JP7438326B2 - 発光装置、及びその製造方法、並びに面状発光装置 - Google Patents
発光装置、及びその製造方法、並びに面状発光装置 Download PDFInfo
- Publication number
- JP7438326B2 JP7438326B2 JP2022507284A JP2022507284A JP7438326B2 JP 7438326 B2 JP7438326 B2 JP 7438326B2 JP 2022507284 A JP2022507284 A JP 2022507284A JP 2022507284 A JP2022507284 A JP 2022507284A JP 7438326 B2 JP7438326 B2 JP 7438326B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- board
- emitting device
- light
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 41
- 239000000758 substrate Substances 0.000 claims description 117
- 229910052751 metal Inorganic materials 0.000 claims description 82
- 239000002184 metal Substances 0.000 claims description 82
- 238000005520 cutting process Methods 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 33
- 230000008569 process Effects 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 description 43
- 230000004048 modification Effects 0.000 description 26
- 238000012986 modification Methods 0.000 description 26
- 238000000926 separation method Methods 0.000 description 22
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 238000010586 diagram Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 239000003566 sealing material Substances 0.000 description 12
- 238000004088 simulation Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 238000005452 bending Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000004907 flux Effects 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 229910001374 Invar Inorganic materials 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002542 deteriorative effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020044571 | 2020-03-13 | ||
| JP2020044571 | 2020-03-13 | ||
| PCT/JP2021/009911 WO2021182585A1 (fr) | 2020-03-13 | 2021-03-11 | Dispositif électroluminescent, son procédé de fabrication et dispositif électroluminescent de surface |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021182585A1 JPWO2021182585A1 (fr) | 2021-09-16 |
| JPWO2021182585A5 JPWO2021182585A5 (fr) | 2022-09-26 |
| JP7438326B2 true JP7438326B2 (ja) | 2024-02-26 |
Family
ID=77670699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022507284A Active JP7438326B2 (ja) | 2020-03-13 | 2021-03-11 | 発光装置、及びその製造方法、並びに面状発光装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7438326B2 (fr) |
| WO (1) | WO2021182585A1 (fr) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116129A (ja) | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | 発光装置 |
| JP2012160534A (ja) | 2011-01-31 | 2012-08-23 | Harison Toshiba Lighting Corp | Ｌｅｄ光源ユニット、照明装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3998027B2 (ja) * | 2005-07-25 | 2007-10-24 | 松下電工株式会社 | Ｌｅｄを用いた照明器具 |
| JP2009176961A (ja) * | 2008-01-24 | 2009-08-06 | Toyoda Gosei Co Ltd | 実装基板の製造方法及び線状光源の製造方法 |
| US8541800B2 (en) * | 2008-12-19 | 2013-09-24 | Samsung Electronics Co., Ltd. | Light emitting device package, backlight unit, display device and lighting device |
| JP2010161279A (ja) * | 2009-01-09 | 2010-07-22 | Sharp Corp | 発光装置 |
| TW201315931A (zh) * | 2011-10-12 | 2013-04-16 | Econova Optronics Co Ltd | 照明裝置 |
| JP2013214362A (ja) * | 2012-03-30 | 2013-10-17 | Toshiba Corp | バックライト装置、液晶モジュール及び液晶表示装置 |
| KR102003001B1 (ko) * | 2013-03-13 | 2019-07-23 | 엘지이노텍 주식회사 | 발광 모듈 |
| US20180313997A1 (en) * | 2015-11-02 | 2018-11-01 | Sharp Kabushiki Kaisha | Lighting device and display device |
| WO2017209149A1 (fr) * | 2016-05-31 | 2017-12-07 | シチズン電子株式会社 | Dispositif électroluminescent |
| JP7154684B2 (ja) * | 2018-01-18 | 2022-10-18 | シチズン電子株式会社 | 照明装置 |
-
2021
- 2021-03-11 WO PCT/JP2021/009911 patent/WO2021182585A1/fr active Application Filing
- 2021-03-11 JP JP2022507284A patent/JP7438326B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116129A (ja) | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | 発光装置 |
| JP2012160534A (ja) | 2011-01-31 | 2012-08-23 | Harison Toshiba Lighting Corp | Ｌｅｄ光源ユニット、照明装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021182585A1 (fr) | 2021-09-16 |
| WO2021182585A1 (fr) | 2021-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7125636B2 (ja) | 発光装置 | |
| US8450929B2 (en) | Light emitting device, backlight unit, liquid crystal display apparatus, and lighting apparatus | |
| JP4551948B2 (ja) | 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置 | |
| TWI784376B (zh) | 發光裝置以及液晶顯示裝置 | |
| JP6852822B2 (ja) | 発光モジュール及びその製造方法 | |
| TW202144823A (zh) | 發光模組及面狀光源 | |
| KR20210098348A (ko) | 면상 광원 | |
| JP7295437B2 (ja) | 発光装置 | |
| US11421856B2 (en) | Light emitting module, surface light source, and a method of manufacturing light emitting module | |
| CN215932316U (zh) | 发光模组和面状光源 | |
| JP2022164682A (ja) | 発光装置および面発光光源 | |
| KR20130030619A (ko) | 발광 모듈 및 이를 구비한 백라이트 유닛 | |
| US11282465B2 (en) | Display device and assembling method thereof | |
| JP7438326B2 (ja) | 発光装置、及びその製造方法、並びに面状発光装置 | |
| JP2020188073A (ja) | Ｌｅｄ光源基板及び照明装置 | |
| JP7117684B2 (ja) | 面状光源の製造方法 | |
| US7875892B2 (en) | Light-emitting device, linear light source, planar light unit and display apparatus | |
| JP2022096128A (ja) | 発光装置及び面状光源 | |
| JP7445145B2 (ja) | 発光モジュールおよび面状光源 | |
| JP7425952B2 (ja) | 面状光源 | |
| JP7266175B2 (ja) | 発光モジュールおよび面状光源 | |
| JP7299522B2 (ja) | 発光モジュール及び面状光源 | |
| JP7484075B2 (ja) | 発光モジュールの製造方法 | |
| JP7295438B2 (ja) | 面状光源 | |
| JP7321832B2 (ja) | 照明装置及び表示装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220801 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220801 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230627 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230817 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230905 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231027 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231114 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231204 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240123 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240213 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7438326 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |