier 40 is separated from the non-contact holder 32 and relatively moves in the Y-axis direction, and the substrate carrier ( 40) is an apparatus for supporting the lower surface of the substrate P held. As described above, the substrate carrier 40 is moved relative to the non-contact holder 32 in the state holding the substrate P. For example, the substrate carrier 40 is moved from the state shown in FIG. 1 . If it moves in +Y direction, the edge part vicinity of the +Y side of the board|substrate P will stop being supported by the non-contact holder 32. As shown in FIG. For this reason, in the substrate stage apparatus 20, in order to suppress bending due to its own weight of a portion of the substrate P not supported by the non-contact holder 32, the substrate P is placed on a pair of auxiliary tables ( 34) is supported from below using one side of A pair of auxiliary tables 34 have substantially the same structure except for the point which is arrange|positioned symmetrically on the paper surface.

The auxiliary table 34 has the some air floating unit 36, as shown in FIG. Further, in the present embodiment, the air floating unit 36 is formed in the shape of a rod extending in the Y-axis direction, and a plurality of air floating units 36 are arranged at predetermined intervals in the X-axis direction, but the substrate ( The shape, number, arrangement, etc. will not be specifically limited as long as the curvature resulting from the self weight of P) can be suppressed. The some air floating unit 36 is supported from below by the arm-shaped support member 36a which protruded from the side surface of the board|substrate table 30, as shown in FIG. A minute gap is formed between the plurality of air floating units 36 and the non-contact holder 32 .

The height position of the upper surface of the air floating unit 36 is set substantially equal to the height position of the upper surface of the non-contact holder 32 (or slightly lower). The air floating unit 36 supports the board|substrate P non-contact by blowing out gas (for example, air) with respect to the lower surface of the board|substrate P from the upper surface. Moreover, although the above-mentioned non-contact holder 32 made the preload act on the board|substrate P, and performed the plane correction of the board|substrate P, the air floating unit 36 can suppress the curvature of the board|substrate P. Since it just needs to exist, it is sufficient only to supply gas to the lower surface of the board|substrate P, and it is not necessary to manage in particular the height position of the board|substrate P on the air floating unit 36.

Next, the board|substrate position measurement system for measuring the position information of the 6-degree-of-freedom direction of the board|substrate P is demonstrated. The substrate position measurement system is for obtaining position information in a direction intersecting the horizontal plane of the substrate table 30 (position information in the Z-axis direction, rotation amount information in the θx and θy directions; hereinafter referred to as “Z tilt position information”). For obtaining the Z tilt position measurement system 58 (refer to FIG. 6) and position information in the XY plane of the substrate carrier 40 (position information in the X-axis direction and the Y-axis direction, and rotation amount information in the θz direction) and an in-horizontal position measurement system 70 (see FIG. 6 ).

A Z tilt position measuring system 58 (refer to FIG. 6) is, as shown in FIG. 2, as a lower surface of the substrate table 30, a plurality of (at least three) lasers fixed around the spherical bearing device 26c. and a displacement meter 58a. The laser displacement meter 58a irradiates measurement light with respect to the target 58b fixed to the case of the weight canceling device 26, and receives the reflected light, so that the substrate table 30 at the irradiation point of the measurement light Displacement amount information in the Z-axis direction is supplied to the main controller 50 (refer to FIG. 6 ). For example, the at least three laser displacement meters 58a are arranged at three points that are not on the same straight line (for example, positions corresponding to vertices of an equilateral triangle), and the main controller 50 includes the at least three Based on the output of the laser displacement meter 58a, the Z tilt position information of the substrate table 30 (that is, the substrate P) is obtained. Since the weight canceling device 26 moves along the upper surface (horizontal plane) of the X guide bar 28 , the main controller 50 moves the substrate table 30 regardless of the X position of the substrate table 30 . Changes in posture with respect to the horizontal plane can be measured.

The in-horizontal position measurement system 70 (refer FIG. 6) has a pair of head units 72, as shown in FIG. One head unit 72 is arranged on the -Y side of the projection optical system 16 , and the other head unit 72 is arranged on the +Y side of the projection optical system 16 .

Each of the pair of head units 72 obtains positional information in the horizontal plane of the substrate P using the reflective diffraction grating that the substrate carrier 40 has. Corresponding to a pair of head units 72, on the upper surface of each pair of X frames 42x of the substrate carrier 40, as shown in FIG. 3, a plurality (in FIG. 3, for example, 6 sheets) of the scale plate 46 is affixed. The scale plate 46 consists of a planar view strip|belt-shaped member extending in the X-axis direction. The length in the X-axis direction of the scale plate 46 is shorter than the length in the X-axis direction of the X frame 42x, and the plurality of scale plates 46 are spaced apart from each other at a predetermined interval in the X-axis direction. are arranged.

Fig. 5 shows an X frame 42x on the -Y side and a head unit 72 corresponding thereto. An X scale 48x and a Y scale 48y are formed on each of the plurality of scale plates 46 fixed on the X frame 42x. The X scale 48x is formed in a half region on the -Y side of the scale plate 46 , and the Y scale 48y is formed in a half region on the +Y side of the scale plate 46 . The X scale 48x has a reflective X diffraction grating, and the Y scale 48y has a reflective Y diffraction grating. 5, the spacing (pitch) between a plurality of grid lines forming the X scale 48x and Y scale 48y is shown to be wider than in reality for ease of understanding.

As shown in FIG. 4, the head unit 72 is a Y-linear actuator 74, and the Y-linear actuator 74 makes a predetermined stroke in the Y-axis direction with respect to the projection optical system 16 (refer to FIG. 1). A Y slider 76 driven, and a plurality of measurement heads (X encoder heads 78x, 80x, Y encoder heads 78y, 80y) fixed to the Y slider 76 are provided. 1 and 4, the pair of head units 72 are configured in the same manner except for being configured symmetrically in the paper. Also, in Figs. 1 and 4, a plurality of scale plates 46 fixed on each of the pair of X frames 42x are configured symmetrically.

The Y linear actuator 74 is being fixed to the lower surface of the pedestal part 18a which the apparatus main body 18 has. The Y linear actuator 74 includes a linear guide for guiding the Y slider 76 straight in the Y-axis direction, and a drive system for applying a thrust to the Y slider 76 . Although the kind of linear guide is not specifically limited, An air bearing with high repeatability is preferable. Moreover, the kind of drive system is not specifically limited, either, For example, a linear motor, a belt (or wire) drive apparatus, etc. can be used.

The Y linear actuator 74 is controlled by the main controller 50 (refer to FIG. 6 ). The stroke amount in the Y-axis direction of the Y slider 76 by the Y linear actuator 74 is set equal to the stroke amount in the Y-axis direction of the substrate P (substrate carrier 40).

The head unit 72 includes a pair of X encoder heads 78x (hereinafter referred to as “X head 78x”), and a pair of Y encoder heads 78y (hereinafter referred to as “Y”, as shown in FIG. 5 ). head 78y"). A pair of X-heads 78x and a pair of Y-heads 78y are respectively spaced apart and arrange|positioned by a predetermined distance in the X-axis direction.

The X head 78x, and the Y head 78y are encoder heads of a so-called diffractive interference scheme, as disclosed, for example, in US Patent Application Publication No. 2008/0094592, and the corresponding scale (X scale 48x) , Y scale 48y) by irradiating the measurement beam in the downward direction (-Z direction), and receiving the beam (return light) from the scale, the displacement amount information of the substrate carrier 40 is transferred to the main controller 50 (See Fig. 6) is supplied to.

That is, in the in-horizontal position measuring system 70 (refer to FIG. 6 ), the total of the pair of head units 72 is, for example, four X heads 78x and opposite to the X heads 78x. For example, four X linear encoder systems for calculating|requiring the positional information of the X-axis direction of the board|substrate carrier 40 by the X scale 48x to do are comprised. Similarly, in the total of the pair of head units 72, for example, four Y heads 78y and a Y scale 48y opposed to the Y heads 78y, the substrate carrier 40 For example, four Y linear encoder systems are configured to obtain positional information in the Y-axis direction.

Here, the distance in the X-axis direction of each of the pair of X heads 78x and the pair of Y heads 78y included in the head unit 72 is set to be wider than the distance between the adjacent scale plates 46 . has been Accordingly, in the X encoder system and the Y encoder system, regardless of the position of the substrate carrier 40 in the X-axis direction, at least one of the pair of X heads 78x always faces the X scale 48x while , at least one of the pair of Y heads 78y always faces the Y scale 48y.

Specifically, in the main controller 50 (refer to FIG. 6 ), when a pair of X heads 78x are all opposed to the X scale 48x, the average value of the outputs of the pair of X heads 78x X position information of the substrate carrier 40 is obtained based on In addition, in the state where only one of the pair of X heads 78x faces the X scale 48x, the main controller 50 is configured to operate the substrate carrier 40 based on only the output of the one X head 78x. Get the location information of X. Accordingly, the X encoder system can supply the position information of the substrate carrier 40 to the main controller 50 without interruption. The same is true for the Y encoder system.

Here, as described above, since the substrate carrier 40 of the present embodiment is movable in a predetermined long stroke also in the Y-axis direction, the main controller 50 (refer to FIG. 6 ) has an X head 78x . The slider 76 (refer to FIG. 4) is driven in the Y-axis direction via the Y linear actuator 74 (refer to FIG. 4) so as to follow the substrate carrier 40. The main controller 50 combines the displacement amount (position information) in the Y-axis direction of the Y slider 76 (that is, each head 78x, 78y) and the output from each head 78x, 78y, and synthesizes the substrate The position information in the horizontal plane of the carrier 40 is obtained.

Information on the position (displacement amount) in the horizontal plane of the Y slider 76 (refer to Fig. 4) is obtained by an encoder system having the same measurement accuracy as the encoder system using the X head 78x and the Y head 78y. As can be seen from Figs. 4 and 5, the Y slider 76 includes a pair of X encoder heads 80x (hereinafter referred to as “X heads 80x”), and a pair of Y encoder heads 80y. ) (hereinafter referred to as "Y head 80y"). The pair of X heads 80x and the pair of Y heads 80y are respectively arranged to be spaced apart from each other by a predetermined distance in the Y-axis direction.

The main controller 50 (see FIG. 6 ) uses a plurality of scale plates 82 fixed to the lower surface of the upper stand 18a (see FIG. 1 , respectively) of the apparatus main body 18 , a Y slider 76 . Find the position information in the horizontal plane of The scale plate 82 is made of a band-shaped member in plan view extending in the Y-axis direction. In the present embodiment, above each of the pair of head units 72 , for example, two scale plates 82 are arranged at predetermined intervals in the Y-axis direction (separated from each other).

As shown in FIG. 5 , in the region on the +X side of the lower surface of the scale plate 82, an X scale 84x is formed to face the pair of X heads 80x, and the scale plate 82 A Y scale 84y is formed in a region on the -X side of the lower surface of , opposite to the pair of Y heads 80y. The X scale 84x and Y scale 84y are light reflection type diffraction gratings having substantially the same configuration as the X scale 48x and Y scale 48y formed on the scale plate 46 described above. Further, the X-head 80x and Y-head 80y are also the encoder heads of the diffractive interference system having the same configuration as the above-described X-head 78x and Y-head 78y (downward head).

A pair of X heads 80x and a pair of Y heads 80y irradiate measurement beams in an upward direction (+Z direction) with respect to the corresponding scales (X scale 84x, Y scale 84y). Then, by receiving the beam from the scale, the displacement amount information in the horizontal plane of the Y slider 76 (refer to FIG. 4) is supplied to the main controller 50 (refer to FIG. 6). An interval in the Y-axis direction of each of the pair of X heads 80x and the pair of Y heads 80y is set to be wider than the interval between adjacent scale plates 82 . As a result, regardless of the position of the Y slider 76 in the Y-axis direction, at least one of the pair of X heads 80x always faces the X scale 84x, and at least one of the pair of Y heads 80y At least one always opposes the Y scale 84y. Therefore, it is possible to supply the position information of the Y slider 76 to the main controller 50 (refer to Fig. 6) without interruption.

FIG. 6 is a block diagram showing the input/output relationship of the main controller 50 which centrally comprises the control system of the liquid crystal exposure apparatus 10 (refer to FIG. 1 ) and controls each of the constituent units. The main controller 50 includes a workstation (or a microcomputer) and the like, and comprehensively controls each component of the liquid crystal exposure apparatus 10 .

In the liquid crystal exposure apparatus 10 (refer to FIG. 1) configured as described above, under the control of the main controller 50 (refer to FIG. 6), by a mask loader (not shown) on the mask stage 14 While the mask M is loaded, the substrate P is loaded onto the substrate stage apparatus 20 (the substrate carrier 40 and the non-contact holder 32) by a substrate loader (not shown). do. Then, by the main controller 50, alignment measurement using an alignment detection system (not shown) and focus mapping using an autofocus sensor (plane position measurement system of the substrate P) (not shown) are executed, and the alignment is performed. After completion of measurement and focus mapping, the exposure operation of the step-and-scan method is sequentially performed on the plurality of shot regions set on the substrate P.

Next, an example of the operation|movement of the board|substrate stage apparatus 20 at the time of exposure operation|movement is demonstrated using FIG.7(a) - FIG.9(b). In the following description, a case in which four shot regions are set on one substrate P (so-called four-sided acquisition) will be described, but the number of shot regions set on one substrate P, and Arrangement can be changed suitably. In addition, in this embodiment, an exposure process is demonstrated as what is implemented from the 1st shot area|region S1 set to the -Y side and the +X side of the board|substrate P as an example. In addition, in FIG.7(a) - FIG.9(b), a part of the element which the board|substrate stage apparatus 20 has is abbreviate|omitted in order to avoid confusion of drawings.

7(a) and 7(b) are a plan view and a front view of the substrate stage apparatus 20 in a state in which the alignment operation and the like have been completed, and the preparation for the exposure operation for the first shot region S1 is completed. each is shown. In the substrate stage device 20, as shown in FIG. The edge of the +X side of the 1st shot area|region S1 rather than the area|region IA (however, in the state shown to Fig.7 (a), the illumination light IL has not yet been irradiated with respect to the board|substrate P) Positioning of the board|substrate P is made based on the output of the in-horizontal position measurement system 70 (refer FIG. 6) so that it may be located slightly on the -X side.

Moreover, since the center of the exposure area IA and the center of the X guide bar 28 (that is, the non-contact holder 32) approximately coincide with respect to the Y-axis direction, the substrate held by the substrate carrier 40 The vicinity of the end of (P) on the +Y side protrudes from the non-contact holder 32 . The board|substrate P is supported from below by the auxiliary table 34 whose protruding part is arrange|positioned at the +Y side of the non-contact holder 32. As shown in FIG. At this time, plane correction by the non-contact holder 32 is not performed in the vicinity of the end of the substrate P on the +Y side, but plane correction is performed in the region including the first shot region S1 to be exposed. Since the applied state is maintained, there is no influence on the exposure accuracy.

Next, from the state shown in Figs. 7(a) and 7(b), in synchronization with the mask M (see Fig. 1), as shown in Figs. 8(a) and 8(b), the substrate carrier ( 40) and the non-contact holder 32 are integrally (synchronously) driven (accelerated) in the +X direction on the X guide bar 28 based on the output of the in-horizontal position measuring system 70 (see Fig. 6) , constant speed drive, and deceleration) (refer to the black arrow in Fig. 8(a)). While the substrate carrier 40 and the non-contact holder 32 are driven at constant velocity in the X-axis direction, on the substrate P, the illumination light IL passing through the mask M (see FIG. 1 ) and the projection optical system 16 ( 8(b) respectively) is irradiated, whereby the mask pattern of the mask M is transferred to the first shot region S1. At this time, according to the result of alignment measurement, the substrate carrier 40 is properly driven with respect to the non-contact holder 32 in the three-degree-of-freedom direction in the horizontal plane, and the non-contact holder 32 is moved according to the result of the focus mapping. It is properly micro-driven in the Z-tilt direction.

Here, in the in-horizontal position measuring system 70 (see Fig. 6), when the substrate carrier 40 and the non-contact holder 32 are driven in the X-axis direction (+X direction in Fig. 8(a)), 1 The Y slider 76 (refer to Fig. 4, respectively) of each of the pair of head units 72 is in a stationary state (strictly, however, it is not necessary for the head unit 72 to be stationary, and the head unit 72 has At least a part of the head may be opposite to the scale plate 46 in the Y-axis direction).

When the transfer of the mask pattern to the first shot region S1 on the substrate P is completed, in the substrate stage apparatus 20, as shown in FIGS. 9(a) and 9(b), the first shot region For the exposure operation to the second shot region S2 set on the +Y side of S1, the substrate carrier 40 is moved a predetermined distance in the -Y direction with respect to the non-contact holder 32 (the width direction of the substrate P) distance of approximately half of the dimension), and driven (Y-step driving) based on the output of the in-horizontal position measuring system 70 (refer to FIG. 6 ) (refer to the black arrow in FIG. 9(a) ). Auxiliary table 34 arranged on the -Y side of the non-contact holder 32 in the vicinity of the -Y side end of the substrate P held by the substrate carrier 40 by the Y step operation of the substrate carrier 40 . supported from below.

In addition, in the in-horizontal position measurement system 70 (see Fig. 6), when the substrate carrier 40 is driven in the Y-axis direction, the Y slider 76 of each of the pair of head units 72 ( 4 ) is driven in the Y-axis direction in synchronization with the substrate carrier 40 (however, the speed does not necessarily coincide with each other).

Hereinafter, although not shown in figure, in synchronization with the mask M (refer FIG. 1), the substrate carrier 40 and the non-contact holder 32 are driven in the -X direction, whereby the scanning exposure with respect to the 2nd shot area|region S2 is carried out is carried out Moreover, the constant velocity movement to the X-axis direction of the substrate carrier 40 and the non-contact holder 32 synchronized with the Y step operation|movement of the substrate carrier 40 and the mask M is repeated suitably, and on the board|substrate P Scanning exposure operations for all the set shot regions are sequentially performed.

According to the substrate stage apparatus 20 which the liquid crystal exposure apparatus 10 which concerns on this 1st Embodiment demonstrated above has, when high-precision positioning within the XY plane of the board|substrate P is performed, the outer periphery of the board|substrate P Since the frame-shaped substrate carrier 40 holding only the edge portion is driven in the three-degree-of-freedom direction in the horizontal plane, for example, the substrate holder which adsorbs and holds the entire lower surface of the substrate P is driven in the three-degree-of-freedom direction in the horizontal plane. Compared with the case where high-precision positioning of the board|substrate P is performed, since a drive object (in this embodiment, the board|substrate carrier 40) is lightweight, position controllability improves. Moreover, the actuator for a drive (in this embodiment, the Y voice coil motor 64, the X voice coil motor 66) can be reduced in size.

Moreover, since the in-horizontal position measuring system 70 for obtaining the positional information in the XY plane of the board|substrate P includes an encoder system, the influence of air fluctuation can be reduced compared with the conventional interferometer system, for example. . Therefore, the positioning accuracy of the board|substrate P improves. Further, since the influence of air fluctuations is small, partial air conditioning equipment essential when using the conventional interferometer system can be omitted, and the cost can be reduced.

In addition, the structure demonstrated in this 1st Embodiment is an example, and a deformation|transformation is possible as appropriate. For example, in the substrate carrier 40A according to the first modification shown in FIGS. 10(a) and 10(b), on the outer surface of each of the pair of X frames 42x, an auxiliary plate member ( 42b) is connected. As shown in FIG.10(b), the plate member 42b is arrange|positioned substantially parallel to the XY plane, and the lower surface opposes the upper surface of the air floating unit 36 via a predetermined clearance gap. The some air floating unit 36 makes the force (lift force) of +Z direction (gravity direction upper direction) act on the board|substrate carrier 40A by blowing gas with respect to the lower surface of the plate member 42b. In the substrate carrier 40A according to the first modified example, since the plate member 42b is always supported by the plurality of air floating units 36 from below, if the non-contact holder 32 and the plurality of air floating units 36 ) between the X frame 42x and the non-contact holder ( 32) (or the air floating unit 36) can be prevented from contacting.

Moreover, like the board|substrate stage apparatus 120 which concerns on the 2nd modified example shown in FIG. 11, while the reference|standard indicator plate 144 is attached to the board|substrate carrier 140, for example, the mark measurement sensor is attached to the board|substrate table 30. (132) may be attached. In the reference index plate 144 , as shown in FIG. 12A , a plurality of reference marks 146 are formed while being spaced apart from each other in the Y-axis direction. The reference indicator plate 144 is disposed on the -X side of the substrate carrier 140 such that the Z positions of the plurality of reference marks 146 are substantially equal to the Z positions of the surface of the substrate P (see FIG. 11 ). It is fixed to the upper surface of the Y frame 142y via a volume raising member 148. Returning to FIG. 11 , the plurality of mark measurement sensors 132 are planar view T-shaped members 134 (refer to FIG. 12(b)) formed by protruding from the -X side side surface of the substrate table 30. ) is mounted on The plurality of mark measurement sensors 132 correspond to the plurality of reference marks 146 (that is, overlap with the plurality of reference marks 146 in the vertical direction) as shown in FIG. They are spaced apart from each other in the direction.

In this second modification, for example, by using a plurality of reference marks 146 and a plurality of corresponding mark measurement sensors 132 , the optical properties of the projection optical system 16 (see FIG. 1 ) (for example, scaling, shifting, rotation, etc.) is performed. Regarding the calibration method, for example, since it is substantially the same as the calibration method disclosed in Unexamined-Japanese-Patent No. 2006-330534, description is abbreviate|omitted. In this second modification, since the substrate table 30 mechanically separated with respect to the substrate carrier 140 having the fiducial mark 146 has the mark measurement sensor 132, the wiring is in the substrate carrier 140 itself. etc. are unnecessary, and the weight of the substrate carrier 140 can be reduced.

