JP7435613B2 - Mobile equipment and processing systems - Google Patents

Description

The present invention relates to, for example, the technical field of moving body devices that move objects and processing systems that process objects.

Patent Document 1 describes a processing device that processes an object by irradiating the object with a laser beam. In the technical field related to the processing of such objects, it is desired to improve the processing accuracy of objects.

US Patent Application Publication No. 2002/0017509

According to the first aspect, a first member having a first surface, a second member provided movably within a second surface separated from the first surface in a first direction, and a second member provided on the second member. a floating member that floats the second member above the first surface; a moving device that includes a moving member that moves in a second direction intersecting the first direction; and a moving device that includes the moving member and the second member. and a connecting member that connects, and the rigidity of the connecting member in the first direction is lower than the rigidity in a direction parallel to the second surface.

According to the second aspect, a mounting device for mounting an object, a processing device for processing the object mounted on the mounting device, and a processing device for measuring the object mounted on the mounting device. a measuring device; the mounting device includes a second member movably provided in a second surface spaced apart in the first direction from the first surface of the first member; and a measuring device provided on the second member; and a floating member that floats a second member above the first surface.

The operation and other advantages of the present invention will become apparent from the detailed description below.

FIG. 1 is a sectional view showing the overall structure of a processing system according to a first embodiment. Each of FIGS. 2(a) to 2(c) is a cross-sectional view showing how a removal process is performed on a workpiece. Each of FIGS. 3(a) to 3(c) is a cross-sectional view showing the state of a workpiece processed by non-thermal processing. FIG. 4 is a sectional view showing the structure of the processing device. FIG. 5 is a perspective view showing the structure of an optical system included in the processing device. FIG. 6 is a top view showing the stage device of the first embodiment. FIG. 7 is a VI#1-VI#1' cross-sectional view of the stage apparatus shown in FIG. FIG. 8 is a sectional view taken along VI#2-VI#2' of the stage apparatus shown in FIG. FIG. 9 is a sectional view taken along VI#3-VI#3' of the stage device shown in FIG. FIG. 10 is a sectional view taken along VI#4-VI#4' of the stage apparatus shown in FIG. FIG. 11 is a sectional view showing how the Y slide member is displaced to the +Z side. FIG. 12 is a cross-sectional view showing how the Y slide member is displaced toward the −Z side. FIG. 13 is a top view showing the stage device of the second embodiment. FIG. 14 is a top view showing the stage device of the third embodiment. FIG. 15 is a cross-sectional view taken along line XIV-XIV' of the stage device shown in FIG. 14. FIG. 16 is a top view showing the stage device of the fourth embodiment. FIG. 17 is a sectional view showing the stage device of the fifth embodiment. FIG. 18 is a sectional view showing the stage device of the fifth embodiment. FIG. 19 is a sectional view showing the stage device of the sixth embodiment. FIG. 20 is a sectional view showing the stage device of the sixth embodiment. FIG. 21 is a top view showing the stage device of the seventh embodiment. FIG. 22 is a sectional view showing the stage device of the seventh embodiment. FIG. 23 is a sectional view showing the stage device of the eighth embodiment. FIG. 24 is a sectional view showing how the Y slide member is displaced to the +Z side in the eighth embodiment. FIG. 25 is a cross-sectional view showing how the Y slide member is displaced toward the −Z side in the eighth embodiment. FIG. 26 is a sectional view showing the stage device of the ninth embodiment. FIG. 27 is a sectional view showing how the Y slide member is displaced to the +Z side in the ninth embodiment. FIG. 28 is a cross-sectional view showing how the Y slide member is displaced toward the -Z side in the ninth embodiment. FIG. 29 is a sectional view showing the stage device of the tenth embodiment. FIG. 30 is a sectional view showing how the Y slide member is displaced to the +Z side in the tenth embodiment. FIG. 31 is a cross-sectional view showing how the Y slide member is displaced toward the -Z side in the tenth embodiment. FIG. 32 is a top view showing the stage device of the eleventh embodiment. FIG. 33 is a cross-sectional view taken along XXXII-XXXII' of the stage device shown in FIG. 32. FIG. 34 is a top view showing the stage device of the twelfth embodiment. FIG. 35 is a sectional view taken along XXXIV-XXXIV' of the stage device shown in FIG. 34.

Hereinafter, embodiments of a mobile device, a mounting device, a processing system, and a processing method will be described with reference to the drawings. Below, embodiments of a moving body device, a mounting device, a processing system, and a processing method will be described using a processing system SYS that processes a workpiece W as an example.

Furthermore, in the following description, the positional relationships of various components constituting the processing system SYS will be explained using an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes. In the following explanation, for convenience of explanation, each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction within a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction perpendicular to the horizontal plane). It is assumed that the vertical direction is substantially the vertical direction or the direction of gravity). Further, the rotation directions (in other words, the tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Further, the XY plane may be set in the horizontal direction.

(1) Processing system SYS of the first embodiment
First, the processing system SYS of the first embodiment (hereinafter, the processing system SYS of the first embodiment will be referred to as the "processing system SYSa") will be described.

(1-1) Overall structure of the processing system SYSa of the first embodiment First, the overall structure of the processing system SYSa of the first embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view showing the overall structure of the processing system SYSa according to the first embodiment. Note that, in order to simplify the drawing, FIG. 1 does not show the cross section of some of the components of the processing system SYSa.

As shown in FIG. 1, the processing system SYSa includes a processing device 1, a measuring device 2, a stage device 3, a housing 4, a drive system 5, a drive system 6, and a control device 7.

The processing device 1 is capable of processing the workpiece W under the control of the control device 7. The work W may be made of, for example, a metal, an alloy (such as duralumin), a semiconductor (such as silicon), or a resin (such as acrylic or PET (polyethylene)). terephthalate), a composite material such as CFRP (Carbon Fiber Reinforced Plastic), glass, or any other material. Good too.

The processing device 1 irradiates the workpiece W with processing light EL in order to process the workpiece W. The processing light EL may be any type of light as long as the workpiece W can be processed by being irradiated onto the workpiece W. In the first embodiment, the description will be given using an example in which the processing light EL is a laser beam, but the processing light EL may be a different type of light from the laser beam. Further, the wavelength of the processing light EL may be any wavelength as long as the workpiece W can be processed by being irradiated with the processing light EL. For example, the processing light EL may be visible light or invisible light (for example, at least one of infrared light and ultraviolet light).

In the first embodiment, the processing apparatus 1 performs a removal process in which a part of the workpiece W is removed by irradiating the workpiece W with the processing light EL. However, as will be described later, the processing device 1 may perform processing different from the removal processing (for example, addition processing or marking processing). Removal machining includes flat machining in which a part of the workpiece W is removed to form a flat surface, curved surface machining in which a part of the workpiece W is removed to form a curved surface, and drilling machining in which a part of the workpiece W is removed to form a hole. , pocket processing in which a part of the workpiece is removed to form a pocket, cutting processing in which the workpiece is cut, and engraving processing in which arbitrary characters or arbitrary patterns are formed (in other words, carved) (in other words, stamping processing). It may contain at least one of the following.

Here, an example of removal processing using processing light EL will be described with reference to FIGS. 2(a) to 2(c). Each of FIGS. 2(a) to 2(c) is a cross-sectional view showing how the removal process is performed on the workpiece W. As shown in FIG. 2(a), the processing device 1 irradiates processing light EL onto an irradiation area EA set (in other words, formed) on the surface of the work W. When the irradiation area EA is irradiated with the processing light EL, the energy of the processing light EL is transmitted to a portion of the workpiece W that is close to the irradiation area EA. When the heat caused by the energy of the processing light EL is transferred, the material constituting the portion of the workpiece W that is close to the irradiation area EA is melted by the heat caused by the energy of the processing light EL. The molten material scatters as droplets. Alternatively, the molten material is evaporated by heat caused by the energy of the processing light EL. As a result, a portion of the workpiece W that is close to the irradiation area EA is removed. That is, as shown in FIG. 2(b), a recess (an example of a groove) is formed on the surface of the workpiece W. In this case, it can be said that the processing apparatus 1 processes the workpiece W using the principle of so-called thermal processing. Furthermore, when the processing light EL scans the surface of the workpiece W, the irradiation area EA moves on the surface of the workpiece W. As a result, as shown in FIG. 2C, the surface of the workpiece W is at least partially removed along the scanning trajectory of the processing light EL (that is, the movement trajectory of the irradiation area EA). That is, the surface of the workpiece W is substantially scraped off along the scanning trajectory of the processing light EL (that is, the movement trajectory of the irradiation area EA). For this reason, the processing device 1 causes the processing light EL to scan the surface of the workpiece W along a desired scanning locus corresponding to the area to be removed, thereby appropriately removing the portion of the workpiece W that is desired to be removed. be able to.

On the other hand, depending on the characteristics of the processing light EL, the processing apparatus 1 can also process the workpiece W using the principle of non-thermal processing (for example, ablation processing). That is, the processing apparatus 1 may perform non-thermal processing (for example, ablation processing) on the workpiece W. For example, when pulsed light with an emission time of picoseconds or less (or nanoseconds or femtoseconds or less, depending on the case) is used as the processing light EL, the material constituting the portion of the workpiece W that is close to the irradiation area EA is , evaporates and scatters instantly. In addition, when pulsed light with an emission time of picoseconds or less (or, depending on the case, nanoseconds or femtoseconds or less) is used as the processing light EL, the material constituting the part of the workpiece W that is close to the irradiation area EA is , sublimation may occur without passing through the molten state. Therefore, as shown in FIGS. 3(a) to 3(c), which are cross-sectional views showing the state of the workpiece W processed by non-thermal processing, the processing system SYSa is capable of generating heat due to the energy of the processing light EL. A concave portion (in other words, a groove portion) can be formed on the surface of the workpiece W while suppressing the influence on the workpiece W as much as possible.

Note that the structure of the processing apparatus 1 that performs such removal processing will be described in detail later with reference to FIG. 4, etc., so a detailed description thereof will be omitted here.

Referring again to FIG. 1, the measuring device 2 is capable of measuring the object to be measured under the control of the control device 7. The measurement target includes, for example, the workpiece W. For example, the measuring device 2 may be a device capable of measuring the state of the workpiece W. The state of the workpiece W may include the position of the workpiece W. The position of the workpiece W may include the position of the surface of the workpiece W. The position of the surface of the workpiece W may include the position of each subdivided portion of the surface of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The state of the work W may include the shape (for example, three-dimensional shape) of the work W. The shape of the work W may include the shape of the surface of the work W. In addition to or in place of the position of the surface of the workpiece W described above, the shape of the surface of the workpiece W is determined by the direction of each part obtained by subdividing the surface of the workpiece W (for example, the direction of the normal line of each part, and the direction of the X-axis , substantially equivalent to the amount of inclination of each part with respect to at least one of the Y axis and the Z axis). The state of the workpiece W may include the size of the workpiece W (for example, the size in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction). Measurement information regarding the measurement results of the measuring device 2 is output from the measuring device 2 to the control device 7.

An example of the measuring device 2 is a measuring device that measures the workpiece W using a light cutting method that projects a slit light onto the surface of the workpiece W and measures the shape of the projected slit light. Another example of the measuring device 2 is a measuring device that measures the workpiece W using a white interferometry method that measures an interference pattern between white light passing through the workpiece W and white light not passing through the workpiece W. Note that the white light referred to here may mean light having a wavelength width (spectral width) compared to monochromatic light. However, the measuring device 2 may measure the workpiece W using a method different from the optical cutting method and the white light interference method. Examples of other methods include a pattern projection method in which a light pattern is projected onto the surface of the workpiece W and the shape of the projected pattern is measured; a method in which light is projected onto the surface of the workpiece W until the projected light returns; Time-of-flight method, moiré topography method (specifically, grating irradiation method or grating projection method), holographic interference method, which measures the distance to the work W from the time of Examples include at least one of the method, autocollimation method, stereo method, astigmatism method, critical angle method, and knife edge method. In either case, the measuring device 2 receives light from a light source that emits measurement light (e.g., slit light or white light) and a work W irradiated with the measurement light (e.g., reflected light of the measurement light). It may also be equipped with a light receiver. The light receiver may include a single photodetector, a plurality of photodetectors arranged in one dimension, or a plurality of photodetectors arranged in two dimensions. .

The stage device 3 is arranged (that is, provided) below the processing device 1 and the measuring device 2 (that is, on the −Z side). The stage device 3 includes a surface plate 31 and a stage 32. The surface plate 31 is arranged on the bottom surface F of the casing 4 (or on a support surface such as a floor surface on which the casing 4 is placed). A stage 32 is arranged on the surface plate 31. The stage 32 is arranged on the surface plate 31 such that the lower surface 322 of the stage 32 (that is, the surface facing the −Z side) faces the upper surface 311 of the surface plate 31 (that is, the surface facing the +Z side). Ru. In particular, as will be described in detail later, the stage 32 is arranged on the surface plate 31 such that the lower surface 322 of the stage 32 is separated from the upper surface 311 of the surface plate 31 along the Z-axis direction. Between the support surface such as the bottom surface of the casing 4 or the floor surface on which the casing 4 is placed, and the surface plate 31, there is provided a guard (not shown) for reducing the transmission of vibrations of the surface plate 31 to the stage 32. A shaking device may be installed. Further, a support frame 8 that supports the processing device 1 and the measuring device 2 may be disposed on the surface plate 31 (particularly on the upper surface 311 of the surface plate 31). The processing device 1 and the measuring device 2 (furthermore, the stage 32) may be supported by the same surface plate 31. However, at least a portion of the processing device 1 may not be placed on the surface plate 31. At least a portion of the measuring device 2 does not need to be placed on the surface plate 31. At least a portion of the processing device 1 and at least a portion of the measuring device 2 may be placed on different surface plates (or other support surfaces). Note that the stage device 3 may include a surface plate 31. In this case, the stage 32 may be placed on the structure of the casing 4.

The stage 32 may be made of quartz glass, or may be made of other materials (eg, metal, ceramics, etc.). A workpiece W is placed on the stage 32. Specifically, the upper surface of the stage 32 includes a placement surface 321 on which the workpiece W can be placed. The mounting surface 321 is a surface parallel to the XY plane. The mounting surface 321 is a surface opposite to the lower surface 322. The workpiece W is placed on the placement surface 321. Therefore, the stage 32 is used as a mounting member on which the workpiece W is mounted. At this time, the stage 32 does not need to hold the workpiece W placed thereon. The stage 32 does not need to apply an external force to the mounted workpiece W to hold the workpiece W. The workpiece W may be placed on the stage 32 without applying any external force. Alternatively, the stage 32 may hold the workpiece W placed thereon. The stage 32 may apply an external force to the mounted workpiece W to hold the workpiece W. The workpiece W may be placed on the stage 32 with an external force applied thereto. In this case, the stage 32 may be used as a holding member that holds the workpiece W. For example, the stage 32 may hold the work W by vacuum suction and/or electrostatic suction. Note that since the stage device 3 includes the stage 32 on which the workpiece W is placed, the stage device 3 may be referred to as a placement device.

