JP7438247B2 - 電磁放射線遮蔽部品の製造方法 - Google Patents
電磁放射線遮蔽部品の製造方法 Download PDFInfo
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- JP7438247B2 JP7438247B2 JP2021578130A JP2021578130A JP7438247B2 JP 7438247 B2 JP7438247 B2 JP 7438247B2 JP 2021578130 A JP2021578130 A JP 2021578130A JP 2021578130 A JP2021578130 A JP 2021578130A JP 7438247 B2 JP7438247 B2 JP 7438247B2
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- styrene
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Description
本発明は、電磁放射線遮蔽基材の製造方法、該方法により得られる基材および装置、ならびに特にエレクトロモビリティ分野で電磁放射線を遮蔽するためのその使用に関する。
電磁波には、電界成分と磁界成分とがある。電子部品が発する波は、相互に電磁干渉(EMI)を引き起こす可能性がある。半導体技術の飛躍的な進歩により、電子部品はますます小型化し、電子装置内のその密度は大幅に高まっている。例えばエレクトロモビリティ、航空宇宙技術、または医療技術などの分野では、電子システムの複雑化に伴い、個々のコンポーネントの電磁両立性が大きな課題となっている。例えば、電動車両では、高出力の電気駆動装置が非常に狭い空間に組み込まれ、電子部品によって制御されているが、個々の部品が互いに干渉してはならない。電磁両立性を実現するために、電磁的影響を遮蔽筐体により減衰させることが知られている。電磁両立性(EMC)という用語は、例えば、DIN VDE 0870によれば、電気機器がその環境において、他の機器をも含み得るこの環境に許容できない影響を与えることなく満足に機能する能力と定義されている。したがって、EMCは、放出された放射線の遮蔽と他の電磁放射線に対する耐性という2つの条件を満たす必要がある。この場合、多くの国では、対応するデバイスが法的規制に準拠している必要がある。DIN VDE 0870によれば、電磁干渉(EMI)とは、電磁波が電気回路、デバイス、システム、または生体に及ぼす影響のことである。このような影響は、影響を受ける対象物において、許容できる障害のみならず、例えばデバイスの機能性や人への危険性など、許容できない障害をも招き得る。このような場合には、対応する保護措置を講じなければならない。EMI遮蔽の対象となる周波領域は、一般的に100Hz~100GHzである。照射された電磁波を遮蔽することで得られる減衰は、すべての遮蔽原理において、一般的に反射および吸収から構成される。吸収の場合には、電磁波のエネルギーが失われてそれが熱エネルギーに変換され、吸収量は遮蔽材の壁厚に依存する。一方で、反射は、周波領域によっては材料の厚さに関係なく、表と裏との双方で、また材料内部でも生じ得る。
- 追加の作業工程によって製造コストが高くなる。これにより、例えばアルミダイキャスト製の遮蔽装置と比較すると経済的に不利になる。
- 本発明による方法は、最初に部品を別個に成形してからその後でコーティングすることなく、EMI遮蔽基材を製造することができる。
本発明の第1の主題は、電磁放射線遮蔽基材の製造方法であって、
i)少なくとも1つの導電性フィラーを含む第1のポリマー材料(a)またはその前駆体を提供し、かつ少なくとも1つの第2のポリマー材料(b)またはその前駆体を提供し、
