CN113826048A

CN113826048A - Exposure apparatus, method for manufacturing flat panel display, and method for manufacturing device

Info

Publication number: CN113826048A
Application number: CN202080036828.6A
Authority: CN
Inventors: 青木保夫
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2019-03-29
Filing date: 2020-03-12
Publication date: 2021-12-21
Anticipated expiration: 2040-03-12
Also published as: WO2020203137A1; KR20210142696A; JP7456436B2; CN116643469A; JP2024052951A; JPWO2020203137A1; CN113826048B

Abstract

In order to achieve miniaturization of a device (reduction in footprint), an exposure device (100) includes: an exposure apparatus body (10); a chamber (200) for accommodating the exposure apparatus body; a substrate holding unit (160) which receives and holds a substrate (P) transferred by an external transfer robot (300) outside the chamber (200) and is provided in the chamber; and a substrate transfer device (140) that transfers the substrate (P) from the external transfer robot (300) to the substrate holding unit (160), transfers the substrate (P) from the substrate holding unit (160) to a holding device (28) included in the exposure apparatus main body (10), and transfers the substrate (P) from the holding device (28) to the external transfer robot (300).

Description

Exposure apparatus, method for manufacturing flat panel display, and method for manufacturing device

Technical Field

The present invention relates to an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method.

Background

In a photolithography process for manufacturing electronic devices such as liquid crystal display devices and semiconductor devices, an exposure apparatus is used in which a pattern formed on a mask (or reticle) is transferred onto a substrate (including a substrate made of glass, plastic, or the like, a semiconductor wafer, or the like) using an energy beam.

In such an exposure apparatus, the substrate transfer device is used to carry out the carrying out of an exposed substrate on the stage device that holds the substrate and the carrying in of a new substrate onto the stage device. As a method for conveying a substrate, for example, a method described in patent document 1 is known.

Documents of the prior art

Patent document

Patent document 1: international publication No. 2013/150787

Disclosure of Invention

Means for solving the problems

The exposure apparatus includes: an exposure apparatus body; a chamber for accommodating the exposure apparatus body; a substrate holding unit that receives and holds a substrate transferred by an external transfer robot outside the chamber, and is provided inside the chamber; and a substrate transfer device that transfers the substrate from the external transfer robot to the substrate holding unit, transfers the substrate from the substrate holding unit to a holding device provided in the exposure apparatus main body, and transfers the substrate from the holding device to the external transfer robot.

Further, the structure of the embodiment described later can be improved as appropriate, and at least a part of the structure can be replaced with another structure. Further, the configuration of the present invention is not particularly limited, and the present invention may be arranged at a position where the functions can be achieved.

Drawings

FIG. 1 is a view schematically showing an exposure apparatus according to a first embodiment, and FIG. 1(b) is a sectional view taken along line A-A of FIG. 1 (a).

FIG. 2 is a cross-sectional view of FIG. 1 (a).

Fig. 3(a) is a view showing the substrate carry-out/carry-in unit shown in fig. 1(a), and fig. 3(b) is a view showing a state of the substrate carry-out/carry-in unit shown in fig. 3(a) as viewed from the + X side.

Fig. 4(a) and 4(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line a-a of fig. 1(a), and (one) of the diagrams is used to explain the substrate exchange operation of the first embodiment.

Fig. 5(a) and 5(b) are a plan view of the vicinity of the stage device and a sectional view taken along line a-a of fig. 1(a), and are views (second) for explaining the substrate replacing operation according to the first embodiment.

Fig. 6(a) and 6(b) are a plan view of the vicinity of the stage device and a sectional view taken along line a-a of fig. 1(a), and are views for explaining a substrate replacing operation according to the first embodiment (third).

Fig. 7(a) and 7(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line a-a of fig. 1(a), and are views (four) for explaining a substrate replacing operation according to the first embodiment.

Fig. 8(a) and 8(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line a-a of fig. 1(a), and are views for explaining a substrate replacing operation according to the first embodiment (fifth).

Fig. 9(a) and 9(b) are a plan view of the vicinity of the stage device and a sectional view taken along line a-a of fig. 1(a), and are views (sixth thereof) for explaining the substrate replacing operation according to the first embodiment.

Fig. 10(a) and 10(b) are a plan view of the vicinity of the stage device and a sectional view taken along line a-a of fig. 1(a), and are (seventh) views for explaining a substrate exchange operation according to the first embodiment.

Fig. 11(a) and 11(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line a-a of fig. 1(a), and are diagrams (eighth) for explaining a substrate exchange operation according to the first embodiment.

FIG. 12 is a view (one) showing an exposure apparatus according to a second embodiment.

FIG. 13 is a view showing an exposure apparatus according to a second embodiment (second embodiment).

FIG. 14 is a cross-sectional view of an exposure apparatus according to a third embodiment.

Fig. 15(a) and 15(b) are (a) a plan view and a vertical cross-sectional view of the vicinity of a stage device, and (b) are (a) diagrams for explaining a substrate exchange operation according to the third embodiment.

Fig. 16(a) and 16(b) are a plan view and a vertical cross-sectional view of the vicinity of the stage device, and are views (second drawing) for explaining the substrate exchange operation according to the third embodiment.

Fig. 17(a) and 17(b) are a plan view and a vertical cross-sectional view of the vicinity of the stage device, and are (the third) views for explaining the substrate replacement operation according to the third embodiment.

Fig. 18(a) and 18(b) are a plan view and a vertical cross-sectional view of the vicinity of the stage device, and are views (the fourth) for explaining the substrate replacing operation according to the third embodiment.

Fig. 19(a) and 19(b) are a plan view and a vertical cross-sectional view of the vicinity of a stage device of an exposure apparatus according to the fourth embodiment, and are (one of) for explaining a substrate replacement operation.

Fig. 20(a) and 20(b) are a plan view and a vertical cross-sectional view of the vicinity of a stage device of an exposure apparatus according to the fourth embodiment, and are for explaining a substrate replacement operation (the second).

Fig. 21(a) and 21(b) are views for explaining a substrate carry-in/out unit according to a fifth embodiment.

Fig. 22(a) and 22(b) are (a) a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to a sixth embodiment, and (ii) a diagram for explaining a substrate exchange operation.

Fig. 23(a) and 23(b) are a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to a sixth embodiment, and are views (the second view) for explaining a substrate exchange operation.

Fig. 24 is a vertical cross-sectional view of the exposure apparatus according to the sixth embodiment, and is a view for explaining a substrate replacement operation (the third).

FIG. 25 is a longitudinal sectional view of an exposure apparatus according to a seventh embodiment.

Fig. 26(a) and 26(b) are (a) a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to an eighth embodiment, and (ii) a diagram for explaining a substrate exchange operation.

Fig. 27(a) and 27(b) are views (the second view) for explaining a substrate replacement operation according to the eighth embodiment.

Fig. 28(a) and 28(b) are views (the third) for explaining the substrate replacement operation according to the eighth embodiment.

Fig. 29(a) and 29(b) are views (the fourth view) for explaining a substrate replacement operation according to the eighth embodiment.

Fig. 30(a) and 30(b) are views (the fifth view) for explaining a substrate replacement operation according to the eighth embodiment.

Fig. 31(a) and 31(b) are (a) a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to a ninth embodiment, and (ii) a diagram for explaining a substrate exchange operation.

Fig. 32(a) and 32(b) are views (the second view) for explaining a substrate replacement operation in the exposure apparatus according to the ninth embodiment.

Fig. 33(a) and 33(b) are (a) cross-sectional views of an exposure apparatus according to a tenth embodiment, illustrating a substrate exchange operation.

Fig. 34(a) and 34(b) are cross-sectional views of an exposure apparatus according to the tenth embodiment, and are (the second) drawings for explaining a substrate replacement operation.

Fig. 35(a) and 35(b) are (a) a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to an eleventh embodiment, and (ii) a diagram for explaining a substrate exchange operation.

Fig. 36(a) and 36(b) are a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to an eleventh embodiment, and are views (ii) for explaining a substrate replacement operation.

Fig. 37(a) and 37(b) are a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to an eleventh embodiment, and are (the third) views for explaining a substrate exchange operation.

Fig. 38(a) to 38(c) are vertical sectional views of an exposure apparatus according to the eleventh embodiment, and are views for explaining a substrate replacement operation (the fourth).

Fig. 39 is a vertical sectional view of the vicinity of a barrier member of the twelfth embodiment, and fig. 39(B) is a sectional view taken along line B-B of fig. 39 (a).

Fig. 40(a) and 40(b) are (a) for explaining a substrate replacement operation in the twelfth embodiment.

Fig. 41(a) to 41(c) are views (the second view) for explaining a substrate replacement operation in the twelfth embodiment.

Fig. 42 is a diagram for explaining (one of) modifications of the substrate feeder.

Fig. 43(a) and 43(b) are views for explaining a modification (second modification) of the substrate feeder.

Detailed Description

First embodiment

A first embodiment of the present invention will be described below with reference to fig. 1 to 11.

Fig. 1(a) is a vertical cross-sectional view schematically showing the structure of an exposure apparatus 100 according to the first embodiment. Fig. 1(b) is a cross-sectional view taken along line a-a of fig. 1(a), and fig. 2 is a cross-sectional view taken along line a of fig. 1 (a). In fig. 1(b), the chamber 200 and the illumination system 12 are not shown for convenience.

As shown in fig. 1(a), the exposure apparatus 100 includes a chamber 200, an exposure apparatus main body 10 housed in the chamber 200, a substrate carry-out/carry-in unit 150, and a substrate sliding hand 140. An external transfer robot 300 is provided outside the chamber 200 of the exposure apparatus 100, and the substrate P is transferred from an external apparatus (not shown) to the exposure apparatus 100 and from the exposure apparatus 100 to the external apparatus by the external transfer robot 300.

(Chamber 200)

The chamber 200 forms a space in which an internal environment (at least one of temperature, humidity, pressure, and cleanliness) is adjusted, and an opening 200a for carrying in/out the substrate P is formed in a part thereof.

(Exposure apparatus body 10)

The exposure apparatus main body 10 is, for example, a so-called scanner, which is a projection exposure apparatus of a step-and-scan method using a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used for a liquid crystal display device (flat panel display) or the like as an exposure object.

The exposure apparatus main body 10 includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, a stage device 20 that holds a substrate P whose surface (surface facing the + Z side in fig. 1 a) is coated with a resist (a sensitive agent), and control systems for these. Hereinafter, as shown in fig. 1(a), the exposure apparatus main body 10 is set with X, Y, and Z axes orthogonal to each other, and the mask M and the substrate P are relatively scanned in the X axis direction with respect to the projection optical system 16 during exposure, and the Y axis is set in the horizontal plane. The directions of rotation (inclination) about the X, Y, and Z axes are referred to as θ X, θ Y, and θ Z directions, respectively. The positions in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, U.S. Pat. No. 5,729,331, and irradiates the mask M with exposure illumination light (illumination light) IL. As the illumination light IL, for example, light having at least one wavelength of i-line (wavelength 365nm), g-line (wavelength 436nm), and h-line (wavelength 405nm) is used. The wavelength of the light source used in the illumination system 12 and the illumination light IL emitted from the light source are not particularly limited, and may be, for example, ultraviolet light such as ArF excimer laser (wavelength 193nm) and KrF excimer laser (wavelength 248nm) or F₂Vacuum ultraviolet light such as laser light (wavelength 157 nm).

The mask stage 14 holds a light-transmissive mask M. The mask stage 14 is mounted on a pair of mask stage guides 218 fixed to the barrel platen 216 in a non-contact state. The pair of mask stage guides 218 are prism-shaped members whose longitudinal direction is the X-axis direction, and are arranged at predetermined intervals in the Y-axis direction as shown in fig. 1 (b). The mask stage 14 is driven by a mask stage driving system (not shown) including, for example, a linear motor with a predetermined stroke in the scanning direction (X-axis direction). Mask stage 14 is driven by a fine drive system that moves the X position or the Y position by a stroke, and adjusts the relative position with respect to at least one of illumination system 12, stage device 20, and projection optical system 16. The positional information of mask stage 14 is obtained by a mask stage position measurement system (not shown) including a linear encoder system or an interferometer system, for example.

The projection optical system 16 is supported by a barrel stage 216 below (on the Z side) the mask stage 14. The projection optical system 16 is a so-called multi-lens type projection optical system having a similar configuration to the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775 and the like, and includes, for example, a plurality of optical systems of both-side telecentric (telecentricity) for forming an erect image. In addition, the projection optical system 16 may not be a multi-lens type. A projection optical system as used in a semiconductor exposure apparatus may be included.

In the exposure apparatus main body 10, when the mask M positioned in a predetermined illumination region of the illumination light IL from the illumination system 12 is illuminated, a projection image of the pattern of the mask M in the illumination region (image of a local pattern) is formed in the exposure region by the projection optical system 16. Then, the mask M is moved relatively in the scanning direction with respect to the illumination region (illumination light IL), and the substrate P is moved relatively in the scanning direction with respect to the exposure region, whereby scanning exposure is performed on the substrate P, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

Stage apparatus 20 includes a platen 22, a substrate table 24, a support apparatus 26, and a substrate support 28.