The stage 32 is movable on the surface plate 31 (particularly on the upper surface 311 of the surface plate 31) with the workpiece W placed thereon under the control of the control device 7. At this time, the upper surface 311 of the surface plate 31 may be used as a guide surface regarding the movement of the stage 32. The stage 32 is movable relative to at least one of the surface plate 31, the processing device 1, and the measuring device 2. The stage 32 is movable along each of the X-axis direction and the Y-axis direction. In this case, the stage 32 is movable along a stage running plane parallel to the XY plane. In addition to or instead of at least one of the X-axis direction and the Y-axis direction, the stage 32 may be movable along at least one of the Z-axis direction, the θX direction, the θY direction, and the θZ direction. . Note that since the stage device 3 includes the movable (that is, a moving body) stage 32, the stage device 3 may be referred to as a moving body device.

Note that the structure of the stage device 3 capable of moving such a stage 32 will be described in detail later with reference to FIG. 6, etc., so a detailed description thereof will be omitted here.

The casing 4 accommodates the processing device 1, the measuring device 2, and the stage device 3 in an internal accommodating space SP separated from the external space of the casing 4. That is, in the first embodiment, the processing device 1, the measuring device 2, and the stage device 3 are arranged in the same housing 4. The processing device 1, the measuring device 2, and the stage device 3 are arranged in the same accommodation space SP. When the workpiece W is placed on the stage 32 of the stage device 3, the housing 4 accommodates the workpiece W in the accommodation space SP therein. That is, the processing device 1, the measuring device 2, and the workpiece W are arranged in the same accommodation space SP. However, at least a portion of the processing device 1 may not be arranged in the accommodation space SP. At least a portion of the processing device 1 may not be located outside the housing 4. At least a portion of the measuring device 2 may not be arranged in the accommodation space SP. At least a portion of the measuring device 2 does not need to be placed outside the housing 4. At least a portion of the stage device 3 does not need to be arranged in the accommodation space SP. At least a portion of the stage device 3 may not be located outside the housing 4.

The drive system 5 moves the processing device 1 under the control of the control device 7. The drive system 5 moves the processing device 1 with respect to at least one of the surface plate 31, the stage 32, and the workpiece W placed on the stage 32. The drive system 5 may move the processing device 1 with respect to the measuring device 2. The drive system 5 moves the processing device 1 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. The drive system 5 includes, for example, a motor. Furthermore, the processing system SYSa includes a position measuring device 51 that can measure the position of the processing device 1 that is moved by the drive system 5. The position measuring device 51 may include, for example, at least one of an encoder and a laser interferometer.

When the drive system 5 moves the processing device 1, the irradiation area EA moves on the workpiece W. Further, when the drive system 5 moves the processing device 1, the processing shot area PSA (see FIG. 5 described below) on the workpiece W also moves. Therefore, the drive system 5 can change the positional relationship between the work W and each of the irradiation area EA and the processing shot area PSA by moving the processing apparatus 1. Note that the "processing shot area PSA" in the first embodiment refers to processing performed by the processing device 1 while the positional relationship between the processing device 1 and the workpiece (for example, the workpiece W) is fixed (that is, without changing). Indicates the area (in other words, the range) where the process is performed. Typically, as shown in FIG. 5, which will be described later, the processing shot area PSA includes processing light that is deflected by a galvanometer mirror 141 included in the processing device 1 while the positional relationship between the processing device 1 and the workpiece is fixed. The area is set to match the EL scanning range or to be narrower than the scanning range. In other words, the processing shot area PSA is an area that coincides with or is narrower than the movable range of the irradiation area EA to which the processing light EL is irradiated with the positional relationship between the processing device 1 and the workpiece being fixed. is set to be. Therefore, the processing shot area PSA is an area determined based on the processing apparatus 1 (that is, an area having a predetermined positional relationship with the processing apparatus 1).

However, since the stage 32 is movable, the positional relationship between the workpiece W and each of the irradiation area EA and the processing shot area PSA can be changed even if the processing apparatus 1 is not movable. For this reason, the processing device 1 does not need to be movable. In this case, the processing system SYSa does not need to include the drive system 5. When the processing device 1 does not move, the processing system SYS does not need to include the position measuring device 51.

Further, in the first embodiment, since the stage 32 is movable in each of the X-axis direction and the Y-axis direction, the processing device 1 may be movable in the Z-axis direction. At this time, the focus position of the processing light EL may be controlled by moving the processing device 1 in the Z-axis direction. The focus position of the observation device 16 may be controlled by moving the processing device 1 along the Z-axis.

The drive system 6 moves the measuring device 2 under the control of the control device 7 . The drive system 6 moves the measuring device 2 with respect to at least one of the surface plate 31, the stage 32, and the workpiece W placed on the stage 32. The drive system 6 may move the measuring device 2 with respect to the processing device 1 . The drive system 6 moves the measuring device 2 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. The drive system 6 includes, for example, a motor. Furthermore, the processing system SYSa includes a position measuring device 61 that can measure the position of the measuring device 2 that is moved by the drive system 6. The position measuring device 61 may include, for example, at least one of an encoder and a laser interferometer.

When the drive system 6 moves the measuring device 2, the measurement shot area MSA moves on the workpiece W. Therefore, the drive system 6 can change the positional relationship between the workpiece W and the measurement shot area MSA by moving the measuring device 2. Note that the "measurement shot area MSA" in the first embodiment refers to the measurement performed by the measuring device 2 while the positional relationship between the measuring device 2 and the object to be measured (for example, the workpiece W) is fixed (that is, without changing). Indicates the area (in other words, the range) where the process is performed. For example, when the measuring device 2 is a measuring device that uses a light sectioning method, the measurement shot area MSA is typically set using the light sectioning method while the positional relationship between the measuring device 2 and the object to be measured is fixed. It may be set to match the range that can be irradiated with the slit light used (for example, the scanning range of the slit light) or to be narrower than the range. For example, when the measuring device 2 is a measuring device that uses white light interferometry, typically the measurement shot area MSA is set using white light interferometry while the positional relationship between the measuring device 2 and the object to be measured is fixed. It may be set to match the range that can be irradiated with the white light used (for example, the scanning range of the white light) or to be narrower than the range. The measurement shot area MSA is a light-receiving surface of a light receiver (for example, a single The range may be set to correspond to the light receiving surface of one photodetector or a plurality of photodetectors arranged in one or two dimensions. Therefore, the measurement shot area MSA is an area determined based on the measurement device 2 (that is, an area having a predetermined positional relationship with the measurement device 2). Such a measurement shot area MSA may be referred to as a measurable range or a measurable field of the measuring device 2.

However, since the stage 32 is movable, the positional relationship between the workpiece W and the measurement shot area MSA can be changed even if the measuring device 2 is not movable. For this reason, the measuring device 2 does not need to be movable. In this case, the processing system SYSa does not need to include the drive system 6. If the measuring device 2 does not move, the processing system SYS does not need to include the position measuring device 61.

Further, in the first embodiment, since the stage 32 is movable in each of the X-axis direction and the Y-axis direction, the measuring device 2 may be movable in the Z-axis direction. At this time, the focus position of the measuring device 2 may be controlled by moving the measuring device 2 in the Z-axis direction.

The control device 7 controls the operation of the processing system SYSa. The control device 7 may include, for example, a calculation device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The control device 7 functions as a device that controls the operation of the processing system SYSa by the arithmetic device executing a computer program. This computer program is a computer program for causing the control device 7 (for example, an arithmetic device) to perform (that is, execute) an operation to be performed by the control device 7, which will be described later. That is, this computer program is a computer program for causing the control device 7 to function so as to cause the processing system SYSa to perform the operations described below. The computer program executed by the arithmetic device may be recorded in a storage device (that is, a recording medium) provided in the control device 7, or may be stored in any storage device built into the control device 7 or externally attachable to the control device 7. It may be recorded on a medium (for example, a hard disk or a semiconductor memory). Alternatively, the computing device may download the computer program to be executed from a device external to the control device 7 via the network interface.

The control device 7 does not need to be provided inside the processing system SYSa, and may be provided as a server or the like outside the processing system SYSa, for example. In this case, the control device 7 and the processing system SYSa may be connected via a wired and/or wireless network (or a data bus and/or a communication line). As the wired network, for example, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) typified by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network compliant with IEEE802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). As the wireless network, a network using infrared rays may be used. A network using optical communication may be used as the wireless network. In this case, the control device 7 and the processing system SYSa may be configured to be able to transmit and receive various information via a network. Further, the control device 7 may be able to transmit information such as commands and control parameters to the processing system SYSa via a network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. Alternatively, a first control device that performs some of the processing performed by the control device 7 is provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 7 is provided inside the processing system SYSa. The control device may be provided outside the processing system SYSa.

Note that recording media for recording computer programs executed by arithmetic units include CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, and DVD-. At least one of optical disks such as RW, DVD+RW, and Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disks, semiconductor memories such as USB memory, and other arbitrary media capable of storing programs is used. It's okay. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block that is realized within the control device 7 when the control device 7 (typically a computer) executes the computer program. However, it may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 7, or by a partial hardware module that realizes a logical processing block and some hardware elements. It may be realized in a mixed format.

(1-2) Structure of processing device 1 Next, the structure of processing device 1 will be described with reference to FIG. 4. FIG. 4 is a cross-sectional view showing the structure of the processing device 1. As shown in FIG.

As shown in FIG. 4, which is a cross-sectional view showing the structure of the processing device 1, the processing device 1 includes a light source 11, an optical system 12, a dichroic mirror 13, an optical system 14, and a return lens. It includes a light prevention device 15 and an observation device 16. Note that the structure of the processing apparatus 1 shown in FIG. 4 is just an example. Therefore, the processing device 1 may have any structure as long as it can process the workpiece W using the processing light EL. That is, the processing apparatus 1 does not necessarily have to include at least one of the light source 11, the optical system 12, the dichroic mirror 13, the optical system 14, the return light prevention device 15, and the observation device 16.

The light source 11 can generate processing light EL. When the processing light EL is a laser beam, the light source 11 may be, for example, a laser diode. Furthermore, the light source 11 may be a light source capable of pulse oscillation. In this case, the light source 11 can generate pulsed light (for example, pulsed light whose emission time is less than picoseconds) as the processing light EL. The light source 11 emits the generated processing light EL toward the optical system 12. Note that the light source 11 may emit processing light EL in a linearly polarized state.

The optical system 12 is an optical system into which the processing light EL emitted from the light source 11 is incident. The optical system 12 is an optical system that emits the processing light EL that has entered the optical system 12 toward the return light prevention device 15 . That is, the optical system 12 is an optical system that guides the processing light EL emitted from the light source 11 to the return light prevention device 15.

The optical system 12 may control the state of the processing light EL emitted from the light source 11 and may emit the state-controlled processing light EL toward the return light prevention device 15 . For example, the optical system 12 may control the beam diameter of the processing light EL (that is, the size of the processing light EL in a plane intersecting the traveling direction of the processing light EL). The optical system 12 may control the beam diameter (that is, the spot diameter) of the processing light EL on the surface of the workpiece W by controlling the beam diameter of the processing light EL. In this case, the optical system 12 may include a beam expander 121. For example, the optical system 12 may control the degree of convergence or divergence of the processing light emitted from the optical system 12. Thereby, the focus position (for example, the so-called best focus position) of the processing light EL is controlled. In this case, the optical system 12 may include a focus lens 122. The focus lens 122 is composed of one or more lenses, and adjusts the position of at least some of the lenses along the optical axis direction to change the degree of convergence or divergence of the processing light EL. This is an optical element for adjusting the focus position. Note that the focus lens 122 may be integrated with the beam expander 121 or may be separate from the beam expander 121. For example, the optical system 12 may control the intensity distribution of the processing light EL in a plane intersecting the traveling direction of the processing light EL. In this case, the optical system 12 may include an intensity distribution control member 123 that can control the intensity distribution of the processing light EL. The state of the processing light EL controlled by the optical system 12 includes the focus position of the processing light EL, the beam diameter of the processing light EL, the degree of convergence of the processing light EL, the degree of divergence of the processing light EL, and the intensity distribution of the processing light EL. In addition to or instead of, it may include at least one of the pulse length of the processing light EL, the number of pulses of the processing light EL, the intensity of the processing light EL, the traveling direction of the processing light EL, and the polarization state of the processing light EL. .

The dichroic mirror 13 guides the processing light EL that is incident on the dichroic mirror 13 from the optical system 12 via the return light prevention device 15 to the optical system 14 . The dichroic mirror 13 reflects one of the processing light EL and observation light (illumination light IL and reflected light ILr) having a wavelength different from the processing light EL, and transmits the other. In the example shown in FIG. 4, the dichroic mirror 13 guides the processing light EL to the optical system 14 by reflecting the processing light EL toward the optical system 14. However, the dichroic mirror 13 may guide the processing light EL to the optical system 14 by passing the processing light EL.

The optical system 14 is an optical system for irradiating the workpiece W with the processing light EL from the dichroic mirror 13 (that is, guiding it to the workpiece W). In order to irradiate the workpiece W with the processing light EL, the optical system 14 includes a galvanometer mirror 141 and an fθ lens 142. The galvanometer mirror 141 deflects the processing light EL so that the processing light EL from the fθ lens 142 scans the workpiece W (that is, the irradiation area EA to which the processing light EL is irradiated moves on the surface of the workpiece W). . In addition to or in place of the galvano mirror 141, the optical system 14 may use a polygon mirror to deflect the processing light EL. As shown in FIG. 5, which is a perspective view showing the structure of the optical system 14, the galvanometer mirror 141 includes an X scanning mirror 141X and a Y scanning mirror 141Y. The X scanning mirror 141X reflects the processing light EL toward the Y scanning mirror 141Y. The X scanning mirror 141X can swing or rotate about the θY direction (that is, the rotation direction around the Y axis). By swinging or rotating the X scanning mirror 141X, the processing light EL scans the surface of the workpiece W along the X-axis direction. By swinging or rotating the X scanning mirror 141X, the irradiation area EA moves on the surface of the workpiece W along the X-axis direction. The Y scanning mirror 141Y reflects the processing light EL toward the fθ lens 142. The Y scanning mirror 141Y can swing or rotate about the θX direction (that is, the rotation direction around the X axis). By swinging or rotating the Y scanning mirror 141Y, the processing light EL scans the surface of the workpiece W along the Y-axis direction. By swinging or rotating the Y scanning mirror 141Y, the irradiation area EA moves on the surface of the workpiece W along the Y-axis direction. The fθ lens 142 is an optical element for condensing the processing light EL from the galvanometer mirror 141 onto the workpiece W. Note that the X scanning mirror 141X may be able to swing or rotate about a direction that is slightly inclined from the θY direction (that is, the rotation direction around the Y axis). The Y scanning mirror 141Y may be able to swing or rotate about a direction slightly tilted from the θX direction (that is, the direction of rotation around the X axis). In the first embodiment, the fθ lens 142 is a telecentric optical system on the exit surface side (workpiece W side), but the fθ lens 142 does not have to be a telecentric optical system. If the fθ lens 142 is a telecentric optical system on the exit surface side (workpiece W side), even if the thickness of the workpiece W (size in the Z-axis direction) changes, the irradiation position of the processing light EL in the XY plane does not change. There is an advantage.

