JP7444927B2 - 太陽光電池及び太陽光発電モジュール - Google Patents
太陽光電池及び太陽光発電モジュール Download PDFInfo
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- JP7444927B2 JP7444927B2 JP2022113428A JP2022113428A JP7444927B2 JP 7444927 B2 JP7444927 B2 JP 7444927B2 JP 2022113428 A JP2022113428 A JP 2022113428A JP 2022113428 A JP2022113428 A JP 2022113428A JP 7444927 B2 JP7444927 B2 JP 7444927B2
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- 239000000758 substrate Substances 0.000 claims description 85
- 238000005192 partition Methods 0.000 claims description 44
- 238000002161 passivation Methods 0.000 claims description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 10
- 238000010248 power generation Methods 0.000 claims description 8
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 225
- 238000010586 diagram Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 18
- 239000011241 protective layer Substances 0.000 description 18
- 239000002019 doping agent Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 239000000969 carrier Substances 0.000 description 12
- 239000005388 borosilicate glass Substances 0.000 description 10
- 239000005360 phosphosilicate glass Substances 0.000 description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052796 boron Inorganic materials 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 229910021419 crystalline silicon Inorganic materials 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 238000005498 polishing Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000012670 alkaline solution Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910021478 group 5 element Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 230000005641 tunneling Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009102 absorption Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010668 complexation reaction Methods 0.000 description 2
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- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- -1 silver aluminum Chemical compound 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- 238000007650 screen-printing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Description
前面と前記前面に背向する背向面とを有する基板であって、前記背向面に、第1方向に沿って千鳥状に間隔を空けて配列された第1領域及び第2領域があり、隣接する前記第1領域と前記第2領域との間に、前記基板の内部へ窪んだ仕切領域がある基板と、
前記第1領域に形成される第1導電層と、
前記第2領域に形成され、前記第1導電層の導電タイプとは逆である第2導電層と、
前記第1導電層に電気的に接触する第1電極と、
前記第2導電層に電気的に接触する第2電極と、を備え、
前記仕切領域と、隣接する前記第1導電層及び/又は前記第2導電層との間には、境界領域があり、前記境界領域に対応する前記背向面の前記境界領域には、線状凹凸テクスチャー構造が形成されている。
基板を提供するステップであって、前記基板が前面と前記前面に背向する背向面とを有し、前記背向面に第1方向に沿って千鳥状に間隔を空けて配列された第1領域及び第2領域があり、隣接する前記第1領域と前記第2領域との間に前記基板の内部へ窪んだ仕切領域があるステップと、
前記基板の背向面に第1導電層を形成するステップと、
基板の背向面に対してレーザ光による膜切りを行い、前記第2領域及び前記仕切領域に位置する第1導電層を除去するステップと、
前記仕切領域及び第2領域に第2導電層を形成するステップと、
前記第2導電層の表面の前記第2領域に対応する箇所に第1保護層を形成するステップと、
前記第1保護層で覆われていない第2導電層を除去するステップと、
前記第1保護層を除去するステップと、