Moreover, the Y frame 142y of the substrate carrier 140 which concerns on this 2nd modification is formed with a wider width compared with the said 1st Embodiment. And, as shown in Fig. 12(b), on each of the upper surface of the flat member 134 and the upper surface of the flat member 136 formed by protruding from the side surface on the +X side of the substrate table 30, Y Two air bearings 138 spaced apart in the axial direction, for example, are mounted. As shown in FIG. 11 , the +X side, for example, two air bearings 138 oppose the lower surface of the Y frame 142y on the +X side of the substrate carrier 140, and on the -X side, For example, the two air bearings 138 are opposed to the lower surface of the Y frame 142y on the -X side of the substrate carrier 140 . The air bearing 138 supports the substrate carrier 140 in a non-contact manner through a predetermined gap by blowing a pressurized gas to the lower surface of the opposing Y frame 142y. Thereby, the curvature of the substrate carrier 140 is suppressed. In addition, the air bearing 138 may be attached to the board|substrate carrier 140 side so that it may oppose the upper surface of the said plate-shaped member 134,136. Moreover, instead of the air bearing 138, for example, the substrate carrier 140 may be magnetically levitated using a magnet, or a buoyancy force may be applied using an actuator such as a voice coil motor.

Moreover, like the board|substrate stage apparatus 220 which concerns on the 3rd modified example shown to FIG.13(a) and FIG.13(b), the Y linear actuator 62, the Y voice coil motor 64, and the X voice coil motor The Z position of (66) may be set to be the same as that of the substrate carrier (40A). That is, in the substrate stage apparatus 220 , the Y mover 64b of the Y voice coil motor 64 and the X movement of the X voice coil motor 66 on the side surface of the Y frame 42y of the substrate carrier 40A The ruler 66b is fixed. In addition, a Y linear actuator for driving the Y stator 64a of the Y voice coil motor 64 and the Y mover 62b to which the X stator 66a of the X voice coil motor 66 is mounted in the Y axis direction. The Y stator 62a of (62) is mounted on the coarse motion stage 224 via the support|pillar 62c so that it may become the Z position of the substrate carrier 40A.

Moreover, the substrate carrier 40A of this 3rd modification is supported from below by the some air floating unit 36 similarly to the said 1st modification (refer FIG.10(a) and FIG.10(b)). It has a pair of auxiliary plate members 42b used. Moreover, as shown in FIG.13(b), similarly to the said 2nd modified example (refer FIGS. 11-12(b)), from each side surface of the -X side and +X side of the substrate table 30, Flat members 234 and 236 protrude, and on the members 234 and 236, air floating units 238 extending in the Y-axis direction, respectively, are fixed. The height position of the upper surface of the air floating unit 238 is set to a position lower than the height position of the upper surface of the air floating unit 36 . As for the substrate carrier 40A, the Y frame 42y is always supported by the air floating unit 238 in a non-contact manner from below (regardless of the position in the Y-axis direction). In other words, the substrate carrier 40A is mounted on the pair of air floating units 238 . Thereby, the curvature of 40A of substrate carriers is suppressed.

《Second Embodiment》

Next, the liquid crystal exposure apparatus which concerns on 2nd Embodiment is demonstrated using FIG.14-20(b). Since the configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration of the substrate stage device 420 is different, only the differences will be described below, and the first embodiment will be described. Elements having the same configuration and function as those in the form are denoted by the same reference numerals as in the first embodiment, and description thereof is omitted.

In the substrate stage apparatus 20 (refer to Fig. 1, etc.) of the first embodiment, the substrate carrier 40 holding the substrate P has a long stroke integrally with the non-contact holder 32 with respect to the scan direction. In the substrate stage apparatus 420 of the second embodiment, the substrate stage device 420 of the second embodiment is different from the first embodiment, while moving to and moving in a long stroke while being separated from the non-contact holder 32 with respect to the non-scan direction. Conversely, the substrate carrier 440 holding the substrate P moves in a long stroke integrally with the non-contact holder 32 with respect to the non-scan direction, and is separated from the non-contact holder 32 with respect to the scan direction. It is different in that it moves with a long stroke. That is, the substrate stage device 420 according to the second embodiment is configured as if the substrate stage device 20 according to the first embodiment was rotated around the Z axis, for example, by 90°. . In addition, the longitudinal direction of the board|substrate P becomes substantially parallel to the X axis similarly to the said 1st Embodiment.

Hereinafter, the detail of the substrate stage apparatus 420 is demonstrated. As shown in FIG. 14 , the substrate stage device 420 includes a base frame 422 , a coarse motion stage 424 , a weight canceling device 26 (not shown in FIG. 14 . Refer to FIG. 15A ), Y Guide bar 428 (not shown in Fig. 14. See Fig. 15(a) etc.), substrate table 30 (not shown in Fig. 14. See Fig. 17(a) etc.), non-contact holder 32, one pair of an auxiliary table 434 , a substrate carrier 440 , and the like. The base frame 422, the coarse motion stage 424, the Y guide bar 428, a pair of auxiliary tables 434, and the substrate carrier 440 are the base frames 22 in the first embodiment, respectively. , the coarse motion stage 24, the X guide bar 28, a pair of auxiliary tables 34, and the substrate carrier 40 (refer to Figs. 1 and 2) are members that function in the same way, so that they will be briefly described below. . In addition, the weight canceling apparatus 26, the board|substrate table 30, and the non-contact holder 32 are each substantially the same as the said 1st Embodiment, respectively.

15(a) and 15(b), in the second embodiment, a lower mount 418b which is a part of the apparatus main body 418 provided on the floor F via the vibration isolator 18d. ) is made of one plate-shaped member, and the Y guide bar 428 is fixed to the upper surface of the lower mount 418b. On the Y guide bar 428 , a weight canceling device 26 is mounted. Moreover, as shown to Fig.16 (a) and Fig.16 (b), the base frame 422 has a pair of Y beams 422a provided on the floor F via the leg part 422b, There is, the coarse motion stage 424 is mounted on the base frame 422 so as to be movable with a predetermined long stroke in the Y-axis direction. In this 2nd Embodiment, the coarse motion stage 424 has a pair of Y tables 424b which connect edge part vicinity of each of the +Y side and -Y side of the pair of Y carriage 424a. To the Y table 424b, one end of the connecting device 26a for pulling the weight canceling device 26 (refer to Fig. 15(a) etc.) and the substrate table 30 (refer to Fig. 17(b) etc.) are provided. One end of the connecting device 30b for pulling is connected. Moreover, the X stator 462a is being fixed to the pair of Y tables 424b via the support|pillar 462c. The X stator 462a together with the X mover 462b constitutes the X linear actuator 462 . In addition, a Y stator 464a and an X stator 466a are attached to the X mover 462b.

17(a) and 17(b), the substrate table 30 and the non-contact holder 32 have the X-axis direction as the longitudinal direction in plan view, similarly to the first embodiment. It consists of a rectangular plate-shaped (or box-shaped) member. Each of the pair of auxiliary tables 434 has a plurality of air floating units 436 supported from below by an arm-shaped support member 436a protruding from the side surface of the substrate table 30 . Unlike the first embodiment (see FIG. 3 and the like), the air floating unit 436 is made of a member extending in the X-axis direction. Moreover, a pair of air floating unit 438 is connected to the board|substrate table 30 via the support member 438a. The air floating unit 438 functions the same as the air floating unit 238 of the third modified example (see FIGS. 13(a) and 13(b)), except that it extends in the X-axis direction. . That is, as shown in FIG. 14, a pair of air floating unit 438 is supporting a pair of X flame|frame 442x which the board|substrate carrier 440 has non-contact from below.

18(a) and 18(b), the substrate carrier 440 is made of the same rectangular frame-like (frame-like) member as in the first embodiment (see FIG. 3 and the like), 1 It has a pair of X frames 442x and a pair of Y frames 442y. In the substrate carrier 40 of the first embodiment, the Y frame 42y is attached to the lower surface side of the X frame 42x (see FIG. 3 ), whereas the substrate carrier 440 of the second embodiment is In , the Y frame 442y is attached to the upper surface side of the X frame 442x. Thereby, the contact of the air floating unit 438 (refer FIG. 14, respectively) which the Y frame 442y and the auxiliary table 434 has is avoided. Moreover, the some suction pad 44 is attached to the lower surface of the Y frame 442y. The point in which a plurality of scale plates 46 are attached to each of the pair of X frames 442x is the same as in the first embodiment. In addition, on the side surfaces of each of the pair of X frames 442x, the Y stator 464a and the X stator 466a (see Fig. 16(a) , respectively) are provided together with a Y voice coil motor 464 and an X voice coil. A Y mover 464b and an X mover 466b constituting the motor 466 (see Fig. 20(a), respectively) are mounted. About the position measuring system of the substrate carrier 440, since it is the same as that of the said 1st Embodiment, description is abbreviate|omitted.

The main controller 50 performs positioning of the substrate P with respect to the exposure area IA in the X-axis direction with only the substrate carrier 440, as shown in FIGS. 19(a) and 19(b) . It is carried out by driving in the X-axis direction. A region of the substrate P that is not supported by the non-contact holder 32 is supported by any of the pair of auxiliary tables 434 . In the exposure operation in the second embodiment, since only the substrate carrier 440 is driven with a long stroke in the X-axis direction with respect to the exposure area IA, the substrate P is above the non-contact holder 32 . through (with a predetermined gap formed). The non-contact holder 32 plane-corrects the board|substrate P passing through sky in a non-contact manner.

In addition, as shown in Figs. 20(a) and 20(b), the main controller 50 is a substrate ( In the Y-axis direction positioning of P), the coarse motion stage 424 and the non-contact holder 32 are driven in the Y-axis direction with a predetermined long stroke, and the substrate carrier 440 is moved with the coarse motion stage 424 It is carried out by moving it integrally in the Y-axis direction.

According to the second embodiment described above, since only the substrate carrier 440 is driven in the scanning direction during scanning exposure, it is not necessary to drive the non-contact holder 32 and the pair of auxiliary tables 34 in the scanning direction as well. Compared to the above-described first embodiment (see Fig. 8(a) and the like), the generation of vibration can be suppressed, and high-precision exposure operation becomes possible. Moreover, since the weight canceling device 26 moves only at the time of a Y step operation, the dimension in the longitudinal direction of the Y guide bar 428 is short compared with the X guide bar 28 of the said 1st Embodiment. In addition, since the weight canceling device 26 is in a stationary state during the exposure operation, the plan view of the guide surface of the Y guide bar 428, which is a surface plate for the weight canceling device 26, is similar to that of the first embodiment. In comparison, it may be rough.

In addition, the structure demonstrated in this 2nd Embodiment is an example, and a deformation|transformation is possible suitably. For example, like the substrate stage apparatus 520 according to the modification (fourth modification) of the second embodiment shown in Figs. 21 to 26(b) , the pair of auxiliary tables 534 is a substrate table. (30) (refer to Fig. 24(a)) may be physically separated. Hereinafter, about a 4th modification, only the difference from the said 2nd Embodiment is demonstrated, and about common elements, the code|symbol same as that of the said 2nd Embodiment is attached|subjected and description is abbreviate|omitted.

22(a) and 22(b), for example, three Y guide bars 528 are fixed on the lower mount 418b at predetermined intervals in the X-axis direction. The Y guide bar 528 is formed in the same dimensions and shape as the Y guide bar 428 of the second embodiment (see FIG. 26) is placed on the Y guide bar 528 via the mechanical linear guide device 26d, so the plan view of the upper surface of the Y guide bar 528 is the Y guide bar according to the second embodiment (428) is rough compared to . Moreover, on the Y guide bar 528 on the +X side and the -X side, the Z actuator 526 is mounted via the Y linear guide device 26d.

Moreover, as shown to FIG.23(a) and FIG.23(b), in each of a pair of Y table 424b which the coarse motion stage 524 has, a pair of plate-shaped member 524a is +X and -X It protrudes in the direction and is connected. One end of a connecting device 26a for pulling the Z actuator 526 (see Fig. 22(b) and the like) is connected to the plate-shaped member 524a. That is, in this fourth modification, for example, the two Z actuators 526 (see Fig. 22(b) and the like) are identical to the weight canceling device 26 (integrated with the weight canceling device 26). ) towed by the coarse motion stage 524 .

As shown in Figs. 24(a) and 24(b), each of the pair of auxiliary tables 534 includes a plurality of air floating units 436 (in Fig. 24(a), for example, four). have it The some air floating unit 436 supports the part which is not supported by the non-contact holder 32 of the board|substrate P from below similarly to said 2nd Embodiment. Moreover, the auxiliary table 534 has a pair of air floating unit 538. In the auxiliary table 534 , the plurality of air floating units 436 and the pair of air floating units 538 are integrally mounted on the base member 536a. The auxiliary table 534 on the +X side is supported from below by the Z actuator 526 on the +X side (refer to Fig. 22(b) etc.) described above, and the auxiliary table 534 on the -X side is It is supported from below by the Z actuator 526 (refer FIG. 22(b) etc.) on the -X side (refer FIG. 26(b)). Moreover, a pair of air floating unit 538 is being fixed also to the board|substrate table 30 via the support member 538a. In addition, the degree to which the air floating unit 438 of the second embodiment can cover the entire range of movement in the X-axis direction of the substrate carrier 440 (see Fig. 14, respectively) (about three times as large as the substrate P) ), the air floating unit 538 of the present modification is formed to have a length equal to that of the other air floating units 436 (equivalent to the substrate P).

Also in this fourth modification, as in the second embodiment, the X frame 442x of the substrate carrier 540 (see Fig. 21, respectively) has a plurality of air floating units 538 (auxiliary table 534) By the air floating unit 538 and the air floating unit 538) which the board|substrate table 30 has, it is supported from below suitably.

25(a) and 25(b), in the substrate carrier 540, the Y frame 442y is covered by the spacer 442a (in Fig. 25(a), the Y frame 442y). (not shown) is fixed on the X frame 442x. In addition, the pair of suction pads 44 on the -X side is attached to the lower surface of the Y frame 442y on the -X side, whereas the pair of suction pads 44 on the +X side is an X frame. It is formed to protrude from the inner surface of 442x. Thereby, in the substrate carrier 540 of this modification, as shown in FIG.25(b) from the state shown in FIG.25(a), the board|substrate P is moved in the +X direction, and the Y frame on the side of +X is moved. By passing the lower part of 442y, carrying out with respect to the board|substrate carrier 540 of the board|substrate P can be performed. Moreover, the board|substrate P can also be carried in to the board|substrate carrier 540 by moving the board|substrate P to -X direction.

Further, on the Y frame 442y on the -X side, a reference indicator plate ( 144 ) is fixed via a volume increasing member 148 . In addition, a plurality of mark measurement sensors 532 are attached to the lower surface of the Y frame 442y on the -X side corresponding to the plurality of reference marks 146 . That is, in the second modification, the reference index plate 144 and the mark measurement sensor 132 were formed separately (see Fig. 11), whereas in the present modification, the reference index plate 144 and the mark measurement were formed. A sensor 532 is integrally formed on the substrate carrier 540 . As for the calibration using the reference indicator plate 144, since it is the same as that of the second modification, the description is omitted.

26(a) and 26(b) show the substrate stage apparatus 520 at the time of the carrying out operation of the substrate P. As shown in FIG. The carrying out of the board|substrate P is performed in the state which the center of the movement range with respect to the X-axis direction of the board|substrate carrier 540, ie, substantially the whole board|substrate P, was supported by the non-contact holder 32. As shown in FIG. After the adsorption|suction holding by the board|substrate carrier 540 is cancelled|released, the board|substrate P slides with respect to the board|substrate carrier 540 with respect to the board|substrate carrier 540 +X direction by the unloading apparatus (not shown). Thereby, the board|substrate P is delivered (transferred) on the some air floating unit 436 which the auxiliary table 534 on the +X side has from the non-contact holder 32 top. In addition, the carrying-out apparatus for sliding the board|substrate P in the X-axis direction may be formed outside the substrate stage apparatus 520 (including the apparatus external to a liquid crystal exposure apparatus), and the substrate stage apparatus 520 itself. may have

In the substrate stage apparatus 520 (see Fig. 21) according to the fourth modification described above, the pair of auxiliary tables 534 and the substrate table 30 (and the non-contact holder 32) are physically separated. For this reason, the Z tilt position controllability of the board|substrate P improves by weight reduction of a drive object. In addition, since the Z position of each of the pair of auxiliary tables 534 can be controlled independently, for example, the substrate P is moved from the non-contact holder 32 to the air floating unit 436 of the auxiliary table 534 . When moving (transferred) upward, by slightly lowering the Z position of the auxiliary table 534, the contact between the end of the substrate P and the air floating unit 436 can be avoided. Moreover, since the board|substrate P can be carried out (and carried in) from the board|substrate carrier 540 by sliding, even when the space above the board|substrate stage apparatus 520 is narrow, the board|substrate on the board|substrate carrier 540 easily. exchange can be carried out.

In addition, the structure of each of the 1st and 2nd embodiment (its modified example is included) demonstrated above is an example, and it can change suitably. For example, in each of the above embodiments, the substrate carrier 40 or the like includes, for example, four frame members along the outer periphery (four sides) of the substrate P (in the first embodiment, a pair of Although formed in a rectangular frame shape by the X frame 42x and the pair of Y frames 42y), it is not limited to this, as long as the substrate P can be reliably held by suction, and the substrate carrier ( 40) etc. may be comprised by the frame member along a part among the outer peripheral edge parts of the board|substrate P, for example. Specifically, the substrate carrier may be formed in a U-shape in plan view by, for example, three frame members along three sides of the substrate P, or two adjacent sides of the substrate P It may be formed, for example, in an L-shape in a plan view by two frame members. Moreover, the board|substrate carrier may be formed with only one frame member along one side of the board|substrate P, for example. Moreover, the board|substrate carrier hold|maintains the mutually different part of the board|substrate P, and may be comprised by the some member used as mutually independent position control.

Further, the Z tilt position measuring system 58 is fixed to the case of the weight canceling device 26 by a laser displacement meter 58a formed on the lower surface of the substrate table 30, as shown in Figs. Although the measurement light was irradiated with respect to the target 58b, the reflected light was received, and the displacement amount information of the Z-axis direction of the board|substrate table 30 was acquired, but it is not limited to this. A Z sensor head 78z is disposed in the head unit 72 in place of the Z tilt position measurement system 58 together with the X head 78x and the Y head 78y. As the Z sensor head 78z, a laser displacement meter is used, for example. In the X frame 42x, a reflective surface is formed by mirror finishing in a region where the scales opposite to the X head 78x and the Y head 78y are not disposed. The Z sensor head 78z irradiates a measurement beam with respect to a reflective surface and receives the reflected beam from the reflective surface, so that the Z-axis direction of the substrate carriers 40 and 440 at the irradiation point of the measurement beam Obtain displacement amount information. Further, the type of the Z sensor head 78z is determined in the Z-axis direction of the substrate carriers 40 and 440 (more specifically, the X frame 42x) with respect to the apparatus main body 18 (refer to FIG. 1). It will not specifically limit as long as a displacement can be measured with desired precision (resolution) and non-contact.

Moreover, although positional information in the XY plane of each of the board|substrate P and the Y slider 76 was calculated|required by the X encoder head 78x and the Y encoder head 78y, for example, displacement amount information in the Z-axis direction Using a two-dimensional encoder head (XZ encoder head or YZ encoder head) capable of measuring ) each Z tilt position information may be obtained. In this case, it is possible to omit the Z tilt position measurement system 58 and the Z sensor head 78z for obtaining the Z tilt position information of the substrate P. Further, in this case, in order to obtain the Z tilt position information of the substrate P, two downward Z heads always need to face the scale plate 46, so the scale plate 46 is connected to the X frame 42x ), it is preferable to configure by one long scale plate having the same length as ), or to arrange, for example, three or more of the two-dimensional encoder heads at predetermined intervals in the X-axis direction.

In addition, in each of the above embodiments, the plurality of scale plates 46 are arranged at predetermined intervals in the X-axis direction, but the present invention is not limited thereto. For example, the length of the substrate carrier 40 or the like in the X-axis direction is the same. You may use one long scale board formed with a length of about. In this case, since the opposing state of the scale plate and the head is always maintained, only one X head 78x and one Y head 78y which each head unit 72 has is sufficient. The same applies to the scale plate 82 . When a plurality of scale plates 46 are provided, the lengths of the respective scale plates 46 may be different from each other. For example, by setting the length of the scale plate extending in the X-axis direction to be longer than the length in the X-axis direction of the shot region, the head unit 72 spans the different scale plates 46 in the scanning exposure operation. Position control of (P) can be avoided. Moreover, you may mutually differ in length between the scale arrange|positioned on one side of the projection optical system 16, and the scale arrange|positioned on the other side (for example, in the case of 4 plane acquisition and the case of 6 plane acquisition).

Moreover, in each said embodiment, although position measurement in the horizontal plane of the board|substrate carrier 40 etc. was implemented using the encoder system, it is not limited to this, For example, to the board|substrate carrier 40, X-axis direction and Y A bar mirror extending in each axial direction may be mounted, and the position of the substrate carrier 40 or the like may be measured by an interferometer system using the bar mirror. Further, in the encoder system of each of the above embodiments, the substrate carrier 40 or the like has a scale plate 46 (diffraction grating), and the head unit 72 has a measurement head. The carrier 40 or the like may have a measurement head, and a scale plate that moves in synchronization with the measurement head may be attached to the apparatus main body 18 (arrangement opposite to that in each of the above embodiments).

Moreover, in each said embodiment, although the non-contact holder 32 supported the board|substrate P in a non-contact, if the relative movement in the direction parallel to the horizontal plane of the board|substrate P and the non-contact holder 32 is not inhibited, this It is not limited to this, For example, you may support in a contact state via rolling elements, such as a ball|bowl.

《Third embodiment》

Next, the liquid crystal exposure apparatus which concerns on 3rd Embodiment is demonstrated using FIGS. 27-48. Hereinafter, only differences from the first embodiment will be described, and elements having the same configuration and functions as those of the first embodiment are denoted by the same reference numerals as in the first embodiment, and description thereof will be omitted.

As shown in FIG. 27 , the liquid crystal exposure apparatus 1010 includes an illumination system 12 , a mask stage 14 , a projection optical system 16 , a substrate stage apparatus 1020 , a substrate exchange apparatus 1040 , and a control system thereof. have a back About the illumination system 12, the mask stage 14, and the projection optical system 16, since it is the same as that of the said 1st Embodiment, it abbreviate|omits description.

As shown in FIG. 29(b) , the substrate stage apparatus 1020 includes a surface plate 1022 , a substrate table 1024 , a self-weight support apparatus 1026 , and a substrate holder 1028 .

The surface plate 1022 consists of, for example, a rectangular plate-shaped member in a planar view (viewed from the +Z side) arranged so that the upper surface (+Z plane) may be parallel to the XY plane, and interposed therebetween a vibration isolator (not shown) and installed on the floor (F). The board|substrate table 1024 consists of a box-shaped member with a thin rectangular thickness in planar view. The self-weight support apparatus 1026 is mounted on the surface plate 1022 in a non-contact state, and is supporting the self-weight of the board|substrate table 1024 from below. Moreover, although not shown in figure, the board|substrate stage apparatus 1020 includes, for example, a linear motor etc., and drives the board|substrate table 1024 with a predetermined long stroke in the X-axis and Y-axis directions (along the XY plane). and a substrate stage drive system for micro-driving the substrate table 1024 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions, and, for example, an optical interferometer system, etc. , a substrate stage measurement system for obtaining positional information in the six-degree-of-freedom direction of the substrate table 1024 .

The substrate holder 1028 is made of a planar view quadrangular plate-shaped member, and the substrate P is placed on the upper surface (surface on the +Z side). As shown to Fig.29(a), the upper surface of the substrate holder 1028 is formed in the rectangle which makes the X-axis direction a longitudinal direction, The aspect ratio is substantially the same as that of the board|substrate P. As shown in FIG. However, the lengths of the long and short sides of the upper surface of the substrate holder 1028 are set slightly shorter than the lengths of the long and short sides of the substrate P, respectively, and the substrate P is positioned on the upper surface of the substrate holder 1028. In the mounted state, the vicinity of the edge portion of the four sides of the substrate P protrudes outward from the substrate holder 1028 . This is to prevent the resist applied to the surface of the substrate P from adhering to the substrate holder 1028 because there is a possibility that the resist may also adhere to the back side in the vicinity of the end of the substrate P.

The upper surface of the substrate holder 1028 is finished very flat over the entire surface. In addition, a plurality of minute holes (not shown) for blowing air and/or for vacuum suction are formed on the upper surface of the substrate holder 1028 . The substrate holder 1028 uses a vacuum suction force supplied from a vacuum device (not shown) to suck air between its upper surface and the substrate P through the plurality of holes, so that almost the entirety of the substrate P is formed. It is possible to (thus) planar correct the surface to mimic the upper surface of the substrate holder 1028 . In addition, the substrate holder 1028 exhausts (spouts) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) to the back surface of the substrate P through the hole, thereby forming the substrate P. It is possible to separate the back surface from the upper surface of the substrate holder 1028 (floating the substrate P). Further, in each of the plurality of holes formed in the substrate holder 1028, a time difference is generated in the timing of evacuating the pressurized gas, or the positions of the hole for performing vacuum suction and the hole for exhausting the pressurized gas are appropriately exchanged, Optimize the grounding state of the substrate P by appropriately changing the air pressure in suction and exhaust (for example, so that air stagnation does not occur between the back surface of the substrate P and the upper surface of the substrate holder 1028) can do.

In the vicinity of the edge part on the +X side in the upper surface of the substrate holder 1028, the two cutouts 1028a are spaced apart in the Y-axis direction, and are formed, for example. Moreover, in the vicinity of the edge part on the -X side in the upper surface of the substrate holder 1028, the two cutouts 1028b are spaced apart in the Y-axis direction, and are formed, for example.

More specifically, the cutout 1028a is formed in the +X side and +Y side corner portions of the substrate holder 1028, and the +X side and -Y side corner portions of the substrate holder 1028, , open to the upper surface (surface on the +Z side), the side surface on the +X side, and the side surface on the +Y side (or -Y side) of the substrate holder 1028 , respectively. On the other hand, the notch 1028b is opened only to the upper surface of the substrate holder 1028, and the side surface on the -X side.

As shown in FIG. 28, the board|substrate exchange apparatus 1040 has the beam unit 1050, the board|substrate carrying-in apparatus 1060, the board|substrate carrying-out apparatus 1070, and the board|substrate assist apparatus 1080. The beam unit 1050 , the substrate carrying-in apparatus 1060 , and the substrate carrying-out apparatus 1070 are provided at a predetermined position on the +X side of the substrate stage apparatus 1020 . Hereinafter, among the board|substrate exchange apparatuses 1040, the place in which the beam unit 1050, the board|substrate carrying-in apparatus 1060, and the board|substrate carrying-out apparatus 1070 were installed is called a port part and demonstrated. For example, transfer of the board|substrate P between external devices (not shown), such as a coater/developer, and the liquid crystal exposure apparatus 1010 is implemented in a port part. The board|substrate carrying-in apparatus 1060 is for conveying the new board|substrate P before exposure from a port part to the board|substrate holder 1028. On the other hand, the board|substrate carrying-out apparatus 1070 is for conveying the board|substrate P exposed to the port part from the board|substrate holder 1028.

In addition, the transmission of the board|substrate P between the external apparatus (not shown) and the liquid crystal exposure apparatus 1010 is the illumination system 12, the mask stage 14, the projection optical system 16 mentioned above, and the board|substrate stage apparatus. 1020 , an external transfer device 1100 disposed outside a chamber (not shown) that accommodates a substrate exchange device 1040 , and the like. The external transfer apparatus 1100 has a fork-shaped robot hand, loads the substrate P on the robot hand, and transfers the substrate P from the external apparatus to the port portion in the liquid crystal exposure apparatus 1010 , and it is possible to transport the substrate P from the port portion to an external device.

As shown to Fig.30 (a), the beam unit 1050 has the balance beam 1052 of a plurality (six pieces in this embodiment, for example) arrange|positioned at predetermined intervals in the Y-axis direction. The balance beam 1052 includes an elongated air bearing extending parallel to the X-axis direction which is the conveyance direction of the board|substrate P at the time of board|substrate exchange. The spacing in the Y-axis direction of the plurality of balance beams 1052 can support the substrate P with good balance from below using the plurality of balance beams 1052, and, for example, in Fig. 32(a). ) and as shown in Fig. 32(b) , when the fork hand of the external conveying device 1100 is disposed above the beam unit 1050, the fork hand has a plurality of branches in the vertical direction. It is set not to be duplicated.

Returning to Fig. 30(a) , the length in the longitudinal direction (X-axis direction) of one balance beam 1052 is slightly longer than the length in the longitudinal direction of the substrate P, and the length in the width direction is the substrate P ) of the length of the width direction, for example, about 1/50 or about 10 to about 50 times the thickness of the substrate P, for example.

As shown in Fig. 30 (b), each of the plurality of balance beams 1052 (in Fig. 30 (b), overlapped in the paper depth direction) is a plurality of (for example, two) extending in the Z-axis direction. It is supported from below by the rod-shaped leg 1054 at the position inside from the both ends of the X-axis direction. Each of the plurality of legs 1054 supporting each balance beam 1052 is connected with a base plate 1056 in the vicinity of its lower end (base plate 1056 is not shown in Fig. 30(a)). In the substrate changing apparatus 1040, the base plate 1056 is driven with a predetermined stroke in the X-axis direction by an X actuator (not shown), whereby the plurality of balance beams 1052 are integrally formed with a predetermined stroke in the X-axis direction. is intended to move to In addition, the Z position of the upper surface (air bearing surface) of the plurality of balance beams 1052 is set to a position (height) substantially equal to the Z position of the upper surface of the substrate holder 1028 .

Returning to Fig. 30(a), the substrate carrying-in apparatus 1060 is the same as the above-described external transfer apparatus 1100 (see Figs. 27 and 28), and a fork-shaped hand 1062 (hereinafter referred to as a substrate carrying-in hand). (1062)). A plurality of substrate carrying hands 1062 extend in parallel to the X-axis direction, which is the transport direction of the substrate P at the time of loading the substrate P from the port portion into the substrate holder 1028 (in this embodiment, yes For example, it has four) branches 1062a. The plurality of branch portions 1062a are connected to each other by a connecting member 1062b in the vicinity of an end on the +X side. On the other hand, the ends on the -X side (substrate holder 1028 (see FIG. 28 and the like) side) of the plurality of branches 1062a are free ends, and the substrate holder 1028 is between adjacent branches 1062a. ) is open to the side. In addition, the board|substrate carrying-in hand 1062 may blow air between the adjacent branch parts 1062a, and may suppress the sag of the board|substrate P in between the adjacent branch parts 1062a. The robot hand of the external transfer apparatus 1100 is also the same.

Each branch 1062a of the substrate carrying hand 1062 has a plurality of balance beams ( 1052) and positions are arranged so that they do not overlap. In addition, a plurality of support pads 1062c for supporting the back surface of the substrate P are attached to the upper surface of each branch 1062a. The connecting member 1062b is a rectangular thin hollow member in plan view, and extends in the Y-axis direction, which is a direction perpendicular to each branch 1062a (and the balance beam 1052 described above).

Each of the vicinity of both ends of the Y-axis direction of the connecting member 1062b is connected with a pair of X-axis drive apparatus 1064 for driving the board|substrate carrying-in hand 1062 in the X-axis direction. In addition, the pair of X-axis drive devices 1064 may be each independently driven, and may be mechanically connected with a gear or a belt, and may be driven simultaneously by one drive motor. In addition, although not shown in figure, the pair of X-axis drive devices 1064 is vertically movable by a Z-axis drive device. Therefore, the substrate carrying-in hand 1062 can move between a position higher than the upper surface of the balance beam 1052 (+Z side) and a position lower than the balance beam 1052 (-Z side). . Further, if the substrate carrying hand 1062 has a structure capable of vertical movement (±Z-axis direction) and horizontal operation in the substrate carrying-in direction (moving in the ±X-axis direction), for example, the X-axis drive device 1064 ) and the arrangement of the Z-axis drive device may be opposite to the above description (the Z-axis drive device on the X-axis drive device 1064).

The board|substrate carrying-out apparatus 1070 is arrange|positioned in the center part in a port part with respect to a Y-axis direction. Among the above-mentioned six balance beams 1052 , for example, three are arranged on the +Y side of the substrate carrying-out apparatus 1070 , and the other three are arranged on the -Y side of the substrate carrying-out apparatus 1070 . has been Moreover, among the four branch parts 1062a of the board|substrate carrying-in hand 1062 with which the board|substrate carrying-in apparatus 1060 is equipped, two are arrange|positioned on the +Y side of the board|substrate carrying-in apparatus 1070, and the other two is disposed on the -Y side of the substrate unloading apparatus 1070 . That is, the some branch part 1062a with which the board|substrate carrying-out apparatus 1070, the board|substrate carrying-in hand 1062 is equipped, and the some balance beam 1052 are arrange|positioned so that a position may not mutually overlap with respect to a Y-axis direction.

The board|substrate carrying-out apparatus 1070 has the one board|substrate carrying-out hand 1072, for example. The substrate carrying hand 1072 is mounted on the Z-axis drive unit 1074 , and the Z-axis drive unit 1074 is mounted on the X-axis drive unit 1076 , as shown in FIG. 30( b ). . The board|substrate carrying-out hand 1072 is enabled to hold|hold (hold) the board|substrate P using the vacuum suction force supplied from the vacuum apparatus (not shown). Thereby, the board|substrate carrying-out apparatus 1070 makes the board|substrate carrying-out hand 1072 adsorb|suck and hold the lower surface of the edge part vicinity of the +X side of the board|substrate P from below, and it is possible to move it in the X-axis direction. Returning to FIG. 30A , the width (Y-axis direction dimension) of the substrate carrying-in hand 1072 is set slightly wider than the width (Y-axis direction dimension) of one branch 1062a of the substrate carrying-in hand 1062 . Moreover, it is set smaller than the space|interval between the center two among the six balance beams 1052, for example.

The drive stroke of the board|substrate carrying-out hand 1072 by the X-axis drive unit 1076 is longer than the length of the X-axis direction of the board|substrate P, and is equal to or slightly shorter than the length of the X-axis direction of the balance beam 1052. It is set. The X-axis drive unit 1076 is, as shown in FIG. 30(b), below the plurality of balance beams 1052, the beam unit 1050 (base plate 1056) moves in the X-axis direction. It is installed in an unobstructed position.

Moreover, the board|substrate carrying-out apparatus 1070 has the alignment pad 1078 which is an alignment apparatus. The alignment pad 1078 is attached to the Z-axis drive unit 1074 via a micro drive unit 1079 (not shown in FIG. 30(b) ). Although the board|substrate carrying-out hand 1072 and the alignment pad 1078 move integrally with respect to the X-axis direction, it is possible to implement the drive control in the Z-axis direction independently. The minute drive unit 1079 micro-drives the alignment pad 1078 in the Y-axis direction and the θz direction. Similar to the substrate carrying hand 1072 described above, the alignment pad 1078 can also hold (hold) the lower surface of the substrate P by using a vacuum suction force supplied from a vacuum apparatus (not shown). is to be done Thereby, the board|substrate carrying-out apparatus 1070 makes the alignment pad 1078 adsorb|suck and hold the lower surface of the center part of the board|substrate P from below, and moves it by a long stroke (or micro stroke) in an X-axis direction, and a Y-axis direction. , , and θz can be moved minutely.

In addition, the structure of the board|substrate carrying-out apparatus 1070 can be changed suitably. For example, two or more board|substrate carrying out hands 1072 may be formed at predetermined intervals in the Y-axis direction. Moreover, the board|substrate carrying-out hand 1072 and the alignment pad 1078 may be attached to the independent X-axis drive unit 1076. As shown in FIG. That is, for example, the X drive unit for the alignment pad 1078 in the central portion of the port portion in the Y-axis direction is placed on both sides (+Y side and -Y side) in the Y-axis direction, and the substrate carrying hand 1072 is disposed. ), the X drive unit may be arranged so that the plurality of balance beams 1052 and the Y position do not overlap, respectively. In addition, the plurality of balance beams 1052 included in the beam unit 1050 may be configured to be movable not only in the X-axis direction but also in the Z-axis direction. Thereby, according to the operation|movement at the time of the transfer of the board|substrate P between the external conveyance apparatus 1100, or the operation|movement at the time of transfer of the board|substrate P between the board|substrate holder 1028 (refer FIG. 27), , the height can be changed.

Returning to FIG. 27, the board|substrate assist apparatus 1080 is an apparatus which assists the operation|movement of the board|substrate carrying-in apparatus 1060 and the board|substrate carrying-out apparatus 1070 at the time of board|substrate exchange. Moreover, when the board|substrate assist apparatus 1080 mounts the board|substrate P on the board|substrate holder 1028, it is also used also for positioning of the board|substrate P.

The substrate assist apparatus 1080 is included in the substrate stage apparatus 1020 as shown in FIGS. 29A and 29B . The board|substrate assist apparatus 1080 is equipped with a pair of board|substrate carrying-in bearer apparatus 1082a, and a pair of board|substrate carrying-in bearer apparatus 1082b. The pair of substrate carrying-in bearer devices 1082a assists (or assists) the carrying-out operation of the substrate P by the substrate carrying-out apparatus 1070 (refer to FIG. 27 or the like), and the pair of substrate carrying-in bearer devices 1082b ) assists (or assists) the carrying-in operation of the board|substrate P by the board|substrate carrying-in apparatus 1060 (refer FIG. 27 etc.).

The board|substrate carrying-in bearer apparatus 1082b is equipped with the holding pad 1084b, the Z actuator 1086z, and the X actuator 1086x, as shown to FIG.29(b). As shown to Fig.29 (a), the holding pad 1084b of the board|substrate carry-in bearer apparatus 1082b of one (+Y side) is formed in the board|substrate holder 1028, For example, among the two cutouts 1028b. , a part is inserted into the cutout 1028b of one side (+Y side). Moreover, a part of the holding pad 1084b of the board|substrate carrying-in bearer apparatus 1082b of the other (-Y side) is inserted in the cutout 1028b of the other (-Y side).

The holding pad 1084b consists of a planar view rectangular plate-shaped member, and is able to adsorb and hold|maintain the lower surface of the board|substrate P by the vacuum suction force supplied from the vacuum apparatus (not shown).

As shown in Fig. 29(b) , the holding pad 1084b can be driven in the Z-axis direction by the Z actuator 1086z. Further, the holding pad 1084b and the Z actuator 1086z can be integrally driven in the X-axis direction by the X actuator 1086x mounted on the substrate table 1024 . The Z actuator 1086z includes a strut for supporting the holding pad 1084b, and the strut is disposed outside the substrate holder 1028 . The holding pad 1084b is driven in the cutout 1028b by the Z actuator 1086z so as to be movable between a position in contact with the lower surface of the substrate P and a position spaced apart from the lower surface of the substrate P. has been Further, the holding pad 1084b can be driven with a long stroke between a position partially accommodated in the cutout 1028b and a position higher than the upper surface of the substrate holder 1028 by the Z actuator 1086z. . In addition, the holding pad 1084b is driven integrally with the Z actuator 1086z by the X actuator 1086x, so that it can move in the X-axis direction.

The mechanical structure of the board|substrate carrying-in bearer apparatus 1082a is substantially the same as that of the board|substrate carrying-in bearer apparatus 1082b mentioned above. That is, the substrate carrying-out bearer device 1082a is, as shown in Fig. 29(b), a holding pad 1084a partially inserted into the cutout 1028a, a Z for driving the holding pad 1084a in the Z-axis direction. An actuator 1086z and an X actuator 1086x for driving the holding pad 1084a in the X-axis direction are provided. In addition, the movable amount of the holding pad 1084a of the substrate carrying-in bearer apparatus 1082a in the X-axis direction is set longer than the movable amount of the holding pad 1084b of the substrate carrying-in bearer apparatus 1082b in the X-axis direction. In contrast, the movable amount in the Z-axis direction of the holding pad 1084a of the substrate carrying-in bearer device 1082a may be shorter than the movable amount in the Z-axis direction of the holding pad 1084b of the substrate carrying-in bearer device 1082b.

The board|substrate assist apparatus 1080 assists as follows at the time of carrying out from the board|substrate holder 1028 of the board|substrate P (exposed board|substrate). First, the holding pad 1084a of each of the pair of substrate carrying-out bearer devices 1082a adsorbs and holds, for example, two points in the vicinity of the +X side end of the substrate P on the substrate holder 1028. . Next, the pair of holding pads 1084a are moved in the X-axis direction (+X direction) by a predetermined stroke (example: For example, about 50 mm to 100 mm) is driven. By driving the holding pad 1084a, the substrate P is moved with respect to the substrate holder 1028 by a predetermined stroke in the X-axis direction. Thereby, the pair of board|substrate carrying-out bearer apparatus 1082a assists the carrying out operation|movement of the board|substrate P by the board|substrate carrying-out apparatus 1070 (refer FIG. 27 etc.) mentioned above.

In addition, although detailed later, the board|substrate assist apparatus 1080 assists also at the time of carrying in the board|substrate P to be mounted on the board|substrate holder 1028 from now on. This will be outlined with reference to FIGS. 41 to 44 described later. First, each of the pair of the substrate carry bearer device (1082b) holding the pad (1084b) are, in the substrate carry-in hand-1062 (portion (1062a)), the substrate (P ₂₎ which is supported on the substrate carry-in device 1060 , two points in the vicinity of the end on the -X side are adsorbed and held (see FIG. 41 ). Next, the substrate carry-in hand-1062 (portion (1062a)) is + when moved in the X direction does not stay from the lower side of the substrate (P _2), holding pad (1084b) in that one pair, the substrate (P ₂₎ In a state in which the adsorption and holding is maintained, it moves by a predetermined stroke in the Z-axis direction (-Z direction) (FIG. 42(b), etc.). With the movement of the holding pad 1084b, the substrate P ₂ is placed on the substrate holder 1028 (FIG. 43(b) and the like). Thereby, a pair of board|substrate carrying-in bearer apparatus 1082b assists the carrying-in operation|movement of the board|substrate P by the board|substrate carrying-in apparatus 1060 (refer FIG. 27 etc.) mentioned above.