Referring again to FIG. 4, the return light prevention device 15 prevents the return light ELr, which is the processing light EL reflected by the workpiece W, from returning to the optical system 12 and the light source 11. On the other hand, the return light prevention device 15 guides the processing light EL emitted by the optical system 12 to the dichroic mirror 13 (that is, guides it to the workpiece W). In order to guide the processing light EL to the dichroic mirror 13 while preventing the return light ELr from returning to the optical system 12 and the light source 11, the return light prevention device 15 may utilize polarized light, for example. When using the return light prevention device 15 that utilizes such polarized light, the light source 11 may emit, for example, processed light EL in a linearly polarized state. The return light prevention device 15 includes, for example, a 1/2 wavelength plate 151, a polarizing beam splitter 152, a 1/4 wavelength plate 153, a 1/2 wavelength plate 154, and a beam diffuser 155. The half-wave plate 151 changes the polarization direction of the processing light EL from the optical system 12. For example, the half-wave plate 151 changes the polarization direction of the processing light EL from the optical system 12 to a direction that allows it to pass through the polarization beam splitter 152. The processing light EL that has passed through the 1/2 wavelength plate 151 passes through the polarizing beam splitter 152. Here, for convenience of explanation, the explanation will be given using an example in which the polarizing beam splitter 152 allows p-polarized light to pass through the polarization separation surface of the polarizing beam splitter 152 while reflecting s-polarized light. That is, the explanation will proceed using an example in which the processing light EL that has passed through the polarization beam splitter 152 is p-polarized light. The processing light EL that has passed through the polarizing beam splitter 152 passes through a quarter-wave plate 153 and becomes circularly polarized light. The processed light EL that has passed through the quarter-wave plate 153 passes through the half-wave plate 154, and the ellipticity of its polarized light is adjusted. The circularly polarized processing light EL enters the dichroic mirror 13. Therefore, the return light prevention device 15 can guide the processing light EL to the dichroic mirror 13. On the other hand, the return light ELr that has entered the return light prevention device 15 enters the quarter-wave plate 153 via the half-wave plate 154 . At this time, since the returned light ELr is the processing light EL reflected on the surface of the workpiece W, the rotation direction of the return light ELr is reversed with respect to the rotation direction of the processing light EL. Therefore, the return light ELr that has passed through the 1/2 wavelength plate 154 and the 1/4 wavelength plate 153 becomes s-polarized light. As a result, the return light ELr that has passed through the quarter-wave plate 153 is reflected by the polarizing beam splitter 152. The return light ELr reflected by the polarizing beam splitter 152 is absorbed by the beam diffuser 155. Therefore, the return light prevention device 15 can prevent the return light ELr from returning to the optical system 12 and the light source 11. Note that when processing the workpiece W with linearly polarized processing light, a quarter-wave plate may be placed in the optical path between the quarter-wave plate 154 and the workpiece W. Alternatively, the workpiece W may be processed with linearly polarized processing light by removing the quarter-wave plate 153 from the optical path.

The observation device 16 is capable of optically observing the state of the surface of the workpiece W. For example, FIG. 4 shows an example in which the observation device 16 can optically image the state of the surface of the workpiece W. In this case, the observation device 16 may include a light source 161, a beam splitter 162, a notch filter 163, and an image sensor 164. Light source 161 generates illumination light IL. The illumination light IL is visible light, but may be invisible light. However, the wavelength of the illumination light IL is different from the wavelength of the processing light EL. In particular, the wavelength of the illumination light IL is set to a wavelength that can pass through the dichroic mirror 13. The light source 161 emits the generated illumination light IL toward the beam splitter 162. Beam splitter 162 reflects at least a portion of illumination light IL from light source 161 toward notch filter 163 . The notch filter 163 is a filter that attenuates only light in a certain wavelength band of the incident illumination light IL. Note that a bandpass filter that transmits only light in a part of the wavelength band of the incident illumination light IL may be used in addition to or in place of the notch filter 163. This notch filter 163 limits the wavelength band of the illumination light IL that passes through the notch filter 163 to a wavelength band that can pass through the dichroic mirror 13. The illumination light IL reflected by the beam splitter 162 enters the dichroic mirror 13 via the notch filter 163. The illumination light IL incident on the dichroic mirror 13 passes through the dichroic mirror 13. As a result, the illumination light IL is irradiated onto the surface of the workpiece W via the optical system 14. That is, the illumination light IL is irradiated onto the surface of the workpiece W via an optical path that at least partially overlaps with the optical path of the processing light EL. The illumination light IL is irradiated onto the surface of the workpiece W via a part of the optical system (in the example shown in FIG. 4, the dichroic mirror 13 and the optical system 14) that guides the processing light EL from the light source 11 to the workpiece W. Therefore, in the example shown in FIG. 4, a part of the optical system that guides the processing light EL from the light source 11 to the workpiece W is shared as a part of the optical system that guides the illumination light IL from the light source 161 to the workpiece W. . However, the optical system that guides the processing light EL from the light source 11 to the workpiece W and the optical system that guides the illumination light IL from the light source 161 to the workpiece W may be optically separated. At least a portion of the illumination light IL irradiated onto the surface of the workpiece W is reflected by the surface of the workpiece W. As a result, the illumination light IL reflected by the workpiece W enters the optical system 14 as reflected light ILr. The reflected light ILr enters the observation device 16 via the optical system 14. The reflected light ILr that has entered the observation device 16 enters the beam splitter 162 via the notch filter 163. Note that the illumination light IL and the reflected light ILr may be referred to as observation light. Note that the notch filter 163 may be used as a light shielding member for preventing the processing light EL having a different wavelength from the observation light from entering the inside of the observation device 16 (in particular, the image sensor 164). At least a portion of the reflected light ILr that has entered the beam splitter 162 passes through the beam splitter 162 and enters the image sensor 164 . As a result, the observation device 16 can optically image the state of the surface of the workpiece W.

The observation results (specifically, the imaging results) of the observation device 16 include information that allows the state of the workpiece W to be specified. Therefore, the observation device 16 may be used as a measuring device for measuring the workpiece W. In particular, the observation results (specifically, the imaging results) of the observation device 16 include information that allows the shape of the workpiece W (for example, the shape of the surface of the workpiece W) to be specified. Therefore, the observation device 16 may be used as a measuring device for measuring the shape of the workpiece W. In this case, it can be said that a part of the processing device 1 is shared with at least a part of the measuring device (in the example shown in FIG. 4, the observing device 16) for measuring the workpiece W.

(1-3) Structure of Stage Device 3 Next, the structure of the stage device 3 of the first embodiment will be described with reference to FIGS. 6 to 10. FIG. 6 is a top view showing the stage device 3 of the first embodiment. FIG. 7 is a sectional view taken along VI#1-VI#1' of the stage device 3 shown in FIG. FIG. 8 is a sectional view taken along VI#2-VI#2' of the stage device 3 shown in FIG. FIG. 9 is a sectional view taken along VI#3-VI#3' of the stage device 3 shown in FIG. FIG. 10 is a sectional view taken along VI#4-VI#4' of the stage device 3 shown in FIG.

As shown in FIGS. 6 to 10, the stage device 3 includes a stage drive system 33, a connecting member 34, and an air bearing 35 in addition to the above-described surface plate 31 and stage 32.

The stage drive system 33 is a device for moving the stage 32 along each of the X-axis direction and the Y-axis direction. In this case, the stage drive system 33 does not need to control the position of the stage 32 in the Z-axis direction. The stage drive system 33 includes an X stage drive system 33X for mainly moving the stage 32 along the X-axis direction, and a Y-stage drive system 33Y for mainly moving the stage 32 along the Y-axis direction. The X stage drive system 33X and the Y stage drive system 33Y are arranged between the surface plate 31 and the stage 32. Specifically, the X stage drive system 33X and the Y stage drive system 33Y are arranged between the upper surface 311 of the surface plate 31 and the lower surface 322 of the stage 32.

The X stage drive system 33X includes an X rail member (X guide member) 331X and an X slide member 332X. The X rail member 331X is arranged on the surface plate 31. The X rail member 331X is a member extending along the X-axis direction. The X rail member 331X is a member whose longitudinal direction is in the X-axis direction. The X slide member 332X is attached to the X rail member 331X. The X slide member 332X is a moving member that can move along the X rail member 331X. That is, the X slide member 332X is attached to the X rail member 331X so that the X slide member 332X is movable along the X rail member 331X. In this case, the X slide member 332X may be referred to as an X block member. Since the X rail member 331X is a member extending along the X-axis direction, the X slide member 332X is movable along the X-axis direction. The X slide member 332X is movable using the power of a motor (for example, a linear motor), not shown, provided in the X stage drive system 33X. In other words, the X stage drive system 33X is a drive system that includes a so-called linear guide. Note that the X stage drive system 33X may be referred to as a moving device.

Y stage drive system 33Y is located above X stage drive system 33X. Specifically, the Y stage drive system 33Y includes a Y rail member (Y guide member) 331Y and a Y slide member 332Y. The Y rail member 331Y is arranged on the X slide member 332X. The Y rail member 331Y is connected to the X slide member 332X. The Y rail member 331Y is a member extending along the Y-axis direction. The Y rail member 331Y is a member having a longitudinal direction in the Y-axis direction. The Y slide member 332Y is attached to the Y rail member 331Y. The Y slide member 332Y is a moving member that can move along the Y rail member 331Y. That is, the Y slide member 332Y is attached to the Y rail member 331Y so that the Y slide member 332Y is movable along the Y rail member 331Y. In this case, the Y slide member 332Y may be referred to as a Y block member. Since the Y rail member 331Y is a member extending along the Y-axis direction, the Y slide member 332Y is movable along the Y-axis direction. The Y rail member is movable using the power of a motor (for example, a linear motor), not shown, provided in the Y stage drive system 33Y. In other words, the Y stage drive system 33Y is a drive system that includes a so-called linear guide. Note that the Y stage drive system 33Y may be referred to as a moving device.

Since the Y rail member 331Y is arranged on the X slide member 332X, as the X slide member 332X moves in the X axis direction, the Y rail member 331Y can also move along the X axis direction. When the Y rail member 331Y moves along the X-axis direction, the Y slide member 332Y attached to the Y rail member 331Y also moves along the X-axis direction. Therefore, the Y slide member 332Y is a moving member that is movable along both the X-axis direction and the Y-axis direction.

The connecting member 34 is a member that extends (that is, extends) toward the stage 32 from the Y slide member 332Y. The connecting member 34 is a member that extends from a position where the Y slide member 332Y and the connecting member 34 are connected to a position where the stage 32 and the connecting member 34 are connected. The connecting member 34 extends from a connecting portion 3321Y (FIG. 7) that is connected to the connecting member 34 of the Y slide member 332Y toward a connecting portion 323 (FIG. 7) that is connected to the connecting member 34 of the stage 32. It is an extending member.

The connecting member 34 connects the Y slide member 332Y and the stage 32. Specifically, the connecting member 34 is connected to the Y slide member 332Y (particularly its connecting portion 3321Y) via a connecting portion 341 (FIG. 7) of the connecting member 34. In the examples shown in FIGS. 6 to 10, the connecting portion 341 of the connecting member 34 is connected to the upper surface of the Y slide member 332Y (that is, the surface facing the +Z side), but any portion of the Y slide member 332Y may be connected to The connecting member 34 is connected to the stage 32 (particularly its connecting portion 323) via a connecting portion 342 (FIG. 7) of the connecting member 34. In the examples shown in FIGS. 6 to 10, the connecting portion 342 of the connecting member 34 is connected to the lower surface 322 of the stage 32, but it may be connected to any part of the stage 32.

In the first embodiment, the connecting member 34 connects the Y slide member through at least a portion of the space below the stage 32 (for example, the space between the lower surface 322 of the stage 32 and the upper surface 311 of the surface plate 31). 332Y and stage 32 are connected. The connecting member 34 extends from the Y slide member 332Y toward the stage 32 in the space below the stage 32. The connecting member 34 is arranged in a space below the stage 32. The connecting member 34 is arranged between the lower surface 322 of the stage 32 and the upper surface 311 of the surface plate 31. In this case, the connecting portion 342 is connected to the stage 32 via the spacer 349 so that any portion of the connecting member 34 other than the connecting portion 342 does not come into contact with the stage 32 (particularly the lower surface 322). The spacer 349 has a size that can form a predetermined gap between the connecting member 34 and the stage 32 in the Z-axis direction. However, the connecting portion 342 may be connected to the stage 32 without using the spacer 349. Note that although the connecting portion 342 or the spacer 349 is connected to the stage 32 at the periphery of the stage 32, it may be connected at another location. For example, they may be connected near the center position of the stage 32 or near the center of gravity. Here, the vicinity of the center position (center of gravity) of the stage 32 is a position closer to the center (center of gravity) than the position of 1/2 of the line segment connecting the center (center of gravity) of the stage 32 and the end of the stage 32. be able to.

When the connecting member 34 connects the Y slide member 332Y and the stage 32 in at least a portion of the space below the stage 32, at least a portion of the Y slide member 332Y and at least a portion of the stage 32 are connected in the Z-axis direction. They may be adjacent along the same line. At least a portion of the Y slide member 332Y and at least a portion of the stage 32 may overlap along the Z-axis direction. At least a portion of the Y slide member 332Y and at least a portion of the stage 32 may face each other along the Z-axis direction. The position of the Y slide member 332Y in the Z-axis direction may be different from the position of the stage 32 in the Z-axis direction. The position of at least a portion of the Y slide member 332Y in the direction along the XY plane may be the same as the position of at least a portion of the stage 32 in the direction along the XY plane. More specifically, at least a portion of the Y slide member 332Y may be arranged in a space below at least a portion of the stage 32. At least a portion of the stage 32 may be arranged in a space above at least a portion of the Y slide member 332Y.

Since the Y slide member 332Y and the stage 32 are connected by the connecting member 34, when the Y slide member 332Y moves along the X-axis direction, the stage connected to the Y slide member 332Y via the connecting member 34 moves. 32 also moves along the X-axis direction. When the Y slide member 332Y moves along the Y-axis direction, the stage 32 connected to the Y slide member 332Y via the connecting member 34 also moves along the Y-axis direction. That is, the stage 32 becomes movable along each of the X-axis direction and the Y-axis direction as the Y slide member 332Y moves. In other words, the stage 32 is movable within the stage running plane along the XY plane.

However, if the rigidity of the connecting member 34 that connects the Y slide member 332Y and the stage 32 in the X-axis direction is too low, the connecting member 34 may function as a spring that absorbs displacement in the X-axis direction. As a result, even if the Y slide member 332Y moves along the X-axis direction, the stage 32 may not move along the X-axis direction. Alternatively, the amount of movement of the stage 32 along the X-axis direction may be smaller than the amount of movement expected from the amount of movement of the Y slide member 332Y along the X-axis direction. Therefore, the rigidity of the connecting member 34 in the X-axis direction is such that, as the Y-slide member 332Y moves along the The value may be set to a value as high as possible to satisfy the movement condition #X that moves along the X-axis direction. The movement mode may include the direction of movement. That is, the movement condition #X may include a condition regarding the movement direction of the Y slide member 332Y and the stage 32 in the X-axis direction. For example, movement condition #X may include movement condition #X1 that the direction of movement of stage 32 in the X-axis direction is the same as the direction of movement of Y slide member 332Y in the X-axis direction. More specifically, the movement condition #X is a movement condition #X11 that the stage 32 moves toward the +X side when the Y slide member 332Y moves toward the +X side, and a movement condition #X11 in which the stage 32 moves toward the +X side when the Y slide member 332Y moves toward the +X side. It may include at least one movement condition #X12 that the stage 32 moves towards the -X side when moving towards the -X side. The movement mode may include the amount of movement in addition to or instead of the direction of movement. That is, the movement condition #X may include a condition regarding the amount of movement of the Y slide member 332Y and the stage 32 in the X-axis direction. For example, the movement condition #X may include a movement condition #X2 in which the amount of movement of the stage 32 along the X-axis direction is proportional to the amount of movement of the Y slide member 332Y along the X-axis direction. The movement mode may include a movement speed (that is, a movement amount per unit time) in addition to or in place of at least one of the movement direction and the movement amount. That is, the movement condition #X may include a condition regarding the movement speed of the Y slide member 332Y and the stage 32 in the X-axis direction. For example, the movement condition #X may include a movement condition #X3 in which the movement speed of the stage 32 along the X-axis direction is proportional to the movement speed of the Y slide member 332Y along the X-axis direction.