The platen 22 is provided on a pair of stage bases 212, and the pair of stage bases 212 are supported from below by a vibration-proof device 210 provided on the floor F. Further, the pair of stage bases 212 support a pair of side columns (side columns) 214, and a barrel platen 216 is supported by the pair of side columns 214. The platen 22 includes, for example, a plate-like member having a rectangular shape in a plan view (when viewed from the + Z side) arranged such that the upper surface (+ Z surface) is parallel to the XY plane.

The support device 26 is placed on the platen 22 in a non-contact state, and supports the substrate stage 24 from below in a non-contact manner. Substrate holder 28 is disposed on substrate stage 24, and substrate stage 24 and substrate holder 28 are integrally driven by a stage drive system, not shown, included in stage device 20. The stage driving system includes: a coarse movement system, for example, including a linear motor or the like, for driving the substrate stage 24 in a predetermined stroke in the X-axis and Y-axis directions (along the upper surface of the platen 22); and a micro-motion system, for example, including a voice coil motor, for finely driving the substrate stage 24 in the six-degree-of-freedom (X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z) direction. Further, stage device 20 includes a stage measurement system including, for example, an optical interferometer system, an encoder system, or the like, and obtains positional information of substrate stage 24 in the six-degree-of-freedom direction. Fig. 1(b) and 2 show a Y interferometer 32Y included in the stage measurement system, and a Y moving mirror (bar mirror) 34Y having a reflection surface orthogonal to the Y axis. The Y moving mirror 34Y is fixed to the substrate stage 24.

The substrate holder 28 has a rectangular upper surface 28u (+ Z side surface) in a plan view, and the substrate P is placed on the upper surface 28 u. As shown in fig. 2, the upper surface 28u of the substrate holder 28 has an aspect ratio substantially equal to that of the substrate P. For example, the lengths of the long side and the short side of the upper surface 28u are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively.

The upper surface 28u of the substrate holder 28 is finished to be flat over the entire surface. A plurality of minute holes (not shown) for air blowing and minute holes (not shown) for vacuum suction are formed in the upper surface 28u of the substrate holder 28. Further, the common hole may be used in combination as the fine hole for air blowing and the fine hole for vacuum suction. The substrate holder 28 can suck air between the upper surface 28u and the substrate P through the plurality of holes by using a vacuum suction force supplied from a vacuum apparatus (not shown), and thereby the substrate P is sucked to the upper surface 28u (surface correction). The substrate holder 28 is a so-called pin chuck (pin chuck) type holder, and a plurality of pins (pins having a very small diameter, for example, a diameter of about 1 mm) are arranged at substantially uniform intervals. By providing the plurality of support rods, the substrate holder 28 can reduce the possibility of supporting the substrate P by sandwiching dust or foreign matter between the back surface of the substrate P, and can reduce the possibility of deformation of the substrate P due to sandwiching of the foreign matter. The substrate P is held (supported) on the upper surfaces of the plurality of support rods. An XY plane formed by the upper surfaces of the plurality of support rods is set as the upper surface of the substrate holder 28. Then, the substrate holder 28 supplies (supplies) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) to between the upper surface 28u and the substrate P through the hole, thereby separating (floating) the back surface of the substrate P adsorbed on the substrate holder 28 from the upper surface 28 u. Further, in each of the plurality of holes formed in the substrate holder 28, the timing of supplying the pressurized gas is varied by a time difference, or the positions of the hole for performing vacuum suction and the hole for supplying the pressurized gas are appropriately changed, or the air pressure is appropriately changed at the time of suction and air supply, whereby the contact state of the substrate P can be controlled (for example, air accumulation between the back surface of the substrate P and the upper surface 28u of the substrate holder 28 is prevented).

The substrate holder 28 may perform the planar alignment of the substrate P in a floating state without attracting the substrate P to the upper surface 28 u. At this time, the substrate holder 28 supplies (supplies) a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) to the back surface of the substrate P through the hole, thereby interposing the gas between the lower surface of the substrate P and the upper surface 28u of the substrate holder 28 (that is, forming a gas film). The substrate holder 28 uses a vacuum suction device to suck the gas between the substrate holder 28 and the substrate P through the hole for vacuum suction, and applies a force (preload) in a direction of gravity downward to the substrate P, thereby imparting rigidity to the gas film in the direction of gravity. The substrate holder 28 may be configured to hold (support) the substrate P in a noncontact manner by floating the substrate P in the Z-axis direction with a slight clearance by balancing the pressure and flow rate of the pressurized gas and the vacuum suction force, and to apply a force for controlling the flatness (for example, a force for correcting or correcting the flatness) to the substrate P. Further, each hole may be formed by processing the substrate holder 28, or the substrate holder 28 may be formed of a porous material to supply or suck air. The upper surface 28u of the substrate holder 28 for supporting the substrate P in a floating manner is not a surface on which a hole is formed, but an imaginary surface located upward by the above-described amount of play from the upper surface, that is, the upper surface of the substrate subjected to the surface correction is defined as the upper surface 28 u.

As shown in fig. 1(a) and 2, two cutouts 28a are formed at the-X-side end of the upper surface 28u of the substrate holder 28 so as to be spaced apart in the Y-axis direction, for example. Near the two notches 28a, a substrate carry-in carriage (loader) device 25 is provided. The substrate loading carrier device 25 includes: a suction pad 27 for sucking and holding the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device not shown; a Z drive mechanism 23Z for driving the suction pad 27 in the Z-axis direction; and a Y drive mechanism 23Y that drives the Z drive mechanism 23Z (and the suction pad 27) in the Y axis direction. The suction pad 27 is positioned on the most-Z side and enters the notch 28a formed in the substrate holder 28. The suction pad 27 is positioned above the substrate holder 28 in a state of being positioned on the most + Z side.

In the exposure apparatus main body 10, under the management of a main control device, not shown, a mask loader, not shown, loads the mask M onto the mask stage 14, and a substrate unloading/loading unit 150 or a substrate slide hand 140, which will be described later, loads the substrate P onto the substrate holder 28. Subsequently, the main controller executes alignment measurement by using an alignment detection system (not shown), and after the alignment measurement is completed, the main controller successively performs a step-and-scan type exposure operation on a plurality of exposure shot (shot) areas set on the substrate P. Since the exposure operation is the same as the exposure operation of the step-and-scan method performed in the related art, the X direction is set as the scanning direction. Further, detailed description of the exposure operation by the step-and-scan method is omitted. Then, the substrate P whose exposure processing has been completed is carried out from the substrate holder 28 by the substrate slide hand 140 or the like, and another substrate P to be exposed next is carried into the substrate holder 28, whereby the substrate P on the substrate holder 28 is replaced, and a series of exposure operations for the plurality of substrates P is continuously performed.

(substrate carry-out/carry-in unit 150)

As shown in fig. 1(a), the substrate carry-in/out unit 150 is provided near the opening 200a of the chamber 200. Fig. 3(a) shows a state where the substrate carry-out/carry-in unit 150 is taken out from fig. 1(a), and fig. 3(b) shows a state where the substrate carry-out/carry-in unit 150 of fig. 3(a) is viewed from the + X side.

As shown in fig. 3(a), the substrate carry-out/carry-in unit 150 includes: a barrier member 152 having an inverted-L-shaped XZ cross section, an inlet shutter 154 and an outlet shutter 156 provided in the barrier member 152, and a substrate feeder 160 fixed to the barrier member 152.

As shown in fig. 3(a) and 3(b), the barrier member 152 includes a carrying-in port 152U and a carrying-out port 152L, and the carrying-in port 152U and the carrying-out port 152L are rectangular when viewed from the X-axis direction and are formed to penetrate in the X-axis direction. The transfer port 152U and the transfer port 152L have minute openings of such a size that the substrate P can pass through, and thus it is difficult for the waste to enter the chamber 200 through the transfer port 152U and the transfer port 152L. A carrying-in port shutter 154 that opens and closes the carrying-in port 152U by sliding in the vertical direction (Z-axis direction) is provided near the carrying-in port 152U. Further, a carrying-out port shutter 156 that opens and closes the carrying-out port 152L by rotating about a rotating shaft 156a extending in the Y-axis direction is provided in the vicinity of the carrying-out port 152L.

The substrate feeder 160 is supported by the barrier member 152 in an overhanging manner at a predetermined height from the floor F by the barrier member 152. Here, the "position of a predetermined height" refers to a height position at which stage device 20 can be positioned below substrate feeder 160 when stage device 20 moves to the substrate replacement position (see fig. 8 (b)). The substrate feeder 160 includes a plate-like member having an XZ cross section in a substantially right triangle shape, and an upper surface of the substrate feeder 160 is inclined with respect to the XY plane. In the example of fig. 3(a), the + X side end of the upper surface of the substrate feeder 160 is parallel to the XY plane. Although not shown, a plurality of fine holes (not shown) for air blowing are formed in the upper surface of the substrate feeder 160. In the substrate feeder 160, a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) to the back surface of the substrate P placed on the upper surface of the substrate feeder 160 through the hole portion, whereby the back surface of the substrate P can be isolated (floated) from the upper surface of the substrate feeder 160. The substrate feeder 160 has a hole for holding the lower surface of the substrate P by suction by a vacuum suction force supplied from a vacuum device not shown. Further, the hole portion through which the pressurized gas is supplied and the hole portion for vacuum suction may be a common hole portion. As shown in fig. 2, the substrate feeder 160 is provided above a corner portion on the + X side and the + Y side of the platen 22. As shown in fig. 1(a), the end of the substrate feeder 160 on the-X side extends to below the barrel platen 216, and a notch 216a for avoiding contact with the substrate P held by the substrate feeder 160 is formed in a part of the barrel platen 216.

(base plate sliding hand 140)

As shown in fig. 2, the substrate sliding hand 140 is provided on the + Y side of the substrate feeder 160. The substrate slide hand 140 includes a suction pad 142 and a vertical movement mechanism 144 for vertically moving (reciprocally driving in the Z-axis direction) the suction pad 142. The vertical movement mechanism 144 is movable in the X-axis direction along a rail 146, and the rail 146 is laid at a predetermined height from the floor F in the X-axis direction. That is, the adsorption pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device not shown.

The substrate sliding hand 140 sucks and holds a part of the lower surface of the substrate P transferred by the external transfer robot 300 and moves in the-X direction, thereby drawing the substrate P from the outside of the chamber 200 into the inside. The substrate slide hand 140 moves along the upper surface of the substrate feeder 160 while holding the substrate P drawn into the chamber 200, thereby transferring the substrate P onto the substrate feeder 160. Further, the substrate slide hand 140 sucks and holds a part of the lower surface of the exposed substrate P placed on the substrate holder 28, and moves in the + X direction, thereby sending out the substrate P from the inside of the chamber 200 to the outside.

The external transfer robot 300 transfers the substrate P between an external apparatus (not shown) such as a coater/developer (coater/developer) installed outside the exposure apparatus 100 (chamber 200) and the exposure apparatus 100. As shown in fig. 1(a) or fig. 2, the external transfer robot 300 includes a flat plate-shaped hand 300F. On the upper surface of the robot 300F, although not shown, a plurality of minute holes (not shown) for air blowing are formed. In the robot 300F, pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) to the back surface of the substrate P placed on the upper surface of the robot 300F through the hole, whereby the back surface of the substrate P can be isolated from the upper surface of the robot 300F (the substrate P can be lifted). The robot 300F has a hole for holding the lower surface of the substrate P by suction by a vacuum device, not shown. Further, the hole portion through which the pressurized gas is supplied and the hole portion for vacuum suction may be a common hole portion.

(substrate replacement action)

The operation of replacing the substrate P on the substrate holder 28 in the exposure apparatus 100 will be described in detail below with reference to fig. 1(a) to 2 and 4(a) to 11 (b). The following substrate replacement operation is controlled by a main controller, not shown. In each of fig. 4(a) to 11(b) for explaining the substrate replacement operation, the movement direction of the constituent elements is schematically indicated by an open arrow for the sake of easy understanding. Further, the state of sucking or supplying (supplying) gas is schematically shown by a black arrow or a broken arrow. Fig. 4(a) and 4(b) show a plan view of the vicinity of stage device 20 and a cross-sectional view taken along line a-a of fig. 1(a) at the same timing, and fig. 5(a) and 5(b), fig. 6(a) and 6(b), … also show a plan view of the vicinity of stage device and a cross-sectional view taken along line a-a at the same timing. In fig. 4(a) to 11(b), the configuration of the exposure apparatus 100, which is not necessary for the description, is not shown.

It is assumed that substrate P1 is placed in advance on substrate holder 28 of stage device 20 as a premise for explanation of the substrate replacement operation. In the substrate replacement operation, it is assumed that the operation of carrying out the exposed substrate P1 and the operation of carrying in (placing on) the newly exposed substrate P2 (different from the substrate P1) to the substrate holder 28 are performed. The substrate P2 may be an unexposed substrate (which has not been exposed at one time) or a substrate subjected to the second and subsequent exposures.