テクスチャリングするステップであって、前記仕切領域に対応する前記背向面に幾つかの第1ピラミッド状テクスチャー構造領域を形成し、前記第2導電層に幾つかの第2ピラミッド状テクスチャー構造領域を形成し、隣接する前記第1ピラミッド状テクスチャー構造領域と隣接する前記第2ピラミッド状テクスチャー構造領域との間に境界領域があり、前記背向面の前記境界領域に線状凹凸テクスチャー構造を形成するステップと、
前記第1導電層に第1電極を形成し、前記第2導電層に第2電極を形成するステップと、を含む。
上記太陽光電池を接続して形成された電池ストリングと、
前記電池ストリングの表面を覆うためのパッケージ層と、
前記パッケージ層の前記電池ストリングから離間する表面を覆うための蓋板と、を備える。
基板1を提供するステップであって、基板1が前面2と前面2に背向する背向面3とを有し、背向面3に、第1方向D1に沿って千鳥状に間隔を空けて配列された第1領域101及び第2領域102があり、隣接する第1領域101と第2領域102との間に仕切領域4があるステップと、
基板1の背向面3に第1導電層6を形成するステップと、
基板1の背向面3に対してレーザ光による膜切りを行い、第2領域102及び仕切領域4に位置する第1導電層6を除去するステップと、
基板1の背向面3に第2導電層7を形成するステップと、
第2導電層7の表面の第2領域102に対応する箇所に第1保護層18を形成するステップと、
第1保護層18で覆われていない第2導電層7を除去するステップと、
第1保護層18を除去するステップと、
テクスチャリングするステップであって、仕切領域4に対応する背向面3に幾つかの第1ピラミッド状テクスチャー構造領域10を形成し、第2導電層7に幾つかの第2ピラミッド状テクスチャー構造領域11を形成し、隣接する第1ピラミッド状テクスチャー構造領域10と隣接する第2ピラミッド状テクスチャー構造領域11との間に境界領域があり、背向面3の境界領域5に有線状凹凸テクスチャー構造12を形成するステップと、
第1導電層6に第1電極8を形成し、第2導電層7に第2電極9を形成するステップと、を含む。
S10ステップでは、図4に示すように、基板1は、N型結晶シリコン基板であることが好ましく、前面2は、太陽光の照射方向に面する受光面であり、背向面3は、前面2に対向する表面であり、第1導電層6は、第1領域101に形成され、第2導電層7は、第2領域102に形成され、第2導電層7は、第1導電層6と、導電タイプが逆であり、仕切領域4は、第1導電層6及び第2導電層7を隔離するために用いられ、それにより、正負極の絶縁性能を向上させ、電池の漏電現象の発生を回避し、電池の信頼性を向上させる。
Claims (16)
- 太陽光電池であって、
前面と前記前面に背向する背向面とを有する基板であって、前記背向面に、第1方向に沿って千鳥状に間隔を空けて配列された第1領域及び第2領域があり、隣接する前記第1領域と前記第2領域との間に、前記基板の内部へ窪んだ仕切領域がある基板と、
前記第1領域に形成される第1導電層と、
前記第2領域に形成され、前記第1導電層の導電タイプとは逆である第2導電層と、
前記第1導電層に電気的に接触する第1電極と、
前記第2導電層に電気的に接触する第2電極と、を備え、
前記仕切領域に対応する前記背向面には、幾つかの第1ピラミッド状テクスチャー構造領域が形成されおり、前記第1導電層及び/又は第2導電層に対応する前記背向面には、幾つかの第2ピラミッド状テクスチャー構造領域が形成されおり、隣接する前記第1ピラミッド状テクスチャー構造領域と隣接する前記第2ピラミッド状テクスチャー構造領域との間には、境界領域があり、前記境界領域に対応する前記背向面の前記境界領域には、線状凹凸テクスチャー構造が形成されていることを特徴とする太陽光電池。 - 裏面パッシベーション層を更に備え、
前記裏面パッシベーション層は、前記第1導電層、前記第2導電層及び前記仕切領域の表面に位置し、前記第1電極は、前記裏面パッシベーション層を通り抜けて前記第1導電層に電気的に接触し、前記第2電極は、前記裏面パッシベーション層を通り抜けて前記第2導電層に電気的に接触することを特徴とする請求項1に記載の太陽光電池。 - 前記基板の前面には、正面パッシベーション層が形成されていることを特徴とする請求項1に記載の太陽光電池。
- 前記基板は、N型基板であり、前記第1導電層は、P型ドープ層を含み、前記第2導電層は、N型ドープ層を含むことを特徴とする請求項1に記載の太陽光電池。
- 前記第1導電層及び前記第2導電層のうちの少なくとも1つと前記基板の背向面との間には、誘電体層が設けられていることを特徴とする請求項1に記載の太陽光電池。
- 前記誘電体層は、酸化シリコン、酸化アルミニウム、酸化ハフニウム、窒化シリコン又は酸窒化シリコンを含むことを特徴とする請求項5に記載の太陽光電池。
- 前記誘電体層の厚さは、0.5nm~3nmであることを特徴とする請求項5に記載の太陽光電池。
- 前記誘電体層は、前記仕切領域に対応する前記基板の背向面を覆わないことを特徴とする請求項5に記載の太陽光電池。
- 前記第1ピラミッド状テクスチャー構造領域の頂部表面と底部表面との間の距離範囲は、2μm~4μmであることを特徴とする請求項1に記載の太陽光電池。
- 前記第2ピラミッド状テクスチャー構造領域の頂部表面と底部表面との間の距離範囲は、1μm~3μmであることを特徴とする請求項1に記載の太陽光電池。
- 前記境界領域の前記第1方向に沿う距離範囲は、3μm~5μmであることを特徴とする請求項1に記載の太陽光電池。
- 前記線状凹凸テクスチャー構造の頂部表面と底部表面との間の距離範囲は、1μm~4μmであることを特徴とする請求項1に記載の太陽光電池。
- 前記仕切領域の前記第1方向に沿う距離範囲は、50~200μmであることを特徴とする請求項1に記載の太陽光電池。
- 前記仕切領域の前記基板の背向面の法線方向に沿う距離範囲は、1~6μmであることを特徴とする請求項1に記載の太陽光電池。
- 前記仕切領域の面積と前記基板の背向面の面積との比は、10%~35%であることを特徴とする請求項1に記載の太陽光電池。
- 太陽光発電モジュールであって、
請求項1~15の何れか一項に記載の太陽光電池を接続して形成された電池ストリングと、
前記電池ストリングの表面を覆うためのパッケージ層と、
前記パッケージ層の前記電池ストリングから離間する表面を覆うための蓋板と、を備える、ことを特徴とする太陽光発電モジュール。
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