JP7445095B2 - 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 - Google Patents

感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 Download PDF

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Publication number
JP7445095B2
JP7445095B2 JP2023551806A JP2023551806A JP7445095B2 JP 7445095 B2 JP7445095 B2 JP 7445095B2 JP 2023551806 A JP2023551806 A JP 2023551806A JP 2023551806 A JP2023551806 A JP 2023551806A JP 7445095 B2 JP7445095 B2 JP 7445095B2
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Japan
Prior art keywords
photosensitive resin
resin composition
epoxy resin
group
type epoxy
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JP2023551806A
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Japanese (ja)
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JPWO2023054523A5 (https=
JPWO2023054523A1 (https=
Inventor
英司 播磨
咲月 小澤
康昭 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2023551806A 2021-09-29 2022-09-28 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 Active JP7445095B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021159246 2021-09-29
JP2021159246 2021-09-29
PCT/JP2022/036285 WO2023054523A1 (ja) 2021-09-29 2022-09-28 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Publications (3)

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JPWO2023054523A1 JPWO2023054523A1 (https=) 2023-04-06
JPWO2023054523A5 JPWO2023054523A5 (https=) 2024-01-19
JP7445095B2 true JP7445095B2 (ja) 2024-03-06

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JP2023551806A Active JP7445095B2 (ja) 2021-09-29 2022-09-28 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Country Status (3)

Country Link
JP (1) JP7445095B2 (https=)
CN (1) CN117999516A (https=)
WO (1) WO2023054523A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003192764A (ja) 2001-12-25 2003-07-09 Mitsubishi Electric Corp 液状熱硬化性樹脂組成物
JP2008058979A (ja) 2007-09-21 2008-03-13 Nippon Kayaku Co Ltd 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物
WO2009147938A1 (ja) 2008-06-02 2009-12-10 株式会社カネカ 新規な樹脂組成物及びその利用
WO2017030099A1 (ja) 2015-08-17 2017-02-23 日立化成株式会社 複合材料、ソルダーレジスト用感光性樹脂組成物、及び感光性エレメント
JP2020204774A (ja) 2018-03-28 2020-12-24 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003192764A (ja) 2001-12-25 2003-07-09 Mitsubishi Electric Corp 液状熱硬化性樹脂組成物
JP2008058979A (ja) 2007-09-21 2008-03-13 Nippon Kayaku Co Ltd 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物
WO2009147938A1 (ja) 2008-06-02 2009-12-10 株式会社カネカ 新規な樹脂組成物及びその利用
WO2017030099A1 (ja) 2015-08-17 2017-02-23 日立化成株式会社 複合材料、ソルダーレジスト用感光性樹脂組成物、及び感光性エレメント
JP2020204774A (ja) 2018-03-28 2020-12-24 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板

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Publication number Publication date
JPWO2023054523A1 (https=) 2023-04-06
WO2023054523A1 (ja) 2023-04-06
CN117999516A (zh) 2024-05-07

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