In addition, the structure of the board|substrate carrying-in bearer apparatus 1082a and the board|substrate carrying-in bearer apparatus 1082b can be changed suitably. For example, each of the bearer devices 1082a and 1082b is mounted on the substrate table 1024 in the present embodiment, but is not limited thereto. For example, the substrate holder 1028 or the substrate table 1024 is XY You may be attached to the XY stage apparatus (not shown) for driving in a plane. Moreover, the position and number of each bearer apparatus 1082a, 1082b are not limited to this, For example, you may attach to the side surface of the +Y side of the board|substrate table 1024, and -Y side.

In the liquid-crystal exposure apparatus 1010 (refer FIG. 27) comprised as mentioned above, the mask M with respect to the mask stage 14 by the mask loader (not shown) under the management of the main control apparatus (not shown). While the loading is performed, the loading of the substrate P on the substrate holder 1028 is performed by the substrate exchange apparatus 1040 . Then, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after the alignment measurement is finished, a plurality of shot areas set on the substrate P are sequentially step-and-scan method. of exposure operation is performed. Since this exposure operation is the same as the exposure operation of the conventional step-and-scan method, the detailed description thereof is omitted. Then, the substrate P on which the exposure processing has been completed is taken out from the substrate holder 1028 by the substrate exchange apparatus 1040, and another substrate P to be exposed next is conveyed to the substrate holder 1028, Exchange|exchange of the board|substrate P on the board|substrate holder 1028 is performed, and exposure operation|movement etc. are performed continuously with respect to the some board|substrate P.

Hereinafter, the substrate P on the substrate holder 1028 in the liquid crystal exposure apparatus 1010 (for convenience, the plurality of substrates P are referred to as a substrate P ₁ , a substrate P ₂ , and a substrate P ₃ ). ) will be described with reference to Figs. 31(a) to 47(b). The following board exchange operation|movement is implemented under the management of the main control apparatus (not shown). In addition, in each side view (FIG. 31(b), FIG. 32(b), etc.) for demonstrating a board|substrate exchange operation|movement, in order to make it easy to understand the operation|movement of the board|substrate carrying-out apparatus 1070, in order to understand the operation|movement of the board|substrate carrying-out apparatus 1070, rather than Illustration of the -Y side (front side) balance beam 1052, the branch part 1062a of the board|substrate carrying-in hand 1062, and the X-axis drive apparatus 1064 (refer FIG. 30(a), respectively) is abbreviate|omitted.

In the following description, the substrate holder 1028 in the substrate stage apparatus 1020, and is placed the substrate (P ₁₎ pre-exposure is completed, and then taken out of the exposure is complete the substrate (P _1), the new (substrate _{The operation of placing the substrate P 2} ( different from (P ₁ )) on the substrate holder 1028 will be described. In addition, before the board|substrate exchange operation|movement, the board|substrate carrying-in hand 1062 which the board|substrate exchange apparatus 1040 has, and the beam unit 1050, as shown to FIG.30(a) and FIG.30(b), connect member ( It is assumed that it is positioned so that the X position of 1062b) and the X position of the plurality of balance beams 1052 do not overlap each other.

Figure 31 (a) and 31 (b) as shown in, when the conveyed new substrate (P ₂₎ port by the external transport device 1100 (namely, the operation of each element, indicated by arrows in the drawings. Hereinafter, the same), the substrate exchange apparatus 1040 lowers the substrate carrying hand (-Z drive) to position the upper surface of the substrate carrying hand 1062 below the lower surfaces of the plurality of balance beams 1052 . At this time, including the connecting member 1062b, the Z position of the highest part (the highest part of the +Z position. For example, the upper surface of the connecting member 1062b) of the substrate carrying hand 1062 is a plurality of balances. Between the upper surface of the beam 1052 and the highest part of the board|substrate carrying-in hand 1062, it is set so that the space|interval which allows insertion of the robot hand of the external conveyance apparatus 1100 with respect to the Z-axis direction may be formed.

Further, the beam unit 1050 is driven in the +X direction. At this time, the beam unit 1050 is stopped at the position where the leg 1054 on the side of +X does not contact the connection member 1062b of the board|substrate carrying-in hand 1062 . Thereby, a part (the edge part vicinity of the +X side) of the some balance beam 1052 is located above the connection member 1062b of the board|substrate carrying-in hand 1062 (+Z side). In the beam unit 1050 , this position becomes a substrate transfer position with the external transfer apparatus 1100 .

Next, FIG. 32 (a) and 32 (b), the substrate (P ₂₎ placed by the robot hand of the external transport device 1100 is moved in the -X direction, and the substrate (P ₂₎ as shown in Fig. It is positioned above the plurality of balance beams 1052 (+Z side). At this time, the robot hand of the external transport device 1100 so that each branch of the fork-shaped robot hand of the external transport device 1100 passes between the adjacent pair of balance beams 1052 (so as not to contact). The Y position of is positioned.

In addition, Figure 33 (a) and, carried on by the robot hand, the drop of the external transport device 1100, the substrate (P ₂₎ a plurality of balance beam 1052 as shown in Fig. 33 (b). The Z position of the robot hand of the external transfer apparatus 1100 is controlled so that it does not come into contact with the board|substrate carrying-in hand 1062 waiting below the balance beam 1052. At this time, the edge vicinity of the + X side of the substrate (P _2), projecting a plurality of balance beam toward the + X side end portion than in the + X 1052. Thereafter, the robot hand of the external conveying apparatus 1100 is driven in the +X direction to withdraw from the port portion (from the inside of the liquid crystal exposure apparatus).

Further, in the substrate exchange device (1040), the alignment pad 1078 of the substrate carry-out device (1070), is driven in the -X direction from the lower side of the substrate (P _2), opposite to the central portion of the substrate (P ₂₎ position is determined in position. In this state, the alignment pad 1078 is driven upward (in the +Z direction), and between the pair of central balance beams 1052 , the lower surface of the substrate P ₂ is sucked and held.

Thereafter, as shown in FIGS. 34(a) and 34(b), pressurized gas is supplied to each of the plurality of balance beams 1052 of the beam unit 1050, and the pressurized gas is applied to the plurality of balance beams ( 1052) it is sprayed towards the lower face of the substrate (P ₂₎ from the respective top surface. Thereby, the board|substrate P ₂ floats with respect to the some balance beam 1052 through the micro clearance gap (for example, several tens of micrometers - several hundreds of micrometers).

Here, in the substrate changing apparatus 1040, the pre-alignment operation is performed on the plurality of balance beams 1052 . The pre-alignment operation, for example, the substrate (P ₂₎ of the position of the chamber, and the substrate board (P ₂₎ in a non-contact manner, by a substrate position determining apparatus of the, not shown disposed on each lower side of the (P ₂₎ It is carried out while measuring. Pre-alignment at the time of operation, the substrate (P ₂₎ when the alignment suction gripping pad 1078 of the central portion is, is suitably driven in the X-axis, Y-axis, and a θz direction (the horizontal plane within the 3-DOF orientation) minute. Since the substrate P ₂ is supported in a non-contact manner by the plurality of balance beams 1052 , the position correction (micro-positioning) in the three-degree-of-freedom direction in the horizontal plane of the _{substrate P 2 can be performed with low friction.} have. Further, in parallel with the pre-alignment action, to drive the alignment pad 1078 in the -X direction, and moves to the center of the substrate placement surface formed by the substrate (P ₂₎ a plurality of balance beam 1052.

Thereafter, as shown in Figs. 35(a) and 35(b), supply of the pressurized gas to the plurality of balance beams 1052 is stopped, and the supply of the vacuum suction force to the alignment pad 1078 is stopped. do. In addition, the alignment pad 1078 is to be separated from the lower surface of the substrate (P _2), it is driven down. Thereby, the board|substrate P _{2 is} mounted on the some balance beam 1052. In this state, the beam unit 1050 is driven in the -X direction (substrate stage apparatus 1020 side). At this time, the substrate (P ₂₎ and a plurality of balance beam, so that the end portion of the + X side is not redundant with respect to the X-axis direction with respect to the connecting member (1062b) of the substrate carry-in hand-1062 (do not overlap in the vertical direction ) to determine the position.

In this state, as shown to FIG.36(a) and FIG.36(b), the board|substrate carrying-in hand 1062 is driven upward. Thus, the substrate on the plurality of the balance beam (1052) (P ₂₎ are rescued from this upward, downward by the substrate carry-hand (1062) (which is transmitted to the substrate carry-hand (1062)).

Further, by (including pre-alignment operation), the above-described substrate (P _2), a transmission operation through a beam unit 1050 to the substrate carry-in hand 1062 from an external transport device 1100 in parallel with, the substrate stage device In 1020, the substrate table 1024 is driven in the +X direction so that the substrate holder 1028 on which the exposed substrate P _{1 is mounted is located at a predetermined substrate exchange position (substrate transfer position).} In this embodiment, the board|substrate exchange position is a position on the -X side of a port part. In addition, for ease of understanding, in Figs. 31(a) to 35(b), the substrate holder 1028 is shown in the same position, but in reality, the external transfer device 1100 for _{the substrate P 2 .} In parallel with the transfer operation|movement to the board|substrate carrying-in hand 1062 _{, the exposure operation|movement with respect to the board|substrate P 1} is performed, and the board|substrate holder 1028 is moving inside the XY plane.

Further, in parallel with the movement operation of the substrate holder 1028 to the substrate exchange position, the holding pads 1084a of each of the pair of substrate carrying-out bearer devices 1082a arranged on the +X side of the substrate holder 1028 are raised. is driven The holding pad 1084a is disposed on a part (the cutout 1028a (see FIGS. 29(a) and 29(b)) of _{the substrate P 1} that is vacuum-adsorbed and held on the upper surface of the substrate holder 1028 ). part) is adsorbed and held from the back surface.

Then, the Fig. 37 (a) and as shown in Fig. 37 (b), the substrate (P ₂₎ to a substrate carry-hand (1062) supported from the lower side, is driven in the -X direction. Thus, the substrate is conveyed (P ₂₎ toward the chamber of the substrate holder 1028, the determined position to the substrate exchange position. Moreover, in the substrate exchange apparatus 1040, the beam unit 1050 is driven in the -X direction (direction approaching the board|substrate holder 1028). The beam unit 1050 is stopped at a predetermined position so that the end of each of the plurality of balance beams 1052 on the -X side and the substrate holder 1028 do not come into contact. As described above, the Z position of the upper surface of each of the plurality of balance beams 1052 and the Z position of the upper surface of the substrate holder 1028 are set to substantially the same height.

Moreover, in the substrate stage apparatus 1020 , pressurized gas is ejected from the upper surface of the substrate holder 1028 to the lower surface of the substrate P _{1 .} Thereby, the substrate P ₁ floats from the upper surface of the substrate holder 1028 , and the friction between the lower surface of the substrate _{P 1 and the upper surface of the substrate holder 1028 becomes negligible (low friction state).}

Further, in the substrate stage apparatus 1020, the holding pad 1084a of the substrate carrying-out bearer apparatus 1082a is slightly upwardly driven in the +Z direction so as to follow the floating operation of _{the substrate P 1 , and the substrate P 1} ) in the state in which a part of it was adsorbed and held, it is driven by a predetermined stroke in the +X direction (port part side). Amount of movement of the holding pad (1084a) (i.e., the substrate (P ₁₎₎ is also different according to the size of the substrate (P _1), but, for example, is set to about 50 ㎜ ~ 100 ㎜. Thereby, the vicinity of the +X side edge part of the board|substrate P ₁ protrudes (overhangs) in the +X direction (port part side) from the +X side edge part of the substrate holder 1028. Here, the portion of the substrate P ₁ protruding from the substrate holder 1028 is supported from below in the vicinity of the -X side end portions of the plurality of balance beams 1052, so that the substrate P ₁ is to be overhanged. At this time, the pressurized gas may be blown out also from the balance beam 1052 in advance.

Figure 38 (a) and as shown in Fig. 38 (b), the substrate (P ₂₎ to a substrate carry-hand (1062) supported from the lower side is, is stopped at a predetermined position in the sky above the substrate holder (1028). In this rest position, the substrate P ₂ is positioned approximately directly above the substrate holder 1028 positioned in the substrate exchange position. Moreover, the substrate stage apparatus 1020 positions the substrate holder 1028 so that _{the Y position of the substrate P 1} and the Y position of the substrate P _{2 substantially coincide.} On the other hand, in the stop position, the X position of the _{substrates P 1} and P _{2 is different by the amount near the end of the substrate P 1 on} the +X side overhangs from the substrate holder 1028, end of the -X side of the substrate (P _2), there is protruded toward the -X than the end in the -X side of the substrate (P _1).

In parallel with the positioning of the substrate carry-hand 1062, the substrate carry-out device (1070), the substrate carry-out the hand 1072 is driven in the -X direction, the substrate (P ₁₎ of the, + X out of the substrate holder 1028 It is positioned below the portion overhanging to the side. Moreover, in the substrate stage apparatus 1020, the holding pad 1084b of each of a pair of board|substrate carrying-in bearer apparatuses 1082b is driven upward by a predetermined stroke (for example, about 50 mm - about 100 mm).

The holding pad 1084b of the board|substrate carrying-in bearer apparatus 1082b is a board|substrate on the board|substrate carrying-in hand 1062 waiting above the board|substrate holder 1028, as shown to FIG.39(a) and FIG.39(b). It is contacted from the lower side in (P ₂₎ and the suction end of the vicinity of the -X side of the substrate (P _2).

In addition, keep the pad in parallel with the suction holding operation, the substrate carry-out device (1070) of the substrate (P ₂₎ according to the (1084b), the substrate carry-out hand 1072 is driven increases, the exposure is complete the substrate (P _1), A portion overhanging from the substrate holder 1028 to the +X side is held by vacuum suction from the back surface. Further, the substrate carry-out hand 1072 when the suction holding the substrate (P _1), the supply of vacuum suction force for the substrate carry-out bearer device (1082a) each of the holding pad (1084a) of the pair is stopped. Thereby, the adsorption|suction holding|holding of the board|substrate P _{1 by the holding pad 1084a is cancelled|released.} The holding pad 1084a is driven downward so as to be spaced apart from the back _{surface of the substrate P 1 .}

In this embodiment, the substrate carry-out hand 1072 is, for phage adsorption from the back surface to a central portion of the edge vicinity of the + X side of exposure finished substrate (P _1), the substrate (P ₁₎ to the substrate carry-out bearer Although it was made to overhang (offset) from the substrate holder 1028 using the apparatus 1082a, it is not limited to this, The +Z side and +X side in the vicinity of the edge part on the +X side in the upper surface of the substrate holder 1028. forming a cut-out portion, and by inserting the substrate carry-out hand 1072 in the cut-out, without offsetting the substrate (P _1), may be to the substrate carry-out hand 1072 is able to adsorb holding the substrate (P _1).

Thereafter, FIG. 40 (a), and as shown in Fig. 40 (b), the substrate carry-out hand 1072 is driven in a state of holding the substrate (P ₁₎ in the direction of + X. Thereby, the substrate P ₁ moves from the substrate holder 1028 onto the beam unit 1050 (plural balance beams 1052 ). At this time, pressurized gas is ejected from the upper surface of each of the plurality of balance beams 1052 . Thus, the substrate is conveyed to the portion (P ₁₎ of the substrate holder 1028, and to the beam unit (1050), (other than the portion that is being held by the substrate carry-out hand-1072) a non-contact state. In addition, the holding pad 1084a of each of the pair of substrate carrying-out bearer devices 1082a is partially accommodated in the cutout 1028a of the substrate holder 1028 (refer to FIGS. 29(a) and 29(b)). , driven in the -X direction.

_{Moreover, in parallel with the carrying out operation|movement of the board|substrate P 1} from the board|substrate holder 1028 by the said board|substrate carrying-in hand 1072, in the board|substrate carrying-in apparatus 1060, the support pad 1062c of the board|substrate carrying-in hand 1062. is, the ejecting a pressurized gas against the lower surface of the substrate (P _2). In this way, on the substrate carry-hand (1062), the substrate (P ₂₎ is a portion (or a half portion) state.

41(a) and 41(b), the substrate P ₁ is completely unloaded (transferred) from the substrate holder 1028 onto the beam unit 1050 by the substrate discharging hand 1072 (transferred). is shown. Here, _{even after the board|substrate P 1} is carried out from the board|substrate holder 1028, the board|substrate holder 1028 is continuing blowing out pressurized gas.

In parallel with the carrying-out operation of the substrate P ₁ , in the substrate carrying-in apparatus 1060 , the substrate carrying-in hand 1062 is driven in the +X direction at high speed and at high acceleration (eg, 1 G or more), , retreat from the lower side of the substrate P _{2 .} If the substrate carry-hand 1062, the evacuation from the lower side of the substrate (P _2), the substrate (P ₂₎ is, in the sense that the end vicinity of the -X side is held by a holding suction pads (1084b) of the pair, It is left above the substrate holder 1028 .

Here, the board|substrate carrying-in bearer apparatus 1082b is spaced apart in a Y-axis direction, and is arrange|positioned, From the point which adsorb|sucks hold|maintains two points spaced apart in the Y-axis direction among the ends on the -X side of the board|substrate P, board|substrate carrying-in It can be said that the movement direction at the time of retraction of the hand 1062 is the direction which opposes the board|substrate carrying-in bearer apparatus 1082b. "The direction opposite to the substrate carry-in bearer device 1082b" refers to a direction opposite to the end (-X side here) of the substrate P held by the substrate carry-in bearer apparatus 1082b (here, the +X side). is the meaning of

And, FIG. 42 (a) and as shown in Fig. 42 (b), when the substrate carry-hand (1062) is completely retracted from the lower side of the substrate (P _2), the substrate (P _2), the holding pad (1084b) Free fall is started by gravity (self-weight) except for the part which is adsorbed and held by . At this time, the substrate P _{2 is prevented from falling rapidly by air resistance between the back surface of the substrate P 2} and the upper surface of the substrate holder 1028 , and gently (with an acceleration smaller than the gravitational acceleration) of the substrate P 2 . It falls on the holder 1028 . Further, in parallel with the falling operation of the substrate (P _2), maintains the pad (1084b), each of the substrate carry bearer device (1082b) of a pair at the same time drop (move in the -Z direction).

The means for lowering the holding pad 1084b is not particularly limited, for example, position control in the Z-axis direction may be performed using a driving device such as a motor, or in the Z-axis direction using an air cylinder or the like. Load control (e.g., force (+Z direction) that resists gravity to raise the holding pad 1084b) is smaller than the downward force (-Z direction) due to the weight of the substrate P control) may be performed. Moreover, the holding pad 1084b is removed (zero) by the force in the +Z direction acting on the holding pad 1084b of the substrate carrying-in bearer device 1082b, after adsorbing and holding the back _{surface of the substrate P 2 .} It may be free-fall with the substrate (P _2).

The substrate carry bearer device in parallel with the fetch operation of the substrate (P ₂₎ using (1082b), a plurality of the balance beam (1052) each of which, to stop the ejection of the pressurized gas. Further, the substrate carry-out device 1070, the substrate carry-out hand 1072 from the back surface together with the box release the suction of the substrate (P ₁₎ by (Fig. 42 (a) in not shown), the substrate (P ₁₎ The board|substrate carrying-out hand 1072 is driven downward so that it may be spaced apart. Thereby, the board|substrate P _{1 is} mounted on the some balance beam 1052. In addition, the substrate (which will be the deceleration after the evacuation from the lower side of the substrate (P ₁₎₎ (P ₂₎ to pass after the substrate holder 1028, the substrate carry-hand 1062 is, X + is driven in the direction.

Further, as at the time of fetch operation (free-fall) of the substrate holder 1028 in the above-mentioned substrate (P _2), shown in Figure 48, surrounding the outer periphery of the substrate holder 1028, and the height position (Z By arranging a frame-like member 1029 (or a control wall) whose axial position) is set higher than the upper surface of the substrate holder 1028 , the air between the substrate _{P 2 and the substrate holder 1028 is evacuated} difficult to (to form air pockets) may be adjusted to the falling speed of the substrate (P _2). Moreover, you may control the generation|occurrence|production of the said air pool positively by controlling the ejection of air from the upper surface of the substrate holder 1028, and suction of air.

43(a) and 43(b), the holding pad 1084b of each of the pair of substrate carrying-in bearer devices 1082b is lowered, and the cutout 1028b of the substrate holder 1028 (Fig. 29(a)). Reference) is shown in a partially inserted state. Here, the substrate P ₂ (excluding the portion held by the holding pad 1084b) naturally falls on the substrate holder 1028 by its own weight, but from the upper surface of the substrate holder 1028 _{, pressurized gas is ejected, and the back surface of the lowered substrate P 2} does not contact the upper surface of the substrate holder 1028 by the positive pressure of the pressurized gas. Thus, via the gap between the substrate (P ₂₎ it is a minute floating state is held in the substrate holder (1028).

In this state, by a substrate stage apparatus 1020 (a substrate holder 1028 or a substrate table 1024) or a substrate position measuring apparatus (not shown) formed outside the substrate stage apparatus 1020, the substrate stage apparatus _{The position of the substrate P 2} with respect to 1020 (or substrate holder 1028 ) is measured. Based on the measurement result, the holding pad 1084b of each of the pair of board|substrate carrying-in bearer apparatuses 1082b is independently driven in the X-axis direction. Thereby, the position of the X-axis direction and the θz direction of _{the substrate P 2} with respect to the substrate stage apparatus 1020 (or the substrate holder 1028 ) is corrected.