ii)ステップi)で提供されたポリマー材料(a)および(b)またはその前駆体を成形に供して、ポリマー材料(a)および(b)を材料接続により結合させ、その際、前駆体が存在する場合にはその前駆体を重合させる、方法である。
本発明の趣意におけるポリマー材料(a)、(b)および(c)とは、少なくとも1つのポリマーを含むか、または少なくとも1つのポリマーからなる材料である。ポリマー材料(a)、(b)および(c)は、少なくとも1つのポリマーに加えて、少なくとも1つのさらなる成分、例えばフィラー、強化材またはそれとは異なる添加剤を含むことができる。ポリマー材料(a)、(b)および(c)は、特定の実施形態では、コンポジット(複合材)として存在する。
特に、本発明による方法のステップi)では、ポリマー材料(a)または(b)のうちの一方がコンポジットの形態で提供される。好ましい実施形態では、ポリマー材料(a)または(b)のうちの一方が、層状のコンポジットの形態で提供される。これは、本発明による方法を背面射出成形に用いる場合に特に有利である。特定の実施形態では、成分(b)が、コンポジットの形態で提供される。
- センサ機能を有する基材の成形、
- 機械的振動を防止するための少なくとも1つのコンポーネントの使用、
- 衝突防止性を向上させるための少なくとも1つのコンポーネントの使用、
- 絶縁耐力を向上させるための少なくとも1つのコンポーネントの使用、
- 腐食防止機能を有する少なくとも1つのコンポーネントの使用、
- 酸化防止機能を有する少なくとも1つのコンポーネントの使用、
- 光保護機能を有する少なくとも1つのコンポーネントの使用、
- 発熱体としての少なくとも1つのコンポーネントの使用、
- 熱電特性を有し、それによって電流を発生させることができる少なくとも1つのコンポーネントの使用、
- シール要素のオーバーモールド成形、
- 保持および/または結合要素のオーバーモールド成形。
- 装飾的な表面構成要素のオーバーモールド成形、
- 少なくとも1つの装飾的なポリマーフィルムの使用、
- 補強要素(リブ、リブ構造体)のオーバーモールド成形など。
ポリマー材料a)、b)およびc)は、非晶質熱可塑性樹脂、熱可塑性エラストマー、半結晶質熱可塑性樹脂、エラストマー、熱硬化性樹脂、およびそれらの混合物から好ましく選択される少なくとも1つのポリマーを含むか、またはそれからなる。
本発明により使用される、少なくとも1つの導電性フィラーを含むポリマー材料(a)により、高度な充填度と非常に良好な遮蔽効果(shielding effectiveness、SE)を達成することができる。ここで、遮蔽効果は、吸収成分SEA、反射成分SER、および多重反射成分SEMから構成される。特に、ポリウレタンおよび特定の尿素基含有ポリウレタンは、EMI遮蔽に適した数多くの異なるフィラーとの高い相容性を示す。
一実施形態では、ポリマー材料b)のポリマー成分は、耐熱性だけでなく耐薬品性や良好な機械的特性をも特徴とするいわゆる高性能プラスチックから選択される少なくとも1つのポリマーを含むか、またはそれからなる。このようなポリマーは、特に自動車分野の用途に適している。
一実施形態では、ポリマー材料(c)のポリマー成分は、エラストマー、熱可塑性エラストマー、およびそれらの混合物から選択される。
ポリマー材料(a)は、電磁放射線を遮蔽するための少なくとも1つのフィラーを含む。
a1)少なくとも1つの導電性フィラー0.5~95重量%、
a2)少なくとも1つのポリマー成分15~99.5重量%、
a3)a2)以外の少なくとも1つの非導電性ポリマー0~20重量%、
a4)少なくとも1つの導電性ポリマー0~10重量%、
a5)任意に、少なくとも1つの添加剤、ただし、各添加剤は最大3重量%の量で存在する、
任意に、少なくとも1つの溶媒。
- 少なくとも1つの導電性フィラー(前記で成分a)と定義されたもの)0.5~95重量%、
- 少なくとも1つのポリウレタン、特に尿素基含有ポリウレタン(前記で成分a2)と定義されたもの)15~99.5重量%、