As shown in fig. 1 a and 2, in a state where exposure of the substrate P1 is being performed in the exposure apparatus main body 10, the main control device drives the external transfer robot 300 holding the substrate P2 before exposure to the vicinity of the chamber 200 (the vicinity of the transfer port 152U). Further, it is assumed that the hand 300F of the external transfer robot 300 is in contact with most of the lower surface (-Z surface) of the substrate P2, but is not in contact with the lower surface of the end portion on the-X side of the substrate P2.

(operation in FIG. 4(a) and FIG. 4 (b))

From this state, the main controller slides the transfer port shutter 154 in the + Z direction, thereby opening the transfer port 152U (see arrow a1 in fig. 4 (b)). Next, the main control device drives the external transfer robot 300 in the-X direction (see arrow a2 in fig. 4 a and 4 b) to insert the-X-side end of the substrate P2 into the chamber 200. Thus, the-X side end of substrate P2 will be located above substrate feeder 160. In the first embodiment, it is assumed that the external transfer robot 300 does not enter the chamber 200. This can suppress entry of dust into the chamber 200 as much as possible.

Next, the main controller drives the substrate sliding hand 140 to move the suction pad 142 in the + X direction (the direction of arrow A3 in fig. 4 b) and the + Z direction (the direction of arrow a 4), thereby bringing the suction pad 142 into contact with a part of the lower surface of the substrate P2 (the end on the (-X side and the + Y side). Then, the main controller starts suction holding of the suction pad 142 to a part of the lower surface (-Z surface) of the substrate P2 (see black arrow a5 in fig. 4 b).

(operation in FIG. 5(a) and FIG. 5 (b))

Next, the main controller starts the supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 160 (see arrows B1 and B2 in fig. 5B). Thus, the substrate P2 floats from the upper surface of the robot 300F and the upper surface of the substrate feeder 160, and the friction between the lower surface of the substrate P2 and the upper surfaces of the robot 300F and the substrate feeder 160 becomes negligible (low friction state). From this state, the main control device drives the suction pads 142 of the substrate sliding hand 140 in the-X direction (the direction of arrow B2 in fig. 5 (B)) and the-Z direction (the direction of arrow B3). That is, the adsorption pad 142 is moved in a direction along the upper surface of the substrate feeder 160 (in the direction of arrow B5 in fig. 5(a) and 5(B), and in a direction inclined to the X axis and the Z axis in the XZ plane). Thus, the substrate P2 is conveyed into the chamber 200 along the upper surface of the robot 300F and the upper surface of the substrate feeder 160. The substrate P2 is moved by the substrate sliding hand 140 while being supported on the upper surface of the robot 300F and the upper surface of the substrate feeder 160.

(operation in FIG. 6(a) and FIG. 6 (b))

As described above, when the substrate P2 is conveyed along the upper surface of the robot 300F and the upper surface of the substrate feeder 160 to reach the positions shown in fig. 6(a) and 6(b), the main control device slides the transfer port shutter 154 in the-Z direction to close the transfer port 152U (see arrow C1 in fig. 6 (b)). This prevents the garbage from entering the chamber 200 from the outside through the carrying-in port 152U. The main control device drives the external transfer robot 300 in the-X direction (see arrow C2 in fig. 6(a) and 6 (b)). In the exposure apparatus main body 10, exposure to the substrate P1 is continued.

(operation in FIG. 7(a) and FIG. 7 (b))

Next, the main controller drives a vacuum device, not shown, of the substrate feeder 160, and holds the substrate P2 by suction with a vacuum suction force. Then, the main controller releases the suction holding of the suction pad 142 by the substrate sliding hand 140, and drives the suction pad 142 downward in the-Z direction (see arrow D1 in fig. 7 b). Then, the main control device drives the external transfer robot 300 in the-Z direction (see arrow D2) and drives the external transfer robot 300 in the-X direction (see arrow D3), thereby bringing the-X end of the hand 300F close to the carrying-out outlet 152L. Further, the main control device drives and rotates the carrying-out port shutter 156 in the counterclockwise direction (the direction of arrow D4), thereby opening the carrying-out port 152L. This completes preparation for replacement of the substrate on the substrate holder 28. It is assumed that at this stage, the exposure operation for the substrate P1 on the substrate holder 28 is ended.

(operation in FIG. 8(a) and FIG. 8(b))

After the exposure operation is completed, the main controller drives stage device 20 to the substrate replacement position (below substrate feeder 160) (see arrow E1 in fig. 8a and 8 b). Next, the main control device slightly raises the suction pad 27 of the substrate carry-in carriage device 25 (see arrow E2), and sucks and holds the lower surface of the substrate P1 on the suction pad 27 (see arrow E3). Then, the main controller starts the supply (gas supply) of the pressurized gas from the upper surface 28u of the substrate holder 28 (see arrow E4), thereby slightly floating the substrate P1 with respect to the upper surface 28u of the substrate holder 28. Further, the main controller moves the suction pad 27 which sucks and holds the substrate P1 in the + Y direction (see arrow E5), thereby slightly shifting the substrate P1 from the substrate holder 28 in the + Y direction. Due to this displacement, the suction pad 142 of the substrate sliding hand 140 can hold the corner on the-X side and the + Y side of the lower surface of the substrate P1.

In a state where the substrate P1 is offset from the substrate holder 28, the main controller drives the suction pads 142 of the substrate slide hand 140 to move up (see arrow E6), and sucks and holds the lower surface of the substrate P1 on the suction pads 142. Further, it is assumed that the main control device starts the supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 at the stage of fig. 8(a) and 8(b) (see arrow E7). In addition, at the stage of fig. 7(b), the main control device drives the transfer port shutter 156 to rotate counterclockwise (in the direction of arrow D4) to open the transfer port 152L, but the transfer port 152L may be opened at the stage of fig. 8 (b).

(operation in FIG. 9(a) and FIG. 9 (b))

Next, the main controller drives the suction pad 142 of the substrate slide hand 140 in the + X direction (see arrow F1 in fig. 9a and 9 b), and slides and conveys the substrate P1 from the substrate holder 28 to the robot 300F. Thus, the exposed substrate P1 is transferred to the robot 300F. That is, the substrate P1 is moved by the substrate sliding hand 140 while being supported on the upper surface of the substrate holder 28 and the upper surface of the robot 300F. When the robot 300F receives the substrate P1, the main control device stops the supply of the pressurized gas (intake) from the robot 300F, drives a vacuum device (not shown), and causes the substrate P1 to be sucked and held by the robot 300F by a vacuum suction force.

Then, the main control device drives the suction pad 27 of the substrate carry-in carrier device 25 to move up (see arrow F2), and brings the suction pad into contact with the-X end of the lower surface of the substrate P2 held by the substrate feeder 160, thereby starting suction holding of the substrate P2 by the suction pad 27 (see arrow F3).

(operation in FIG. 10(a) and FIG. 10 (b))

Next, the main controller drives stage device 20 in the-X direction with substrate P2 sucked and held by suction pads 27 of substrate carry-in carrier device 25 (see arrow G1). At this time, as stage device 20 moves away from substrate feeder 160, the area of substrate P2 held by substrate feeder 160 gradually decreases, and the area of substrate P2 supported by substrate support 28 gradually increases. As a result, as shown in fig. 10(a), the substrate P2 is transferred from the substrate feeder 160 to the substrate holder 28.

The main controller also lowers the suction pad 142 (see arrow G2) after the substrate P1 is transferred to the robot 300F, and rotates the transfer port shutter 156 in the clockwise direction (see arrow G3), thereby closing the transfer port 152L. This can prevent garbage from entering the chamber 200 from the outside through the carrying-out port 152L. The main control device drives the external transfer robot 300 holding the substrate P1 in the + X direction (see arrow G4) and transfers the substrate P1 to the external device.

(operation in FIG. 11(a) and FIG. 11 (b))

When the transfer of the substrate P2 from the substrate feeder 160 to the substrate holder 28 is completed, the main controller stops the supply (gas supply) of the pressurized gas from the upper surface of the substrate feeder 160. Then, the main control device finely drives the adsorption pads 27 to align (position adjust) the substrate P2 (see arrow H1). Subsequently, the main controller drives the suction pad 27 down (see arrow H2), starts suction holding of the substrate P2 by the substrate holder 28, and starts exposure of the substrate P2 newly mounted on the substrate holder 28.

Subsequently, the processes of fig. 4(a), 4(b) to 11(a) and 11(b) are repeatedly performed, thereby repeatedly performing exposure on the plurality of substrates P.

As described above in detail, according to the first embodiment, the exposure apparatus 100 includes: an exposure apparatus body 10; a chamber 200 for accommodating the exposure apparatus body 10; a substrate feeder 160 receiving and holding a substrate P transferred by an external transfer robot 300 outside the chamber 200; and a substrate slide hand 140 and a substrate loading carrier device 25 for transferring the substrate P from the external transfer robot 300 to the substrate feeder 160, transferring the substrate P from the substrate feeder 160 to the substrate holder 28 of the exposure apparatus main body 10, and transferring the substrate P from the substrate holder 28 to the external transfer robot 300. Thus, a substrate transfer port provided for transferring the substrate P from the external transfer robot 300 to the substrate feeder 160 in the conventional art (for example, japanese patent laid-open No. 2001-332600) is not required. Since the substrate transfer port is provided at a position between the exposure apparatus main body 10 and the external transfer robot 300, in the exposure apparatus 100 not provided with the substrate transfer port, the apparatus can be downsized (the occupied area can be reduced) according to the substrate transfer port. Further, by omitting the substrate transfer port section, the cost of the exposure apparatus 100 can be reduced. Further, in the exposure apparatus having the substrate transfer port section, the substrate P is transferred from the external transfer robot 300 to the substrate transfer port section and from the substrate transfer port section to the substrate holder 28 twice. Each time the substrate transfer operation is performed, the substrate P is subjected to an excessive stress, and the substrate P may be deformed or damaged. Therefore, as in the first embodiment, when the substrate transfer operation is performed only once between the exposure apparatus main body 10 and the external transfer robot 300, there is an effect that the substrate P is less likely to be deformed or damaged.

In the first embodiment, the substrate slide hand 140 moves in a direction including the X-axis direction in which the substrate feeder 160 and the substrate holder 28 are arranged when the substrate P is transferred from the substrate feeder 160 to the substrate holder 28 while holding a part of the substrate P. Accordingly, the substrate P can be transferred from the substrate feeder 160 to the substrate holder 28 with the movement of the substrate slide hand 140.

In the first embodiment, the upper surface (substrate support surface) of substrate feeder 160 is inclined with respect to the upper surface of substrate holder 28, and stage device 20 moves in the-X direction while substrate P is held by substrate carry-in carrier device 25, whereby substrate P is transferred from substrate feeder 160 to substrate holder 28. This allows the substrate P to be delivered to the substrate holder 28 while sliding along the upper surface of the substrate feeder 160, and therefore, the substrate P can be prevented from being warped or the like when the substrate P is delivered to the substrate holder 28.

In the first embodiment, the external transfer robot 300 does not enter the chamber 200 of the exposure apparatus 100, and dust adhering to the external transfer robot 300 can be prevented from entering the chamber 200. Further, since the volume of the chamber 200 can be reduced, temperature management in the chamber 200 becomes easy. Further, since the external transfer robot 300 does not enter the chamber 200, contact between the external transfer robot 300 and each part of the exposure apparatus 100 and the like can be suppressed as much as possible. In addition, the openings connecting the inside of the chamber 200 and the outside of the chamber 200 are only the carrying-in port 152U and the carrying-out port 152L having a size enough to move the substrate P, and thus, the entry of the garbage into the chamber can be prevented.

In the first embodiment, the + X-side end of the upper surface of the substrate feeder 160 is parallel to the XY plane. Thus, the substrate slide hand 140 can easily receive the substrate P transferred by the external transfer robot 300.

In the first embodiment, the substrate P on the substrate holder 28 is delivered to the external transfer robot 300 in a state where the substrate P is held on the upper surface of the substrate feeder 160, and then the substrate P held by the substrate feeder 160 is immediately delivered to the substrate holder 28. Thus, even if there is no substrate transfer port, the substrate on the substrate holder 28 can be quickly replaced.

In the first embodiment, since the carry-in port 152U and the carry-out port 152L of the barrier member 152 are provided separately, the carry-in port 152U and the carry-out port 152L are not opened simultaneously during the substrate replacement operation, and the carry-in port 152U and the carry-out port 152L are opened and closed separately, whereby entry of dust can be suppressed.

In the first embodiment, the case where the suction pad 27 of the substrate carry-in carrier device 25 is movable in the Y axis direction has been described, but the present invention is not limited thereto. For example, even when the suction pad 142 of the substrate sliding hand 140 can suction-hold the lower surface of the substrate P without moving (shifting) the substrate P on the substrate holder 28 in the Y-axis direction, the suction pad 27 may not be moved in the Y-axis direction.

In the first embodiment, the case where the hand 300F of the external transfer robot 300 is a flat plate-like member whose upper surface can float the substrate P by air has been described, but the present invention is not limited thereto. For example, the robot 300F may be a fork-shaped member or the like as long as the substrate P can be slid without causing dust. The robot 300F may have a rotating roller that rolls and contacts to transport the substrate P in the X-axis direction. By providing the rotating roller in the robot 300F, friction when the substrate P contacts the robot 300F can be reduced, and dust can be suppressed.