Similarly, if the rigidity of the connecting member 34 that connects the Y slide member 332Y and the stage 32 in the Y-axis direction is too low, the connecting member 34 may function as a spring that absorbs displacement in the Y-axis direction. As a result, even if the Y slide member 332Y moves along the Y-axis direction, the stage 32 may not move along the Y-axis direction. Alternatively, the amount of movement of the stage 32 along the Y-axis direction may be smaller than the amount of movement expected from the amount of movement of the Y slide member 332Y along the Y-axis direction. Therefore, the rigidity of the connecting member 34 in the Y-axis direction is such that, as the Y-slide member 332Y moves along the Y-axis direction, the stage 32 moves in a manner expected from the manner in which the Y-slide member 332Y moves in the Y-axis direction. The value may be set to a value as high as possible to satisfy the movement condition #Y that moves along the Y-axis direction. As described above, the movement mode may include at least one of the direction of movement, the amount of movement, and the speed of movement. In other words, the movement condition #Y includes a condition regarding the direction of movement of the Y slide member 332Y and the stage 32 in the Y-axis direction, a condition regarding the amount of movement of the Y slide member 332Y and the stage 32 in the Y-axis direction, and a condition regarding the movement amount of the Y slide member 332Y and the stage 32 in the Y-axis direction. It may include at least one condition regarding the moving speed of the stage 32 in the Y-axis direction. For example, the movement condition #Y may include a movement condition #Y1 that the direction of movement of the stage 32 in the Y-axis direction is the same as the movement direction of the Y-slide member 332Y in the Y-axis direction. More specifically, the movement condition #Y is a movement condition #Y11 that the stage 32 moves toward the +Y side when the Y slide member 332Y moves toward the +Y side, and a movement condition #Y11 that the stage 32 moves toward the +Y side when the Y slide member 332Y moves toward the +Y side. It may include at least one movement condition #Y12 that the stage 32 moves toward the −Y side when the stage 32 moves toward the −Y side. For example, the movement condition #Y may include a movement condition #Y2 in which the amount of movement of the stage 32 along the Y-axis direction is proportional to the amount of movement of the Y slide member 332Y along the Y-axis direction. For example, the movement condition #Y may include a movement condition #Y3 in which the movement speed of the stage 32 along the Y-axis direction is proportional to the movement speed of the Y slide member 332Y along the Y-axis direction.

On the other hand, if the rigidity in the Z-axis direction of the connecting member 34 that connects the Y-slide member 332Y and the stage 32 is too high, the displacement of the Y-slide member 332Y along the Z-axis direction will cause the stage 32 to move through the connecting member 34. It is transmitted to Such displacement of the stage 32 along the Z-axis direction may lead to deterioration of the machining accuracy of the workpiece W placed on the stage 32. Therefore, the rigidity of the connecting member 34 in the Z-axis direction is determined by the displacement of the Y-slide member 332Y that deforms (for example, distorts, deflects, or bends) in the Z-axis direction so as to absorb the displacement of the Y-slide member 332Y along the Z-axis direction. It may be set to a value as low as possible to satisfy the absorption conditions. In this case, the connecting member 34 is typically displaced in the Z-axis direction. In particular, the connecting member 34 is displaced in the Z-axis direction when the stage 32 moves along the stage running surface. As a result, the stage 32 can appropriately move along the stage running surface without being affected by the displacement of the Y slide member 332Y along the Z-axis direction. Note that "absorption of displacement of the Y slide member 332Y" in the first embodiment does not mean only canceling the displacement of the Y slide member 332Y with the connecting member 34 so that the displacement of the Y slide member 332Y is not transmitted to the stage 32. First, it includes reducing the displacement of the Y slide member 332Y by the connecting member 34 so that the displacement transmitted from the Y slide member 332Y to the stage 32 is so small that it hardly affects the machining accuracy of the workpiece W.

The connecting member 34 is typically a member whose rigidity in each of the X-axis direction and the Y-axis direction is higher than the rigidity in the Z-axis direction. The connecting member 34 is typically a member whose rigidity in the Z-axis direction is lower than its rigidity in each of the X-axis direction and the Y-axis direction. In other words, the connecting member 34 may be a flexible member having higher rigidity in one direction than in another direction. In this case, compared to the connecting member of the comparative example in which the rigidity in each of the X-axis direction and the Y-axis direction is not higher than the rigidity in the Z-axis direction, the rigidity of the connecting member 34 is It becomes easier to satisfy condition #Y and displacement absorption condition.

The connecting member 34 may be, for example, a member extending along the X-axis direction or the Y-axis direction (or any direction along the XY plane). The connecting member 34 may be a member having a longitudinal shape. The connecting member 34 may be a member whose length in at least one of the X-axis direction and the Y-axis direction is sufficiently larger than the thickness in the Z-axis direction. The connecting member 34 may be a member having a relatively high aspect ratio, which is the ratio of length to thickness. In the examples shown in FIGS. 6 to 10, the connecting member 34 is a member that extends along the X-axis direction (that is, a member whose longitudinal direction is the X-axis direction). In this case, the rigidity of the connecting member 34 easily satisfies the above-described movement condition #X, movement condition #Y, and displacement absorption condition.

When the connecting member 34 is a member extending along the X-axis direction or the Y-axis direction (or any direction along the XY plane), the connecting portions 341 and 342 of the connecting member 34 are may be one end and the other end. In this case, the connecting portion 3321Y of the Y slide member 332Y to which the connecting portion 341 is connected and the connecting portion 323 of the stage 32 to which the connecting portion 342 is connected are separated along the direction in which the connecting member 34 extends. In other words, the connecting member 34 has a connecting portion 3321Y of the Y slide member 332Y of the stage 32 whose position along the X-axis direction or the Y-axis direction (or any direction along the XY plane) is different from that of the connecting portion 3321Y. Connecting portion 323 is connected.

The connecting member 34 may include an elastic body. The connecting member 34 may include an elastic member that is an elastic body. For example, the connecting member 34 may include a spring, which is an example of an elastic body. Examples of springs include at least one of a wire spring (in other words, a coil spring), a plate spring, a bar spring (in other words, a torsion bar), and a spiral spring. When the connecting member 34 includes a leaf spring, the leaf spring may have a plate-like shape along the XY plane or a plane parallel to the XY plane. The leaf spring may have a plate-like shape along a stage running surface or a plane parallel to the stage running surface. Alternatively, for example, the connecting member 34 may include rubber, which is another example of an elastic body, in addition to or instead of a spring. When the connecting member 34 includes an elastic body in this manner, the rigidity of the connecting member 34 particularly easily satisfies the displacement absorption condition, compared to a case where the connecting member 34 does not include an elastic body. Note that the connecting member 34 including an elastic body may be referred to as an elastic member.

However, as described above, if the connecting member 34 is a member that extends along the X-axis direction or the Y-axis direction (or any direction along the XY plane), the rigidity of the connecting member 34 meets the movement condition #X, It becomes easier to satisfy the movement condition #Y and the displacement absorption condition. Therefore, when the connecting member 34 includes a spring, the spring included in the connecting member 34 is a spring having a shape extending along the X-axis direction or the Y-axis direction (or any direction along the XY plane). There may be. An example of such a spring is a plate-shaped spring (so-called plate spring).

The air bearing 35 is a member that supports the stage 32. Specifically, the air bearing 35 supports the stage 32 in the Z-axis direction. The air bearing 35 supports the stage 32 in the Z-axis direction so as to maintain the relative position between the surface plate 31 (for example, the upper surface 311 of the surface plate 31) and the stage 32 in the Z-axis direction. The air bearing 35 supports the stage 32 in the Z-axis direction so that the positional relationship between the surface plate 31 (for example, the upper surface 311 of the surface plate 31) and the stage 32 in the Z-axis direction is a desired positional relationship. . The air bearing 35 is mounted in the Z-axis direction to prevent the stage 32 from unintentionally moving along the Z-axis direction with respect to the surface plate 31 (that is, to prevent the stage 32 from being misaligned in the Z-axis direction). Supports the stage 32.

In the first embodiment, the stage device 3 includes a plurality of air bearings 35. In the examples shown in FIGS. 6 to 10, the stage device 3 includes three air bearings 35 (specifically, air bearings 35-1 to 35-3). However, the stage device 3 may include a single air bearing 35, two air bearings 35, or four or more air bearings 35.

Air bearing 35 is arranged on stage 32. Typically, air bearing 35 is fixed to stage 32. In particular, the air bearing 35 is arranged on the lower surface 322 of the stage 32. Specifically, the air bearing 35 is provided on the stage 32 via a mounting member 36. However, the air bearing 35 may be provided directly on the stage 32 without using the attachment member 36. In the example shown in FIGS. 6 to 10, the air bearing 35-1 is attached to the stage 32 via the mounting member 36-1, and the air bearing 35-2 is attached to the stage 32 via the leg member 36-2. The air bearing 35-3 is attached to the stage 32 via a mounting member 36-3. Note that the air bearing 35 may be fixed to the mounting member 36, or may be simply fitted.

The mounting member 36 is a member extending from the lower surface 322 of the stage 32 toward the air bearing 35 disposed below the stage 32. However, the attachment member 36 may have any structure as long as the air bearing 35 can be attached to the stage 32. In the examples shown in FIGS. 6 to 10, another member (specifically, as shown in FIG. 10, the Y rail member 331Y) is arranged between the air bearing 35-3 and the stage 32. . In other words, the air bearing 35-3 is arranged at a position overlapping the Y rail member 331Y in the Z-axis direction. Therefore, the attachment member 36-3 for attaching the air bearing 35-3 to the stage 32 is attached to another member disposed between the air bearing 35-3 and the stage 32 (specifically, as shown in FIG. As shown, it has a shape that extends from the lower surface 322 of the stage 32 toward the air bearing 35-3 while avoiding the Y rail member 331Y). In the example shown in FIG. 10, the mounting member 36-3 includes a member extending downward from the lower surface 322 of the stage 32 passing through one side of the left and right sides of the Y rail member 331Y, and a member extending downward from the lower surface 322 of the stage 32 to the left and right sides of the Y rail member 331Y. It includes a member that passes through the other side and extends downward, and a member that connects these two members and in which the air bearing 35 is arranged.

The air bearing 35 is arranged to face the surface plate 31 (particularly its upper surface 311). The air bearing 35 supports the stage 32 without contacting the surface plate 31. Specifically, the air bearing 35 forms a thin gas film between the air bearing 35 and the surface plate 31 (particularly its upper surface 311) by ejecting gas from the gas ejection port of the air bearing 35. The formed gas film can function as a gas bearing. As a result, the air bearing 35 is in a floating state relative to the surface plate 31. Therefore, the stage 32 on which the air bearing 35 is arranged also floats relative to the surface plate 31. That is, the air bearing 35 can function as a floating member that floats the stage 32 above the surface plate 31 (in particular, the upper surface 311 thereof). Note that the gas ejected from the gas ejection port of the air bearing 35 may be air, CDA (clean dry air), or another type of gas. For example, when the inside of the housing 4 is filled with an inert gas such as nitrogen gas, the inert gas such as nitrogen gas may be ejected from the gas ejection port of the air bearing 35. That is, the same type of gas as the atmosphere around the air bearing 35 may be ejected from the gas ejection port of the air bearing 35.

The stage 32 is supported by the air bearing 35 and moves along the X-axis direction and the Y-axis direction as the X slide member 332X and the Y slide member 332Y move. At this time, since the air bearing 35 is disposed on the stage 32, the air bearing 35 also moves along the X-axis direction and the Y-axis direction as the stage 32 moves. That is, the air bearing 35 moves along each of the X-axis direction and the Y-axis direction while facing the surface plate 31 and forming a gas film between the air bearing 35 and the surface plate 31.

However, as described above, the X rail member 331X is disposed on the surface plate 31 that the air bearing 35 faces. In this case, the X rail member 331X may become an obstacle to the movement of the air bearing 35. Specifically, as shown in FIG. 6, when the stage 32 (furthermore, the air bearing 35) moves along the Y-axis direction as the Y slide member 332Y moves, the air bearing 35 moves against the X rail member 331X. There is a possibility of contact. Therefore, the air bearing 35 is placed at an appropriate position where it will not come into contact with the X rail member 331X even when the stage 32 moves. Specifically, the air bearing 35 does not come into contact with the X rail member 331X even when the stage 32 moves as much as possible to the +Y side, and when the stage 32 moves as much as possible to the -Y side. Even if it is, it is placed at an appropriate position where it does not come into contact with the X rail member 331X. More specifically, the air bearing 35 prevents the stage 32 from overlapping at least a portion of the X rail member 331X in the Z-axis direction even when the stage 32 moves to the +Y side as much as possible, and the stage 32 does not overlap the - Even when it moves to the Y side to the maximum extent, it is placed at an appropriate position that does not overlap with at least a portion of the X rail member 331X in the Z-axis direction. In the example shown in FIG. 6, the three air bearings 35-1 to 35-3 are arranged such that the air bearings 35-1 and 35-2 and the air bearing 35-3 have an X rail member 331X between them along the Y-axis direction. They are arranged so that they are sandwiched together.

Furthermore, in the example shown in FIG. 6, the three air bearings 35-1 to 35-3 are arranged such that the air bearing 35-1 and the air bearing 35-2 sandwich the Y rail member 331Y between them along the Y-axis direction. It is located in When a plurality of air bearings 35 are arranged such that at least two air bearings 35 sandwich the Y rail member 331Y and at least two air bearings 35 sandwich the X rail member 331X, All of the bearings 35 are not lined up in a straight line. As a result, since the stage 32 is supported at three or more points, the stability of the stage 32 supported by the three air bearings 35-1 to 35-3 is improved.

When the stage 32 moves, the positional relationship between the stage 32 (furthermore, the workpiece W placed on the stage 32), the processing device 1, and the measuring device 2 changes. That is, when the stage 32 moves, the position of the stage 32 (and the workpiece W placed on the stage 32) with respect to the processing device 1 and the measuring device 2 changes. Therefore, moving the stage 32 can be considered to be equivalent to changing the positional relationship between the stage 32 (furthermore, the workpiece W placed on the stage 32), the processing device 1, and the measuring device 2. good.