- a2)とは異なる少なくとも1つの非導電性ポリマー(前記で成分a3)と定義されたもの)0~20重量%、
- 少なくとも1つの導電性ポリマー(前記で成分a4)と定義されたもの)0~7重量%、
- 少なくとも1つの溶媒0~90重量%、好ましくは10~80重量%、
- さらなる添加剤、フィラーおよび強化材100重量%まで。
a)少なくとも1つの導電性フィラーを提供するステップと、
b)少なくとも1つの導電性フィラーを、ポリマーマトリックスを形成するポリマーと混合するステップと
を含む方法である。
- 該電磁放射線遮蔽用組成物から基材を形成する(成形)、または
- 該電磁放射線遮蔽用組成物を基材に組み込む(組み込み)、または
- 該電磁放射線遮蔽用組成物で基材を少なくとも部分的にコーティングする(コーティング)方法である。
本発明による方法の第1の変形例では、電磁放射線遮蔽用組成物から基材が成形される。ここで、本発明による組成物は可塑化され、成形ステップに供される。これらは、注型成形、ブロー成形、カレンダー加工、射出成形、プレス加工、射出エンボス加工、エンボス加工、押出加工など、当業者に知られている成形ステップである。
本発明による方法の第2の変形例では、電磁放射線遮蔽用組成物が基材に組み込まれる。
本発明による方法の第3の変形例では、基材が少なくとも部分的に電磁放射線遮蔽用組成物でコーティングされる。
ポリマーマトリックス:
EMI遮蔽用組成物は、以下のポリマーマトリックスの1つ以上を含む:
- コンパウンディング処理されたTPE(老化防止剤、可塑剤、および任意に他の添加物質を含む)、または
- コンパウンディング処理されたTPU(老化防止剤、可塑剤、および任意に他の添加物質を含む)、または
- コンパウンディング処理されたTPV(老化防止剤、可塑剤、および任意に他の添加物質を含む)
- 割合:EMI遮蔽用組成物の総重量に対して、それぞれ20~95重量%、好ましくは40~95重量%。
EMI遮蔽用組成物は、以下の導電性フィラーを1つ以上含む:
導電性カーボンブラック:
- 着色、導電性向上、紫外線保護の役割を果たす
- 割合:EMI遮蔽用組成物の総重量に対して5~30重量%。
- 導電性向上の役割を果たす
- 割合:EMI遮蔽用組成物の総重量に対して5~30重量%。
- 導電性向上の役割を果たす
- 粒子径:5μm~600μm
- 割合:EMI遮蔽用組成物の総重量に対して5~30重量%。
- 導電性向上の役割を果たす
- 粒子径:0.01μm~100μm
- 割合:EMI遮蔽用組成物の総重量に対して5~30重量%。
- 導電性向上の役割を果たす
- 使用される金属(合金を含む):鉄、ステンレス鋼、銅、アルミニウム
- 断面形状:丸形、三角形、正方形、長方形
- 直径:1μm~500μm
- 長さ:0.5mm~15mm
- アスペクト比:1~15000
- 割合:EMI遮蔽用組成物の総重量に対して5~50重量%。
Claims (35)
- 電磁放射線遮蔽基材の製造方法であって、
i)少なくとも1つの導電性フィラーを含む第1のポリマー材料(a)またはその前駆体を提供し、かつ少なくとも1つの第2のポリマー材料(b)またはその前駆体を提供し、
ii)前記ステップi)で提供されたポリマー材料(a)および(b)またはその前駆体を成形に供して、前記ポリマー材料(a)および(b)を材料接続により結合させ、その際、前記前駆体が存在する場合には前記前駆体を重合させ、
前記ポリマー材料(a)のポリマー成分は、熱可塑性エラストマーを含むか、または少なくとも1つの熱可塑性エラストマーからなり、前記熱可塑性エラストマーは、熱可塑性ポリアミドエラストマー、熱可塑性コポリエステルエラストマー、オレフィン系熱可塑性エラストマー、熱可塑性スチレンブロックコポリマー、ポリウレタン系熱可塑性エラストマー、熱可塑性加硫物、およびオレフィン系架橋熱可塑性エラストマー、ポリエーテルブロックアミド、およびそれらの混合物から選択され、