In the first embodiment, a mechanism for applying buoyancy to the substrate P by supplying (supplying) pressurized gas may be provided near the transfer port 152U or the transfer port 152L of the substrate carry-out/transfer-in unit 150. Further, a rotating roller that transports the substrate P in the X-axis direction by rolling contact may be provided near the carry-in port 152U or the carry-out port 152L of the substrate carry-out/carry-in unit 150.

In the first embodiment, the case where the substrate feeder 160 is fixed to the barrier member 152 of the substrate carry-out/carry-in unit 150 has been described, but the present invention is not limited thereto. The substrate feeder 160 may also be secured to a member other than the barrier member 152.

In the first embodiment, the substrate feeder 160 is provided above the corner portion on the + X side and the + Y side of the platen 22, but the present invention is not limited thereto. The substrate feeder 160 may be provided above the + X-side end and the Y-axis direction center of the platen 22, for example, as long as the exposure operation is not hindered.

In the first embodiment, the case where the carry-in-port shutter 154 and the carry-out-port shutter 156 are provided in the barrier member 152 of the substrate carry-out/carry-in unit 150 has been described, but the present invention is not limited to this. That is, at least one of the transfer-in shutter 154 and the transfer-out shutter 156 may be provided in the chamber 200.

Second embodiment

Next, an exposure apparatus according to a second embodiment will be described with reference to fig. 12 and 13. The configuration of the exposure apparatus 100A according to the second embodiment is the same as that of the first embodiment except for the difference in the configuration and operation of a part of the substrate feeder, and therefore only the difference will be described below.

Fig. 12 is a diagram showing an exposure apparatus 100A according to a second embodiment (a diagram corresponding to fig. 1(a) of the first embodiment).

In the first embodiment, the substrate feeder 160 is fixed to the barrier member 152 of the substrate carry-out/carry-in unit 150, but in the substrate carry-out/carry-in unit 150A of the second embodiment, as shown in fig. 12, the substrate feeder 161 is attached to the rotation shaft 162 provided in the barrier member 152.

The shape and function of substrate feeder 161 are the same as those of substrate feeder 160 according to the first embodiment, but since substrate feeder 161 is attached to a rotating shaft 162 extending in the Y-axis direction, rotation about rotating shaft 162 becomes free. Although not shown in fig. 12 and 13, the substrate feeder 161 is rotated by a driving mechanism (including a motor) not shown.

In the second embodiment, the notch 216b formed in the barrel platen 216 is set to be larger than the notch 216a of the first embodiment so as to avoid mechanical interference with the substrate feeder 161 or the substrate sliding hand 140 as the substrate feeder 161 is rotatable.

The substrate feeder 161 is shifted between a state in which the upper surface (substrate supporting surface) shown in fig. 12 is parallel to the XY plane and a state in which the substrate supporting surface shown in fig. 13 is inclined with respect to the XY plane (the same state as the first embodiment).

(substrate replacement action)

In the second embodiment, when the substrate P is carried in from the outside of the chamber 200 by the substrate slide hand 140 (P2), the main controller controls the driving mechanism so that the substrate supporting surface (upper surface) is kept parallel to the XY plane as shown in fig. 12. Then, when substrate P (P2) is pulled into substrate feeder 161 by substrate sliding hand 140, the main control device supplies (supplies) pressurized gas from the upper surface of external transfer robot 300 and the substrate supporting surface of substrate feeder 161. Thereby, the substrate supporting surface (upper surface) of the substrate feeder 161 and the supporting surface of the external transfer robot can be flush (in the same plane). In this state, since the main controller moves the substrate P2 by the substrate sliding hand 140, it is possible to prevent deformation or breakage of the substrate due to application of an excessive stress to the substrate P2.

As shown in fig. 12, when substrate P (P2) is transferred onto substrate feeder 161, the main control device starts suction holding of substrate P (P2) by substrate feeder 161. Then, the main controller controls the driving mechanism to rotate the substrate feeder 161 counterclockwise as shown in fig. 13, and after tilting the substrate supporting surface of the substrate feeder 161 with respect to the XY plane, the substrate on the substrate holder 28 is replaced as in the first embodiment.

As described above, according to the second embodiment, since the substrate feeder 161 can transition between a state in which the substrate support surface is parallel to the XY plane and a state in which the substrate support surface is inclined, it can be set to an appropriate state (posture) when the substrate P is received from the external transfer robot 300 or when the substrate P is transferred to the substrate holder 28. This can reduce the possibility that the carry-in port 152U or the substrate feeder 161 comes into contact with the substrate P.

Further, the substrate sliding hand 140 may not change the height position (position in the Z-axis direction) of the suction pad 142 when the substrate P (P2) is carried into the chamber 200 from the external transfer robot 300, and thus the control of the suction pad 142 can be simplified.

In addition, in the second embodiment, since the substrate support surface of the substrate feeder 161 can be inclined and the-X end of the substrate P (P2) newly placed on the substrate holder 28 can be brought close to the upper surface of the substrate holder 28 at the time of substrate replacement, the stroke in the Z direction of the suction pad 142 of the substrate carry-in carrier device 25 can be shortened (or set to 0), and the substrate P (P2) can be smoothly transferred to the substrate holder 28 without impact.

In the second embodiment, the description has been given of the case where the rotation shaft 162 is located at the + X end of the substrate feeder 161, but the present invention is not limited to this, and the rotation shaft 162 may be located at an X-axis direction intermediate portion of the substrate feeder 161, for example.

Third embodiment

Next, an exposure apparatus according to a third embodiment will be described with reference to fig. 14 to 18. Fig. 14 shows a cross-sectional view of an exposure apparatus 100B according to a third embodiment (a view corresponding to fig. 2 of the first embodiment).

The exposure apparatus 100 according to the first embodiment includes the substrate sliding hand 140, but the exposure apparatus 100B according to the third embodiment includes the first sliding hand 240 and the second sliding hand 340 instead of the substrate sliding hand 140.

The first sliding hand 240 is provided on the upper surface (substrate supporting surface) of the substrate feeder 163. The substrate feeder 163 has the same structure and function as the substrate feeder 160 of the first embodiment. The first sliding hand 240 has: a rail 246 provided on the substrate supporting surface of the substrate feeder 163; and an adsorption pad 242 moving along the rail 246. Further, assuming that the rail 246 is fitted into the substrate feeder 163, there is no step between the upper surface of the rail 246 and the upper surface (substrate supporting surface) of the substrate feeder 163. The first sliding hand 240 moves in the-X direction by sucking and holding a part of the substrate P conveyed by the external conveyance robot 300, and thereby can pull the substrate P into the chamber 200 (on the substrate feeder 163).

Second sliding hand 340 is provided on the + X-side surface of stage device 20 (substrate stage 24). The second sliding hand 340 has the same configuration as the substrate sliding hand 140 of the first embodiment, and includes a rail 346 extending in the X-axis direction, a Z-drive mechanism 344 moving in the X-axis direction along the rail 346, and a suction pad 342 driven in the Z-axis direction by the Z-drive mechanism 344. The second sliding hand 340 moves in the + X direction by sucking and holding a part of the substrate P placed on the substrate holder 28, and thereby can transfer the substrate P from the substrate holder 28 to the external transfer robot 300.

That is, in the third embodiment, the same function as that of the substrate sliding hand 140 of the first embodiment is realized by the first sliding hand 240 and the second sliding hand 340.

The other configuration of the exposure apparatus 100B is the same as that of the exposure apparatus 100 of the first embodiment.

(substrate replacement action)

The operation of replacing the substrate P on the substrate holder 28 in the exposure apparatus 100B will be described in detail below with reference to fig. 14 to 18 (B). Fig. 15(a) and 15(b) show a plan view and a vertical cross-sectional view of the vicinity of stage device 20 at the same timing, and fig. 16(a) and 16(b), fig. 17(a) and 17(b), and fig. 18(a) and 18(b) also show a plan view and a vertical cross-sectional view of the vicinity of stage device at the same timing. In fig. 15(a) to 18(B), the configuration of the exposure apparatus 100B that is not necessary for the description is not shown.

In the substrate replacement operation, the operation of carrying out the exposed substrate P1 and the operation of carrying in (placing) the newly exposed substrate P2 (different from the substrate P1) on the substrate holder 28 are executed. In a state where exposure of the substrate P1 on the substrate holder 28 is being performed in the exposure apparatus main body 10, as shown in fig. 14, the main controller drives the external transfer robot 300 holding the substrate P2 before exposure to the vicinity of the chamber 200 (the vicinity of the transfer port 152U). Further, it is assumed that at this stage, the adsorption pad 242 of the first sliding hand 240 is located at the + X end of the rail 246.

(operation in FIG. 15(a) and FIG. 15 (b))

From this state, the main controller slides the transfer port shutter 154 in the + Z direction, thereby opening the transfer port 152U (see arrow J1 in fig. 15 b). Next, the main control device drives the external transfer robot 300 in the-X direction (see arrow J2 in fig. 15 a and 15 b) to insert the-X-side end of the substrate P2 into the chamber 200. Thereby, the-X side end of the lower surface of the substrate P2 will approach or contact the adsorption pad 242. Then, the main controller starts suction holding of the suction pad 242 to a part of the lower surface of the substrate P2 (see arrow J3 in fig. 15 b).

(operation in FIG. 16(a) and FIG. 16 (b))

Next, the main controller starts the supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 163, and drives the adsorption pad 242 of the first sliding hand 240 toward the-X side (the direction of arrow K1 in fig. 16a and 16 b) along the rail 246. Thus, the substrate P2 is conveyed into the chamber 200 along the upper surface of the robot 300F and the upper surface of the substrate feeder 163. Further, after the main control device conveys the substrate P2 onto the substrate feeder 163, the supply of the pressurized gas from the substrate feeder 163 and the robot 300F is stopped, and the adsorption holding of the substrate P2 by the substrate feeder 163 is started. The main controller closes the carry-in shutter 154 and opens the carry-out shutter 156. When exposure to substrate P1 at stage device 20 is completed, the main control unit drives stage device 20 to the position (substrate replacement position) shown in fig. 16a and 16b (see arrow K2).

When the stage device 20 moves to the vicinity of the substrate replacement position, the main controller starts the supply of the pressurized gas from the upper surface 28u of the substrate holder 28, and drives the suction pad 27 of the substrate carry-in carrier device 25 in the + Z direction and the + Y direction so that the substrate P1 is displaced from the substrate holder 28 to the + Y side (see arrow K3 in fig. 16 a). Then, the main control device drives the external transfer robot 300 in the + X direction (see arrow K4).

(operation in FIG. 17(a) and FIG. 17 (b))

The main control device drives the external transfer robot 300 in the-Z direction and the-X direction (see arrows L1 and L2 in fig. 17 (b)), thereby bringing the-X end of the robot 300F close to the carrying-out port 152L. Then, the main control device starts the supply (gas supply) of the pressurized gas from the upper surface of the robot 300F.

Then, the main controller drives the suction pad 342 of the second sliding hand 340 to move up, and the lower surface of the board P1 is sucked and held by the suction pad 342. Then, the main controller drives the suction pad 342 in the + X direction along the rail 346 (see arrow L3), and slides and conveys the substrate P1 from the substrate holder 28 to the robot 300F. After the substrate P1 is slidingly transferred to the robot 300F, the main control device drives the robot 300F in the + X direction, retracts the substrate P1 to the outside of the chamber 200, and closes the transfer-out shutter 156.

Then, the main controller drives the suction pad 27 of the substrate carry-in carrier device 25 to move up (see arrow L4), and starts suction holding of the-X end of the substrate P2 by the suction pad 27 (see arrow L5). Further, the main controller starts the supply of the pressurized gas from the upper surface of the substrate feeder 163.

(operation in FIG. 18(a) and FIG. 18 (b))

The main controller drives stage device 20 in the-X direction with substrate P2 sucked and held by suction pads 27 of substrate carry-in carrier device 25 (see arrow N1). Thereby, the substrate P2 is delivered from the substrate feeder 163 to the substrate holder 28. While the substrate P2 is being transferred from the substrate feeder 163 onto the substrate holder 28, a pressurized gas is supplied from the upper surface of the substrate holder 28.

On the other hand, when the entire substrate P2 is transferred from the substrate feeder 163 to the substrate holder 28, the main control device stops the supply of the pressurized gas from the upper surface of the substrate feeder 163. Then, the main control device finely drives the suction pads 27 to perform alignment (position adjustment) of the substrate P2. Subsequently, the main controller drives the suction pad 27 down (see arrow N2), and starts exposure to the substrate P2 newly mounted on the substrate holder 28.

Then, the main control device drives the external transfer robot 300 in the + X direction (see arrow N3), thereby transferring the substrate P1 to the external device.

Subsequently, the above-described processes of fig. 15(a), 15(b) to 18(a) and 18(b) are repeatedly performed, thereby repeatedly performing exposure on the plurality of substrates P.