In parallel with the position correction operation (fine alignment operation) of the substrate P _{2 , in the port portion, the beam unit 1050 on which the substrate P 1} is mounted is driven in the +X direction, and a substrate unloading apparatus ( The alignment pad 1078 of 1070 is driven in the -X direction, and is positioned at a position opposite to the center of the _{substrate P 1 .}

Thereafter, as shown in FIGS. 44(a) and 44(b), the ejection of pressurized gas from the substrate holder 1028 is stopped, and the substrate P ₂ lands on the upper surface of the substrate holder 1028 ( contact). In this manner, dropping of the present embodiment, the substrate holder due to the landing to 1028 to carry out accurate positioning (fine alignment) of the substrate (P _2), a low friction (injured) state just before the substrate (P ₂₎ when, the falling (the landing), there is no need to take into account the position and orientation, also, the substrate (P ₂₎ after landing of the substrate (P _2), the relocation, there is no possibility cause it is necessary to (reload).

In addition, the substrate (P ₂₎ is a chamber of the substrate holder 1028, from one (for the example, several tens of micrometers to hundreds of micrometers), the gap is formed where smiling between the substrate holder 1028, a temporary fall in Since the operation is stopped, it is possible to suppress the occurrence of local air stagnation between the substrate _{P 2 and the substrate holder 1028 .} Therefore, when maintaining the substrate (P ₂₎ on the substrate holder 1028, it is possible to suppress deformation of the substrate (P _2). Further, when mounting the substrate (P ₂₎ on the substrate holder 1028, by controlling the location or time of the ejection stop of the pressurized gas from the substrate holder 1028, and further a substrate in the substrate holder 1028 by a combination of vacuum of (P _2), it may suppress the deformation of the substrate (P _2).

Further, in the substrate carry bearer device (1082b), holding pad (1084b) are, it is possible to carry out the substrate holder positioning (fine alignment) of the Y-axis direction on the (1028) of the substrate (P ₂₎ of the import destination It may be comprised so that a micro drive is possible in the Y-axis direction so that it may be. In addition, in the present embodiment, the holding pad 1084b is configured to be driven only in the X-axis direction with respect to the horizontal plane, but in reality, the substrate P ₂ is microrotatable in the θz direction. With respect to the post of the Z actuator 1086z (refer to Fig. 29(b)) by deformation or the like, it is possible to slightly displace in the θz direction and in the Y-axis direction.

In the substrate stage apparatus 1020 , when the substrate P ₂ is placed on the substrate holder 1028 , the substrate holder 1028 _{adsorbs and holds the substrate P 2} , and moves to a predetermined exposure start position. Description of the operation of the substrate stage apparatus 1020 at the time of the exposure operation with respect to the substrate P _{2 is omitted.}

In addition, in parallel with the suction holding operation, the substrate carry-out device (1070) of the substrate (P ₂₎ by the substrate holder 1028, an alignment pad 1078 is driven increases, in the back surface of the substrate (P ₁₎ The central part of the body is adsorbed and held from below. Moreover, when the alignment pad 1078 _{adsorbs and holds the substrate P 1} , pressurized gas is ejected from each of the plurality of balance beams 1052 , whereby the substrate P ₁ floats on the plurality of balance beams 1052 . do. Then, by driving the alignment pad 1078 in the +X direction, the board|substrate P ₁ is moved to the board|substrate exchange position with the external conveyance apparatus 1100. At this time, in a predetermined place, you may correct the position (position of X-axis and Y-axis direction, and attitude|position of (theta)z direction) of the _{board|substrate P 1 in the horizontal plane by the alignment pad 1078.}

45( a ) and 45 ( b ) show a state in which the substrate P ₁ is positioned at a substrate exchange position with the external transfer apparatus 1100 . In the substrate exchange position, the alignment pad 1078 of the substrate carry-out device (1070), together with the box release the suction of the substrate (P _1), it is driven to drop away from the substrate (P _1).

Thereafter, while the robot hand of the external transfer device 1100 moves in the -X direction at a height position lower than the upper surface of the plurality of balance beams 1052 , it rises and the substrate P _{1 on the plurality of balance beams 1052 .} ) from below. The plurality of balance beams 1052 stop blowing of the pressurized gas.

The robot hand of the external transfer apparatus 1100 holding the exposed substrate P ₁ moves in the +X direction and withdraws from the port, as shown in FIGS. 46A and 46B . In the port part, after the beam unit 1050 (plural balance beams 1052) moves in the -X direction in order to avoid contact with the board|substrate carrying-in hand 1062, the board|substrate carrying-in hand 1062 is driven downward.

After the exposed substrate P ₁ is transferred to an external device (not shown) such as a coater/developer, for example, the robot hand of the external transport device 1100 is shown in Figs. 47(a) and 47(b). As shown in , the substrate P ₂ , which is to be exposed next to the substrate P ₂ , is held and moved toward the port portion. Moreover, in the port part, while the board|substrate carrying-in hand 1062 moves below the some balance beam 1052, the some balance beam 1052 moves in the +X direction, and the external conveyance apparatus 1100 It is positioned at the substrate receiving position for receiving the _{substrate P 3} from the robot hand of Thereby, it returns to the state shown in FIG. 31(a) and FIG. 31(b) at the beginning.

According to this embodiment demonstrated above, since it carries in on the substrate stage apparatus 1020 by making the board|substrate P of carrying-in object fall freely, for example, for receiving the board|substrate P from the board|substrate carrying-in apparatus 1060. Compared to the case of using a device (eg, a lift pin device, etc.), the device configuration is simple. Moreover, since there are few movements of the movable member at the time of the board|substrate transfer operation|movement with respect to the board|substrate carrying-in apparatus 1060 to the board|substrate holder 1028, it becomes possible to carry in the board|substrate P quickly. Moreover, since dust can be suppressed compared with the case where a lift pin apparatus etc. are used, for example, adhesion of the dust to the board|substrate P can be suppressed.

Moreover, when conveying the apparatus for receiving the board|substrate P, such as a lift pin apparatus, from the board|substrate carrying-in apparatus 1060, or the board|substrate P to the board|substrate stage apparatus 1020, for example, the board|substrate P It is not necessary to form in the substrate holder 1028 a hole (or concave portion) for accommodating a member to be placed (so-called substrate tray or the like). Therefore, almost the entire surface of the upper surface of the substrate holder 1028 can be flattened except for minute holes for gas ejection and gas suction. Thereby, plane calibration of the board|substrate P mounted on the board|substrate holder 1028 can be performed reliably, and exposure precision improves. Moreover, since it is not necessary to form a hole, a recess, etc. on the board|substrate holder 1028, the change of the reflectance and reflection amount of exposure light resulting from the hole and recessed part can be suppressed. Therefore, the transfer nonuniformity of the mask pattern with respect to the board|substrate P can be suppressed.

Moreover, when free-falling the board|substrate P of carrying-in object, it is a board|substrate by a pair of board|substrate carrying-in bearer apparatus 1082b formed separately from the board|substrate carrying-in apparatus 1060 which supported the board|substrate P at the time of board|substrate carrying-in. Since the position in the horizontal plane of (P) is restrained, the position shift in the horizontal plane of the board|substrate P by the influence of the air resistance at the time of a free fall can be suppressed. Therefore, the board|substrate P can be dropped on the board|substrate holder 1028 reliably.

In addition, since the free fall of the substrate P is temporarily stopped before the substrate P is placed on the substrate holder 1028, when the substrate P is adsorbed and held by the substrate holder 1028, the substrate ( It is possible to suppress the occurrence of so-called air pooling between P) and the substrate holder 1028 and the deformation of the substrate P resulting from air pooling. Moreover, when dropping the board|substrate P on the board|substrate holder 1028, since the board|substrate holder 1028 functions like an air bearing, the impact at the time of a fall can be suppressed.

Moreover, in order to position the board|substrate with respect to the board|substrate holder 1028 with a pair of board|substrate carry-in bearer apparatus 1082b before mounting the board|substrate P on the board|substrate holder 1028, once a board|substrate The possibility that the need to perform rearrangement (reload) of the board|substrate P mounted on the holder 1028 (for example, shift|offset|difference of a mounting position) arises can be reduced. Therefore, the carrying-in operation speed of the board|substrate P improves, and the overall throughput improves.

Moreover, in recent years, there exists a tendency for the board|substrate P to be thinner and lighter. When the substrate P becomes thinner and lighter, the force in the downward direction in the gravitational direction acting on the substrate P decreases, so that the substrate P is free-falling by its own weight and transmitted to the substrate holder 1028. can be reduced. Thus, the board|substrate exchange apparatus 1040 which concerns on this embodiment is especially suitable for exchange of the large size board|substrate P reduced in thickness and weight. Moreover, in this embodiment, the sudden fall of the board|substrate P is suppressed by the air resistance which acts on the board|substrate P at the time of fall, and by this, the board|substrate P at the time of being mounted on the board|substrate holder 1028. From the viewpoint of suppressing impact, it is preferable that the upper surface of the substrate holder 1028 has many flat regions in which no recesses, holes, or the like are formed.

In addition, the structure of the said 3rd Embodiment can be changed suitably. For example, in the third embodiment, as shown in Fig. 29(a), a cutout 1028a is formed on the +X side of the substrate holder 1028, and a substrate carrying-out bearer device ( Although a part of the holding pad 1084a of 1082a was accommodated, it is not limited to this, For example, the board|substrate carrying-out bearer apparatus 1082a is omitted, and a pair of board|substrates are arrange|positioned on the -X side of the board|substrate holder 1028. You may make it the carry-in bearer apparatus 1082b assist board|substrate carrying-out operation|movement.

That is, in the exchange operation of the substrate P on the substrate holder 1028 according to the present modification, first, the substrate carry-in bearer device 1082b grips the substrate P and moves the substrate holder 1028 in the +X direction in a non-contact manner. When the substrate P is offset (overhanged) from the substrate holder 1028 (see FIGS. 37(a) and 37(b)), the ejection of the pressurized gas from the substrate holder 1028 is stopped, The substrate P is placed on the substrate holder 1028 again. The substrate carry-in bearer device 1082b cancels the adsorption of the substrate P, descends slightly, moves again in the -X direction, then rises high and waits in the air above the substrate holder 1028 for a new substrate P Suction gripping from the bottom. In the board|substrate carrying-out apparatus 1070, the board|substrate carrying-out hand 1072 adsorption-holds from below the edge part vicinity of the board|substrate P offset and mounted on the board|substrate holder 1028 (FIG.38(a) and FIG.38(b)) ) Reference). Thereafter, pressurized gas is ejected from the substrate holder 1028 and the balance beam 1052 , and the substrate P is carried out to the port portion in a non-contact state except for the portion held by the substrate carrying hand 1072 . In this way, according to the present modification, since the substrate unloading bearer device 1082a is omitted (the assist device for carrying in the substrate and the assist device for unloading the substrate are shared in common), the structure is simplified and the cost can be reduced. have.

In addition, the alignment pad 1078 may be configured to rotate the substrate P in the θz direction, for example, by 90°. In this case, in the port part, since it is possible to change the direction of the board|substrate P using the alignment pad 1078 (make a longitudinal direction parallel to an X-axis or a Y-axis), for example, an external conveyance apparatus A state in which the substrate P conveyed from 1100 in a state in which the longitudinal direction is parallel to the X axis (horizontal elongated state) is rotated, for example, by 90° in the port portion, so that the longitudinal direction is parallel to the Y axis. (vertically long state). Therefore, when carrying in the board|substrate P into the substrate stage apparatus 1020, carrying in the board|substrate P in a horizontally long state, and carrying in in a vertically long state can be arbitrarily selected. Moreover, it is also possible to make the board|substrate P conveyed to the port part in a vertically elongate state by the external conveyance apparatus 1100, rotate 90 degrees in a port part, and to make it into a horizontally long state. In this case, the branch of the robot hand of the external transfer device 1100 can be shortened.

Moreover, in said 3rd Embodiment, using the holding pad 1084b of each of a pair of board|substrate carrying-in bearer apparatus 1082b arrange|positioned spaced apart in the Y-axis direction, 2 spaced apart in the Y-axis direction of the board|substrate P. Although the opening position was maintained, the holding position of the board|substrate P is not limited to this, For example, you may hold|maintain the board|substrate P at one position with one holding pad 1084b. In this case, in order to secure a contact area between the holding pad 1084b and the substrate P, the holding surface of the holding pad 1084b may be shaped to extend in the Y-axis direction.

Moreover, in the said 3rd Embodiment, although the board|substrate carry-in bearer apparatus 1082b is comprised so that the -X direction side edge part of the board|substrate P may be restrained (maintained), it is not limited to this. For example, the +Y direction side edge part or the -Y direction side edge part, the -X direction side edge part and the +Y direction side edge part, or the -X direction side edge part and the -Y direction side edge part of the board|substrate P. You may comprise so that it may restrain (maintain) wealth. The point (place) at which the substrate carrying-in bearer apparatus 1082b restrains the substrate P is set so that the operation of the substrate carrying-in bearer apparatus 1082a, the substrate carrying-in apparatus 1070, and the substrate carrying-in apparatus 1060 is not disturbed. As long as it can be installed, either of the said each edge part or each corner part may be sufficient, or any combination may be sufficient.

Further, in the third embodiment, the holding pads 1084b of each of the pair of substrate carry-in bearer devices 1082b are accommodated in the corresponding cutouts 1028b, but the present invention is not limited thereto. For example, the substrate ( Among P), you may adsorb|suck hold the part which protruded from the edge part vicinity of the board|substrate holder 1028 beforehand. In this case, it is not necessary to form the cutout 1028b in the substrate holder 1028 . In addition, since the area of the protruding portion is small, in order to secure a contact area between the holding pad 1084b and the substrate P, if the holding surface of the holding pad 1084b is formed to extend in the Y-axis direction, do. Further, when the substrate P is placed on the upper surface of the substrate holder 1028, the holding pad 1084b is sandwiched between the back surface of the substrate P and the upper surface of the substrate holder 1028, and then the holding pad 1084b ) can be removed. Also in this case, it is not necessary to form the cutout 1028b in the substrate holder 1028 . At this time, what is necessary is just to hold|maintain a part of the board|substrate P so that the board|substrate P may not move when taking out the holding pad 1084b.

Further, in the third embodiment, the substrate P to be unloaded is in an offset state (a state in which a part protrudes from the substrate holder 1028) by the substrate unloading bearer device 1082a, but is not limited thereto. Instead, the substrate holder 1028 may be tilted around the Y-axis to incline the upper surface of the substrate holder 1028, and the substrate P may be brought into an offset state by its own weight. Moreover, although the board|substrate carrying-out apparatus 1070 carried out the board|substrate P while holding|maintained the offset vicinity of the edge part of the board|substrate P, the part of the board|substrate P which protruded from the edge part vicinity of the board|substrate holder 1028 beforehand. may be adsorbed and held. Note that the operation of setting the substrate P in the offset state by the substrate carrying-out bearer device 1082a may be performed while the substrate holder 1028 is moving to the substrate exchange position (in parallel with the movement of the substrate holder 1028). do.

Moreover, in said 3rd Embodiment, although the board|substrate carrying-in apparatus 1060 conveyed the board|substrate P using the board|substrate carrying-in hand 1062 which supports the board|substrate P from below in the gravity direction, although the board|substrate P If the free fall at the time of conveyance of can be prevented, the structure of the conveyance apparatus for carrying in will not be limited to this, For example, using a well-known Bernoulli chuck etc., the board|substrate P is suspended from gravity direction upper direction. You may support it and convey it. In this case, the board|substrate P can be dropped by its own weight by canceling|releasing the suspension support of the board|substrate P by a Bernoulli chuck.

In addition, even when this Bernoulli chuck method is used, in order to constrain the position in the XY plane of the substrate P above the substrate holder 1028, it becomes a substitute for the substrate carry-in bearer device 1082b in the above embodiment. Some conveyance assist mechanism is required. As this conveyance assist mechanism, you may make it comprise the wall member for physically restricting the side surface of the board|substrate P in the peripheral part of a Bernoulli chuck, for example. Or you may make it provide in a Bernoulli chuck the mechanism which injects the air for position constraint in an XY plane with respect to the side surface of the board|substrate P.

Moreover, in the operation sequence at the time of board|substrate exchange in the said 3rd Embodiment, as shown to FIGS. 40-42, drive of the board|substrate carrying-out hand 1072 in the +X direction (by the board|substrate carrying-out hand 1072). , _{after the start of the carrying-out operation of the substrate P 1} from the substrate holder 1028/referred to as the “removing operation” of the substrate carrying-out hand 1072), driving the substrate carrying-in hand 1062 in the +X direction (substrate evacuation operation / other words fetch operation / substrate carry-in to the substrate holder (1028) of the substrate (P ₂₎ by the substrate carry-in hand 1062 from the lower side of the substrate (P ₂₎ of the imported hand 1062 hand-1062 (referred to as a "drawing-out operation"), the timing of this extraction operation is not limited to this. If accompanying with the withdrawal operation of the substrate carry-hand 1062 and controls the substrate (P _2), the operation timing so as not to contact this, both hands (1062, 1072) and the substrate (P ₁₎ to fall by its own weight, amount of hand The order of starting the extraction operation of (1062, 1072) may be either first or may be simultaneous.

Moreover, in said 3rd Embodiment, although the board|substrate holder 1028 was the structure which adsorb|sucks hold|maintains the board|substrate P, it is not limited to this, For example, you may hold|maintain the board|substrate P in a non-contact state.

Moreover, in the said 3rd Embodiment, the board|substrate carry-in bearer apparatus 1082b for constraining the position in the XY plane of the board|substrate P above the board|substrate holder 1028 is the board|substrate holder 1028 (substrate stage apparatus) 1020)), it is not limited to this, for example, the substrate carrying-in apparatus 1060 may have, or above the substrate exchange position, for example, the substrate stage apparatus 1020 or the like is accommodated. You may be suspended and supported by the frame member which comprises the chamber to do.

Moreover, in the said 3rd Embodiment, after the robot hand of the external transfer apparatus 1100 transfers the board|substrate P to be carried in to the port part, the board|substrate P is transferred by the board|substrate carrying-in apparatus 1060 to the board|substrate holder 1028. ), but it is not limited to this, and the robot hand of the external transfer apparatus 1100 conveys the board|substrate P to be carried in over the board|substrate holder 1028, and the board|substrate P is a board|substrate You may send it directly to the import bearer apparatus 1082b.

《Fourth embodiment》

Next, the fourth embodiment will be described with reference to Figs. 49(a) to 56(b). The fourth embodiment provides a substrate exchange operation in a liquid crystal exposure apparatus having a substrate stage apparatus having the same configuration as that of the substrate stage apparatus 20 (see FIG. 2 and the like) according to the first embodiment. A substrate exchange apparatus having the same configuration as that of the substrate exchange apparatus 1040 (refer to FIG. 27 and the like) in the third embodiment is used. Hereinafter, in the description of the fourth embodiment, elements having the same configuration and function as those of the first or third embodiment are denoted by the same reference numerals as those of the first or third embodiment, and the description thereof is given. shall be omitted.

49(a) and 49(b) , the substrate stage device 20 includes a coarse motion stage 24, a weight canceling device 26, an X guide bar 28, a substrate table 30, A non-contact holder 32, a pair of auxiliary tables 34, a substrate carrier 40, and the like are provided (see the first embodiment for details of each element). The substrate carrier 40 adsorbs and holds the vicinity of the four corners of the _{substrate P 1} supported by the non-contact holder 32 in a non-contact manner.

Further, the substrate exchange apparatus 1040 includes a beam unit 1050, a substrate loading apparatus 1060, a substrate unloading apparatus 1070 (the alignment pad 1078 is omitted), and a substrate assist apparatus 1080 ( For details of each element, refer to the above third embodiment). A substrate (P ₂₎ to be exposed in a next embodiment of the external transport device 1100 is formed on the robot hand, the substrate (P ₁₎ of is placed. Among the pair of Y frames 42y constituting the substrate carrier 40, the Z position of the Y frame 42y on the +X side is disposed at a position lower than the Z position of the lower _{surface of the substrate P 1 (} see Fig. 3, etc.).

In the substrate stage apparatus 20 of the fourth embodiment, the pair of substrate carrying-in bearer apparatuses 1082a and the pair of substrate carrying-in bearer apparatuses 1082b constituting the substrate assist apparatus 1080 are coarse motion stages. Although it is attached to (24) (for convenience, the same code|symbol is used), you may attach to the board|substrate table 30 (or the non-contact holder 32) similarly to the said 3rd Embodiment.

The exchange operation of the substrate P in the fourth embodiment is substantially the same as in the third embodiment. Hereinafter, it will be briefly described. Figure 50 (a) and Figure 50 (b), the conveying robot hand of the external transport device 1100 to the substrate (P ₂₎ on the upper portion of the beam port unit 1050. Next, FIG. 51 (a) and mounted in Fig. 51 (b), the robot hand has a substrate (P _2), beam unit (1050) of the external transport device 1100, as shown in (passes). Next, FIG. 52 (a) and as shown in Fig. 52 (b), the substrate (P ₂₎ for supporting a beam unit 1050, the substrate carry-in hand to move in the -X direction, the substrate carry-in device 1060 1062 rises to retrieve the substrate P ₂ on the beam unit 1050 . In parallel with this operation, in the substrate stage apparatus 20, the substrate carrying-out bearer apparatus 1082a moves the exposed substrate P ₁ relative to the non-contact holder 32 by a predetermined amount in the +X direction (offsets it). ).