前記ポリマー材料(b)のポリマー成分は、ポリウレタン、シリコーン、フルオロシリコーン、ポリカーボネート、エチレン酢酸ビニル、アクリロニトリル-ブタジエン-アクリレート、アクリロニトリル-ブタジエンゴム、アクリロニトリル-ブタジエン-スチレン、アクリロニトリル-メチルメタクリレート、アクリロニトリル-スチレン-アクリレート、酢酸セルロース、酢酸セルロースブチレート、ポリスルホン、ポリ(メタ)アクリレート、ポリ塩化ビニル、ポリフェニレンエーテル、ポリスチレン、ポリアミド、ポリオレフィン、ポリケトン、ポリエーテルケトン、ポリイミド、ポリエーテルイミド、ポリエチレンテレフタレート、ポリブチレンテレフタレート、フルオロポリマー、ポリエステル、ポリアセタール、液晶ポリマー、ポリエーテルスルホン、エポキシ樹脂、フェノール樹脂、クロロスルホネート、ポリブタジエン、ポリブチレン、ポリネオプレン、ポリニトリル、ポリイソプレン、天然ゴム、スチレン-イソプレン-スチレン、スチレン-ブタジエン-スチレン、エチレン-プロピレン、エチレン-プロピレン-ジエンゴム、スチレン-ブタジエンゴム、およびそれらの共重合体、ならびにそれらの混合物から選択され、
前記成形の後に、さらなるステップで、前記ステップii)で得られた基材で電子部品をコーティングおよび/または被覆し、かつ/または前記ステップii)で得られた基材に電子部品を埋め込む、方法。 - 前記材料接続は、射出成形法によって行われる、請求項1記載の方法。
- 前記射出成形法は、背面射出成形法である、請求項2記載の方法。
- ステップi)で提供される、前記ポリマー材料(a)、前記ポリマー材料(a)の前駆体、前記ポリマー材料(b)、および前記ポリマー材料(b)の前駆体から選択される成分のうち少なくとも1つは、ステップii)での成形のために流動性のある形態で使用されるか、またはステップii)のプロセス条件下で成形可能である、請求項1から3までのいずれか1項記載の方法。
- ステップii)で、材料接続による少なくとも1つの結合、および任意にさらに形状接続による少なくとも1つの結合を形成する、請求項1から4までのいずれか1項記載の方法。
- さらにステップii)で、前記ポリマー材料(a)および(b)を、少なくとも1つのポリマー材料(c)またはその前駆体と、材料接続および/または形状接続により結合させる、請求項1から5までのいずれか1項記載の方法。
- iii)前記(a)および(b)および任意に(c)の複合材を、材料接続および/または形状接続により結合させ、任意にさらなる成形に供し、
その際、前記ステップiii)を、1回または複数回繰り返すことができる、請求項1から6までのいずれか1項記載の方法。 - ステップi)で、ポリマー材料(a)または(b)のうちの一方を、コンポジット、好ましくは層状のコンポジットの形態で提供する、請求項1から7までのいずれか1項記載の方法。
- 前記コンポジットは、前記ポリマー材料(a)または(b)のポリマー成分と、少なくとも1つのさらなる成分(K)とを含み、前記さらなる成分(K)は、好ましくは、ポリマー、高分子材料、金属材料、セラミックス材料、鉱物材料、テキスタイル材料、およびそれらの組み合わせから選択され、特に好ましくは、ポリマーフィルム、ポリマー成形体、金属箔、金属成形体、強化および/または充填されたプラスチック材料、ならびにそれらの組み合わせから選択される、請求項8記載の方法。
- ステップi)で、前記ポリマー材料(a)または(b)のポリマー成分をポリマーフィルム上のコーティングとして含むコンポジットを提供し、ステップii)で、前記コンポジットを、射出成形により別のポリマー材料と材料接続により結合させる、請求項8または9記載の方法。
- ステップi)で、前記ポリマー材料(a)のポリマー成分をポリマーフィルム上のコーティングとして含むコンポジットを提供する、請求項10記載の方法。
- - 前記ポリマーフィルムを、前記射出成形ステップii)の後に、得られた射出成形体から剥離するか、または