As described above in detail, the third embodiment includes: a first sliding hand 240 drawing the substrate P from the outside of the chamber 200 into the inside of the chamber 200; and a second slide hand 340 for carrying out the substrate P from the inside of the chamber 200 to the outside of the chamber 200. This improves the degree of freedom in design, and thus, for example, the substrate replacement position of stage device 20 can be set to the + X-side end and the vicinity of the Y-axis direction center of platen 22.

In the third embodiment, since the first sliding hand 240 is provided at the center of the substrate feeder 163 in the Y-axis direction, a space is generated on the + Y side and the-Y side of the substrate feeder 163. This enables design changes such as holding the substrate feeder 163 from the Y-axis direction.

In the third embodiment, since second slide hand 340 is provided on stage device 20, the substrate carry-out operation can be started before stage device 20 reaches the substrate replacement position.

In the third embodiment, since the rails 246 of the first sliding hand 240 are provided along the upper surface (substrate supporting surface) of the substrate feeder 163, the control can be simplified as compared with the case where the control is performed in the two axial directions of the X axis and the Z axis when the adsorption pad 242 is driven as in the first embodiment. Further, the rail 146 does not need to be provided as in the first and second embodiments, and the number of components can be reduced.

In the third embodiment, the posture (inclination of the substrate support surface) of the substrate feeder 163 can be changed as in the second embodiment.

Fourth embodiment

Next, an exposure apparatus 100C according to a fourth embodiment will be described with reference to fig. 19 and 20. As shown in fig. 19(a) and 19(b), an exposure apparatus 100C according to the fourth embodiment has substantially the same configuration as the exposure apparatus 100 according to the first embodiment, but differs in that a substrate feeder 160 has a function of suspending and holding a substrate P in a non-contact manner on a lower surface.

For example, holes for discharging pressurized gas are formed in the lower surface of the substrate feeder 160, and air is exhausted in accordance with the principle of a known Bernoulli chuck (Bernoulli's chuck), whereby a negative pressure can be generated between the upper surface of the substrate P and the lower surface of the substrate feeder 160. Therefore, in the present fourth embodiment, the substrate P can be held in a non-contact suspended manner by the negative pressure generated between the upper surface of the substrate P and the lower surface of the substrate feeder 160 (i.e., the upper surface of the substrate P is held in a non-contact manner on the lower surface of the substrate feeder 160). However, the present invention is not limited to this, and a hole for vacuum suction and a hole for exhausting pressurized gas may be provided in advance on the lower surface of the substrate feeder 160, and the substrate P may be suspended and held in a non-contact manner by using the balance between vacuum suction and air exhaust of these holes.

(substrate replacement action)

Fig. 19(a) and 19(b) show diagrams corresponding to fig. 8(a) and 8(b) of the first embodiment. The state shown in fig. 19(a) and 19(b) is a state in which substrate P2 before exposure is held on the upper surface of substrate feeder 160, and stage device 20 and exposed substrate P1 are positioned facing the lower surface of substrate feeder 160. In this state, the substrate P1 is slightly displaced in the + Y direction with respect to the substrate holder 28, and the pressurized gas is supplied from the upper surface 28u of the substrate holder 28, whereby the lower surface of the substrate P1 and the upper surface of the substrate holder 28 are brought into a non-contact state. Then, the suction pad 142 of the substrate sliding hand 140 is in a state of sucking and holding a part of the lower surface of the substrate P1.

From this state, the main control device discharges the pressurized gas from the lower surface of the substrate feeder 160, thereby holding the substrate P1 in non-contact suspension on the lower surface of the substrate feeder 160 by the principle of the bernoulli chuck.

Next, the main control device causes a part of the substrate P2 on the substrate feeder 160 to be suction-held to the suction pad 27 of the substrate carry-in carrier device 25, and starts the supply of the pressurized gas from the upper surface of the substrate feeder 160. As shown in fig. 20 a and 20 b, the main controller moves the suction pad 142 of the substrate slide hand 140 in the + X direction (see arrow Q1) to start the transfer of the substrate P1 to the external transfer robot 300, and drives the stage device 20 in the-X direction (see arrow Q2) to transfer the substrate P2 from the substrate feeder 160 to the substrate holder 28. Further, as described above, since the substrate P1 is suspended and held in a non-contact manner by generating negative pressure on the lower surface of the substrate feeder 160, when the substrate P1 is slidingly conveyed by the substrate carry-in carrier device 25 as shown in fig. 20(b), the substrate P1 can be smoothly slidingly conveyed to the external conveyance robot 300 even if the substrate holder 28 is not present on the lower side of the substrate P1.

As described above, according to the fourth embodiment, since the substrate P1 carried out to the outside is held in a non-contact suspended manner on the lower surface of the substrate feeder 160, the stage device 20 does not wait at the substrate replacement position until the substrate P1 is transferred from the substrate holder 28 to the external transfer robot 300. As a result, as shown in fig. 20(b), the operation of placing a new substrate P2 on the substrate holder 28 can be started at a stage before the substrate P1 is transferred to the external transfer robot 300. Therefore, according to the fourth embodiment, the time required for substrate replacement can be shortened. Further, after substrate P2 is placed on substrate holder 28 and stage device 20 is moved in the-X direction, substrate P1 held in non-contact with the lower surface of substrate feeder 160 may be transferred to external transfer robot 300. Accordingly, when the stage device 20 is located near the carrying-out port 152L, the carrying-out port shutter 156 can be closed, and therefore, even if dust enters the chamber 200 from the carrying-out port 152L, the possibility of dust adhering to the stage device 20 is low.

In the substrate feeder 160 according to the fourth embodiment, the barrier member 152 may be rotatably provided, as in the second embodiment. That is, the upper surface of the substrate feeder 160 may be shifted between a state of being horizontal to the XY plane and a state of being inclined.

In the fourth embodiment, as in the third embodiment, a first sliding hand 240 and a second sliding hand 340 may be provided instead of the substrate sliding hand 140.

Fifth embodiment

Next, a fifth embodiment will be described with reference to fig. 21. Fig. 21(a) shows a substrate carry-out/carry-in unit 150' according to the fifth embodiment. The substrate carry-out/in unit 150 'includes a substrate feeder 165 instead of the substrate feeder 160 of the substrate carry-out/in unit 150 according to the first embodiment, and includes a carry-out shutter 156' instead of the carry-out shutter 156.

The substrate feeder 165 includes: a first portion 165a fixed to the-X side face of the barrier member 152, and a second portion 165b slidably movable with respect to the first portion 165 a. The sliding movement direction of the second portion 165b is assumed to be the same direction as the tilt direction (direction tilted with respect to the X axis and the Z axis in the XZ plane) of the upper surface (substrate supporting surface) of the second portion 165 b. As shown in fig. 21(b), a drive mechanism 165c of a feed screw system, for example, is provided between the first portion 165a and the second portion 165 b. The driving mechanism 165c drives the second portion 165b to change the interval between the second portion 165b and the first portion 165 a. The driving mechanism 165c is not limited to the feed screw type, and may be a driving mechanism of another type such as a driving mechanism including a linear motor.

In the fifth embodiment, the substrate feeder 165 is configured as described above, and thus the first portion 165a and the second portion 165b are brought close to each other as shown in fig. 21(a) except for the time of substrate replacement. This can prevent the substrate feeder 165 from interfering with operations such as exposure operation and maintenance. In addition, at the time of substrate replacement, the second section 165b of the substrate feeder 165 is moved as shown in fig. 21(b), whereby the substrate replacement position can be set to a position closer to the-X side. This can shorten the stroke in the X-axis direction when stage device 20 moves to the substrate replacement position.

In the fifth embodiment, the substrate replacement position is set to the-X side of the first embodiment or the like by using the substrate feeder 165 as described above, and therefore, there is a possibility that the distance between the substrate holder 28 and the external transfer robot 300 may be increased at the time of substrate replacement. However, in the fifth embodiment, as shown in fig. 21(b), the length of the carrying-out port shutter 156 'in the X-axis direction when the carrying-out port 152L is opened is set longer than the carrying-out port shutter 156 shown in fig. 1(b) and the like, and the lifting force applying mechanism for supplying the pressurized gas upward from the + Z-side surface in the state of fig. 21(b) is provided in the carrying-out port shutter 156'. The carrying-out port shutter 156' moves in the opposite direction to the carrying-out port shutter 156 when opening and closing the carrying-out port 152L (moves clockwise when opening the carrying-out port 152L, and moves counterclockwise when closing). Thus, the carry-out shutter 156' bridges the substrate P between the substrate holder 28 and the external transfer robot 300. Therefore, according to the fifth embodiment, the substrate P can be delivered from the substrate holder 28 to the external transfer robot 300 without causing the substrate to bend.

In the fifth embodiment, when the carrying-out port 152L is opened by the carrying-out port shutter 156 '(fig. 21(b)), the + X end of the carrying-out port shutter 156' is located at substantially the same position as the + X end of the carrying-out port 152L. Accordingly, the external transfer robot 300 can receive the substrate from the substrate holder 28 at the position closer to the + X side than the carry-out port 152L, and thus entry of dust into the chamber 200 can be suppressed as much as possible.

In the fifth embodiment, the carrying-out port shutter 156 similar to the first to fourth embodiments may be used instead of the carrying-out port shutter 156'.

As with the carrying-out port shutter 156' of the fifth embodiment, the carrying-out port shutter 156 described in the first to fourth embodiments may have a function of supplying pressurized gas from the upper surface thereof in a state where the carrying-out port 152L is opened.

In the fifth embodiment, the substrate feeder 165 may be rotatably provided, as in the second embodiment.

Sixth embodiment

Next, a sixth embodiment will be described with reference to fig. 22 to 24. Fig. 22(a) and 22(b) show a lateral sectional view and a longitudinal sectional view of an exposure apparatus according to a sixth embodiment. In the sixth embodiment, the third embodiment (fig. 14 to 18) is modified, and as shown in fig. 22 a, the width of the substrate feeder 166 in the Y axis direction is set to be wider than the width of the substrate feeder 163 in fig. 14 in the Y axis direction. Further, as shown in fig. 22(b), the substrate feeder 166 is rotatably supported near its + X end by a rotary shaft 176 extending in the Y-axis direction. The substrate feeder 166 is suspended and supported at two locations near both ends in the Y axis direction by suspension mechanisms 186 provided in the barrier member 152. Further, the barrier member 152 of the sixth embodiment is provided with a holding portion 155 that holds the suspension mechanism 186, unlike the barrier member 152 of the first to fifth embodiments.

The suspension mechanism 186 has two cables 196 that suspend and support the substrate feeder 166, and adjusts the inclination of the upper surface (substrate supporting surface) of the substrate feeder 166 by adjusting the length by winding or unwinding the two cables 196. In the sixth embodiment, by adopting the above-described configuration as the substrate feeder 166, even when the rigidity of the vicinity of the rotation shaft 176 of the substrate feeder 166 is low, the posture of the substrate feeder 166 can be accurately controlled while suppressing the deflection of the substrate feeder 166 by a small force of the suspension mechanism 186.

(substrate replacement action)

In the sixth embodiment, the main control device controls the suspension mechanism 186 so as to maintain the upper surface (substrate support surface) of the substrate feeder 166 horizontal as shown in fig. 22 b when performing the substrate replacement operation. Then, the main control device slides the transfer port shutter 154 in the + Z direction to open the transfer port 152U (see arrow R1), and brings the external transfer robot 300 close to the transfer port 152U (see arrow R2), thereby positioning the-X end of the substrate P2 near the + X end of the substrate supporting surface of the substrate feeder 166. Further, it is assumed that at this stage, the adsorption pad 242 of the first sliding hand 240 is located at the + X end of the rail 246.

Next, the main controller starts suction holding of the suction pad 242 to a part of the lower surface of the board P2 (see arrow R3 in fig. 22 b).

Next, the main controller starts the supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 166, and drives the suction pad 242 of the first sliding hand 240 toward the-X side along the rail 246 as shown in fig. 23 a and 23 b (see arrow R4). Thus, substrate P2 is pulled into chamber 200 along the upper surface of robot 300F and the upper surface of substrate feeder 166. Further, after the main controller conveys the substrate P2 onto the substrate feeder 166, the supply of the pressurized gas from the substrate feeder 166 and the robot 300F is stopped, and the adsorption holding of the substrate P2 by the substrate feeder 166 is started.

Next, the main controller closes the carry-in shutter 154 and opens the carry-out shutter 156. When exposure to substrate P1 at stage device 20 is completed, the main control unit drives stage device 20 to the position (substrate replacement position) shown in fig. 24 (see arrow R5).

Next, as shown in fig. 24, the main control device controls the suspension mechanism 186 to adjust the length of the cable 196 (see arrow R6), thereby tilting the substrate supporting surface of the substrate feeder 166. Then, the main controller starts the supply of the pressurized gas from the upper surface 28u of the substrate holder 28, and drives the suction pad 27 of the substrate carry-in carriage device 25 in the + Z direction and the + Y direction, thereby displacing the substrate P1 from the substrate holder 28 to the + Y side. Then, the main control device positions the external transfer robot 300 to a position near the carrying-out port 152L shown in fig. 24, and starts the supply (gas supply) of the pressurized gas from the upper surface of the hand 300F.