Then, as Figure 53 (a) and shown in Fig. 53 (b), the substrate carry-hand (1062) is holding the substrate (P ₂₎ and starts to move (in the -X direction) to the chamber of the substrate exchange position. In parallel with this operation, in the substrate unloading apparatus 1070 , the substrate unloading hand 1072 moves in the -X direction, and the substrate stage device 20 includes the non-contact holder 32 , the substrate carrier 40 , and the like. It moves (in +X direction) to this board exchange position. Then, as shown to Fig.54 (a) and Fig.54 (b), the board|substrate carrying-in hand 1062 stops above the board|substrate exchange position. And as for the board|substrate stage apparatus 20, the board|substrate carrying-in bearer apparatus 1082b raises operation|movement. Moreover, in parallel with each said operation|movement, in the board|substrate carrying-out apparatus 1070, the board|substrate carrying-out hand 1072 holds the edge part vicinity of the +X side of _{the board|substrate P 1 offset with respect to the non-contact holder 32 from below.} (maintain adsorption).

Then, the take-off Figure 55 (a) and an exposure finished substrate (P _1), and the substrate carry-out hand 1072 is moved in the + X direction as shown in Fig. 55 (b) parts of the port. Further, the substrate carry bearer device (1082b) is, and the grip (suction) from the lower end vicinity of the -X side of the substrate (P ₂₎ on the substrate carry-hand (1062). When the substrate (P ₂₎ is held by the substrate carry bearer device (1082b), the substrate carry-hand (1062) is a substrate (P ₂₎ is retracted in the + X direction to the left chamber of the contact holder 32. In other words, when the substrate (P ₂₎ is held by the substrate carry bearer device (1082b), to release the holding of the substrate carry-hand (1062) includes a substrate (P _2).

Next, FIG. 56 (a) and release and drop to Figure 56 (b), the substrate (P _1), the substrate carry-out hand 1072 is completed, the exposure as shown in. Moreover, the board|substrate carrying-in hand 1062 is completely retracted from the sky of the board|substrate stage apparatus 20. As shown in FIG. In parallel with each of the above operations, the substrate carry-in bearer apparatus 1082b descends while holding the _{new substrate P 2} , and thereafter corrects (pre-alignment) the position of the _{substrate P 2 , and the substrate P 2} ) is guided to the suction pad 44 (see FIG. 3 ) of the substrate carrier 40 . The substrate carry-in bearer device 1082b holds and lowers the substrate P ₂ , thereby supporting the substrate P ₂ by the non-contact holder 32 , and correcting the position of the _{new substrate P 2 in this state (} After carrying out pre-alignment), you may make it guide to the suction pad 44 (refer FIG. 3) of the board|substrate carrier 40.

Here, as shown in Figs. 87(a) and 87(b), the substrate P is floating from the non-contact holder 32 (apart from the upper surface of the non-contact holder 32) in the Z-axis direction. To the extent possible, the Z position of the holding pad 1084b is preset so that the substrate P is transferred from the holding pad 1084b to the suction pad 44 . The substrate P may be transferred from the holding pad 1084b to the suction pad 44 in a state in which the substrate P is floating by the air supplied from the non-contact holder 32 in the Z-axis direction, or non-contact Not the air supplied from the holder 32, but air interposed between the lower surface of the substrate P and the upper surface of the non-contact holder 32, so-called air pooling, causes the substrate P to float above the non-contact holder 32 and In the existing state, you may transfer the board|substrate P. Moreover, since the board|substrate P just needs to float, when the board|substrate P is floated by air stagnation, not the non-contact holder 32 but an adsorption-type holder may be sufficient. In addition, it is not limited to this embodiment that the substrate P is floated above the non-contact holder 32 by air interposed between the lower surface of the substrate P and the upper surface of the non-contact holder 32, so-called air stagnation. It is also applicable to all the embodiments of the embodiments described above and the embodiments described later. In the present embodiment, since the substrate P is transferred from the holding pad 1084b to the suction pad 44 by the lowering of the holding pad 1084b, the upper surface of the holding pad 1084b is more The upper surface is arranged on the +Z side. Thereby, when the holding pad 1084b holding the board|substrate P is moved in -Z direction, the lower surface of the board|substrate P will contact the suction pad 44, and the board|substrate P will float from the non-contact holder 32. With one state being maintained, the member supporting the substrate P from below is automatically switched from the holding pad 1084b to the suction pad 44 . Since the substrate P is transferred from the holding pad 1084b to the suction pad 44, the positions held by the suction pad 44 and the holding pad 1084b in the substrate P are different from each other. . In addition, the holding pad 1084b holding the substrate P is a substrate ( You may stop sucking air from the lower surface of P). Further, air may be supplied from the holding pad 1084b to the lower surface of the substrate P to actively cancel the adsorption of the substrate P to the holding pad 1084b. In addition, shortly before the lower surface of the substrate P comes into contact with the suction pad 44, that is, before the substrate P is transferred from the holding pad 1084b to the suction pad 44, from the suction pad 44 to the substrate ( You may make it suppress the damage|damage of the board|substrate P by supplying air with respect to the lower surface of P), the shock at the time of the suction pad 44 and the board|substrate P contacting is relieve|moderated.

In addition, the operation|movement when the holding pad 1084b of the board|substrate carrying-in bearer apparatus 1082b transfers the board|substrate P to the suction pad 44 of the board|substrate carrier 40 is not limited to this. That is, since the transfer of the substrate P becomes possible when the holding pad 1084b and the suction pad 44 are relatively moved in the Z-axis direction, the suction pad 44 (substrate P) of the substrate carrier 40 is ) may move in the Z-axis direction to receive the substrate P from the holding pad 1084b (the side that delivers the substrate P) of the substrate carry-in bearer apparatus 1082b. In this case, the holding pad 1084b may be stationary, or both the suction pad 44 and the holding pad 1084b move in the Z-axis direction (the holding pad 1084b descend|falls, and the suction pad 44 rises) ) can be done. In other words, if the movable range of the holding pad 1084b in the Z-axis direction and the movable range of the suction pad 44 overlap at least partially, the substrate ( The transmission of P) is possible. Moreover, from the state in which one of the holding pad 1084b and the suction pad 44 hold|maintained the board|substrate P, through the state which both hold|maintained the board|substrate P, the state in which the other hold|maintains the board|substrate P is However, it is not limited to this. From the state in which one of the holding pad 1084b and the suction pad 44 hold|maintained the board|substrate P, it is good also as the state which hold|maintains the board|substrate through the state which is not hold|maintained to either. This is due to the air supplied from the non-contact holder 32 or the air pooling on the lower surface of the substrate P, so that even if the substrate P is not supported by both the holding pad 1084b and the suction pad 44, the substrate P ) collides with the non-contact holder 32 and is not damaged. However, when the substrate P is not supported by both the holding pad 1084b and the suction pad 44, the position of the floating substrate P is not defined, so more carefully the It is better to correct the position (pre-alignment).

Also in the fourth embodiment described above, the same effects as those in the third embodiment can be obtained. 57(a) and 57(b), in the substrate stage apparatus 20, the substrate carry-in bearer apparatus 1082b is attached to the substrate carrier 40, and the substrate carry-in bearer apparatus ( 1082b), the substrate carrier 40 may hold the substrate P (the adsorption pad may be made common). In this case, the two suction pads 44 (refer to FIG. 3) on the -X side attached to the substrate carrier 40 can be omitted. Moreover, although it is not shown in figure, you may attach the board|substrate carrying-out bearer apparatus 1082a to the board|substrate carrier 40 similarly. In this case, the two suction pads 44 on the +X side mounted on the substrate carrier 40 can also be omitted. In this case, the substrate carrying-in bearer device 1082b is relatively driven upward with respect to the substrate carrier 40, and the vicinity of the -X side end portion of _{the substrate P 2 on the substrate carrying-in hand 1062 is gripped from below (} suction), and when the substrate carry-in hand 1062 is retracted from the lower side of the substrate (P _2), the substrate (P ₂₎ by the substrate carry bearer device (1082b) is driven downwardly to the non-contact sensible holder.

《Fifth embodiment》

Next, a fifth embodiment will be described with reference to FIGS. 58 to 65 . The fifth embodiment differs from the fourth embodiment in a part of the structure of the substrate stage apparatus and a part of the structure of the substrate exchange apparatus. Hereinafter, in the description of the fifth embodiment, elements having the same configuration and functions as those of the fourth embodiment are denoted by the same reference numerals as in the fourth embodiment, and description thereof is omitted.

The substrate carrier 2040 included in the substrate stage apparatus 2020 according to the fifth embodiment includes a point formed in a U-shape opened to the +Y side, and a suction pad 2044 for holding the substrate P by suction. It differs from the fourth embodiment in that it is attached to a pair of Y frames 42y. Moreover, the board|substrate carrier 2040 is supported from below by the air floating unit 238 similarly to the board|substrate stage apparatus 220 shown to FIG.13(a), FIG.13(b). The X frame 42x on the -Y side of the substrate P is mounted at a higher position than the substrate P. Moreover, the pair of board|substrate carrying-in bearer apparatus 1082b is arrange|positioned at predetermined intervals in the X-axis direction so that the edge part vicinity of the +X side of the board|substrate P, and the edge part vicinity of -X side may be hold|maintained, respectively. A pair of board|substrate carrying-in bearer apparatus 1082b is attached to the coarse motion stage (not shown). Operation itself of the board|substrate carry-in bearer apparatus 1082b is the same as that of the said 4th Embodiment.

Here, the substrate carrier 2040 moves relative to the non-contact holder 32, the air floating unit 36, and the air floating unit 238 in the horizontal plane, but the substrate carrying-in bearer apparatus 1082b is the substrate P ) is disposed outside the movement trajectory of the substrate carrier 2040 (and the substrate P) holding the . Specifically, a pair of board|substrate carrying-in bearer apparatus 1082b is spaced apart in an X-axis direction, and is arrange|positioned, and is arrange|positioned between the air floating unit 36 and the air floating unit 238, respectively. Since the holding pad 1084b (refer to Fig. 29(b)) of the substrate carry-in bearer apparatus 1082b is movable in the Z-axis direction, the substrate carrier 2040 is relative to the non-contact holder 32 or the like in a horizontal plane. When moving, the holding pad 1084b is controlled to move in the -Z direction and retract out of the movement trajectory of the substrate carrier 2040 (and the substrate P).

In the substrate exchange apparatus 1040, the beam unit 2050A and the substrate unloading apparatus 2070A disposed in the port portion (the +X side of the substrate exchange position) are the driving apparatus 2098 (shown in FIGS. 59 to 64). is omitted) to enable movement in the X-axis and Y-axis directions. Moreover, the board|substrate exchange apparatus 1040 has the beam unit 2050B and the board|substrate carrying-out apparatus 2070B also on the -Y side of the board|substrate exchange position. The configuration of the beam units 2050A, 2050B, and the substrate carrying-out apparatuses 2070A, 2070B is the beam unit 1050 and the substrate carrying-out apparatus 1070 of the fourth embodiment, respectively (Figs. 30(a) and 30, respectively). (b) and the like) are approximately the same.

Next, the board|substrate exchange operation|movement which concerns on this 5th Embodiment is demonstrated. In Fig. 59, the non-contact holder 32 is positioned at the substrate exchange position. In this state, when the substrate carrier 2040 is driven to the -Y side, as for the exposed substrate P ₁ , the half region on the -Y side is supported by the auxiliary table 34 on the -Y side from below. In parallel with this operation, the substrate carry-hand 2062 and is conveyed to a substrate (P ₂₎ in the port unit. A substrate (P ₂₎ carrying the port unit by a robot hand (not shown) of the external transport device, the substrate carry-hand 2062 is delivered produces from below.

Then, as shown in Figure 60, the substrate carry-hand (2062) is a substrate (P ₂₎ is conveyed towards the chamber of the contact holder 32. In parallel with this, the board|substrate carrying-out hand 2072B of the board|substrate carrying-out apparatus 2070B holds _{the edge part vicinity of the -Y side of the board|substrate P 1} , and moves in the -Y direction in that state. Moreover, in parallel with the movement of the board|substrate carrying out hand 2072B (substrate P ₁ ), the board|substrate carrier 2040 moves in the +Y direction (direction opposite to the _{board|substrate P 1 ).} Further, in parallel with each of the above operations, the beam unit 2050A and the substrate unloading apparatus 2070A move integrally in the -Y direction.

Then, as shown in Figure 61, the substrate carry bearer device (1082b) is driven increases, the absorption of two points of the edge vicinity of the + Y side of the substrate (P ₂₎ on the substrate carry-in hand 2062 from the lower side keep The substrate carrier 2040 is returned to a normal position (a position capable of holding the substrate P on the non-contact holder 32 ), and in this state, the substrate carrier 2040 and the substrate P ₁ are in the XY plane. There are no overlapping positions.

Then, as shown in FIG. 62, the board|substrate carrying-in hand 2062 retracts in the +X direction from the upper space of the non-contact holder 32 at high speed and high acceleration. Substrate (P ₂₎ is, because it is sucked and held on the substrate carry bearer device (1082b), it is left in the chamber of a non-contact holder (32). In parallel with the above operation, the beam unit 2050A and the substrate unloading apparatus 2070A move in the -X direction. As for the beam unit 2050A and 2070A of board|substrate carrying out apparatuses, the height position is set so that it may pass (not to contact) the sky of the air floating unit 238 on the +X side, as shown in FIG. 62, in the board|substrate carrying-out apparatus 2070A, 2072A of board|substrate carrying-out hands move to -X direction.

Here, the acceleration at the time of retraction of the board|substrate carrying-in hand 2062 is set to the acceleration faster than the descending acceleration (1 G or less) of the board|substrate P, for example, about 3 G.

Then, holding the substrate (P _1), the substrate carry-out hand (2072A) is completed, the exposure as shown in Figure 63 and move in the direction of + X. The beam units 2050A, 2050B are set in height positions such that the height positions of the upper surfaces are approximately equal (see FIG. 65 ), and the substrate P ₁ is a plane formed by the beam units 2050A and 2050B guide surface). When the substrate P ₁ is supported by the beam unit 2050A, the beam unit 2050A and the substrate carrying-out apparatus 2070A move in the +X direction. In parallel with the respective operations, the substrate stage device (2020), the substrate carry bearer device (1082b) is held (maintained), the substrate (P ₂₎ descends in a state.

Then, as shown in Figure 64, and moves the beam unit (2050A) and the substrate carry-out device (2070A) holding the substrate (P ₁₎ in the + Y direction. In addition, the beam unit 2050A and the board|substrate carrying-out apparatus 2070A may move to +X direction as it is, and may carry out the board|substrate P ₁ toward an external apparatus. In parallel with the above operation, in the substrate stage apparatus 2020, the substrate carry-in bearer apparatus 1082b transfers the substrate P ₂ to the suction pad 2044 of the substrate carrier 2040, and the non-contact holder 32 comprises: The substrate P ₂ is supported in a non-contact manner from below. In this state, the substrate carrier 2040 and the non-contact holder 32 move to a predetermined exposure start position.

Also in the fifth embodiment described above, the same effects as those in the third embodiment can be obtained. In addition, since moving the substrate (P ₁₎ and the substrate carrier 2040 during operation out of the substrate (P ₁₎ in the opposite direction to each other, it is possible to quickly carry out the operation out of the substrate (P _1).

In addition, in the said 5th embodiment, the board|substrate P (substrate P ₂ ) to be carried in is carried in by moving from the +X side to the -X side (in the -X direction), and the substrate P to be carried out ( substrate (P ₁₎₎ is, after the shift movement in the -Y direction, and moves in the + X direction and + Y direction, but is to be carried out of the same place and brought, not limited thereto, for example, the substrate While carrying in (P) from the +X side to the -X side (in the -X direction), you may carry it out in the -Y direction, or the substrate P is carried in from the -Y side to the +Y side (in the +Y direction) You may take it out in the -Y direction together with the box. In addition, a new substrate (P) (the substrate (P _2)), phage, and although the timing that comes back to that substrate carrier 2040 is + Y direction in which the drops substrate carry bearer device (1082b) almost simultaneously, either It doesn't matter which comes first However, when the descent|falling of the board|substrate P is first, when the board|substrate carrier 2040 returns to a normal position, it is necessary to be made so that the suction pad 2044 and the board|substrate P may not contact.

《Sixth Embodiment》

Next, the sixth embodiment will be described with reference to Figs. 66(a) to 70(b). In the sixth embodiment, replacement of the substrate P in a liquid crystal exposure apparatus having a substrate stage apparatus having the same configuration as that of the substrate stage apparatus 520 (refer to FIG. 21 and the like) according to the modification of the second embodiment Operation WHEREIN: The board|substrate carry-in bearer apparatus of the same structure as the board|substrate carry-in bearer apparatus 1082b (refer FIG. 29(a), FIG. 29(b), etc.) in said 3rd Embodiment is used. Hereinafter, in the description of the sixth embodiment, elements having the same configuration and function as those of the second or third embodiment are denoted by the same reference numerals as those of the second or third embodiment, and the description thereof is given. shall be omitted.

66(a) and 66(b) , the substrate stage apparatus 3520 has a substrate carrier 3540 formed in a U-shape that opens to the -X side in plan view. The substrate carrier 3540 holds near the end of the substrate P supported by the non-contact holder 32 . In the scan exposure operation, when the substrate carrier 3540 moves in the X-axis direction, the substrate P moves on the guide surface formed by the non-contact holder 32 and the plurality of air floating units 436 in a non-contact manner. The moving point is the same as the modified example of the second embodiment. The drive systems of the non-contact holder 32, the plurality of air floating units 436, and the substrate carrier 3540 are the same as those of the modification of the second embodiment (refer to FIGS. 21 to 25 (b) and the like) below. For this reason, description is abbreviate|omitted.

The substrate stage apparatus 3520 has a substrate carry-in bearer apparatus 3082b and a substrate carry-out bearer apparatus 3082a. Each of the bearer devices 3082a and 3082b has a fixed position in the XY plane with respect to the non-contact holder 32 (a holding pad is movable only in the Z-axis direction with respect to the non-contact holder 32). The substrate carrying-in bearer device 3082b is disposed at a position capable of holding the vicinity of the -X side end of the substrate P, and the substrate carrying-in bearer device 3082a is disposed in the auxiliary table 534 on the +X side .

Hereinafter, the substrate exchange operation in the substrate stage apparatus 3520 will be described. When the exposure operation is finished, as shown in Figs. 67 (a) and 67 (b), the substrate carrier 3540 is the exposed substrate P _{1 to} a plurality of air floating units 436 on the +X side. It moves in the +X direction while holding the _{board|substrate P 1} so that it may be supported.

Next, FIG. 68 (a) and as shown in Fig. 68 (b), the substrate carry-hand (3062) (Fig. 68 (a) in not shown) to maintain the new substrate (P ₂₎ and a non-contact holder (32) coming into the sky Moreover, the board|substrate carrying-out bearer apparatus 3082a raises, and the exposure completion board|substrate P ₁ hold|maintained by the board|substrate carrier 3540 is adsorb|sucked and hold|maintained from below. Moreover, in parallel with each said operation|movement, the board|substrate carrying-in bearer apparatus 3082b starts raising.

Then, to keep FIG. 69 (a) and the absorption edge vicinity of the -X side in Fig. 69 (b), the substrate carry bearer device (3082b) of the substrate (P ₂₎ to rise as shown in. Further, in this state, the substrate carry-in hand 3062 moves at a high speed in the + X direction, and retracted from the lower side of the substrate (P _2). In parallel with each of the above operations, the substrate carrier 3540 moves in the -X direction after releasing the adsorption holding of the _{substrate P 1 .}

Then, the drop in the Figure 70 (a), and, the substrate carry bearer device (3082b) as shown in Fig. 70 (b) that holds the substrate (P ₂₎ state. Further, the substrate carrier 3540 moves in the -X direction to return to the normal position. The substrate carry bearer device (3082b), the substrate (P _2), the suction pad 44 of the after the rough alignment in the horizontal plane within the three degrees of freedom minute-drive in the direction against the contact holder 32, the substrate carrier (3540) Transfer the substrate P _{2 .}

In the sixth embodiment described above, the same effects as in the third embodiment can be obtained. Further, the exposed substrate P ₁ is moved to a position completely retracted from above the non-contact holder 32 (on the auxiliary table 534 on the +X side), and the exposed substrate P ₁ is left there. Since only the substrate carrier 3540 is configured to return to the normal position (on the non-contact holder 32), the substrate carrying-out bearer device 3082a only performs vertical movement, and the configuration is simple. In addition, it is not limited to this, The board|substrate carrying out hand 2072B (FIG. 61) at the position where the _{exposed board|substrate P 1 is supported (overlapping) about half by the non-contact holder 32 similarly to the said 5th Embodiment.} reference) and the carrying out device (the board carrying out bearer device 3082a may be configured to be drivable in the X direction and the board carrying out bearer device 3082a may be used), and the substrate carrier 3540 is returned. Simultaneously with (moving in -X direction), you may move the exposure completion board|substrate P _{1 in the} direction opposite to the board|substrate carrier 3540 (+X direction). In this case, while being able to shorten the length of the auxiliary table 534 by the side of +X _{, since the time for retracting the board|substrate P 1} from the board|substrate carrier 3540 is halved, board|substrate exchange time is shortened.

In addition, the substrate (P ₂₎ fetch timing, the non-contact holder exposure finished substrate on a (32) (P ₁₎ the first substrate (P ₂₎ than this, disappears, does not matter at any time, the substrate carrier (3540) Non-contact holder (32 ), it is necessary to prevent the suction pad 44 of the substrate carrier 3540 _{from contacting the new substrate P 2 while the substrate carrier 3540 is returning.} In addition, the direction of carry out direction, the substrate (P ₁₎ of the substrate (P ₂₎ is not matter even from either side.