- 前記ポリマーフィルムは、前記射出成形ステップii)の後に、得られた射出成形体と結合したままである、
請求項10または11記載の方法。 - 前記コンポジットは、少なくとも1つの強化および/または充填されたプラスチック材料を含み、前記強化材は、好ましくは、繊維状強化材、繊維状強化材の織物、繊維状強化材のレイドウェブ、繊維状強化材の緯編物、および繊維状強化材の経編物、ならびにそれらの混合物から選択され、前記フィラーは、好ましくは、カオリン、チョーク、ウォラストナイト、タルク、炭酸カルシウム、ケイ酸塩、酸化アルミニウム、二酸化チタン、酸化亜鉛、ガラス粒子、およびそれらの混合物などの粒子状フィラーから選択される、請求項8または9記載の方法。
- 前記ステップi)で提供されたポリマー材料(a)および(b)は、双方とも可塑性を示し、前記ステップii)で、前記ポリマー材料(a)および(b)を、多成分射出成形によって材料接続により結合させる、請求項1から7までのいずれか1項記載の方法。
- 多成分射出成形には、以下の技術:コアバック法、トランスファ法、ロータリー法、シフト法、サンドイッチ法のうち少なくとも1つが用いられる、請求項14記載の方法。
- 以下:
- センサ機能を有する基材の成形、
- 機械的振動を防止するための少なくとも1つのコンポーネントの使用、
- 衝突防止性を向上させるための少なくとも1つのコンポーネントの使用、
- 絶縁耐力を向上させるための少なくとも1つのコンポーネントの使用、
- 腐食防止機能を有する少なくとも1つのコンポーネントの使用、
- 酸化防止機能を有する少なくとも1つのコンポーネントの使用、
- 光保護機能を有する少なくとも1つのコンポーネントの使用、
- 発熱体としての少なくとも1つのコンポーネントの使用、
- 熱電特性を有し、それによって電流を発生させることができる少なくとも1つのコンポーネントの使用、
- シール要素のオーバーモールド成形、
- 保持および/または結合要素のオーバーモールド成形
のうち1つ以上の手段によって追加機能を前記基材に組み込む、請求項1から15までのいずれか1項記載の方法。 - 前記ポリマー材料(c)のポリマー成分は、ポリウレタン、シリコーン、フルオロシリコーン、ポリカーボネート、エチレン酢酸ビニル、アクリロニトリル-ブタジエン-アクリレート、アクリロニトリル-ブタジエンゴム、アクリロニトリル-ブタジエン-スチレン、アクリロニトリル-メチルメタクリレート、アクリロニトリル-スチレン-アクリレート、酢酸セルロース、酢酸セルロースブチレート、ポリスルホン、ポリ(メタ)アクリレート、ポリ塩化ビニル、ポリフェニレンエーテル、ポリスチレン、ポリアミド、ポリオレフィン、ポリケトン、ポリエーテルケトン、ポリイミド、ポリエーテルイミド、ポリエチレンテレフタレート、ポリブチレンテレフタレート、フルオロポリマー、ポリエステル、ポリアセタール、液晶ポリマー、ポリエーテルスルホン、エポキシ樹脂、フェノール樹脂、クロロスルホネート、ポリブタジエン、ポリブチレン、ポリネオプレン、ポリニトリル、ポリイソプレン、天然ゴム、スチレン-イソプレン-スチレン、スチレン-ブタジエン-スチレン、エチレン-プロピレン、エチレン-プロピレン-ジエンゴム、スチレン-ブタジエンゴム、およびそれらの共重合体、ならびにそれらの混合物から選択される、請求項6または7記載の方法。
- 前記ポリマー材料(a)のポリマー成分は、SEBS、SEPS、SBS、SEEPS、SiBS、SIS、SIBS、またはそれらの混合物、特に、SBS、SEBS、SEPS、SEEPSから選択される、請求項1から17までのいずれか1項記載の方法。
- 前記ポリマー材料(a)のポリマー成分は、オレフィン系熱可塑性エラストマーから選択され、特に、PP/EPDMおよびエチレン-プロピレン共重合体から選択される、請求項1から18までのいずれか1項記載の方法。