The stage 32 may move so that at least a portion of the workpiece W is located within the processing shot area PSA during at least a portion of the processing period in which the processing device 1 processes the workpiece W. The stage 32 may move so that the processing shot area PSA is located on the workpiece W during at least part of the processing period. When at least a part of the workpiece W is located within the processing shot area PSA (that is, the processing shot area PSA is located on the workpiece W), the processing apparatus 1 controls the processing of the workpiece W located within the processing shot area PSA. Processing light EL can be irradiated onto at least a portion. As a result, at least a portion of the workpiece W is processed by the processing light EL emitted by the processing device 1 while being placed on the stage 32 (or held on the stage 32). Note that if the workpiece W is so large that the entire workpiece W cannot be located within the processing shot area PSA, the processing device may 1 may be performed in sequence. Specifically, first, the stage drive system 33 moves the stage 32 along the stage running surface so that the first portion of the workpiece W is included in the processing shot area PSA (further, the stage 32 is moved as necessary). The processing device 1 may be moved by a drive system 5 to be described later (the same applies in this paragraph below). Thereafter, with the stage 32 stationary, the processing apparatus 1 processes the first portion by irradiating the processing light EL so that the irradiation area EA moves within the processing shot area PSA including the first portion. Thereafter, the stage drive system 33 moves the stage 32 along the stage running surface so that a second portion of the work W that is different from the first portion is included in the processing shot area PSA. Thereafter, with the stage 32 stationary, the processing apparatus 1 processes the second portion by irradiating the processing light EL so that the irradiation area EA moves within the processing shot area PSA including the second portion. Thereafter, similar operations may be repeated until processing of the workpiece W is completed.

The stage 32 may move so that at least a portion of the workpiece W is located within the measurement shot area MSA during at least a portion of the measurement period during which the measuring device 2 measures the workpiece W. The stage 32 may move so that the measurement shot area MSA is located on the work W during at least part of the measurement period. When at least a part of the workpiece W is located within the measurement shot area MSA (that is, the measurement shot area MSA is located on the workpiece W), the measuring device 2 measures the workpiece W located within the measurement shot area MSA. At least part of it can be measured. That is, at least a portion of the work W is measured by the measuring device 2 while being placed on the stage 32 (or held on the stage 32). Note that if the workpiece W is so large that the entire workpiece W cannot be located within the measurement shot area MSA, the measuring device may be used at multiple locations on the workpiece W (for example, multiple locations within the plane along the XY plane). 2 may be performed in sequence. Specifically, first, the stage drive system 33 moves the stage 32 along the stage running surface so that the first portion of the workpiece W is included in the measurement shot area MSA (furthermore, the stage drive system 33 moves the stage 32 along the stage running surface as necessary). Then, the measuring device 2 may be moved by a drive system 6, which will be described later (the same applies in this paragraph below). Thereafter, with the stage 32 stationary, the measuring device 2 measures the first portion by measuring the measurement shot area MSA including the first portion. Thereafter, the stage drive system 33 moves the stage 32 along the stage running surface so that a second portion of the work W that is different from the first portion is included in the measurement shot area MSA. Thereafter, with the stage 32 stationary, the measuring device 2 measures the second portion by measuring the measurement shot area MSA including the second portion. Thereafter, similar operations may be repeated until the measurement of the workpiece W is completed. In the measurement device 2 using the optical cutting method, the measurement shot area MSA is typically in the shape of a slit extending in a predetermined direction. The workpiece W may be measured while being moved.

The stage 32 may move between the processing shot area PSA and the measurement shot area MSA with the workpiece W placed on the stage 32. The stage 32 may be moved such that the workpiece W is moved between the processing shot area PSA and the measurement shot area MSA with the workpiece W placed on the stage 32. That is, in addition to the processing period in which the processing device 1 processes the workpiece W and the measurement period in which the measurement device 2 measures the workpiece W, the workpiece W moves between the processing shot area PSA and the measurement shot area MSA. It may also remain placed on the stage 32 during the movement period. The work W may remain placed on the stage 32 between the processing of the work W by the processing device 1 and the measurement of the work W by the measuring device 2. The work W may remain placed on the stage 32 from the processing of the work W by the processing device 1 to the measurement of the work W by the measuring device 2. The workpiece W may remain placed on the stage 32 from the measurement of the workpiece W by the measuring device 2 until the processing of the workpiece W by the processing device 1. In other words, after the processing of the workpiece W by the processing device 1 is completed and before the measurement of the workpiece W by the measuring device 2 is started, or after the measurement of the workpiece W by the measurement device 2 is completed and the measurement of the workpiece W by the processing device 1 is completed, the processing device 1 The workpiece W does not have to be removed from the stage 32 until processing of the workpiece W is started.

Note that the stage 32 may move from the processing shot area PSA to the measurement shot area MSA after the processing of the workpiece W by the processing apparatus 1 is completed. In this case, the measuring device 2 may measure the workpiece W after the processing device 1 processes the workpiece W. The processing device 1 may process the workpiece W before the measuring device 2 measures the workpiece W. The measurement results of the measuring device 2 may be used to evaluate the processing quality of the workpiece W by the processing device 1.

Further, the stage 32 may move from the measurement shot area MSA to the processing shot area PSA after the measurement device 2 completes measurement of the workpiece W. In this case, the measuring device 2 may measure the workpiece W before the processing device 1 processes the workpiece W. The processing device 1 may process the workpiece W after the measuring device 2 measures the workpiece W. The measurement results of the measuring device 2 may be used to control the processing operation of the workpiece W by the processing device 1.

When the stage 32 holds the workpiece W, there are two holding modes: one in which the stage 32 holds the workpiece W during at least part of the machining period, and the other in which the stage 32 holds the workpiece W in at least a part of the measurement period. may be the same. An example of the holding mode is the force with which the stage 32 holds the workpiece W. However, the holding manner in which the stage 32 holds the workpiece W during at least part of the processing period and the holding manner in which the stage 32 holds the workpiece W during at least a part of the measurement period may be different. Furthermore, in addition to or instead of the stage 32 holding the work W, a weight may be placed on the work W. Particularly, when the work W is lightweight and/or small, the weight is effective.

When the stage 32 moves, the stage device 3 may include a position measuring device 39 (see FIG. 1) to measure the position of the stage 32. The position measuring device 39 may include, for example, at least one of an encoder and a laser interferometer.

(1-4) Technical Effects As explained above, the processing system SYSa of the first embodiment includes both the processing device 1 and the measuring device 2. In particular, the machining system SYSa includes a machining device 1 and a measuring device 2 in a housing 4 in which a stage device 3 is housed (that is, a workpiece W is housed). Therefore, it is not necessary to remove the workpiece W from the stage 32 after the processing device 1 processes the workpiece W until the measuring device 2 measures the processed workpiece W. Similarly, the workpiece W does not have to be removed from the stage 32 after the measuring device 2 measures the workpiece W until the processing device 1 processes the measured workpiece W. For this reason, after the processing device 1 processes the workpiece W until the measuring device 2 measures the processed workpiece W, and/or after the measuring device 2 measures the workpiece W, the measured workpiece W is Compared to the case where it is necessary to remove the workpiece W from the stage 32 before processing by the processing device 1, it is unnecessary to remove the workpiece W from the stage 32 and place the workpiece W on the stage 32 again. The throughput for processing the workpiece W is improved. Furthermore, since there is no need to perform an alignment operation (for example, an operation for positioning the workpiece W with respect to the stage 32) that may be necessary when remounting the workpiece W on the stage 32, the workpiece Throughput related to processing is improved. Furthermore, the influence of processing errors and measurement errors caused by mounting and removing the workpiece W can be reduced.

In addition, since the processing system SYSa includes both the processing device 1 and the measuring device 2, the processing system SYSa measures the state of the workpiece W processed by the processing device 1 using the measuring device 2, while measuring the state of the workpiece W. Can be processed. As a result, when the state of the workpiece W deviates from the desired state (for example, the amount of processing of the workpiece W is not appropriate and/or the processing position of the workpiece W is not appropriate), the processing system SYSa The processing apparatus 1 can be immediately controlled so that the state approaches or matches the desired state. For example, if the machining amount of the workpiece W is not appropriate and/or the machining position of the workpiece W is not appropriate, the machining system SYSa adjusts the machining amount of the workpiece W to be appropriate and/or the machining position of the workpiece W. The processing device 1 can be immediately controlled as appropriate. For this reason, the processing system SYSa can process the workpiece W with higher precision compared to the case where the workpiece W processed by the processing device 1 is processed without measuring the state of the workpiece W with the measuring device 2. .

Further, since the processing device 1 processes the workpiece W using the processing light EL, cutting waste of the workpiece W is less likely to be generated compared to a case where the workpiece W is processed using a cutting member or the like. Therefore, even if the processing device 1 and the measuring device 2 are placed in the same housing 4, the appropriate operation of the measuring device 2 is hardly hindered by cutting waste.

Furthermore, since the processing device 1 processes the workpiece W using the processing light EL, a relatively large external force acts on the workpiece W compared to when the workpiece W is processed using a cutting member or the like. There isn't. Therefore, the stage 32 does not need to hold the workpiece W with a relatively large holding force. As a result, the workpiece W can be placed on the stage 32 in substantially the same state both when the processing device 1 processes the workpiece W and when the measuring device 2 measures the workpiece W. Therefore, the measuring device 2 can measure the workpiece W placed on the stage 32 in the same state as when the processing device 1 is processing the workpiece W. In other words, when the processing device 1 is processing the workpiece W, the measuring device 2 detects a relatively strong holding force caused by a relatively strong force compared to a case where the workpiece W is held by the stage 32. The work W can be measured with relatively high accuracy without being affected by minute distortions of the work W that may occur. Further, the processing device 1 can process the workpiece W with high precision while reducing the influence of distortion of the workpiece W.

Further, in the first embodiment, the stage 32 connects the connecting member 34 to the stage drive system 33 (specifically, the X stage drive system 33X and the Y stage drive system 33Y, particularly the Y slide member 332Y). connected via. When the rigidity of the connecting member 34 satisfies the movement condition #X, the stage 32 can appropriately move along the X-axis direction in accordance with the movement of the Y slide member 332Y along the X-axis direction. When the rigidity of the connecting member 34 satisfies the movement condition #Y, the stage 32 can appropriately move along the Y-axis direction in accordance with the movement of the Y-slide member 332Y along the Y-axis direction. Therefore, the stage 32 can be accurately moved along each of the X-axis direction and the Y-axis direction under the control of the control device 7. Therefore, even when the stage 32 and the stage drive system 33 are connected via the connecting member 34, the processing accuracy of the workpiece W does not deteriorate.

Further, when the rigidity of the connecting member 34 satisfies the displacement absorption condition, the displacement of the stage drive system 33 in the Z-axis direction (especially the displacement of the Y slide member 332Y in the Z-axis direction) is absorbed by the connecting member 34. be done. In other words, the displacement of the stage drive system 33 in the Z-axis direction is no longer transmitted to the stage 32, or the displacement transmitted from the stage drive system 33 to the stage 32 is so small that it hardly affects the machining accuracy of the workpiece W. Become. This absorption of displacement of the stage drive system 33 will be explained with reference to FIGS. 11 and 12. FIG. 11 is a cross-sectional view showing how the Y slide member 332Y is displaced to the +Z side. FIG. 12 is a cross-sectional view showing how the Y slide member 332Y is displaced toward the −Z side.

As shown in FIG. 11, when the Y slide member 332Y is displaced to the +Z side while the stage 32 is moving along the stage running surface, the connecting portion 342 of the connecting member 34 connected to the Y slide member 332Y is also displaced to the +Z side. Note that "displacement of the Y slide member 332Y" as used herein means a state in which the position of the Y slide member 332Y is deviated from the reference position of the Y slide member 332Y. Even in this case, if the rigidity of the connecting member 34 satisfies the displacement absorption condition, the force transmitted from the Y slide member 332Y to the connecting portion 341 to displace the connecting portion 341 to the +Z side is It is not directly transmitted to the connecting portion 342 of the connecting member 34 that is connected to the stage 32. In other words, the connecting member 34 that satisfies the displacement absorption condition suppresses the force transmitted from the Y slide member 332Y to the connecting portion 341 to displace the connecting portion 341 toward the +Z side from being transmitted to the connecting portion 342. It becomes possible. As a result, the connecting portion 342 will not be displaced to the +Z side in the same way as the connecting portion 341. Specifically, the connecting portion 342 does not move toward the +Z side (that is, does not move along the Z-axis direction). Alternatively, even if the connecting portion 342 is displaced to the +Z side (that is, even if it moves along the Z-axis direction), the amount of movement will be smaller than the amount of movement of the connecting portion 341. Typically, the connecting portion 342 is only displaced to the +Z side to an extent that hardly affects the machining accuracy of the workpiece W.

Similarly, as shown in FIG. 12, when the Y slide member 332Y is displaced toward the −Z side while the stage 32 is moving along the stage running surface, the connecting portion 341 is also displaced toward the −Z side. Even in this case, if the rigidity of the connecting member 34 satisfies the displacement absorption condition, the force transmitted from the Y slide member 332Y to the connecting portion 341 to displace the connecting portion 341 toward the -Z side will be , are not directly transmitted to the connecting portion 342. In other words, the connecting member 34 that satisfies the displacement absorption condition prevents the force transmitted from the Y slide member 332Y to the connecting portion 341 to displace the connecting portion 341 toward the −Z side to be transmitted to the connecting portion 342. It becomes possible to suppress it. As a result, the connecting portion 342 will not be displaced to the −Z side in the same way as the connecting portion 341. Specifically, the connecting portion 342 does not move toward the −Z side (that is, does not move along the Z-axis direction). Alternatively, even if the connecting portion 342 is displaced to the -Z side, the amount of movement thereof will be smaller than the amount of movement of the connecting portion 341. Typically, the connecting portion 342 is only displaced to the -Z side to an extent that hardly affects the machining accuracy of the workpiece W.

Note that the state in which the connecting portion 342 does not displace in the Z-axis direction like the connecting portion 341 is substantially a state in which the connecting portion 342 and the connecting portion 341 are movable separately in the Z-axis direction. It can be said that there is.

In this way, in the first embodiment, the displacement of the stage drive system 33 in the Z-axis direction is absorbed by the connecting member 34. Therefore, the stage 32 does not unintentionally move along the Z-axis to the extent that the machining accuracy of the workpiece W is affected due to the displacement of the stage drive system 33 in the Z-axis direction. Therefore, the processing accuracy of the workpiece W is improved compared to the case where the displacement of the stage drive system 33 in the Z-axis direction is not absorbed by the connecting member 34.

Further, even if the rigidity of the connecting member 34 in the Z-axis direction is so low that the displacement of the stage drive system 33 in the Z-axis direction is absorbed by the connecting member 34, the stage 32 is moved by the air bearing 35 in the Z-axis direction. Supported by Therefore, even if the rigidity of the connecting member 34 connecting the stage 32 and the stage drive system 33 in the Z-axis direction is relatively low, since the air bearing 35 supports the stage 32, the work W The stage 32 does not unintentionally move along the Z-axis direction to the extent that machining accuracy is affected. In other words, the positional relationship between the stage 32 and the surface plate 31 (for example, the positional relationship between the stage 32 and the upper surface 311 of the surface plate 31) is ) is maintained, so the processing accuracy of the workpiece W is improved.

In the first embodiment, the position of the stage 32 in the Z-axis direction is determined based on the surface plate 31 (the upper surface 311 of the surface plate 31), and the coupling member 34, the machining accuracy of the workpiece W, particularly in the Z direction, is improved.

It should be noted that the adverse effect regarding the Z displacement exerted on the stage 32 does not have to be caused by the stage drive system 33. Further, the adverse effect regarding the Z displacement imparted to the stage 32 may be vibration.