《Seventh Embodiment》

Next, a seventh embodiment will be described with reference to Figs. 71 to 75(c). The seventh embodiment is a liquid crystal exposure apparatus having a substrate stage apparatus having the same configuration as that of the substrate stage apparatus 1020 (see FIG. 27 and the like) according to the third embodiment. The structure and operation of the substrate carrying-in bearer apparatus This is different from the third embodiment. Hereinafter, in the description of the seventh embodiment, elements having the same configuration and functions as those of the third embodiment are denoted by the same reference numerals as in the third embodiment, and the description thereof is omitted.

In FIG. 71, a part of the board|substrate carry-in bearer apparatus 4082 which concerns on 7th Embodiment is abbreviate|omitted and shown. The substrate carry-in bearer device 4082 according to the seventh embodiment performs the same operation as that of the substrate carry-in bearer device 1082b (refer to Fig. 29(b)) according to the third embodiment, but the substrate P The improvement of the adsorption force of , and the improvement of the rigidity at the time of the pre-alignment (X-axis direction and θz direction) operation of the substrate P are aimed at.

The substrate carry-in bearer device 1082b (see Fig. 29(b)) according to the third embodiment has a configuration in which the holding pad 1084b is inserted into the cutout 1028b formed in the substrate holder 1028, but the substrate holder ( 1028), from the viewpoint of the holding force (planar straightening force) of the substrate P, it is preferable that the holder upper surface has a small (or no) concave portion such as a notch. On the other hand, when the notch is made small, it is necessary to also downsize a holding pad together, and there exists a possibility that the adsorption|suction force of the board|substrate P may fall. In this embodiment, as shown in FIG. 71, while the holding pad 4084 of the board|substrate carry-in bearer apparatus 4082 is thinned, the cutout (recessed part) is not formed in the board|substrate holder (not shown). The holding pad 4084 is larger than that of the third embodiment, and the adsorption force of the substrate P is improved.

Moreover, the board|substrate carrying-in bearer apparatus 4082 has the guide mechanism 4098 which makes the holding pad 4084 micro-movement only in the Y-axis direction and (theta)z direction. The exploded view of the board|substrate carrying-in bearer apparatus 4082 is shown in FIG. 72, and the conceptual diagram of the guide mechanism 4098 is shown in FIG. A joint 4082f is connected to the holding pad 4084 . The holding pad 4084 is being fixed to a trapezoidal rocking block 4082e in plan view (as viewed from the Z-axis direction) via bolts or the like. A rotating shaft 4082g protrudes from the upper and lower surfaces of the rocking block 4082e. The holding pad 4084 is attached to the main body portion 4086 via the rotation shaft 4082g, the first fine movement guide 4082b, and the second fine movement guide 4082d. The fine movement guides 4082b and 4082d include a parallel plate spring device installed between the body portion 4086 and the bearing block 4082h. A θz position control guide 4082c is attached to the main body 4086 . The θz position control guide 4082c has a pair of leaf springs, and the rocking block 4082e is inserted between the pair of leaf springs. The θz position control guide 4082c returns the rocking block 4082e to the neutral position. The holding pad 4084, the body portion 4086, and the like are integrally driven in the X-axis direction by the X linear actuator 4082a.

As shown in FIG. 73, in the guide mechanism 4098, the bearing block 4082h which supports the rotating shaft 4082g by the micro-movement guides 4082b, 4082d can micro-movement with respect to the body part 4086 in the Y-axis direction. In addition, the holding pad 4084 can freely swing at a minute angle in the θz direction with respect to the bearing block 4082h. The swingable range of the holding pad 4084 is defined by a pair of leaf springs included in the ?z position control guide 4082c.

As shown in FIG. 74, at the time of the pre-alignment operation of the board|substrate P WHEREIN: In order that a pair of board|substrate carry-in bearer apparatus 4082 rotates the board|substrate P in the θz direction, the main body portion 4086 is mutually connected. driven in the opposite direction. At this time, according to the guide mechanism 4098 (refer FIG. 73) of this embodiment, a structure is simple, and rigidity is high, and the positioning operation|movement of the board|substrate P can be performed with high precision.

The carrying-in operation|movement of the board|substrate P which concerns on 7th Embodiment is shown by FIG.75(a) - FIG.75(c). The carrying-in operation|movement of the board|substrate P is substantially the same as that of the said 2nd Embodiment. After the substrate P is transferred to the holding pad 4084 of the substrate carry-in bearer device 4082 from a substrate carrying-in hand (not shown) in the sky above the substrate holder 1028, the substrate P and the retaining pad 4084 are lowered. And the board|substrate P is non-contact-supported by the board|substrate holder 1028 via the micro clearance gap. In the seventh embodiment, a recess for accommodating the holding pad 4084 is not formed on the upper surface of the substrate holder 1028 , and the thickness of the holding pad 4084 is the same as that of the lower surface of the substrate P and the substrate. It is set thinner than the space|interval between the upper surfaces of the holder 1028.

In this state, as shown to Fig.75 (a), the pre-alignment operation|movement of the board|substrate P is implemented by the pair of holding pads 4084 being independently driven in the X-axis direction. Subsequently, as shown in FIG. When most of the adsorption and holding of the substrate P is completed, as shown in FIG. (P) evacuates (takes out) from below. Moreover, high-pressure gas may be blown off from the holding pad 4084, and the contact with the board|substrate P may be decreased, that is, friction force may be made small. Hereinafter, although it is not shown in figure, the board|substrate holder 1028 adsorb|sucks hold|maintains the whole board|substrate P. As shown in FIG.

According to the board|substrate carrying-in bearer apparatus 4082 of this 7th Embodiment, the flatness of the board|substrate holder 1028 is not impaired, maintaining the holding force of the board|substrate P. Moreover, the rigidity of the operation direction at the time of a pre-alignment operation is improved, and pre-alignment precision can be improved. You may apply the board|substrate carry-in bearer apparatus 4082 of 7th Embodiment demonstrated above to 4th Embodiment mentioned above.

《Eighth Embodiment》

Next, an eighth embodiment will be described with reference to Figs. 76 to 77(c). The eighth embodiment is a liquid crystal exposure apparatus having a substrate stage apparatus having the same configuration as that of the substrate stage apparatus 1020 (see FIG. 27 and the like) according to the third embodiment, wherein the structure and operation of the substrate exchange apparatus are It is different from the said 3rd Embodiment. Hereinafter, in the description of the eighth embodiment, elements having the same configuration and functions as those of the third embodiment are denoted by the same reference numerals as in the third embodiment, and the description thereof is omitted.

The substrate stage apparatus 5020 has a substrate carrying-out bearer device 5082a in the vicinity of the +X side edge of the substrate holder 1028, and is located in the vicinity of the -X side edge of the substrate holder 1028. It has a board|substrate carrying-in bearer apparatus 5082b. The configuration of the bearer devices 5082a and 5082b is substantially the same as that of the substrate carry-in bearer device 4082 (refer to FIG. 71 and the like) according to the seventh embodiment. That is, each of the bearer devices 5082a and 5082b has a thin holding pad 4084 (see FIG. 71 and the like) that is movable in a predetermined stroke in the X-axis direction. Therefore, the recessed part for pad accommodation is not formed in the upper surface of the board|substrate holder 1028. As shown in FIG. The stroke in the X-axis direction of the substrate carrying-out bearer device 5082a is set longer than that of the third embodiment. Bearer apparatus 5082a, 5082b may be attached to the board|substrate table 1024, and may be attached to the coarse motion stage (not shown).

The substrate stage apparatus 5020 has a platform 5030 for carrying out. The platform 5030 for carrying out has the balance beam 5032 of several (in this embodiment, for example, 10 pieces). The plurality of balance beams 5032 are connected to the side surface of the substrate table 1024 on the +X side via a platform base 5038 . The balance beam 5032 is a member of the same function, except for the point different in length from the balance beam 1052 (refer FIG. 28) of 3rd Embodiment mentioned above. The Z position of the upper surface of the balance beam 5032 is set to be substantially equal to (or slightly lower than) the Z position of the upper surface of the substrate holder 1028 . Moreover, the Z position of the upper surface of the balance beam 5032 is set to be substantially the same as the Z position of the upper surface of the balance beam 1052 which the beam unit 1050 (refer to FIG. 77(a)) has. The platform 5030 for carrying out may be attached to the side surface or the lower surface of the board|substrate holder 1028.

On the platform base 5038 , a plurality of illuminance sensors 5034 , a reference indicator 5036 , a reference illuminance meter (not shown), and the like (hereinafter referred to as “sensors”) are mounted. The Z position of the upper surface of the sensors is set lower than the Z position of the upper surface of the balance beam 5032 . Including a plurality of balance beams 5032 and sensors, the platform 5030 for carrying out moves in a long stroke within the XY plane integrally with the substrate holder 1028 in a scanning exposure operation or the like. As shown in FIG. 77(a), the bar mirror 5022 is attached to the side surface of the -X side of the board|substrate table 1024 via the mirror base 5024.

Next, the carrying out operation|movement of the board|substrate P in the board|substrate stage apparatus 5020 is demonstrated. As shown in FIG. 76, the vicinity of the both edges on the +X side of the exposed board|substrate P is gripped (held) by the board|substrate carrying-out bearer apparatus 5082a. The substrate carrying-out bearer device 5082a moves (offset) the substrate P to the +X side with respect to the substrate holder 1028 . In the offset state, the vicinity of the end of the substrate P on the +X side protrudes from the end of the substrate holder 1028 , but this protruding portion is supported by the plurality of balance beams 5032 from below. As described above, since the balance beam 5032 forms an integral system with the substrate holder 1028, the offset operation of the substrate P by the substrate carrying-out bearer device 5082a is performed after the exposure operation is finished. It can be performed in parallel with the operation in which the substrate holder 1028 faces a predetermined substrate exchange position. At this time, even if the substrate stage apparatus 5020 becomes out of control, the substrate unloading hand 1072 is configured such that the substrate unloading hand 1072 of the substrate unloading apparatus 1070 and the balance beam 5032 do not come into contact with each other. (5032) is waiting from below.

After the substrate holder 1028 is disposed at the substrate exchange position, the vicinity of the end of the +X side of the substrate P is held (held) by the substrate carrying hand 1072 (refer to Fig. 77(b)), and the substrate The point at which the board|substrate P is carried out on the beam unit 1050 by the board|substrate carrying-out hand 1072 which gripped (P) being driven in the +X direction (refer FIG. 77(c)) said 3rd Embodiment Since it is the same as , the description is omitted. In addition, since the carrying-in operation|movement of the board|substrate using the board|substrate carrying-in bearer apparatus 5082b is the same as that of the said 7th Embodiment, description is abbreviate|omitted.

According to 8th Embodiment demonstrated above, since carrying out operation|movement of the board|substrate P can be started prior to arrival to the board|substrate exchange position of the board|substrate holder 1028, a board|substrate exchange operation|movement can be implemented quickly. Moreover, the length of the balance beam 1052 which the beam unit 1050 has, and the stroke of the X-axis direction of the board|substrate carrying-out hand 1072 of the board|substrate carrying-out apparatus 1070 can also be shortened, respectively.

《Ninth Embodiment》

Next, a ninth embodiment will be described with reference to FIGS. 78 to 83 . The ninth embodiment is a liquid crystal exposure apparatus having a substrate stage apparatus having the same configuration as that of the substrate stage apparatus 5020 (see FIG. 76 and the like) according to the eighth embodiment, wherein the structure and operation of the substrate exchange apparatus are It is different from the said eighth embodiment. Hereinafter, in the description of the ninth embodiment, elements having the same configuration and functions as those of the eighth embodiment are denoted by the same reference numerals as in the eighth embodiment, and description thereof is omitted.

As shown in FIG. 78, the substrate stage apparatus 6020 according to the ninth embodiment is the substrate stage apparatus ( 5020) (refer to FIG. 76 and the like). As for a pair of board|substrate carry-in bearer apparatus 6082b, one is arrange|positioned at the +Y side of the board|substrate holder 1028, and the other is arrange|positioned at the -Y side of the board|substrate holder 1028. The substrate carry-in bearer device 6082b is the same as the substrate carry-in bearer device 4082 (see FIG. 71 and the like) according to the seventh embodiment, but the stroke of the thin holding pad 4084 in the X-axis direction is The point set longer than the seventh embodiment is different. In this embodiment, the holding pad 4084 of the board|substrate carry-in bearer apparatus 6082b is movable with a long stroke along the edge part of the +Y side (or -Y side) of the board|substrate holder 1028. In addition, the holding pad 4084 is movable with a predetermined stroke also in the Y-axis direction.

Hereinafter, the carrying-in operation|movement of the board|substrate P which concerns on 9th Embodiment is demonstrated. As shown in FIG. 80, the board|substrate P is carried in by the board|substrate carrying-in apparatus 1060 similar to the said 3rd Embodiment. 79(a) and 81, the board|substrate P mounted on the board|substrate carrying-in hand 1062 of the board|substrate carrying-in apparatus 1060 is conveyed above the board|substrate holder 1028. At this time, the point where the substrate P is offset to the +X side with respect to the substrate holder 1028 is different from the third embodiment.

Then, as shown in FIG. 81, a pair of board|substrate carry-in bearer apparatus 6082b grips (holds) the edge part vicinity of the -X side of the board|substrate P. As shown in FIG. The holding pad 4084 is disposed at a position (outside the substrate holder 1028 ) that does not overlap with the substrate P within the XY plane during exposure operation or the like, and when holding the substrate P, one The holding pad 4084 of (+Y side) is driven in the -Y direction and the holding pad 4084 of the other (-Y side) is driven in the +Y direction, respectively, so that the holding pad 4084 is connected to the substrate P It is inserted between the substrate holders 1028 . Thereafter, as shown in FIGS. In parallel with the retraction operation of this board|substrate carrying-in hand 1062, the holding pad 4084 is driven down along with the fall by the self-weight of the board|substrate P. As shown in FIG. Moreover, the holding pad 4084 is driven in the -X direction (the direction opposite to the moving direction of the board|substrate carrying-in hand 1062 at the time of a retraction operation|movement) together with a descending|falling operation|movement.

As shown in FIG. 83, on the -X side of the substrate holder 1028, a pair of edge sensors 6098 are spaced apart in the Y-axis direction, and are arrange|positioned (not shown in FIG. 78, FIGS. 80-82). The edge sensor 6098 is attached to the mirror base 5024 via an L-shaped bracket 6096 when viewed from the side, as shown in Fig. 79(a). A target 6094 is disposed below the edge sensor 6098 . The edge sensor 6098 detects a position in the X-axis direction with respect to the substrate holder 1028 at the -X side end of the substrate P inserted between the edge sensor 6098 and the target 6094 . do.

The holding pad 4084 performs a descending operation and a moving operation in the -X direction in parallel, so that, as shown in FIG. and the target 6094 . At this time, pressurized gas is ejected from the substrate holder 1028 to the lower surface of the substrate P, and the substrate P is floating on the substrate holder 1028 is the same as in the third embodiment. .

As shown in FIG. 83 , the holding pad 4084 is appropriately micro-driven in the X-axis direction and the Y-axis direction based on the output of the pair of edge sensors 6098 . Thereby, the pre-alignment operation|movement of the board|substrate P is performed. After the end of the pre-alignment operation, as shown in FIG. Implementation is the same as in the seventh embodiment.

According to 9th Embodiment demonstrated above, the stroke of the X direction of the board|substrate carrying-in hand 1062 of the board|substrate carrying-in apparatus 1060 can be shortened. In addition, by moving the holding pad 4084 and the substrate carrying-in hand 1062 in opposite directions to each other, the substrate P and the substrate carrying-in hand 1062 can be separated quickly and the total substrate exchange time can be shortened. can Moreover, it becomes possible to install the edge sensor 6098 and the target 6094 together in the substrate stage apparatus 6020, for example, compared to the case where only the edge sensor is installed in the apparatus main body 18 (refer FIG. 1), Edge detection is simple. Further, by the movement operation in the -X direction of the holding pad 4084 , the X-side end of the substrate P can be detected by the edge sensor 6098 , and the The time required for the pre-alignment operation to adjust the position is shortened.

In addition, in this embodiment, although the edge sensor 6098 detected two points of the edge part of one direction (-X side in this embodiment) of the board|substrate P, it is not limited to this, but shown in FIG. Thus, you may perform detection of the edge part by the side of 3 directions (+Y direction, -Y direction, and -X direction) of the substrate holder 1028 using a pair of edge sensors 6098, respectively. In addition, when the reference side is on the +X side, the substrate P is rotated by 180 degrees around the Z-axis at the port portion and loaded into the substrate holder 1028 .

In addition, the structures of the liquid crystal exposure apparatus, the substrate stage apparatus, the substrate exchange apparatus, etc. according to each of the first to ninth embodiments described above are examples and can be appropriately changed. Hereinafter, a modified example is demonstrated.

85(a) and 85(b), in the fourth embodiment, a pair of substrate carrying-in bearer apparatuses 1082b are provided in the upper mount portion 18a of the apparatus main body 18. It is in the form of being fixed in a suspended state. The holding pad 1084b of the substrate carry-in bearer apparatus 1082b is movable in the Z-axis and X-axis directions (or the Z-axis, X-axis, and Y-axis directions). For the structure of the substrate carrying-in bearer device 1082b, a linear actuator similar to that of the fourth embodiment may be used, for example, a known parallel link mechanism as disclosed in US Patent No. 6,516,681 may be used. In this case, it is not necessary to form a recess (cutout) for accommodating the holding pad 1084b in the non-contact holder 32 .

The second modification shown in Figs. 86(a) and 86(b) is the holding pad 1084b (refer to Fig. 29(b)) and the substrate of the substrate carry-in bearer apparatus 1082b according to the fourth embodiment. It is a form in which the holding pad 10044 which doubles as the adsorption pad 44 (refer FIG. 3) of the carrier 40 was attached to the board|substrate carrier 40. As shown in FIG. The holding pad 10044 is movable in the Z-axis and X-axis directions (or the Z-axis, X-axis, and Y-axis directions) with respect to the body portion (frame-like member) of the substrate carrier 40 . In this case, the transfer operation of the substrate P between the holding pads as in the fourth embodiment is not necessary. Since the substrate carrier 40 is equipped with a sensor (interferometer or encoder) for measuring the position of the substrate P, it is used as a pad member for carrying in a substrate and a pad member for holding a substrate as in this modified example. In this case, it is necessary to make sure that the holding pad 10044 does not shift|deviate with respect to the main body part of the board|substrate carrier 40 after posture adjustment of the board|substrate P. As an example, as shown in FIG.87(c), FIG.87(d), after attaching the suction pad 1046 to the substrate carrier 40, and transferring the board|substrate P to the non-contact holder 32, the suction By adsorbing and holding the back surface of the holding pad 10044 by the pad 1046 , the relative movement of the holding pad 10044 with respect to the substrate carrier 40 may be restricted. A method of limiting the relative movement of the body portions of the suction pad 1046 and the substrate carrier 40, mechanically locking the body portions of the suction pad 1046 and the substrate carrier 40 (e.g., the suction pad and the substrate carrier 40) 40) may be connected). After the substrate P is supported by the non-contact holder 32 in a non-contact manner, the suction pad 1046 that drives the substrate P and the substrate carrier 40 may be electrically locked. As a method of electrically locking, the driving force (electric power) may be turned off to drive the suction pad 1046 in the vertical direction so that the suction pad 1046 cannot be driven relative to the substrate carrier 40 . As another method of electrically locking, position control may be performed so that the suction pad 1046 does not shift with respect to the substrate carrier 40, and the relative positional relationship between the two may be controlled so as not to change. Moreover, you may further have a measuring system which measures the relative positional relationship of the board|substrate carrier 40 and a holding pad. Although it is assumed that the relative movement of the holding pad 10044 and the substrate carrier 40 is limited by the measurement system, it is for monitoring whether the relative positional relationship between the two is maintained within a predetermined range. Measurement by a measurement system may be performed intermittently, and you may make it perform every predetermined time.

In the third modified example shown in Figs. 88(a) and 88(b), in the fourth embodiment, the substrate stage apparatus does not have an element corresponding to the substrate carry-in bearer apparatus 1082b (see Fig. 49). is not in the form In this modified example, the substrate carrier 40 is vertically moved by a plurality of lifters 10048 mounted on the coarse movement stage 24, and the substrate P waiting in the air above the non-contact holder 32 is transferred to the substrate carrying hand ( 1062) and descends. For that purpose, the substrate carrier 40 has, for example, a shape (U-shape in plan view) without a frame member on the +X side so as not to interfere with the substrate P to be carried in. Further, the lifter 10048 may be capable of micro-movement in the XY direction, and one lifter 10048 adsorbs and fixes the back surface of the substrate carrier 40, and rotates the substrate carrier 40 around the Z axis. It may be possible to do it. In this case, rough alignment of the board|substrate P with respect to the board|substrate carrier 40 becomes possible. In this modified example, in the linear motor (voice coil motor) for driving the substrate carrier 40 minutely, as shown in FIGS. 1 and 2, the stator and the mover are arranged so as to be separable in the Z direction, The substrate carrier 40 can be easily separated and coupled from the coarse motion stage 24 or the like. In addition, in this modified example, since there is no frame member on the side of +X, among the linear motors for micro-driving the substrate carrier 40, the X linear motor is spaced apart in the Y-axis direction, and a pair, the Y linear motor, One of them is arranged on the -Y side of the substrate carrier 40 in the central portion with respect to the Y-axis direction, and micro-rotation control around the Z-axis of the substrate carrier 40 is also enabled. Moreover, similarly to the modified example shown to Fig.13 (a), the board|substrate carrier 40 is attached to the board|substrate table 30 which is vibrationally (physically) separated from the coarse motion stage 24, the air floating unit 238. placed on the top.