Then, the main controller drives the suction pad 342 of the second sliding hand 340 to move up, and the lower surface of the board P1 is sucked and held by the suction pad 342. Then, the main controller drives the suction pad 342 in the + X direction along the rail 346, and slides and conveys the substrate P1 from the substrate holder 28 to the robot 300F. After the substrate P1 is slidingly transferred to the robot 300F, the main control device drives the robot 300F in the + X direction, retracts the substrate P1 to the outside of the chamber 200, and closes the transfer-out shutter 156. The main control device drives the external transfer robot 300 in the + X direction, thereby transferring the substrate P1 to the external device.

Then, the main controller drives the suction pad 27 of the substrate carry-in carrier device 25 to move up (see arrow R7), and starts suction holding of the-X end of the substrate P2 by the suction pad 27 (see arrow R8). Further, the main controller starts the supply of the pressurized gas from the upper surface of the substrate feeder 166.

Then, the main control device drives stage device 20 in the-X direction in a state where suction pad 27 of substrate carry-in carrier device 25 sucks and holds substrate P2. Thus, as in fig. 18(b), the substrate P2 is delivered from the substrate feeder 166 to the substrate holder 28. While the substrate P2 is being transferred from the substrate feeder 166 to the substrate holder 28, a pressurized gas is supplied from the upper surface of the substrate holder 28.

On the other hand, when the substrate P2 is transferred from the substrate feeder 166 to the substrate holder 28, the main control device stops the supply of the pressurized gas from the upper surface of the substrate feeder 166. After alignment (position adjustment) of the substrate P2 is performed, the main controller drives the suction pad 27 down to start exposure for the substrate P2 newly mounted on the substrate holder 28.

Subsequently, by repeatedly performing the above-described processes, exposure to a plurality of substrates P is repeatedly performed.

In the sixth embodiment, the substrate feeder 166 is suspended and held by the pair of cables 196, but the present invention is not limited thereto. For example, the support may be suspended by a mechanism having no flexibility. For example, the support substrate feeder 166 may be suspended by an air cylinder or the like.

The substrate feeder 166 may be a substrate feeder having a first part and a second part as in the fifth embodiment (see fig. 21 a).

Seventh embodiment

Next, a seventh embodiment will be described with reference to fig. 25. Fig. 25 shows a state in which stage device 20 has been positioned to the substrate exchange position in the exposure apparatus according to the seventh embodiment.

In the present seventh embodiment, the substrate feeder 167 is supported on its upper surface by a support frame 78 provided on the + Y side of the substrate feeder 167. Further, the substrate feeder 167 has a feature of suspending and holding the substrate P newly carried into the substrate holder 28 on the lower surface side in a non-contact manner (P2). The mechanism for non-contact suspension holding is the same as in the fourth embodiment. In the seventh embodiment, the barrier member 152 of the first to sixth embodiments is not provided, and the chamber 200 is provided with the opening/

closing doors

198a and 198b for opening and closing the opening 200 a.

In the seventh embodiment, since the barrier member 152 is omitted as described above, the occupied area of the entire exposure apparatus can be reduced. Moreover, since the substrate feeder 167 is supported on the upper surface side, it is possible to suppress occurrence of flexure of the substrate feeder 167 compared to the case where the substrate feeder 167 is supported by being cantilevered.

(substrate replacement action)

While the stage device 20 is performing the exposure operation, the main controller opens the open/

close doors

198a and 198b (see arrow S1), and controls the external transfer robot 300 to position the-X end of the newly loaded substrate P2 below the + X end of the lower surface of the substrate feeder 167. Then, the main controller starts non-contact suspension holding of the substrate P2 on the lower surface of the substrate feeder 167, and carries the substrate P2 to the position shown in fig. 25 using the substrate sliding hand 140.

Then, the main controller drives the substrate P1 on the substrate holder 28 in the + X direction while holding it on the substrate slide hand 140, and slides and conveys the exposed substrate P1 from the substrate holder 28 to the robot hand 300F of the external conveyance robot 300 (see arrow S2), as in the previous embodiments.

Subsequently, the main control device causes substrate P2 to be sucked and held by suction pad 27 of substrate carry-in carrier device 25, and drives stage device 20 in the-X direction, thereby causing substrate P2 to be handed over from above substrate feeder 167 to substrate holder 28.

The subsequent operations are the same as those in the third embodiment.

Eighth embodiment

Next, the eighth embodiment will be described in detail with reference to fig. 26 to 30. Fig. 26(a) and 26(b) show a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to an eighth embodiment. In fig. 26 to 30, the chamber 200 is not shown for convenience.

In the eighth embodiment, the hand 300F 'of the external transfer robot 300' has a flat plate-like member whose-X-side end is processed into a comb-teeth shape. However, the robot 300F' supplies the pressurized gas from the upper surface, as in the above embodiments, and thereby can support the substrate P by floating it in the air and can vacuum-adsorb the substrate P.

In the eighth embodiment, a barrier member 172 is used instead of the barrier member 152 described in the first embodiment and the like. The barrier member 172 has a box-shaped portion forming a space 173, and a substrate feeder 168 is provided on an upper surface of an upper wall (+ Z-side wall) of the box-shaped portion. Further, the wall of the box-like portion on the + X side is provided with a carrying-out port 172L, and the wall of the box-like portion on the-X side is provided with a substrate passage port 172M. Further, a carrying-in port 172U is provided above the carrying-out port 172L of the barrier member 172. An outlet shutter 156 is provided near the outlet 172L, and an inlet shutter 154 is provided near the inlet 172U. Since fig. 26(b) is a sectional view, the + Y side and the-Y side of the box-shaped portion are closed by walls, although not shown.

The substrate feeder 168 is reciprocally movable in the X-axis direction along a pair of rails 174, the pair of rails 174 being laid along the X-axis direction on the upper surface of the upper wall of the box-shaped portion of the barrier member 172. In addition, the movable range of the substrate feeder 168 in the X-axis direction is about half the length of the substrate P in the X-axis direction.

In the eighth embodiment, a plurality of (four in fig. 26 a) rod-shaped air floating members 29 are provided at predetermined intervals in the Y-axis direction on the + X-side end surface of the substrate holder 28. An opening, not shown, is provided on the upper surface (+ Z surface) of the air floating member 29, and pressurized gas is supplied from the opening.

(substrate replacement action)

Next, a substrate replacement operation in the eighth embodiment will be described with reference to fig. 26 to 30. Fig. 26(a) and 26(b), fig. 27(a) and 27(b), and fig. 28(a) and 28(b) show a transverse sectional view and a longitudinal sectional view of the vicinity of the stage device at the same timing. In fig. 26(a) to 30(b), the structures of the exposure apparatus that are not necessary for the description are not shown.

(operation in FIG. 26(a) and FIG. 26 (b))

In the state shown in fig. 26(a) and 26(b), substrate P1 is being exposed on stage device 20. On the other hand, the main controller slides the transfer port shutter 154 in the + Z direction to receive the substrate P2 to be exposed next into the chamber 200, thereby opening the transfer port 152U (see arrow T1 in fig. 26 b). Next, the main control device drives the external transfer robot 300' in the-X direction (see arrow T2 in fig. 26(a) and 26 (b)) to insert the-X-side end of the substrate P2 into the chamber 200. Thus, the-X side end of substrate P2 will be above the + X end of substrate feeder 168. Then, the main controller brings the suction pad 142 of the substrate sliding hand 140 into contact with a part of the lower surface of the substrate P2 to start suction holding. Then, the main controller starts the supply of the pressurized gas from the upper surface of the robot hand 300F 'of the external transfer robot 300' and the upper surface of the substrate feeder 168.

(operation in FIG. 27(a) and FIG. 27 (b))

The main control device drives the adsorption pad 142, thereby moving the substrate P2 along the substrate supporting surface (upper surface) of the substrate feeder 168 (see arrow T3).

(operation in FIG. 28(a) and FIG. 28 (b))

When the substrate P2 moves to the position shown in fig. 28(a) and 28(b) by the movement of the suction pad 142, the main control device drives the external transfer robot 300' (see arrow T4) downward (-Z direction) and positions it near the carrying-out port 172L. Then, the main controller slides the transfer port shutter 154 in the-Z direction to close the transfer port 172U (see arrow T5).

(operation in FIG. 29 (a))

Subsequently, when the exposure of the stage device 20 with respect to the substrate P1 is completed, the main control device moves the stage device 20 to the substrate replacement position (see arrow T6). In the state where stage device 20 is positioned at the substrate replacement position, air floating member 29 enters space 173 through substrate passage opening 172M as shown in fig. 29 (a). Then, the main controller starts suction holding of the substrate P2 by the substrate feeder 168, and drives the substrate feeder 168 in the-X direction along the rail 174 (see arrow T7). Further, the adsorption pad 142 holding the substrate P2 may be moved in the-X direction in synchronization with the movement of the substrate feeder 168, or the adsorption holding of the substrate P2 by the adsorption pad 142 may be released in advance and the adsorption pad 142 may be moved in the-X direction in advance when the substrate feeder 168 is moved.

Then, the main controller slides the conveyance port shutter 156 in the-Z direction to open the conveyance port 172L (see arrow T8). Then, the main control device drives the external transfer robot 300' in the-X direction, thereby causing the external transfer robot 300 to enter the space 173 formed by the barrier member 172 (see arrow T9). In this state, the substrate holder 28 and the air floating member 29 are substantially at the same height as the upper surface of the hand 300F 'of the external transfer robot 300'. Further, the air floating member 29 and the comb-tooth-shaped portion of the robot 300F' are in a nested state, so that mechanical interference (contact) is avoided.

(operation in FIG. 29 (b))

Next, the main controller slightly raises the suction pad 27 of the substrate carry-in carrier device 25, and sucks and holds the lower surface of the substrate P1 on the suction pad 27. Then, the main controller starts the supply (gas supply) of the pressurized gas from the upper surface of the substrate holder 28, and moves the suction pad 27 that sucks and holds the substrate P1 in the + Y direction, thereby slightly shifting the substrate P1 from the substrate holder 28 in the + Y direction. Due to this displacement, the suction pad 142 of the substrate sliding hand 140 can hold the corner on the-X side and the + Y side of the lower surface of the substrate P1.

Next, the main control device holds a part of the lower surface of the board P1 by suction through the suction pad 142 of the board sliding hand 140. Further, it is assumed that the main control device starts the supply (air supply) of the pressurized gas from the upper surfaces of the air floating member 29 and the robot 300F' at the stage of fig. 29 b.

Next, the main controller starts the movement of the suction pad 142 of the substrate sliding hand 140 in the + X direction (see arrow T10). Then, the main controller drives the suction pad 27 of the substrate carry-in carriage device 25 in the + Z direction (see arrow T11) at a timing when the substrate P1 has moved a predetermined distance in the-X direction, and starts suction holding of the-X end of the substrate P2 on the substrate feeder 168 by the suction pad 27.

(operation in FIG. 30 (a))

Next, the main control device starts supply of the pressurized gas (gas supply) from the upper surface of the substrate feeder 168. Then, the main control device drives stage device 20 in the-X direction with substrate P2 sucked and held by suction pads 27 of substrate carry-in carrier device 25 (see arrow T12). Then, the main control device moves substrate feeder 168 in the + X direction while driving stage device 20 in the-X direction. As a result, as shown in fig. 10(a), the substrate P2 is transferred from the substrate feeder 168 to the substrate holder 28. Thus, substrate P2 can be carried onto substrate holder 28 at a higher speed by driving stage device 20 and substrate feeder 168 in a direction away from each other in the X direction than by driving stage device 20 in the-X direction alone, thereby carrying substrate P2 onto substrate holder 28. This is made possible by adopting a device structure in which the substrate feeder 168 can be driven in the + X direction by providing the space 173 in the chamber 200. The timing for driving stage device 20 in the-X direction may be different from the timing for moving substrate feeder 168 in the + X direction. The main control device may move the substrate feeder 168 in the + X direction after the substrate P2 has been transferred to the substrate holder 28.

(operation in FIG. 30 (b))

As shown in fig. 30(b), the main controller continues the movement of the suction pad 142 in the + X direction, and thereby transfers the substrate P1 to the hand 300F 'of the external transfer robot 300'. When the transfer is completed, the main control device stops the suction holding of the suction pad 142 to the substrate P1. Then, the main control device drives the external transfer robot 300' (see arrow T13) holding the substrate P1 in the + X direction, and transfers the substrate P1 to an external device. Then, the main controller slides the conveyance port shutter 156 in the + Z direction, thereby closing the conveyance port 172L (see arrow T14).

The subsequent operation is the same as in the first embodiment and the like.

As described above in detail, according to the eighth embodiment, the loading operation of the substrate P2 into the substrate holder 28 and the unloading operation of the substrate P1 from the substrate holder 28 can be performed in parallel, and therefore the time required for the substrate replacement operation can be shortened.

In the eighth embodiment, the air floating member 29 is provided on the + X side of the substrate holder 28, and the-X side end of the hand 300F 'of the external transfer robot 300' is comb-toothed. Thus, the air floating member 29 and the robot 300F' are fitted to each other, and therefore, the substrate P can be prevented from being bent when the substrate P is transferred.