(2) Processing system SYSb of the second embodiment
Next, the processing system SYS of the second embodiment (hereinafter, the processing system SYS of the second embodiment will be referred to as the "processing system SYSb") will be described. The processing system SYSb of the second embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3b instead of the stage device 3. Other characteristics of the processing system SYSb may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3b of the second embodiment will be described below with reference to FIG. 13. FIG. 13 is a top view showing the stage device 3b of the second embodiment. In the following description, constituent elements that have already been explained will be given the same reference numerals and detailed explanations thereof will be omitted.

As shown in FIG. 13, the stage device 3b is different from the stage device 3 in that no other member (for example, the Y rail member 331Y) is disposed between the air bearing 35-3 and the stage 32. differ in terms of That is, in the second embodiment, the stage device 3b has a mounting member 36-3 for mounting the air bearing 35-3 on the stage 32, which is arranged between the air bearing 35-3 and the stage 32. The difference is that it does not have to have a shape that extends from the lower surface 322 of the stage 32 toward the air bearing 35-3 while avoiding other members. In other words, in the second embodiment, all the air bearings 35 are arranged at positions that do not overlap with the Y rail member 331Y in the Z-axis direction. Other features of the stage device 3b may be the same as other features of the stage device 3.

The processing system SYSb of the second embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

In the example shown in FIG. 13, the stage device 3b further includes an air bearing 35-4 attached to the stage 32 via an attachment member 36-4. The air bearing 35-4 is arranged primarily to balance the forces for supporting the stage 32. However, the stage device 3b does not need to include the air bearing 35-4.

(3) Processing system SYSc of third embodiment
Next, the processing system SYS of the third embodiment (hereinafter, the processing system SYS of the third embodiment will be referred to as the "processing system SYSc") will be described. The processing system SYSc of the third embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3c instead of the stage device 3. Other characteristics of the processing system SYSc may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3c of the third embodiment will be described below with reference to FIGS. 14 and 15. FIG. 14 is a top view showing the stage device 3c of the third embodiment. FIG. 15 is a sectional view showing a stage device 3c of the third embodiment.

As shown in FIGS. 14 and 15, the stage device 3c does not need to be provided with a plurality of connection members 34 in that it is provided with a plurality of connection members 34 (for example, a single connection member 34 is provided with a plurality of connection members 34). This is different from the stage device 3 (equipped). In the example shown in FIGS. 14 and 15, the stage device 3c includes two connecting members 34 (specifically, connecting members 34-1 and 34-2), but the stage device 3c includes three or more connecting members 34. You may be prepared. Other features of the stage device 3c may be the same as other features of the stage device 3.

The processing system SYSc of the third embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

Note that the third embodiment also has the structural requirements described in the second embodiment (for example, that no other member (for example, the Y rail member 331Y) is disposed between the air bearing 35-3 and the stage 32). configuration requirements) may be adopted.

(4) Processing system SYSd of the fourth embodiment
Next, the processing system SYS of the fourth embodiment (hereinafter, the processing system SYS of the fourth embodiment will be referred to as the "processing system SYSd") will be described. The processing system SYSd of the fourth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3d instead of the stage device 3. Other characteristics of the processing system SYSd may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3d of the fourth embodiment will be described below with reference to FIG. 16. FIG. 16 is a top view showing a stage device 3d of the fourth embodiment.

As shown in FIG. 16, the stage device 3d differs from the stage device 3 described above in that it includes a connecting member 34d instead of the connecting member 34. Other features of the stage device 3d may be the same as other features of the stage device 3. The connecting member 34d differs from the connecting member 34 in that it is a member that spreads along both the X-axis direction and the Y-axis direction (that is, it spreads along the XY plane). The connecting member 34d may be a member having a relatively high aspect ratio, which is the ratio of the length in the X-axis direction to the thickness, and a relatively high aspect ratio, which is the ratio of the length in the Y-axis direction to the thickness. In this case, the rigidity of the connecting member 34d easily satisfies both the above-mentioned movement condition #X and movement condition #Y. Furthermore, even in this case, if the connecting member 34 is a member whose length in the X-axis direction and the Y-axis direction is sufficiently larger than the thickness in the Z-axis direction, the rigidity of the connecting member 34d is , there is no change in the fact that the above-mentioned displacement absorption condition can be satisfied. Other features of the connecting member 34d may be the same as other features of the connecting member 34.

The connecting member 34d may be a leaf spring. At this time, the connecting member 34d may have a plate-like shape along the XY plane or a plane parallel to the XY plane. The connecting member 34d may have a plate-like shape along the stage running surface or a plane parallel to the stage running surface.

The processing system SYSd of the fourth embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

In the fourth embodiment, at least one of the constituent features described in the second embodiment and the constituent features described in the third embodiment (for example, the constituent features regarding the plurality of connecting members 34) may be adopted.

(5) Processing system SYSe of the fifth embodiment
Next, the processing system SYS of the fifth embodiment (hereinafter, the processing system SYS of the fifth embodiment will be referred to as the "processing system SYSe") will be described. The processing system SYSe of the fifth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3e instead of the stage device 3. Other characteristics of the processing system SYSe may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3e of the fifth embodiment will be described below with reference to FIGS. 17 and 18. Each of FIGS. 17 and 18 is a sectional view showing a stage device 3e of the fifth embodiment.

As shown in FIGS. 17 and 18, the stage device 3e differs from the stage device 3 described above in that an X rail member 331X is embedded in the surface plate 31. Other features of the stage device 3e may be the same as other features of the stage device 3.

The X-rail member 331X is embedded in the surface plate 31 such that the upper surface of the X-rail member 331X is not located on the +Z side (that is, not located above) than the upper surface 311 of the surface plate 31. The X-rail member 331X is embedded in the surface plate 31 so that the upper surface of the X-rail member 331X does not protrude further to the +Z side than the upper surface 311 of the surface plate 31. At this time, the position of the top surface of the X-rail member 331X in the Z-axis direction may be the same as the position of the top surface 311 of the surface plate 31 in the Z-axis direction. That is, the upper surface of the X rail member 331X may be arranged at the same height as the upper surface 311 of the surface plate 31. Alternatively, the position of the upper surface of the X-rail member 331X in the Z-axis direction may be located on the -Z side (that is, lower) than the position of the upper surface 311 of the surface plate 31 in the Z-axis direction. That is, the upper surface of the X rail member 331X may be arranged at a lower position than the upper surface 311 of the surface plate 31.

When the X-rail member 331X is embedded in the surface plate 31 in this manner, the X-rail member 331X does not become an obstacle to the movement of the air bearing 35. Specifically, as shown in FIG. 18, even if the stage 32 (furthermore, the air bearing 35) moves along the Y-axis direction as the Y slide member 332Y moves, the air bearing 35 does not move along the X rail member. No more contact with 331X. That is, in the fifth embodiment, the stage drive system 33 including the X rail member 331X is arranged at a position where it does not interfere with the movement of the air bearing 35 (that is, does not become an obstacle to the movement of the air bearing 35).

Therefore, the air bearing 35 can be placed at a limited position on the lower surface 322 of the stage 32 (for example, a position where the air bearing 35 can be placed so as not to overlap the X rail member 331X in the Z-axis direction even if the stage 32 moves). There is no need to arrange the air bearing 35. In other words, the air bearing 35 can be placed at a position where the X rail member 331X and the air bearing 35 overlap in the Z-axis direction when the stage 32 moves. The air bearing 35 can be arranged so as to overlap the X rail member 331X in the Z-axis direction when the stage 32 moves. Therefore, the degree of freedom in the arrangement position of the air bearing 35 increases.

The machining system SYSe of the fifth embodiment can enjoy the same effects as the machining system SYSa of the first embodiment described above, and can also increase the degree of freedom in the arrangement position of the air bearing 35. can be increased. Furthermore, since the degree of freedom in the arrangement position of the air bearing 35 is increased, it is also possible to prevent the size of the stage 32 from becoming excessively large. As an example, if the X rail member 331X becomes an obstacle to the movement of the air bearing 35 in the Y-axis direction (that is, the movement of the stage 32 in the Y-axis direction) as described above, the movement stroke of the stage 32 in the Y-axis direction may be In order to secure the amount, it is desirable to make the distance between the air bearing 35 and the X rail member 331X in the Y-axis direction relatively large (see FIG. 6). In this case, the larger the size (that is, the length) in the Y-axis direction of the stage 32 on which the air bearing 35 is arranged, the larger the distance between the air bearing 35 and the X-rail member 331X in the Y-axis direction. However, in this case, the size of the stage 32 in the Y-axis direction may become considerably larger than the size of the workpiece W in the Y-axis direction. In other words, in exchange for the advantage of securing the moving stroke amount of the stage 32 in the Y-axis direction, the disadvantage of increasing the size of the stage 32 becomes apparent. However, in the fifth embodiment, since the degree of freedom in arranging the air bearing 35 is increased, the stage can be moved without increasing the distance between the air bearing 35 and the X rail member 331X in the Y-axis direction. A moving stroke amount of 32 in the Y-axis direction can be secured.

Note that the X slide member 332X does not need to be embedded in the surface plate 31. Alternatively, the X slide member 332X may be embedded in the surface plate 31. For example, the X slide member 332X may be embedded in the surface plate 31 so that the upper surface of the X slide member 332X is not located on the +Z side with respect to the upper surface 311 of the surface plate 31. At this time, the position of the top surface of the X slide member 332X in the Z-axis direction may be the same as the position of the top surface 311 of the surface plate 31 in the Z-axis direction. When the upper surface of the X slide member 332X is not located on the +Z side than the upper surface 311 of the surface plate 31, the X slide member 332X does not become an obstacle to the movement of the air bearing 35. Incidentally, a case where the X slide member 332X becomes an obstacle to the movement of the air bearing 35 is a case where the air bearing 35 is arranged at a position overlapping in the Z-axis direction with the Y rail member 331Y arranged on the X slide member 332X. . In other words, the X slide member 332X may become an obstacle to movement in the Y-axis direction of the air bearing 35, which is disposed at a position overlapping the Y-rail member 331Y in the Z-axis direction. On the other hand, the X slide member 332X does not become an obstacle to the movement of the air bearing 35 in the Y-axis direction, which is disposed at a position that does not overlap with the Y-rail member 331Y in the Z-axis direction. In the example shown in FIG. 6, the X slide member 332X may become an obstacle to the movement of the air bearing 35-3 in the Y-axis direction. On the other hand, in the example shown in FIG. 6, the X slide member 332X does not become an obstacle to the movement of the air bearings 35-1 and 35-2 in the Y-axis direction.

Note that the fifth embodiment also employs at least one of the constituent features explained in the second to third embodiments and the constituent features explained in the fourth embodiment (for example, the constituent features regarding the connecting member 34d). Good too.

(6) Processing system SYSf of the sixth embodiment
Next, the processing system SYS of the sixth embodiment (hereinafter, the processing system SYS of the sixth embodiment will be referred to as the "processing system SYSf") will be described. The processing system SYSf of the sixth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3f instead of the stage device 3. Other characteristics of the processing system SYSf may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3f of the sixth embodiment will be described below with reference to FIGS. 19 and 20. Each of FIGS. 19 and 20 is a sectional view showing a stage device 3f of the sixth embodiment.

As shown in FIGS. 19 and 20, the stage device 3f differs from the stage device 3 described above in that the X rail member 331X is disposed upwardly away from the surface plate 31. Specifically, the stage device 3f includes a support member 37f. In the example shown in FIG. 19, the stage device 3f includes two support members 37f, but the number of support members 37f is not limited to two. The support member 37f is arranged on the surface plate 31 (for example, the upper surface 311 of the surface plate 31). The support member 37f is a member extending upward from the surface plate 31. The support member 37f supports the X rail member 331X from below. In the example shown in FIG. 19, the two support members 37f support the X rail member 331X from below at or near both ends of the X rail member 331X. As a result, the X rail member 331X is disposed upwardly away from the surface plate 31.

The stage device 3f further differs from the stage device 3 described above in that it includes a stage 32f instead of the stage 32. Other features of the stage device 3f may be the same as other features of the stage device 3.

The stage 32f includes a ceiling member 324f, a bottom member 325f, and a side wall member 326f. The ceiling member 324f is a plate-shaped member parallel to the XY plane. The workpiece W is placed on the upper surface of the ceiling member 324f. The connecting member 34 is connected to the lower surface of the ceiling member 324f via a spacer 349. Therefore, like the stage 32 described above, the stage 32f is movable along the X-axis direction and the Y-axis direction as the Y slide member 332Y moves. The bottom member 325f is a plate-shaped member parallel to the XY plane. The bottom member 325f is arranged below the ceiling member 324f. An air bearing 35 is arranged on the lower surface of the bottom member 325f via a mounting member 36. Therefore, like the stage 32, the stage 32f is supported by the air bearing 35 in the Z-axis direction. The side wall member 326f is a plate-shaped member parallel to the XZ plane. The side wall member 326f is a member that connects the ceiling member 324f and the bottom member 325f. Specifically, the stage 32f includes a side wall member 326f-1 that connects the +Y side outer edge of the ceiling member 324f and the +Y side outer edge of the bottom member 325f, and a side wall member 326f-1 that connects the -Y side outer edge of the ceiling member 324f and the bottom member 325f. and a side wall member 326f-2 that connects the -Y side outer edge of. As a result, the stage 32f including the ceiling member 324f, the bottom member 325f, and the side wall member 326f has a cylindrical shape.

The internal space 327f surrounded by the ceiling member 324f, the bottom member 325f, and the side wall member 326f is used as an accommodation space for accommodating (that is, arranging) at least a portion of the stage drive system 33. In the example shown in FIGS. 19 and 20, the internal space 327f accommodates a portion of the X rail member 331X, an X slide member 332X, a portion of the Y rail member 331Y, and a Y slide member 332Y. Therefore, in the sixth embodiment, the X slide member 332X moves along the X-axis direction while being accommodated in the internal space 327f. The Y slide member 332Y moves along the Y-axis direction while being accommodated in the internal space 327f. Furthermore, the connecting member 34 is accommodated in the internal space 327f. Therefore, in the sixth embodiment, the connecting member 34 connects the Y slide member 332Y and the stage 32f (particularly the ceiling member 324f) in the internal space 327f.

As described above, since the stage 32f has a cylindrical shape, the internal space 327f is connected to the external space of the stage 32f via the opening 3281f that is the end of the internal space 327f. Specifically, the internal space 327f is connected to the external space of the stage 32f via an opening 3281f-1 that is the +X side end of the internal space 327f. The internal space 327f is connected to the external space of the stage 32f via an opening 3281f-2, which is the -X side end of the internal space 327f. The X rail member 331X extends from the internal space 327f to the space outside the stage 32f via the openings 3281f-1 and 3281f-2. Since the X-rail member 331X extends from the internal space 327f to the space outside the stage 32f via the openings 3281f-1 and 3281f-2, the axis connecting the opening 3281f-1 and the opening 3281f-2 is the X-rail member 331X. is parallel to the direction in which it extends (that is, the X-axis direction). As a result, even if the X-rail member 331X is a member extending in the X-axis direction (especially a relatively long member), the X-rail member 331X does not become an obstacle to the movement of the stage 32f. In other words, the stage 32f is movable along the X-axis direction while maintaining the state in which the X rail member 331X extends from the internal space 327f to the space outside the stage 32f via the openings 3281f-1 and 3281f-2. . The stage 32f is movable along the X-axis direction while maintaining the state in which the X rail member 331X does not contact the stage 32f.