The fourth modification shown in Figs. 89(a) to 89(c) is a configuration different from that of the fourth embodiment in the structure of the substrate stage apparatus 10050. As shown in Figs. The substrate stage apparatus 10050 is the same as the fourth embodiment in that the member holding the substrate P (substrate carrier 10052) and the non-contact holder 32 are separated, but the substrate carrier 10052 and the non-contact holder 32 are both capable of moving with a long stroke within the XY plane, and the substrate carrier 10052 is different from each other in that the non-contact holder 32 is capable of micro-movement with respect to the non-contact holder 32 . The substrate carrier 10052 is formed in the shape of a rod extending in the Y-axis direction, and has a holding pad 10054 that adsorbs and holds the vicinity of an end portion of the substrate P on the -X side from below. The substrate carrier 10052 is placed on the air floating unit 238 attached to the substrate table 30 in a non-contact manner, and is micro-movable with respect to the non-contact holder 32 in three degrees of freedom in a horizontal plane. A pair of openings spaced apart in the Y-axis direction are formed on the holding surface of the holding pad 10054 , and the holding pad 10056 is accommodated in the opening. The holding pad 10056 is a part of the bearer device 10058 for carrying in the substrate, and is driven at least in the Z-axis direction with respect to the main body portion (rod-shaped member) of the substrate carrier 10052 . In this modification, as shown in FIG. 89(b), when the substrate carrying hand 1062 conveys the substrate P above the non-contact holder 32, the holding pad 10056 is driven upward, and the substrate ( The vicinity of the -X side end of P) is adsorbed and held. After that, as shown in the point where the substrate carrying-in hand 1062 retracts in the +X direction, and in FIG. The point is the same as that of the fourth embodiment. At this time, the upper surface of the holding pad 10056 for carrying in is positioned so that it may become a position lower than the upper surface of the holding pad 10054 for adsorption holding (so that the holding pad 10056 is separated from the board|substrate P).

The fifth modification shown in FIGS. 90A and 90B is a configuration different from the fourth embodiment in the configuration of the substrate stage apparatus 10060 . While the substrate carrier 40 (refer to Fig. 49) of the fourth embodiment was a planar view rectangular frame-like member, the substrate carrier 10062 of the present modification is a rod-shaped member extending in the Y-axis direction, and is a substrate The central portion (one point) on the -X side of (P) is adsorbed and held from below. The substrate carrier 10062 is mounted in a non-contact manner on the air floating unit 238 attached to the substrate table 30 , and is micro-movable in the three-degree-of-freedom direction in the horizontal plane with respect to the non-contact holder 32 . The substrate carrier 10062 has a plurality of encoder heads 10068 , and the movement amount information with respect to the coarse motion stage 24 is calculated|required by the encoder system using the scale 10071 attached to the coarse motion stage 24 . Moreover, the coarse motion stage 24 also has a plurality of encoder heads 10073, and movement amount information with respect to the apparatus main body 18 is calculated|required by the encoder system using the scale 10075 attached to the apparatus main body 18. . As described above, in the substrate stage apparatus 10060 of the present modification, the position information of the substrate carrier 10062 (substrate P) is transmitted to the apparatus main body 18 via a two-stage encoder system via the coarse motion stage 24 . ) is calculated based on A pair of board|substrate carrying-in bearer apparatus 10064 spaced apart in the Y-axis direction is attached to the board|substrate table 30. As shown in FIG. The substrate carry-in bearer apparatus 10064 has a holding pad 10066 that is movable at least in the Z-axis direction with respect to the non-contact holder 32 . The carrying-in operation|movement of the board|substrate P using the holding pad 10066 is the same as that of the said 4th Embodiment.

A sixth modification shown in Figs. 91, 102 (a) and 102 (b) is a bearer apparatus for carrying a substrate into a substrate stage apparatus 10070 of the type disclosed in the specification of US Patent Application Laid-Open No. 2011/0053092 ( 10072) is arranged. The substrate stage apparatus 10070 holds the substrate P by the substrate holding frame 10076 which is a frame-like member, but is the same as that of the above fourth embodiment, but a member for supporting the substrate P from below ( It differs in that the position in the horizontal plane of the air floating unit 10078a and the apex stage 10078b) is fixed. In FIG. 91 , six bearer devices 10072 for carrying in the substrate are arranged in total. However, in the substrate stage device 10070 , the substrate P is disposed on the apex stage 10078b at the time of substrate exchange. Since it is not arrange|positioned, it is possible to arrange|position the several bearer apparatus 10072 for board|substrate carrying in at the arbitrary position below the board|substrate P. The point in which the bearer apparatus 10072 for board|substrate carrying-in has the holding pad 10074 movable in the Z-axis direction at least is the same as each said embodiment and modified example. Moreover, the holding pad 10074 which can oppose the center part of the board|substrate P is movable also in the Z-axis circumferential direction. Thereby, θz rotation correction (rough alignment) of the substrate P can be performed using the holding pad 10074 . The holding pad 10074 descends to transfer the substrate P to the holding pad 10079 of the substrate holding frame 10076, and after this transfer operation to the position where the holding pad 10074 is lower than the holding pad 10079. The downward driving point is the same as in the fourth modified example. The substrate holding frame 10076 may not be provided with the holding pad 10079 holding the substrate P, as disclosed in US Patent Application Laid-Open No. 2011/0053092. The substrate holding frame 10076 may hold the substrate P by a pressing member attached via a compression coil spring.

The seventh modification shown to FIG.92(a) and FIG.92(b) in the said 5th Embodiment WHEREIN: The board|substrate carrying-in hand 1062 after transferring the board|substrate P to the board|substrate carrying-in bearer apparatus 1082b. ) has a different evacuation direction. As mentioned above, in 3rd and 4th embodiment, the board|substrate carrying-in hand 1062 is retracted in the direction opposite to the board|substrate carrying-in bearer apparatus 1082b. In this 7th modification, a pair of board|substrate carrying-in bearer apparatuses 1082b are spaced apart in the X-axis direction, and are arrange|positioned, and among the edge parts of the +Y side of the board|substrate P, two points spaced apart in the X-axis direction are adsorbed. From the viewpoint of holding, the substrate carrying-in hand 1062 is also moved in the direction opposite to the substrate carrying-in bearer apparatus 1082b, ie, to the -Y side, similarly to the third and fourth embodiments, so that the lower side of the substrate P escape from In this case, since the supporting part 1062a (refer FIG. 30(a)) on the most +Y side of the board|substrate carrying-in hand 1062 supports the board|substrate P from below until the completion|finish of a evacuation operation|movement, the board|substrate P sags. (In particular, the sag of the edge of the -Y side and the -X side of the board|substrate P) can be suppressed. Moreover, although the branch 1062a blows out air with respect to the board|substrate P in order to support the board|substrate P in a non-contact manner, the blowing direction may blow in the direction normal to the board|substrate P, and air to the board|substrate P You may make it blow out air from the oblique direction with respect to the board|substrate P in order to increase the area from which this is blown.

In the eighth modification shown in FIGS. 93(a) and 93(b), in the fourth embodiment, the substrate stage apparatus 10080 has the same carrying-out platform 10082 as that of the eighth embodiment, Furthermore, it is a form in which the platform 10082 for carrying out also has the board|substrate carrying out hand 10084. The platform 10082 for carrying out is connected to the non-contact holder 32, and moves integrally with the non-contact holder 32 by a long stroke in the X-axis direction. The balance beam 10086 which the platform 10082 for carrying out has is longer than the balance beam 5032 (refer FIG. 76) of the said 8th Embodiment, The length of the grade which can support the whole board|substrate P from below. is set to The platform 10082 for carrying out also has the drive apparatus 10088 for driving the board|substrate carrying out hand 10084. For this reason, the board|substrate stage apparatus 10080 can carry out the board|substrate P from the board|substrate carrier 40 (on the non-contact holder 32) only with the platform 10082 for carrying out. Therefore, the carrying out operation of the substrate P can be started before the substrate stage apparatus 10080 reaches the substrate exchange position (in movement). Moreover, the board|substrate P can be carried out from the board|substrate carrier 40 at the speed faster than the moving speed to the board|substrate exchange position of the board|substrate stage apparatus 10080.

The ninth modification shown to FIGS. 94(a) - FIG. It is a form of control independent of (or acceleration). As described above, the substrate P is placed on the substrate holder 1028 except for the portion held by the substrate carry-in bearer device 1082b (the side where the collision force with respect to the substrate holder 1028 is buffered). Free fall (actually, fall with an acceleration less than the acceleration of gravity). In the example shown in FIG. 94(b), the holding pad 1084b is lowered after the start of the lowering operation on the free end side of the substrate P, and in the example shown in FIG. 94(c), the free end side of the substrate P is lowered. The holding pad 1084b is lowered prior to the start of the lowering operation of .

95 to 100 show modifications (10th to 15th modifications) of the fourth embodiment shown in FIGS. 89(a) to 89(c) (in FIGS. 95 to 100, non-contact holder) (32) is not shown). The substrate carrier 10052A included in the substrate stage apparatus 10050A shown in FIG. 95 is formed in the shape of a rod extending in the Y-axis direction as in the fourth modification, but the substrate carrier 10052A itself is directly a substrate ( P) has a function of adsorbing and holding. The point in which the holding pad 10056 for carrying in a board|substrate is built in the board|substrate carrier 10052A is the same as that of the said 4th modification. In the substrate stage apparatus 10050B shown in FIG. 96, the substrate carrier 10052B is formed in the shape of a rod extending in the X-axis direction, and the vicinity of the end of the substrate P on the -Y side is directly adsorbed and held from below. The point in which a pair of holding pads 10056 for carrying in a board|substrate is built in the board|substrate carrier 10052B is the same as that of the modified example shown in FIG.

In the substrate stage apparatus 10050C shown in FIG. 97, a substrate carrier 10052Ca holding the vicinity of the -X side end of the substrate P, and a substrate carrier holding near the +X side end of the substrate P ( 10052Cb), the substrate P is directly held. The substrate carriers 10052Ca and 10052Cb are each formed in the shape of a rod extending in the Y-axis direction. The point in which a pair of holding pads 10056 for carrying in a board|substrate is built in the board|substrate carrier 10052Ca arrange|positioned on the -X side is the same as that of the modified example shown in FIG. In the substrate stage apparatus 10050D shown in FIG. 98, the substrate P is directly held by the substrate carrier 10052D formed in a U-shape in plan view. The point in which a pair of holding pads 10056 for carrying in a board|substrate is built in the part of the board|substrate carrier 10052D extending in the Y-axis direction along the edge part of the -X side of the board|substrate P is shown in FIG. It is the same as the modified example.

In the substrate stage apparatus 10050E shown in Fig. 99, the substrate P is directly held by the substrate carrier 10052E formed in an L-shape in plan view. A brace 20054 for reinforcement is connected to the substrate carrier 10052E, and this brace 20054 does not impede the relative movement of the substrate carrier 10052E and the substrate table 30; It is housed in a groove formed in the . A point in which a pair of holding pads 10056 for carrying in a substrate is incorporated in a portion of the substrate carrier 10052E extending in the Y-axis direction along the -X side end portion of the substrate P is shown in FIG. 95 . It is the same as the modified example. In the substrate stage apparatus 10050F shown in FIG. 100 , similarly to the fourth embodiment, the substrate carrier 10052F is formed in a rectangular frame shape surrounding the outer periphery of the substrate P. As shown in FIG. However, unlike the fourth embodiment, the substrate carrier 10052F, together with the substrate table 30 (a substrate holder not shown), can move in a horizontal plane with a predetermined long stroke, and is mounted on the substrate table 30 . Micro-actuation is possible. The point in which a pair of holding pads 10056 for carrying in a board|substrate is built in the part of the board|substrate carrier 10052F extending in the Y-axis direction along the edge part on the -X side of the board|substrate P is shown in FIG. It is the same as the modified example.

FIG. 101 shows a substrate stage apparatus 10060A of a modification (sixteenth modification) of the fifth modification shown in FIGS. 90A and 90B . In the fifth modification, the substrate carrier 10062 (see Fig. 90(a) ) holds the vicinity of the -X side end of the substrate P, whereas the substrate stage apparatus 10060A of the present modification includes a substrate In addition to the carrier 10062 , a substrate carrier 10164 holding the vicinity of an end of the substrate P on the +X side is provided. The point in which the +X side substrate carrier 10164 has the encoder head 10068 for position measurement is the same as the -X side substrate carrier 10062 . The point in which the substrate stage apparatus 10060A has the holding pad 10066 for board|substrate carrying in which hold|maintains the edge part vicinity of the -X side of the board|substrate P is the same as that of the said 5th modification.

In addition, the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not specifically limited, For example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248). nm) or vacuum ultraviolet light such as F2 laser light (wavelength: 157 nm).

Moreover, in each of the above embodiments, as the projection optical system 16 , an equal magnification system was used, but it is not limited to this, and a reduction system or an enlargement system may be used.

Moreover, the use of an exposure apparatus is not limited to the exposure apparatus for liquid crystals which transfers a liquid crystal display element pattern to a rectangular glass plate, For example, the exposure apparatus for organic EL (Electro-Luminescence) panel manufacture, For semiconductor manufacture, It can also be widely applied to exposure apparatuses for manufacturing exposure apparatuses, thin film magnetic heads, micromachines, DNA chips, and the like. In addition, circuit patterns are transferred to glass substrates or silicon wafers to manufacture masks or reticles used not only in microdevices such as semiconductor devices, but also in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, and electron beam exposure apparatuses. It can also be applied to an exposure apparatus.

Moreover, the object used as an exposure target is not limited to a glass plate, For example, other objects, such as a wafer, a ceramic substrate, a film member, or mask blanks, may be sufficient. Moreover, when an exposure target object is a board|substrate for flat panel displays, the thickness of the board|substrate is not specifically limited, For example, the thing of a film form (a flexible sheet-like member) is also included. Further, the exposure apparatus of the present embodiment is particularly effective when a substrate having a length of one side or a length of a diagonal of 500 mm or more is an object to be exposed.

For an electronic device such as a liquid crystal display element (or semiconductor element), a step of designing the function and performance of the device, a step of producing a mask (or reticle) based on this design step, a step of producing a glass substrate (or a wafer) , a lithography step of transferring the pattern of a mask (reticle) to a glass substrate by the exposure apparatus of each embodiment described above, and an exposure method thereof, a developing step of developing the exposed glass substrate, and a portion other than the portion where the resist remains It is manufactured through the etching step which removes the exposed member of a part by etching, the resist removal step which removes the resist which became unnecessary after etching was completed, a device assembly step, an inspection step, etc. In this case, in the lithography step, since the above-described exposure method is performed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate, a highly integrated device can be manufactured with good productivity.

In addition, a plurality of constituent requirements of each of the above embodiments can be appropriately combined. Accordingly, some of the above-described plurality of constituent requirements do not have to be used.

In addition, the disclosures of all publications, international publications, US Patent Application Publications, and US Patent Specifications, etc. relating to the exposure apparatus and the like cited in the above embodiments are incorporated herein by reference.

Industrial Applicability

As described above, the conveying apparatus and method of the present invention are suitable for conveying an object. Moreover, the exposure apparatus and exposure method of this invention are suitable for exposing an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. Moreover, the device manufacturing method of this invention is suitable for manufacture of a microdevice.

10: liquid crystal exposure apparatus, 20: substrate stage apparatus, 22: base frame, 24: coarse motion stage, 26: weight canceling device, 28: X guide bar, 32: non-contact holder, 34: auxiliary table, 40: substrate carrier, P : Board.

Claims (33)

A conveying apparatus used in an exposure apparatus for scanning exposure of a plurality of regions of an object, respectively, and conveying the object with respect to a support in the exposure apparatus capable of supporting the object in a non-contact manner,
a carrying part for carrying out the first object on the support part;
a first holding part for holding the outside of the plurality of regions that are part of a second object at a first position located above the support part on which the first object is supported;
a driving unit for moving the first holding unit holding a part of the second object downward so that the plurality of regions of the second object are supported in a non-contact manner by the supporting unit from which the first object is taken out by the carrying-out unit; ,
The second object held by the first holding unit is moved by the driving unit, and the plurality of regions includes a second holding unit for holding the second object supported by the supporting unit in a non-contact manner;
The driving unit may include a second capable of transferring the first holding unit to the second holding unit from the first position in part in parallel with discharging of the first object from the supporting unit by the discharging unit. A conveying device that moves it into position. The method of claim 1,
The said 1st holding part is moved to a position below the said 2nd position by the said drive part, The conveyance apparatus which delivers the said 2nd object to the said 2nd holding part. 3. The method according to claim 1 or 2,
The second holding unit holds an area different from an area held by the first holding unit among the second objects. 3. The method according to claim 1 or 2,
The said 2nd holding part is a conveyance apparatus which performs position adjustment with respect to the said support part of the said 2nd object transmitted from the said 1st holding part. 3. The method according to claim 1 or 2,
The said 1st holding part adjusts the position of the said 2nd object with respect to the said support part, The conveying apparatus which delivers the said 2nd object to the said 2nd holding part. 5. The method of claim 4,
The said support part is a conveyance apparatus which non-contact-supports the said 2nd object by interposing a gas between the said support part and the said 2nd object in the said position adjustment. 3. The method according to claim 1 or 2,
The said 1st holding part transfers the said 2nd object to the said 2nd holding part at the said 2nd position located above the said support part. 3. The method according to claim 1 or 2,
and a drive system for moving the second holding unit to the second position so that the second holding unit receives the second object located at the second position from the first holding unit. 9. The method of claim 8,
The said drive system moves the said 2nd holding|maintenance part within the range which overlaps with the movable range of the said 1st holding|maintenance part in part. 9. The method of claim 8,
The said drive system is a conveying apparatus which moves the said 2nd holding part relative to the said support part. 3. The method according to claim 1 or 2,
a third holding part for holding the other part of the second object at the first position located above the support part;
The third holding part is configured to release the holding of the other part of the second object in a state where it is located in the first position and the second object is supported by the first holding part and the third holding part. A driving device for moving in an intersecting direction intersecting the vertical direction from one position is provided;
The driving unit is configured to move the first holding unit holding the object downward when the third holding unit is moved in the crossing direction by the driving unit to release holding of the other part of the second object. 12. The method of claim 11,
The third holding part is configured to hold the other part of the second object so as to be levitable and to be retracted from the other part of the second object in a state where the other part of the second object is levitated in the crossing direction by the driving device. moving conveying device. 12. The method of claim 11,
The drive device is a conveying device for moving the third holding unit to the first position. 14. The method of claim 13,
Further comprising a fourth holding part for holding a part of the first object,
The said 4th holding part is a conveyance apparatus which delivers the said 1st object to the said carrying-out part. 15. The method of claim 14,
The said support part has a 1st accommodating part which accommodates the said 4th holding part, The conveying apparatus. 3. The method according to claim 1 or 2,
The driving unit is configured to move the first holding unit so that the object is not deformed by a gas interposed between the second object and the support unit. 3. The method according to claim 1 or 2,
The support part has a supply hole for supplying gas from the support part to the second object,
A conveying apparatus for changing an amount of gas between the second object held by the first holding unit and the supporting unit. 3. The method according to claim 1 or 2,
The support part has a suction hole for sucking the gas between the support part and the second object,
A conveying apparatus for changing an amount of gas between the second object held by the first holding unit and the supporting unit. 3. The method according to claim 1 or 2,
Further comprising a first driving unit for moving the support,
The first driving part is movable along a plane parallel to the surface of the support part,
The first holding unit is movable along the surface in a predetermined positional relation with respect to the supporting unit. 20. The method of claim 19,
The said drive part is a conveyance apparatus which moves the said 1st holding part when the said support part is being moved by the said 1st drive part. 3. The method according to claim 1 or 2,
The said support part is a conveyance apparatus which has a 1st accommodating part which accommodates the said 1st holding part. 3. The method according to claim 1 or 2,
The said 1st holding part is a conveyance apparatus which adsorb|sucks and holds a part of the said 2nd object. 3. The method according to claim 1 or 2,
The said 1st holding part holds the one end side of the outer peripheral edge part of the said 2nd object outside the said some area|region. The conveying apparatus according to claim 1 or 2;
and a pattern forming apparatus for forming a predetermined pattern on the first object or the second object by using an energy beam. 25. The method of claim 24,
The exposure apparatus wherein the first object and the second object are substrates used in a flat panel display. 26. The method of claim 25,
The substrate is an exposure apparatus having at least one side length or a diagonal length of 500 mm or more. A conveying method for conveying the object with respect to a support part in the exposure apparatus capable of supporting the object in a non-contact manner, which is used in an exposure apparatus for scanning exposure of a plurality of regions of an object, respectively,
Carrying out the first object on the support;
a first holding portion for holding the outside of the plurality of regions that are part of a second object at a first position located above the support portion on which the first object is supported, wherein the plurality of regions of the second object are non-contact with the support portion to be supported, to move, and
holding the plurality of regions of the second object supported by the support in a non-contact manner by a second holding portion by the moving;
In the moving, the second object is moved from the first position to a second position capable of being delivered to the second holding unit in part in parallel with unloading of the first object from the support unit. conveying the second object to the support unit by the conveying method according to claim 27;
and exposing the second object conveyed to the support unit. exposing the first object or the second object using the exposure method according to claim 28;
and developing the exposed first object or the second object. exposing the first object or the second object using the exposure method according to claim 28;
and developing the exposed first object or the second object. delete delete delete

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