In the eighth embodiment, as in the fourth embodiment, a substrate (a substrate to be carried out) may be supported on a lower surface of the substrate feeder 168 in a non-contact manner.

In the eighth embodiment, a shutter for opening and closing the substrate passage opening 172M may be provided. Further, a shutter for opening and closing the substrate passage port 172M may be provided, and the transfer port shutter 156 may be omitted.

In the eighth embodiment, the rail 146 of the substrate sliding hand 140 may be provided on the substrate feeder 168. At this time, since the substrate feeder 168 may move in the X-axis direction, the length of the rail 146, i.e., the X stroke of the adsorption pad 142, may be shortened.

Ninth embodiment

Next, a ninth embodiment will be described with reference to fig. 31 and 32. Fig. 31(a) and 31(b) show a lateral sectional view and a longitudinal sectional view of an exposure apparatus according to a ninth embodiment.

The exposure apparatus according to the ninth embodiment is characterized in that a substrate feeder 169 is used instead of the substrate feeder 168 according to the eighth embodiment. On the + X side of the upper surface of the substrate feeder 169, a plurality of (three in fig. 31 a) grooves 169a are formed. The size and the interval of the slots 169a are set so that the substrate feeder 169 does not contact the robot 300F ' even when the robot 300F ' of the external transfer robot 300' enters from the carry-in port 172U. The other structure is the same as that of the eighth embodiment.

(substrate replacement action)

Next, a substrate replacement operation according to the ninth embodiment will be described with reference to fig. 31 and 32. Fig. 31(a) and 31(b), and fig. 32(a) and 32(b) show a lateral cross section and a vertical cross section of the vicinity of the stage device at the same timing. In fig. 31(a) to 32(b), the structures of the exposure apparatus that are not necessary for the description are not shown.

It is assumed that exposure to the substrate P1 placed on the substrate holder 28 is being performed in the stage device 20 in the state of fig. 31(a) and 31 (b). In this state, the main controller slides the transfer port shutter 154 in the + Z direction to open the transfer port 172U (see arrow U1 in fig. 31 b) in order to receive the substrate P2 to be exposed next into the chamber 200. Next, the main control device drives the external transfer robot 300' in the-X direction (see arrow U2 in fig. 31(a) and 31 (b)). By the operation of the external transfer robot 300', as shown in fig. 32(a) and 32(b), the-X side half of the robot 300F' and the-X side half of the substrate P2 are positioned above the substrate feeder 169.

Next, the main control device drives the robot 300F' to descend, and thereby delivers a part of the substrate P2 to the substrate feeder 169.

Then, the main controller starts the supply of the pressurized gas from the substrate supporting surface (upper surface) of the substrate feeder 169 and the upper surface of the robot 300F'. Then, the main controller drives the suction pad 142 to suction and hold the + Y side and-X side end portions of the board P2 on the suction pad 142.

Subsequently, the main control device performs the same operation as in the eighth embodiment, thereby replacing the substrate on the substrate holder 28.

As described above, according to the ninth embodiment, since the external transfer robot 300' enters the chamber 200 and delivers the-X half of the substrate P2 to the substrate feeder 169, the X-direction movement range (stroke) and the Z-direction movement range of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200 can be shortened. In addition, the movement time of the suction pad 142 can be shortened.

In addition, since the substrate is delivered from above when the substrate is delivered from the external transfer robot 300' to the substrate feeder 169, the possibility of the substrate coming into contact with the substrate feeder 169 due to the deflection (sagging) of the front end of the substrate can be reduced as compared with the case where the substrate is delivered by sliding.

Tenth embodiment

Next, a tenth embodiment will be described with reference to fig. 33 and 34. Fig. 33(a) to 34(b) are cross-sectional views showing an exposure apparatus according to a tenth embodiment. As shown in fig. 33(a), the exposure apparatus according to the tenth embodiment is different from the ninth embodiment in that the rail 146 of the substrate sliding hand 140 is fixed to the substrate feeder 169. The other configurations are the same as those of the ninth embodiment.

(substrate replacement action)

Hereinafter, a substrate replacement operation in the exposure apparatus according to the tenth embodiment will be described with reference to fig. 33(a) to 34 (b).

In fig. 33(a), it is assumed that exposure to the substrate P1 placed on the substrate holder 28 is being performed in the stage device 20. In this state, the main controller causes the transfer port shutter 154 to slide in the + Z direction to open the transfer port 172U in order to receive the substrate P2 to be exposed next into the chamber 200. Next, the main control device drives the external transfer robot 300' in the-X direction (see arrow V1). By the operation of the external transfer robot 300', as shown in fig. 33(b), the-X side half of the robot 300F' and the-X side half of the substrate P2 are positioned above the substrate feeder 169.

Next, the main control device drives the robot 300F 'down to a height at which the upper surface of the robot 300F' substantially coincides with the upper surface of the substrate feeder 169, thereby delivering a part of the substrate P2 to the substrate feeder 169. Next, the main controller starts the supply of the pressurized gas from the substrate supporting surface (upper surface) of the substrate feeder 169 and the upper surface of the robot 300F'. Then, the main controller drives the suction pad 142 to suction and hold the + Y side and-X side end portions of the board P2 on the suction pad 142.

Next, as shown in fig. 34 a, the main control device drives the suction pad 142 in the-X direction, thereby moving the substrate P2 along the substrate supporting surface of the substrate feeder 169 (see arrow V2). Subsequently, when exposure of stage device 20 to substrate P1 is completed, main control device drives substrate feeder 169 in the-X direction (see arrow V3) and drives external transfer robot 300' in the + X direction to retract it from inside chamber 200 (see arrow V4), as shown in fig. 34 b. Subsequently, the main control device performs the same operation as that of the eighth embodiment described above (the operation of fig. 29 a to fig. 30), thereby replacing the substrate on the substrate holder 28.

As described above, according to the tenth embodiment, since the external transfer robot 300' enters the chamber 200 and delivers the-X half of the substrate P2 to the substrate feeder 169, the X-direction movement range (stroke) and the Z-direction movement range of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200 can be shortened. In addition, the movement time of the suction pad 142 can be shortened.

In the tenth embodiment, since the rail 146 of the substrate sliding hand 140 is provided in the substrate feeder 169, the moving range (stroke) of the substrate sliding hand 140 in the X-axis direction can be shortened as compared with the ninth embodiment.

Eleventh embodiment

Next, an exposure apparatus according to an eleventh embodiment will be described with reference to fig. 35 to 38.

Fig. 35(a) and 35(b) show a transverse sectional view and a longitudinal sectional view of an exposure apparatus according to the eleventh embodiment. In fig. 35(a), 35(b), and the like, the chamber 200 is not shown for convenience.

As shown in fig. 35(a) and 35(b), in the eleventh embodiment, an external transfer robot 301 is used in place of the external transfer robot 300' of the ninth embodiment. Further, the barrier member 172 is provided with a surrounding member 182 forming a space 171 covering the substrate feeder 169.

As shown in fig. 35(a), the external transfer robot 301 has a plurality of (for example, five) finger parts 301F, but unlike the external transfer robots 300 and 300', does not have a function of floating the substrate P in the air. Further, the length of the slot 169a of the substrate feeder 169 in the X-axis direction is set longer than that of the ninth embodiment in accordance with the finger 301F of the external conveyance robot 301. Further, a member having irregularities such as a substrate support pad may be present on the upper surface of the finger 301F of the external transfer robot 301.

An opening 172N is formed in a surrounding member 182 provided in the barrier member 172. In the eleventh embodiment, the finger 301F of the external transfer robot 301 enters the chamber 200, but the entering range is limited to the space 171 and the space 173. In the eleventh embodiment, an air exhaust device 183 that exhausts air in the + Z direction is provided in the space 173. For the air discharging device 183, high-pressure air may also be supplied from a compressor commonly used as plant equipment. The air exhaust device 183 may be a device using a fan as disclosed in japanese patent laid-open No. 2009-073660, for example.

The other structures are the same as those of the ninth embodiment.

(substrate replacement action)

Next, the substrate replacement operation in the eleventh embodiment will be described in detail with reference to fig. 35(a) to 38 (c). Fig. 35(a) and 35(b), fig. 36(a) and 36(b), and fig. 37(a) and 37(b) show a transverse sectional view and a longitudinal sectional view of the vicinity of the stage device at the same timing. In fig. 35(a) to 38(c), the structures of the exposure apparatus that are not necessary for the description are not shown.

(operation in FIG. 35(a) and FIG. 35 (b))

In the state shown in fig. 35(a) and 35(b), substrate P1 is being exposed on stage device 20. On the other hand, the main controller slides the transfer port shutter 154 in the + Z direction to open the transfer port 152U (see arrow α 1 in fig. 35 b) in order to receive the substrate P2 to be exposed next into the chamber 200 (into the space 171).

(operation in FIG. 36(a) and FIG. 36 (b))

Next, the main control device drives the external transfer robot 301 in the-X direction (see arrow α 2 in fig. 36(a) and 36 (b)). By the operation of the external conveyance robot 301, as shown in fig. 36(a) and 36(b), the half of the external conveyance robot 301 on the-X side of the finger 301F and the half of the external conveyance robot 301 on the-X side of the substrate P2 are positioned above the substrate feeder 169. In this state, the main controller drives the external transfer robot 301 to descend, thereby delivering a part of the substrate P2 to the substrate feeder 169. Then, the main controller starts the supply of the pressurized gas from the substrate feeder 169. Then, the main controller drives the suction pad 142 to suction and hold the + Y side and-X side end portions of the board P2 on the suction pad 142.

(operation in FIG. 37(a) and FIG. 37 (b))

Next, the main control device drives the adsorption pad 142 in a direction intersecting the X axis and the Z axis (the direction in which the substrate support surface of the substrate feeder 169 is inclined) within the XZ plane (see arrow α 3), thereby moving the substrate P2 to the position shown in fig. 37(a) and 37 (b). Then, the main control device drives the external conveyance robot 301 in the + X direction, thereby retreating the finger 301F out of the space 171. When the + X end of the substrate P2 is located on the-X side of the transfer-in-port shutter 154 and the-X end of the finger 301F of the external transfer robot 301 is located on the + X side of the transfer-in-port shutter 154, the main controller slides the transfer-in-port shutter 154 in the-Z direction to close the transfer-in port 172U (see arrow α 4). Then, the main control device drives the external transport robot 301 in the-Z direction to position the-X end of the finger 301F near the carrying-out port 172L (see arrow α 5).

(operation in FIG. 38 (a))

Next, the main controller starts the suction holding of the substrate P2 by the substrate feeder 169, and drives the substrate feeder 169 in the-X direction (see arrow α 6). Further, the suction pad 142 holding the substrate P2 may be moved in the-X direction in synchronization with the movement of the substrate feeder 169, or the suction pad 142 may be moved in the-X direction by releasing the suction holding of the substrate P2 by the suction pad 142 in advance when the substrate feeder 169 is moved. Then, the main controller slides the transfer port shutter 156 in the-Z direction to open the transfer port 172L (see arrow α 7). Further, the main control device drives the external transport robot 301 in the-X direction (see arrow α 8), whereby the finger parts 301F are inserted through the carrying-out port 172L and the substrate passage port 172M.

(operation in FIG. 38 (b))

Subsequently, when exposure to substrate P1 in stage device 20 is completed, the main control device moves stage device 20 to a substrate replacement position below substrate feeder 169 (see arrow α 9). At this time, the air floating member 29 provided on the substrate holder 28 and the finger 301F of the external transfer robot 301 are fitted.

Then, the main control unit controls the air discharging unit 183 to start discharging the high-pressure air upward (see a broken-line arrow α 10). Then, the main controller starts the supply of the pressurized gas from the upper surface of the substrate holder 28 and the upper surface of the air floating member 29. Then, the main control device uses the substrate carry-in carrier device 25 to shift the substrate P1 in the + Y direction, and to drive the suction pad 27 in the + X direction while sucking and holding a part of the substrate P2 to the suction pad 27 (see arrow α 11 in fig. 38 (c)).

Subsequently, the main control device drives the suction pad 27 of the substrate carry-in carriage device 25 to move up, and the-X end of the substrate P2 is suction-held by the suction pad 27. Then, the main controller starts the supply (gas supply) of the pressurized gas from the upper surface of the substrate feeder 169. Then, the main control device moves the substrate feeder 169 in the + X direction (see arrow α 13) while driving the stage device 20 in the-X direction (see arrow α 12) in a state where the suction pad 27 of the substrate carry-in carrier device 25 sucks and holds the substrate P2. As a result, as shown in fig. 38(c), the substrate P2 is transferred from the substrate feeder 169 to the substrate holder 28. Thus, substrate P2 can be carried onto substrate holder 28 at a higher speed by driving stage device 20 and substrate feeder 169 in a direction away from each other in the X direction than by driving stage device 20 in the-X direction alone, thereby carrying substrate P2 onto substrate holder 28. This is possible because of the apparatus structure in which the substrate feeder 169 can be driven in the + X direction by providing the space 173 in the chamber 200. The timing for driving stage device 20 in the-X direction may be different from the timing for moving substrate feeder 168 in the + X direction. The main control device may move the substrate feeder 169 after the substrate P2 has been transferred to the substrate holder 28 in the + X direction. Then, the main control device finely drives the suction pads 27 to perform alignment (position adjustment) of the substrate P2. Subsequently, the main controller drives the suction pad 27 down to start suction holding of the substrate P2 by the substrate holder 28, and starts exposure for the substrate P2 newly mounted on the substrate holder 28. The main control device may move the substrate feeder 169 after the substrate P2 has been transferred to the substrate holder 28 in the + X direction (see arrow α 13).

