JPWO2023054523A1 - - Google Patents
Info
- Publication number
- JPWO2023054523A1 JPWO2023054523A1 JP2023551806A JP2023551806A JPWO2023054523A1 JP WO2023054523 A1 JPWO2023054523 A1 JP WO2023054523A1 JP 2023551806 A JP2023551806 A JP 2023551806A JP 2023551806 A JP2023551806 A JP 2023551806A JP WO2023054523 A1 JPWO2023054523 A1 JP WO2023054523A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159246 | 2021-09-29 | ||
| JP2021159246 | 2021-09-29 | ||
| PCT/JP2022/036285 WO2023054523A1 (ja) | 2021-09-29 | 2022-09-28 | 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054523A1 true JPWO2023054523A1 (https=) | 2023-04-06 |
| JPWO2023054523A5 JPWO2023054523A5 (https=) | 2024-01-19 |
| JP7445095B2 JP7445095B2 (ja) | 2024-03-06 |
Family
ID=85780707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551806A Active JP7445095B2 (ja) | 2021-09-29 | 2022-09-28 | 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7445095B2 (https=) |
| CN (1) | CN117999516A (https=) |
| WO (1) | WO2023054523A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003192764A (ja) * | 2001-12-25 | 2003-07-09 | Mitsubishi Electric Corp | 液状熱硬化性樹脂組成物 |
| JP2008058979A (ja) * | 2007-09-21 | 2008-03-13 | Nippon Kayaku Co Ltd | 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物 |
| WO2009147938A1 (ja) * | 2008-06-02 | 2009-12-10 | 株式会社カネカ | 新規な樹脂組成物及びその利用 |
| WO2017030099A1 (ja) * | 2015-08-17 | 2017-02-23 | 日立化成株式会社 | 複合材料、ソルダーレジスト用感光性樹脂組成物、及び感光性エレメント |
| JP2020204774A (ja) * | 2018-03-28 | 2020-12-24 | 太陽インキ製造株式会社 | 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
-
2022
- 2022-09-28 JP JP2023551806A patent/JP7445095B2/ja active Active
- 2022-09-28 WO PCT/JP2022/036285 patent/WO2023054523A1/ja not_active Ceased
- 2022-09-28 CN CN202280064998.4A patent/CN117999516A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003192764A (ja) * | 2001-12-25 | 2003-07-09 | Mitsubishi Electric Corp | 液状熱硬化性樹脂組成物 |
| JP2008058979A (ja) * | 2007-09-21 | 2008-03-13 | Nippon Kayaku Co Ltd | 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物 |
| WO2009147938A1 (ja) * | 2008-06-02 | 2009-12-10 | 株式会社カネカ | 新規な樹脂組成物及びその利用 |
| WO2017030099A1 (ja) * | 2015-08-17 | 2017-02-23 | 日立化成株式会社 | 複合材料、ソルダーレジスト用感光性樹脂組成物、及び感光性エレメント |
| JP2020204774A (ja) * | 2018-03-28 | 2020-12-24 | 太陽インキ製造株式会社 | 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7445095B2 (ja) | 2024-03-06 |
| WO2023054523A1 (ja) | 2023-04-06 |
| CN117999516A (zh) | 2024-05-07 |
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