CN117999516A - 感光性树脂组合物、干膜、固化物和印刷布线板 - Google Patents

感光性树脂组合物、干膜、固化物和印刷布线板 Download PDF

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Publication number
CN117999516A
CN117999516A CN202280064998.4A CN202280064998A CN117999516A CN 117999516 A CN117999516 A CN 117999516A CN 202280064998 A CN202280064998 A CN 202280064998A CN 117999516 A CN117999516 A CN 117999516A
Authority
CN
China
Prior art keywords
photosensitive resin
resin composition
group
epoxy resin
type epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280064998.4A
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English (en)
Chinese (zh)
Inventor
播磨英司
小泽咲月
荒井康昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN117999516A publication Critical patent/CN117999516A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202280064998.4A 2021-09-29 2022-09-28 感光性树脂组合物、干膜、固化物和印刷布线板 Pending CN117999516A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021159246 2021-09-29
JP2021-159246 2021-09-29
PCT/JP2022/036285 WO2023054523A1 (ja) 2021-09-29 2022-09-28 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Publications (1)

Publication Number Publication Date
CN117999516A true CN117999516A (zh) 2024-05-07

Family

ID=85780707

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280064998.4A Pending CN117999516A (zh) 2021-09-29 2022-09-28 感光性树脂组合物、干膜、固化物和印刷布线板

Country Status (3)

Country Link
JP (1) JP7445095B2 (https=)
CN (1) CN117999516A (https=)
WO (1) WO2023054523A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3876709B2 (ja) * 2001-12-25 2007-02-07 三菱電機株式会社 液状熱硬化性樹脂組成物、並びに液状熱硬化性樹脂組成物の製造方法と絶縁コイルの製造方法
JP4562761B2 (ja) * 2007-09-21 2010-10-13 日本化薬株式会社 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物
CN102046727B (zh) * 2008-06-02 2013-02-13 株式会社钟化 树脂组合物及其利用
KR20180042841A (ko) * 2015-08-17 2018-04-26 히타치가세이가부시끼가이샤 복합 재료, 솔더 레지스트용 감광성 수지 조성물 및 감광성 엘리먼트
JP6759323B2 (ja) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板

Also Published As

Publication number Publication date
JP7445095B2 (ja) 2024-03-06
JPWO2023054523A1 (https=) 2023-04-06
WO2023054523A1 (ja) 2023-04-06

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