An opening 3282f is formed in the side wall member 326f. Specifically, an opening 3282f-1 is formed in the side wall member 326f-1, and an opening 3282f-2 is formed in the side wall member 326f-2. The Y rail member 331Y extends from the internal space 327f to the space outside the stage 32f via the openings 3282f-1 and 3282f-2. Since the Y rail member 331Y extends from the internal space 327f to the space outside the stage 32f via the openings 3282f-1 and 3282f-2, the axis connecting the openings 3282f-1 and 3282f-2 is the Y rail member 331Y. is parallel to the direction in which it extends (that is, the Y-axis direction). As a result, even if the Y-rail member 331Y is a member extending in the Y-axis direction (especially a relatively long member), the Y-rail member 331Y does not become an obstacle to the movement of the stage 32f. In other words, the stage 32f is movable along the Y-axis direction while maintaining the state in which the Y rail member 331Y extends from the internal space 327f to the space outside the stage 32f via the openings 3282f-1 and 3282f-2. . The stage 32f is movable along the Y-axis direction while maintaining the state in which the Y rail member 331Y does not contact the stage 32f (particularly does not contact the side wall member 326f).

In this way, the X rail member 331X is disposed upwardly away from the surface plate 31, and the air bearing 35 is attached to the bottom member 325f of the stage 32f (specifically, the member located below the stage drive system 33). When placed, the X rail member 331X no longer becomes an obstacle to the movement of the air bearing 35. Specifically, even if the stage 32 (furthermore, the air bearing 35) moves along the Y-axis direction as the Y slide member 332Y moves, the X rail member 331X is not placed on the surface plate 31. Therefore, the air bearing 35, which moves with a thin gas film formed between it and the surface plate 31, does not come into contact with the X rail member 331X. That is, in the sixth embodiment, the stage drive system 33 including the X rail member 331X is arranged at a position where it does not interfere with the movement of the air bearing 35 (that is, does not become an obstacle to the movement of the air bearing 35). Therefore, in the fifth embodiment, as in the sixth embodiment, the degree of freedom in the arrangement position of the air bearing 35 is increased.

The machining system SYSf of the sixth embodiment can enjoy the same effects as the machining system SYSa of the first embodiment described above, and also has a greater degree of freedom in the arrangement position of the air bearing 35. can be increased.

Note that, also in the sixth embodiment, the constituent features described in the second to fourth embodiments and the constituent features explained in the fifth embodiment (for example, the constituent features regarding embedding the X rail member 331X in the surface plate 31) ) may be adopted.

(7) Processing system SYSg of the seventh embodiment
Next, the processing system SYS of the seventh embodiment (hereinafter, the processing system SYS of the seventh embodiment will be referred to as the "processing system SYSg") will be described. The processing system SYSg of the seventh embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3g instead of the stage device 3. Other characteristics of the processing system SYSg may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3g of the seventh embodiment will be described below with reference to FIGS. 21 and 22. FIG. 21 is a top view showing a stage device 3g according to the seventh embodiment. FIG. 22 is a sectional view taken along line XXI-XXI' of the stage device 3g shown in FIG.

As shown in FIGS. 21 and 22, the stage device 3g differs from the stage device 3 described above in that it includes a protection member 38g. Other features of the stage device 3g may be the same as other features of the stage device 3.

The protection member 38g is arranged on the X slide member 332X. Therefore, the protection member 38g moves along the X-axis direction together with the Y stage drive system 33Y disposed on the X slide member 332X as the X slide member 332X moves.

The protection member 38g is arranged around the Y stage drive system 33Y. Specifically, the protection member 38g is arranged so as to surround at least a portion of the Y stage drive system 33Y. The protection member 38g is arranged to surround at least a portion of the Y rail member 331Y and the Y slide member 332Y. That is, at least a portion of the Y rail member 331Y and the Y slide member 332Y are arranged in the space 38SP surrounded by the protection member 38g. In this case, the possibility that substances from the space outside the space 38SP (specifically, the accommodation space SP inside the housing 4) will enter the space 38SP surrounded by the protection member 38g is relatively small. . For example, there is a possibility that products generated as a result of processing the workpiece W exist in the storage space SP. An example of such a product is a substance generated by irradiation with the processing light EL (for example, a fume containing melted or vaporized material of the workpiece W). For example, in the accommodation space SP, there is a possibility that there are necessary materials to be supplied to the accommodation space SP for processing the workpiece W. An example of such a necessary item is a material (that is, a material for additional processing) that is supplied to the storage space SP when the processing system SYSg performs additional processing as described later. In the seventh embodiment, there is a relatively small possibility that substances containing such products and/or necessary materials (hereinafter referred to as "invading substances" for convenience of explanation) will invade from the accommodation space SP to the space 38SP. Become. Therefore, the protection member 38g can function as a member that reduces the intrusion of invading substances into the space 38SP.

As described above, at least a portion of the Y rail member 331Y and the Y slide member 332Y are arranged in the space 38SP. Therefore, the possibility that the invading substance will enter at least a portion of the space where the Y rail member 331Y and the Y slide member 332Y are arranged becomes relatively small. As a result, the possibility that invading substances will adhere to at least a portion of the Y rail member 331Y and the Y slide member 332Y becomes relatively small. Therefore, the protection member 38g may function as a member that reduces the adhesion of invading substances to at least a portion of the Y rail member 331Y and the Y slide member 332Y. If invading substances adhere to the Y rail member 331Y and/or the Y slide member 332Y, proper movement of the Y slide member 332Y along the Y rail member 331Y may be hindered. However, in the seventh embodiment, since the protective member 38g is disposed, the appropriate movement of the Y slide member 332Y along the Y rail member 331Y is hindered compared to the case where the protective member 38g is not disposed. The possibility of being lost is smaller. Therefore, the Y slide member 332Y (furthermore, the stage 32 connected to the Y slide member 332Y) can appropriately move along the Y-axis direction.

Note that an opening 38AP may be formed in the protection member 38g. The opening 38AP may be used as a space through which the connecting member 34 passes. That is, the connecting member 34 may extend from the Y slide member 332Y arranged in the space 38SP toward the stage 32 located outside the space 38SP via the opening 38AP.

21 and 22 show a specific example of the structure of the protective member 38g that functions as described above. In the example shown in FIGS. 21 and 22, the protection member 38g includes a protection member 381g, a protection member 382g, and a protection member 383g.

The protection member 381g is arranged on the X slide member 332X. The protection member 381g is a member that extends from the X slide member 332X toward the +Z side (that is, upward). The protection member 381g is arranged on one side of the left and right sides (the −X side in the example shown in FIG. 22) of the Y rail member 331Y. The protection member 381g extends along the Y rail member 331Y while ensuring a gap between the protection member 381g and the Y rail member 331Y. In other words, the protection member 381g is a member extending along the Y-axis direction. Such a protection member 381g is used as a side wall member that defines the space 38SP.

The protection member 382g is a member that extends from the +Z side end (that is, the outer edge) of the protection member 381g toward the side (+X side in the example shown in FIG. 22). The protection member 382g is arranged above at least a portion of the Y rail member 331Y and the Y slide member 332Y. The protection member 382g extends along the Y rail member 331Y while ensuring a gap between the Y rail member 331Y and the Y slide member 332Y. In other words, the protection member 382g is a member extending along the Y-axis direction. Such a protection member 382g is used as a ceiling member that defines the space 38SP.

The protection member 383g is a member that extends from the X slide member 332X toward the +Z side (that is, upward). The protection member 383g is arranged on the other left and right side (+X side in the example shown in FIG. 22) of the Y rail member 331Y. The protection member 383g is arranged so as to sandwich at least a portion of the Y rail member 331Y between the protection member 381g and the protection member 381g. The protection member 383g extends along the Y rail member 331Y while ensuring a gap between the protective member 383g and the Y rail member 331Y. In other words, the protection member 383g is a member extending along the Y-axis direction. Such a protection member 383g is used as a side wall member that defines the space 38SP.

The gap between the protection member 382g and the protection member 383g is used as an opening 38AP through which the connection member 34 passes. Since each of the protection members 382g and 383g is a member extending along the Y-axis direction, the opening 38AP has a longitudinal shape with the Y-axis direction being the longitudinal direction. As a result, even if the Y slide member 332Y moves along the Y rail member 331Y, the connecting member 34 that moves with the Y slide member 332Y as the Y slide member 332Y moves will not come into contact with the protection members 382g and 383g. do not have.

The processing system SYSg of the seventh embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above, and the Y slide member 332Y (furthermore, the stage 32 ) can be moved relatively smoothly and/or with high precision.

In addition to or in place of the protection member 38g, the stage device 3g may include a member that reduces adhesion of intruding substances to at least a portion of the X rail member 331X and the X slide member 332X. The stage device 3g is a member that reduces the intrusion of invading substances into a space in which components (for example, at least a part of the stage drive system 33, drive system 5, and drive system 6) to which it is desired to reduce the adhesion of invading substances are arranged. may be provided.

Also in the seventh embodiment, the constituent features explained in the second to fifth embodiments and the constituent features explained in the sixth embodiment (for example, regarding the X rail member 331X arranged at a position away from the surface plate 31 At least one of the configuration requirements) may be adopted.

(8) Processing system SYSh of the eighth embodiment
Next, the processing system SYS of the eighth embodiment (hereinafter, the processing system SYS of the eighth embodiment will be referred to as "processing system SYSh") will be described. The processing system SYSh of the eighth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3h instead of the stage device 3. Other characteristics of the processing system SYSh may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3h of the eighth embodiment will be described below with reference to FIG. 23. FIG. 23 is a top view showing a stage device 3h of the eighth embodiment.

As shown in FIG. 23, the stage device 3h differs from the stage device 3 described above in that it includes a connecting member 34h instead of the connecting member 34. Other features of the stage device 3h may be the same as other features of the stage device 3.

The connecting member 34h differs from the connecting member 34 in that it has a structure that can function as an elastic hinge. Other features of the connecting member 34h may be the same as other features of the connecting member 34.

In order to function as an elastic hinge, the connecting member 34h includes a connecting portion 341h, a connecting portion 342h, an intermediate portion 343h, a notch portion 344h, and a notch portion 345h. The connecting portion 341h is a portion of the connecting member 34h that is connected to the Y slide member 332Y, similar to the connecting portion 341 described above. The connecting portion 342h is a portion of the connecting member 34h that is connected to the stage 32, similar to the connecting portion 342 described above. The intermediate portion 343h is a portion of the connecting member 34h located between the connecting portion 341h and the connecting portion 342h. The cutout portion 344h is a portion of the connecting member 34h that connects the connecting portion 341h and the intermediate portion 343h. The notch portion 345h is a portion of the connecting member 34h that connects the connecting portion 342h and the intermediate portion 343h. A notch is formed in each of the notch portions 344h and 345h.

The connecting member 34h, which can function as such an elastic hinge, also has a rigidity that satisfies the displacement absorption condition, similar to the above-mentioned connecting member 34. That is, the displacement of the stage drive system 33 in the Z-axis direction (particularly the displacement of the Y slide member 332Y in the Z-axis direction) is absorbed by the connecting member 34h. The absorption of displacement of the stage drive system 33 by the connecting member 34h will be explained with reference to FIGS. 24 and 25. FIG. 24 is a sectional view showing how the Y slide member 332Y is displaced to the +Z side in the eighth embodiment. FIG. 25 is a cross-sectional view showing how the Y slide member 332Y is displaced toward the -Z side in the eighth embodiment.

As shown in FIG. 24, when the Y slide member 332Y is displaced to the +Z side while the stage 32 is moving along the stage running surface, the connecting portion 341h of the connecting member 34h that is connected to the Y slide member 332Y is also displaced to the +Z side. In this case, due to the force transmitted from the Y slide member 332Y to the connecting portion 341h to displace the connecting portion 341h to the +Z side, the connecting member 34h that can function as an elastic hinge is deformed (specifically, due to the force transmitted from the Y slide member 332Y to the connecting portion 341h) transform. Specifically, the connecting member 34h is configured to prevent the connecting portion 342h connected to the stage 32 from being displaced to the +Z side, or to displace the connecting portion 342h to the +Z side only to the extent that it hardly affects the machining accuracy of the workpiece W. Transform it so that it doesn't. Similarly, as shown in FIG. 25, when the Y slide member 332Y is displaced toward the −Z side while the stage 32 is moving along the stage running surface, the connecting portion 341h is also displaced toward the −Z side. Even in this case, the connecting member 34h is designed to prevent the connecting portion 342h from being displaced toward the −Z side, or to prevent the connecting portion 342h from being displaced toward the −Z side only to the extent that it hardly affects the machining accuracy of the workpiece W. transform. Therefore, in the eighth embodiment, as in the first embodiment, due to the displacement of the stage drive system 33 in the Z-axis direction, the stage 32 moves in the Z-axis direction to the extent that it affects the machining accuracy of the workpiece W. There will be no unintentional movement along the line. Therefore, the processing accuracy of the workpiece W is improved compared to the case where the displacement of the stage drive system 33 in the Z-axis direction is not absorbed by the connecting member 34h.

The processing system SYSh of the eighth embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

Note that the eighth embodiment also employs at least one of the constituent features explained in the second to sixth embodiments and the constituent features explained in the seventh embodiment (for example, constituent features regarding the protective member 38g). Good too.

(9) Processing system SYSi of the ninth embodiment
Next, the processing system SYS of the ninth embodiment (hereinafter, the processing system SYS of the ninth embodiment will be referred to as the "processing system SYSi") will be described. The processing system SYSi of the ninth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3i instead of the stage device 3. Other characteristics of the processing system SYSi may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3i of the ninth embodiment will be described below with reference to FIG. 26. FIG. 26 is a top view showing the stage device 3i of the ninth embodiment.

As shown in FIG. 26, the stage device 3i differs from the stage device 3 described above in that it includes a connecting member 34i instead of the connecting member 34. Other features of the stage device 3i may be the same as other features of the stage device 3.

The connecting member 34i differs from the connecting member 34 in that it constitutes a link mechanism. Other features of the coupling member 34i may be the same as other features of the coupling member 34.

To configure the link mechanism, the connecting member 34i includes a connecting portion 341i, a connecting portion 342i, and an intermediate portion 343i. The connecting portion 341i is a portion of the connecting member 34i that is connected to the Y slide member 332Y, similar to the connecting portion 341 described above. The connecting portion 342i is a portion of the connecting member 34i that is connected to the stage 32, similar to the connecting portion 342 described above. The intermediate portion 343i is a portion of the connecting member 34i located between the connecting portion 341i and the connecting portion 342i. Each of the connecting portion 341i, the connecting portion 342i, and the intermediate portion 343i corresponds to a link in a link mechanism. The connecting portion 341i and the intermediate portion 343i are connected via a joint 344i. The connecting portion 341i is rotatable around a rotation axis defined by the joint 344i (particularly a rotation axis parallel to the XY plane, and in the example shown in FIG. 26, the Y axis). Intermediate portion 343i is rotatable about a rotation axis defined by joint 344i. The connecting portion 341i and the intermediate portion 343i are rotatable (that is, movable) separately from each other. The connecting portion 342i and the intermediate portion 343i are connected via a joint 345i. The connecting portion 342i is rotatable around a rotation axis (particularly a rotation axis parallel to the XY plane, and in the example shown in FIG. 26, the Y axis) defined by the joint 345i. Intermediate portion 343i is rotatable about a rotation axis defined by joint 344i. The connecting portion 342i and the intermediate portion 343i are rotatable (that is, movable) separately from each other.