Then, the main controller continues to drive the suction pad 142 in the + X direction (see arrow α 11), and the substrate P1 is transferred from the substrate holder 28 and the air floating member 29 to the external transfer robot 301. In addition, since high-pressure air is blown upward from the air blowing device 183 during the transfer of the substrate P1, the finger 301F of the external transfer robot 301 can be prevented from coming into contact with the substrate P1 even if the external transfer robot 301 does not have a function of supplying pressurized gas. Subsequently, the main control device stops the air discharging device 183, and starts the suction holding of the substrate P1 by the finger 301F. Then, the main control device drives the external transfer robot 301 in the + X direction, carries out the substrate P1 out of the chamber 200, and closes the carrying-out port shutter 156.

By the above operation, the substrate replacement operation is completed.

As described above, in addition to the same effects as those of the ninth embodiment, the use of the air exhaust device 183 prevents the finger parts 301F from coming into contact with the substrate P1 even if the external transfer robot 301 does not have a mechanism for supplying a pressurized gas. Further, since the barrier member 172 has the

spaces

171 and 173, dust can be prevented from entering the vicinity of the exposure apparatus main body 10.

In the eleventh embodiment, a shutter may be provided in the substrate passage opening 172M or the opening 172N. This can prevent dust from entering the chamber 200.

Twelfth embodiment

Next, a twelfth embodiment will be described in detail with reference to fig. 39 to 41. Fig. 39(a) is a vertical sectional view of the vicinity of the barrier member 172 according to the twelfth embodiment, and fig. 39(B) is a sectional view taken along line B-B of fig. 39 (a).

The twelfth embodiment is characterized in that, in addition to the configuration of the eleventh embodiment, a tape ejecting mechanism 40 is provided in an air discharging device 183 provided in the space 173.

The tape ejecting mechanism 40 includes: a pair of rails 41 provided in the air exhaust device 183 and having the X-axis direction as the longitudinal direction; a pair of movable bodies 43 movable in the X-axis direction along the rail 41; and moving members 42 connected to the movable body 43, respectively, and having a longitudinal direction in the Y-axis direction. The moving member 42 is provided with a plurality of (for example, four) projections projecting in the Z direction at predetermined intervals in the Y axis direction. The tape feeding mechanism 40 further includes: a plurality of (e.g., four) belts 45 each having one end fixed to the convex portion of the moving member 42; and a hammer member 47 fixed to the respective other ends of the belts 45. The belt 45 is suspended from pulleys (pullies) 48, and the pulleys 48 are fixed to shaft members provided in the air exhaust device 183 and extending in the Y-axis direction.

In the tape ejecting mechanism 40, when the movable body 43 is not provided with a driving force in the-X direction, the hammer member 47 abuts against the bottom surface of the space 173 as shown in fig. 39(a), and thus the state shown in fig. 39(a) is maintained. On the other hand, when a driving force in the-X direction is applied to the movable body 43, the moving member 42 moves in the-X direction, and thus the length of the portion of the belt 45 extending in the X-axis direction becomes long.

(substrate replacement action)

Next, a substrate replacement operation in the exposure apparatus according to the twelfth embodiment will be described in detail with reference to fig. 40(a) to 41 (c).

Fig. 40(a) shows a state in which, in stage device 20, exposure of substrate P1 has been completed, and, as in the eleventh embodiment, substrate P2 has been conveyed onto substrate feeder 169 by external conveyance robot 301 and substrate feeder 169 has been moved in the-X direction. At this time, the hammer member 47 of the tape ejecting mechanism 40 is in contact with the bottom surface of the space 173.

In fig. 40 a, the main controller slides the transfer port shutter 156 in the-Z direction to open the transfer port 172L (see arrow β 1 in fig. 40 a). As shown in fig. 40 b, the main control device moves finger 301F of external transport robot 301 in through carry-out outlet 172L (see arrow β 2), and drives stage device 20 to the substrate replacement position (below substrate feeder 169) (see arrow β 3). At this time, as shown in fig. 41(a), the air-floating members 29 provided on the substrate holder 28 are aligned linearly with the respective tapes 45. Further, since the finger 301F of the external conveyance robot 301 is nested in the belt 45 and the air-floating member 29, the finger 301F does not contact the belt 45 and the air-floating member 29. In addition, since the belt 45 is provided with a large number of small holes, a part of the high-pressure air passes through the holes by supplying the high-pressure air from the air discharging device 183. Therefore, the belt 45 can be provided with the same function as the air floating member 29. This enables the substrate P1 to be slid and moved in a floating state or a semi-floating state with respect to the belt 45.

That is, in the state of fig. 41(a), by sliding the substrate P1 placed on the substrate holder 28 in the + X direction using the substrate sliding hand 140, the substrate P1 is not deflected and the substrate P1 can be moved to above the finger 301F of the external transfer robot 301 even if the finger 301F of the external transfer robot 301 does not have a function for air floating.

Subsequently, as in the eleventh embodiment, the transfer of the substrate P2 from the substrate feeder 169 to the substrate holder 28 and the transfer of the substrate P1 from the substrate holder 28 to the external transfer robot 300 are performed. In this operation, main control device drives stage device 20 in the-X direction, but moves moving member 42 in the-X direction to follow the drive of stage device 20 in the-X direction. As a result, as shown in fig. 41(b), the air floating member 29 or the belt 45 can be maintained in a state of being disposed substantially without a gap in the gap between the finger parts 301F of the external conveyance robot 301.

Fig. 41(c) shows a state in which a substrate P2 is placed on the substrate holder 28 and a substrate P1 is positioned above the finger 301F of the external transfer robot 301. From this state, the main control device drives the external transfer robot 301 to move up, and thereby delivers the substrate P1 to the external transfer robot 301. Subsequently, the main control device stops the air discharging device 183, and starts the suction holding of the substrate P1 by the finger 301F. Then, the main control device drives the external transfer robot 301 in the + X direction to retract from the space 173, and slides in the + Z direction toward the transfer exit damper 156, thereby closing the transfer exit 172L.

In the above description, the case where the substrate P1 is slidingly conveyed into the space 173 in the state where the external conveyance robot 301 is introduced into the space 173 has been described, but the present invention is not limited to this. For example, after the substrate P1 is slidingly conveyed into the space 173, the external conveyance robot 301 may be moved into the space 173.

(modification example)

In each of the above embodiments, the case where the transfer-out shutter and the transfer-in shutter are provided near the transfer-out opening and the transfer-in opening of the

barrier members

152 and 172 has been described, but the present invention is not limited to this, and the transfer-out shutter and the transfer-in shutter may be provided in the chamber 200.

The substrate feeder according to each of the above embodiments may be a substrate feeder 264 shown in fig. 42, and the upper surface of the substrate feeder 264 may be covered by fixing a cover 199 to a pair of block members 265 provided on the + Y side surface and the-Y side surface of the substrate feeder 264. In the case of a substrate feeder having a groove formed in the upper surface, the cover 199 may be provided so as to cover the upper side of the groove.

The YZ cross section of the cover 199 is inverted U-shaped, and the substrate can be carried in and out from the + X side and the substrate can be carried out and moved out from the-X side between the cover 199 and the substrate feeder 264. In fig. 42, the cover 199 is illustrated as being transparent, but the cover 199 may not be transparent. In this modification, by providing the cover 199, adhesion of dust to the substrate P can be prevented, and the temperature of the substrate P can be kept constant.

In addition, in the case of using the substrate feeder 264 of fig. 42 in the sixth embodiment (fig. 22(a), 22(b), etc.), the upper surface of the support cover 199 may be suspended by the suspension mechanism 186. Further, in the case of employing the substrate feeder 264 of fig. 42 in the seventh embodiment (fig. 25), the cover 199 may be provided on the lower surface side of the substrate feeder.

As the substrate feeder according to each of the above embodiments, a substrate feeder 364 shown in fig. 43(a) may be used. The substrate feeder 364 is in a state in which the upper surface is curved. By curving the upper surface (substrate supporting surface) of the substrate feeder 364 in this manner, the section modulus of the substrate can be increased. That is, the same effect as that of the substrate having a thickness several times to several hundreds times larger than the actual thickness can be obtained with respect to the deflection of the substrate.

With this, even when the substrate P is placed on the substrate feeder 364 in a state where the-X end protrudes as in fig. 43(b), the-X end of the substrate P can be suppressed from being bent (sagged). Moreover, since the occurrence of flexure (sagging) of the substrate P is suppressed, the substrate P can be brought into contact with the substrate holder 28 from the center portion in the Y-axis direction of the side on the-X side, and hence the-X end portion of the substrate P can be made less likely to wrinkle.

In addition, an ionizer (ionizer) may be provided near the substrate feeder. This makes it possible to remove the static electricity as a countermeasure against the static electricity of the substrate before being mounted on the substrate holder 28.

The described embodiments are preferred embodiments of the invention. However, the present invention is not limited thereto, and various modifications can be made without departing from the scope of the present invention.

Description of the symbols

10: exposure device body

100: exposure device

200: chamber

300: external transfer robot

28: substrate support

160: a substrate feeder.

Claims

1. An exposure apparatus comprising:

an exposure apparatus body;

a chamber for accommodating the exposure apparatus body;

a substrate holding unit that receives and holds a substrate transferred by an external transfer robot outside the chamber, and is provided inside the chamber; and

and a substrate transfer device that transfers the substrate from the external transfer robot to the substrate holding unit, transfers the substrate from the substrate holding unit to a holding device provided in the exposure apparatus main body, and transfers the substrate from the holding device to the external transfer robot.

2. The exposure apparatus according to claim 1, wherein

The substrate transfer device includes a holding unit provided in the holding unit and configured to hold a part of the substrate on the substrate holding unit,

the holding device moves in a first direction away from the substrate holding portion in a state where the holding portion holds a part of the substrate on the substrate holding portion, and thereby the substrate is transferred from the substrate holding portion to the holding device.

3. The exposure apparatus according to claim 2, wherein

The first surface of the substrate holding portion, which holds the substrate before the substrate is transferred to the holding device, is inclined with respect to an upper surface of the holding device at least when the substrate is transferred from the substrate holding portion to the holding device.

4. The exposure apparatus according to claim 3, wherein

The substrate holding portion transitions between a state in which the first surface is inclined with respect to an upper surface of the holding device and a state in which the first surface is not inclined.

5. The exposure apparatus according to any one of claims 1 to 4, wherein

The substrate transfer device transfers the substrate to the substrate holding portion from a state in which the external transfer robot is located outside the chamber and a part of the substrate held by the external transfer robot is located inside the chamber.

6. The exposure apparatus according to any one of claims 1 to 5, wherein

The substrate transfer device transfers the substrate on the holding device to the external transfer robot in a state where the substrate holding portion holds the substrate, and transfers the substrate held by the substrate holding portion to the holding device after the transfer.

7. The exposure apparatus according to any one of claims 1 to 6, wherein

The substrate interface apparatus includes:

a first transfer mechanism provided in the substrate holding section and configured to transfer the substrate from the external transfer robot to the substrate holding section; and

and a second transfer mechanism provided in the holding device and configured to transfer the substrate from the holding device to the external transfer robot.

8. The exposure apparatus according to any one of claims 1 to 7, wherein

A non-contact suspension holding mechanism for suspending and holding the substrate in a non-contact manner is provided on a lower surface of the substrate holding portion.

9. The exposure apparatus according to claim 8, wherein

The non-contact suspension holding mechanism holds a substrate transferred from the holding device to the external transfer robot in a non-contact suspension manner.

10. The exposure apparatus according to claim 8, wherein

The non-contact suspension holding mechanism holds the substrate before being handed over to the holding device in a non-contact suspension manner.

11. The exposure apparatus according to any one of claims 1 to 10, wherein

An opening/closing door is provided in the chamber near an opening through which the substrate is carried out,

a first floating force applying mechanism for applying a floating force to the substrate is provided at a position of the opening/closing door facing the lower surface of the substrate passing through the opening.

12. The exposure apparatus according to any one of claims 1 to 11, wherein

The substrate holding section is capable of reciprocating between a first position above a movement area of the holding device and a second position above the outside of the movement area of the holding device.

13. The exposure apparatus according to any one of claims 1 to 12, wherein

The substrate is transferred by the relative movement of the external transfer robot and the substrate holding portion in the vertical direction.

14. The exposure apparatus according to any one of claims 1 to 13, comprising:

and a second floating force applying mechanism for applying a floating force from below to the substrate transferred from the holding device to the external transfer robot.

15. A flat panel display manufacturing method, comprising:

exposing a substrate using the exposure apparatus according to any one of claims 1 to 14; and

and developing the exposed substrate.

16. A component manufacturing method comprising:

and developing the exposed substrate.