- 前記ポリマー材料(a)のポリマー成分は、ポリウレタン系熱可塑性エラストマーから選択され、特に、少なくとも1つの高分子量ポリオールから誘導されたポリウレタン系熱可塑性エラストマーから選択され、殊に、少なくとも1つのポリエステルジオール、ポリエーテルジオール、ポリカーボネートジオール、およびそれらの混合物から選択される少なくとも1つの高分子量ポリオールから誘導されたポリウレタン系熱可塑性エラストマーから選択される、請求項1から17までのいずれか1項記載の方法。
- 前記ポリマー材料(c)のポリマー成分は、エラストマー、熱可塑性エラストマー、およびそれらの混合物から選択される、請求項6、7または17記載の方法。
- 前記ポリマー材料(a)のポリマー成分は、オレフィン系熱可塑性エラストマー、オレフィン系架橋熱可塑性エラストマー、熱可塑性スチレンブロックコポリマー、架橋熱可塑性スチレンブロックコポリマー、ポリウレタン系熱可塑性エラストマー、ポリウレタン系架橋熱可塑性エラストマー、およびそれらの混合物から選択される、請求項1から21までのいずれか1項記載の方法。
- 前記ポリマー材料(a)のポリマー成分は、少なくとも1つの尿素基含有ポリウレタンを含む、請求項1から22までのいずれか1項記載の方法。
- 前記少なくとも1つの尿素基含有ポリウレタンは、低分岐状または線状であり、好ましくは0~20%の分岐度を有し、特に線状である、請求項23記載の方法。
- 前記ポリマー材料(a)は、少なくとも1つの導電性ポリマーをさらに含む、請求項1から24までのいずれか1項記載の方法。
- 前記導電性ポリマーは、ポリアニリン、ポリピロール、ポリチオフェン、ポリエチレンジオキシチオフェン(PEDOT)、ポリ(p-フェニレン-ビニレン)、ポリアセチレン、ポリジアセチレン、ポリフェニレンスルフィド(PPS)、ポリペリナフタレン(PPN)、ポリフタロシアニン(PPhc)、スルホン化ポリスチレンポリマー、炭素繊維充填ポリマー、ならびにそれらの混合物、誘導体、および共重合体から選択される、請求項25記載の方法。
- 前記少なくとも1つの導電性フィラーは、カーボンナノチューブ、炭素繊維、グラファイト、グラフェン、導電性カーボンブラック、金属被覆支持体、単体金属、金属酸化物、金属合金、金属繊維、およびそれらの混合物から選択される、請求項1から26までのいずれか1項記載の方法。
- 前記導電性フィラーは、金属からなる均質な層としては存在せず、好ましくは、前記導電性フィラーは、金属蒸着で得られた金属層でもなく、金属箔でもない、請求項27記載の方法。
- 前記導電性フィラーは、カーボンブラックと、カーボンブラックとは異なる少なくとも1つの成分との混合物を含み、好ましくは、前記カーボンブラックとは異なる成分は、金属被覆支持体、単体金属、金属酸化物、金属合金、金属繊維、およびそれらの混合物から選択される、請求項1から28までのいずれか1項記載の方法。
- 前記導電性フィラーは、少なくとも1つの導電性カーボンブラックと少なくとも1つの金属含有材料との混合物である、請求項29記載の方法。
- 請求項1から30までのいずれか1項記載の方法により得られる、基材。
- 請求項31記載の、または請求項1から30までのいずれか1項記載の方法により得られる基材を含むか、またはそれからなる、電磁放射線遮蔽装置。
- 電磁放射線を特にエレクトロニクス用筐体において遮蔽するための、請求項1から30までのいずれか1項記載の方法により得られる基材の使用。
- 電動車両、航空機、宇宙船における、好ましくは電動車両およびドローンにおける、請求項33記載の基材の使用。
- パワーエレクトロニクス、バッテリ、電気モータの分野の電磁放射線を遮蔽するための、ならびにナビゲーションおよび通信ユニットの遮蔽のための、特に好ましくは、インバータ、DC/DCコンバータ、車載充電器の電磁放射線を遮蔽するための、およびGPSシステムの遮蔽のための、請求項33または34記載の基材の使用。
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