The connecting member 34i constituting such a link mechanism can absorb the displacement of the Y slide member 332Y along the Z-axis direction, whether or not it has the rigidity that satisfies the above-mentioned displacement absorption condition. Can be done. That is, the displacement of the stage drive system 33 in the Z-axis direction (particularly the displacement of the Y slide member 332Y in the Z-axis direction) is absorbed by the connecting member 34i. The absorption of displacement of the stage drive system 33 by the connecting member 34i will be explained with reference to FIGS. 27 and 28. FIG. 27 is a sectional view showing how the Y slide member 332Y is displaced to the +Z side in the ninth embodiment. FIG. 28 is a cross-sectional view showing how the Y slide member 332Y is displaced toward the −Z side in the ninth embodiment.

As shown in FIG. 27, when the Y slide member 332Y is displaced to the +Z side while the stage 32 is moving along the stage running surface, the connecting portion 341i of the connecting member 34i that is connected to the Y slide member 332Y is also displaced to the +Z side. In this case, the joint 344i that connects the connecting portion 341i and the intermediate portion 343i is also displaced to the +Z side. On the other hand, since the connecting portion 341i, the intermediate portion 343i, and the connecting portion 342i are movable separately from each other, even if the joint 344i formed at one end of the intermediate portion 343i is displaced to the +Z side, the intermediate portion 343i and the connecting portion 342i are movable separately from each other. The joint 345i formed at the other end of the portion 343i is not displaced to the +Z side. Alternatively, even if the joint 345i were to be displaced to the +Z side, the amount of displacement would be extremely small. This is because the force transmitted to the intermediate portion 343i to displace one end of the intermediate portion 343i toward the +Z side is used as a force for rotating the intermediate portion 343i around the rotation axis defined by the joint 345i. be. As a result, the connecting portion 342i connected to the other end of the intermediate portion 343i via the joint 345i (that is, the connecting portion 342i connected to the stage 32) does not displace to the +Z side or has almost no effect on the machining accuracy of the workpiece W. The connecting portion 342h is only displaced to the +Z side to the extent that it does not have any influence. Similarly, when the Y slide member 332Y is displaced to the −Z side while the stage 32 is moving along the stage running surface, as shown in FIG. 28, the joint 345i formed at the other end of the intermediate portion 343i is not displaced to the -Z side. Alternatively, even if the joint 345i were to be displaced to the −Z side, the amount of displacement would be extremely small. As a result, the connecting portion 342i connected to the stage 32 is not displaced toward the −Z side, or the connecting portion 342h is only displaced toward the +Z side to an extent that hardly affects the machining accuracy of the workpiece W. Therefore, in the ninth embodiment, as in the first embodiment, due to the displacement of the stage drive system 33 in the Z-axis direction, the stage 32 may move in the Z-axis direction to the extent that it affects the machining accuracy of the workpiece W. There will be no unintentional movement along the line. Therefore, the processing accuracy of the workpiece W is improved compared to the case where the displacement of the stage drive system 33 in the Z-axis direction is not absorbed by the connecting member 34i.

The processing system SYSi of the ninth embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

Note that the ninth embodiment also employs at least one of the constituent features explained in the second to seventh embodiments and the constituent features explained in the eighth embodiment (for example, constituent features regarding the connecting member 34h). Good too.

(10) Processing system SYSj of the tenth embodiment
Next, the processing system SYS according to the tenth embodiment (hereinafter, the processing system SYS according to the tenth embodiment will be referred to as "processing system SYSj") will be described. The processing system SYSj of the tenth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3j instead of the stage device 3. Other characteristics of the processing system SYSj may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3j of the tenth embodiment will be described below with reference to FIG. 29. FIG. 29 is a top view showing the stage device 3j of the tenth embodiment.

As shown in FIG. 29, the stage device 3j differs from the stage device 3 described above in that it includes a connecting member 34j instead of the connecting member 34. Other features of the stage device 3j may be the same as other features of the stage device 3.

The connecting member 34j differs from the connecting member 34 in that it absorbs displacement of the Y slide member 332Y along the Z-axis direction using a linear guide. Other features of the coupling member 34j may be the same as other features of the coupling member 34.

The connecting member 34j includes a connecting portion 341j, a connecting portion 342j, a sliding portion 343j, and a rail portion 344j. The connecting portion 341j is a portion of the connecting member 34j that is connected to the Y slide member 332Y, similar to the connecting portion 341 described above. The connecting portion 342j is a portion of the connecting member 34j that is connected to the stage 32, similar to the connecting portion 342 described above. The sliding portion 343j is connected to the connecting portion 341j. Rail portion 344j is connected to connecting portion 342j. The rail portion 344j is a member extending along the Z-axis direction. Slide portion 343j is attached to rail portion 344j so as to be movable along rail portion 344j. Therefore, the slide portion 343j is movable along the Z-axis direction. Thus, the connecting member 34j includes a linear guide including a slide portion 343j and a rail portion 344j.

The connecting member 34j including such a linear guide can absorb the displacement of the Y slide member 332Y along the Z-axis direction, whether or not it has the rigidity that satisfies the above-mentioned displacement absorption condition. Can be done. That is, the displacement of the stage drive system 33 in the Z-axis direction (particularly the displacement of the Y slide member 332Y in the Z-axis direction) is absorbed by the connection member 34j. The absorption of displacement of the stage drive system 33 by the connecting member 34j will be explained with reference to FIGS. 30 and 31. FIG. 30 is a sectional view showing how the Y slide member 332Y is displaced to the +Z side in the tenth embodiment. FIG. 31 is a cross-sectional view showing how the Y slide member 332Y is displaced toward the −Z side in the tenth embodiment.

As shown in FIG. 30, when the Y slide member 332Y is displaced to the +Z side while the stage 32 is moving along the stage running surface, the connecting portion 341j of the connecting member 34j that is connected to the Y slide member 332Y is also displaced to the +Z side. As a result, the sliding portion 343j connected to the connecting portion 341j is also displaced to the +Z side. On the other hand, even if the slide portion 343j is displaced to the +Z side, the rail portion 344j to which the slide portion 343j is attached will not be displaced to the +Z side. Therefore, the connecting portion 342j connected to the rail portion 344j (that is, the connecting portion 342j connected to the stage 32) is also not displaced to the +Z side. Similarly, when the Y slide member 332Y is displaced toward the −Z side while the stage 32 is moving along the stage running surface, the connecting portion 341j and the slide portion 343j are displaced toward the −Z side, as shown in FIG. Although the rail portion 344j and the connecting portion 342j are displaced, the rail portion 344j and the connecting portion 342j are not displaced toward the −Z side. Therefore, in the tenth embodiment, as in the first embodiment, due to the displacement of the stage drive system 33 in the Z-axis direction, the stage 32 moves in the Z-axis direction to the extent that it affects the machining accuracy of the workpiece W. There will be no unintentional movement along the line. Therefore, the processing accuracy of the workpiece W is improved compared to the case where the displacement of the stage drive system 33 in the Z-axis direction is not absorbed by the connecting member 34j.

The processing system SYSj of the tenth embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

Note that the tenth embodiment also employs at least one of the constituent features explained in the second to eighth embodiments and the constituent features explained in the ninth embodiment (for example, the constituent features regarding the connecting member 34i). Good too.

(11) Processing system SYSk of the eleventh embodiment
Next, a processing system SYS according to the eleventh embodiment (hereinafter, the processing system SYS according to the eleventh embodiment will be referred to as "processing system SYSk") will be described. The processing system SYSk of the eleventh embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a stage device 3k instead of the stage device 3. Other characteristics of the processing system SYSk may be the same as other characteristics of the processing system SYSa. Therefore, the stage device 3k of the eleventh embodiment will be described below with reference to FIGS. 32 and 33. FIG. 32 is a top view showing the stage device 3k of the eleventh embodiment. FIG. 33 is a sectional view taken along XXXII-XXXII' of the stage device 3k shown in FIG. 32.

As shown in FIGS. 32 and 33, the stage device 3k differs from the stage device 3 described above in that the positional relationship between the connecting member 34, the stage 32, and the stage drive system 33 is different. Specifically, in the stage device 3 described above, the connecting member 34 connects the Y slide member 332Y and the stage 32 via at least a portion of the space below the stage 32. That is, the stage drive system 33 is arranged below the stage 32, and the connecting member 34 extends from the Y slide member 332Y toward the stage 32 in the space below the stage 32. On the other hand, in the stage device 3k of the eleventh embodiment, the connecting member 34 connects the Y slide member 332Y and the stage 32 via at least a part of the space on the side of the stage 32. In other words, in the stage device 3k of the eleventh embodiment, the stage drive system 33 is arranged on the side of the stage 32 (that is, the position of the stage 32 and the position of the stage drive system 33 in the direction along the XY plane are (different), the connecting member 34 extends from the Y slide member 332Y toward the stage 32 through the space on the side of the stage 32. Other features of the stage device 3k may be the same as other features of the stage device 3.

The processing system SYSk of the eleventh embodiment can enjoy the same effects as the processing system SYSa of the first embodiment described above.

In the example shown in FIGS. 32 and 33, the connecting member 34 is connected to the stage 32 without using the spacer 349, but it may be connected to the stage 32 via the spacer 349. Although the air bearing 35 is attached to the stage 32 without using the attachment member 36, it may be attached to the stage 32 via the attachment member 36.

Also in the eleventh embodiment, at least one of the constituent features explained in the second to ninth embodiments and the constituent features explained in the tenth embodiment (for example, constituent features regarding the connecting member 34j) may be adopted. .

(12) Processing system SYSl of the twelfth embodiment
Next, a processing system SYS according to the twelfth embodiment (hereinafter, the processing system SYS according to the twelfth embodiment will be referred to as "processing system SYSl") will be described. The processing system SYSl of the twelfth embodiment differs from the processing system SYSk of the eleventh embodiment described above in that it includes a stage device 3l instead of the stage device 3k. Other characteristics of the processing system SYSl may be the same as other characteristics of the processing system SYSk. Therefore, the stage device 3l of the twelfth embodiment will be described below with reference to FIGS. 34 and 35. FIG. 34 is a top view showing a stage device 3l of the twelfth embodiment. FIG. 35 is a sectional view taken along XXXIV-XXXIV' of the stage device 3l shown in FIG. 34.

As shown in FIGS. 34 and 35, the stage device 3l is different from the stage device 3k described above in that it includes a plurality of stage drive systems 33. In the example shown in FIGS. 34 and 35, the stage device 3l includes a stage drive system 33 disposed on one left and right side of the stage 32 (for example, the +Y side), and a stage drive system 33 disposed on the other left and right side of the stage 32 (for example, the −Y side). A stage drive system 33 is provided. In the following description, "-1" will be added to the end of the reference numeral of the component regarding the stage drive system 33 disposed on one side of the left and right sides of the stage 32, and the stage drive system 33 disposed on the other side of the left and right sides of the stage 32 will be suffixed with "-1". These two are distinguished by adding "-2" to the end of the reference numeral of the component related to system 33.

Furthermore, compared to the stage device 3k described above, the stage device 3l includes a plurality of connecting members 34 that connect the plurality of Y slide members 332Y of the plurality of stage drive systems 33 and the stage 32, respectively. In the example shown in FIGS. 34 and 35, the stage device 3l includes a connecting member 34 (hereinafter referred to as “connecting member 34-1”) that connects the Y slide member 332Y-1 included in the stage drive system 33-1 and the stage 32. and a connecting member 34 (hereinafter referred to as “connecting member 34-2”) that connects the Y slide member 332Y-2 included in the stage drive system 33-2 and the stage 32.

Other features of the stage device 3l may be the same as other features of the stage device 3l.

The processing system SYSl of the twelfth embodiment can enjoy the same effects as the processing system SYSk of the eleventh embodiment described above.

Note that the stage device 3l may include a plurality of stage drive systems 33 and a single connecting member 34. The stage device 3l includes a single stage drive system 33, but may also include a plurality of connecting members 34 (see the third embodiment).

Each of the stage apparatus 3 of the first embodiment to the stage apparatus j of the tenth embodiment described above may also include a plurality of stage drive systems 33, similarly to the stage apparatus 3l of the twelfth embodiment. Similarly to the stage device 3l of the twelfth embodiment, each of the stage device 3 of the first embodiment to the stage device j of the tenth embodiment described above also includes a plurality of connection members respectively corresponding to the plurality of stage drive systems 33. 34 may be provided.

Also in the twelfth embodiment, at least one of the constituent elements described in the first to tenth embodiments may be adopted.

(13) Other Modifications In the above description, the stage drive system 33 is a stage drive system that includes a linear guide. However, the stage drive system 33 may be any drive system as long as it can move the stage 32 along each of the X-axis direction and the Y-axis direction. Even in this case, as long as the moving member of the stage drive system 33 that moves along the X-axis direction and/or the Y-axis direction and the stage 32 are connected via the above-mentioned connection member 34, the above-mentioned The effect can be enjoyed.

In the above description, the stage device 3 includes the air bearing 35 as a support member for supporting the stage 32 in the Z-axis direction. However, the stage device 3 may include a support member different from the air bearing 35 as a support member for supporting the stage 32 in the Z-axis direction. This support member may be a support member that supports the stage 32 without contacting the surface plate 31 (or without contacting the stage 32).

In the above description, the processing apparatus 1 performs a removal process in which a part of the workpiece W is removed by irradiating the workpiece W with the processing light EL. However, in addition to or in place of the removal process, the processing apparatus 1 may irradiate the work W with the process light EL to perform a process different from the removal process. For example, the processing device 1 may perform additional processing on the work W by irradiating the work W with the processing light EL. For example, the processing device 1 changes the characteristics of at least a portion of the surface of the workpiece W by irradiating the processing light EL to form a desired pattern (for example, a character pattern, a figure pattern, or an arbitrary pattern) on the surface of the workpiece W. Marking processing may also be performed.

In the above description, the processing system SYS includes the measuring device 2, but it may not include the measuring device 2.

In the above description, the processing apparatus 1 processes the work W by irradiating the work W with the processing light EL, which is an example of an energy beam. However, the processing apparatus 1 may process the workpiece W by irradiating the workpiece W with an arbitrary energy beam different from light. In this case, the processing device 1 may include, in addition to or instead of the light source 11, a beam irradiation device capable of irradiating an arbitrary energy beam. Any energy beam may include, but is not limited to, a charged particle beam such as an electron beam, an ion beam, or electromagnetic waves.

In the above description, the processing system SYS that processes the workpiece W includes the stage device 3. However, any device that performs some kind of operation or processing using the workpiece W (or any object) may use the above-mentioned stage device 3 as a mounting device on which the workpiece W (or any object) is placed. You may be prepared.

In the above description, the workpiece W is placed on the stage device 3. However, the processing device 1 and/or the measuring device 2 may be provided on the stage device 3.

(14) Additional Notes Regarding the embodiments described above, the following additional notes are further disclosed.
[Additional note 1]
a mounting member on which an object is mounted;
a support member that supports the mounting member in the support direction;
a moving device including a moving member movable along a moving direction intersecting the supporting direction;
a connecting member connecting the moving member and the placing member;
A first portion of the connection member connected to the moving member and a second portion of the connection member connected to the placement member are movable separately in the support direction.
[Additional note 2]
Supplementary note 1, wherein during a period in which the first portion moves by a first movement amount with respect to the support direction, the second portion moves by a second movement amount that is smaller than the first movement amount with respect to the support direction. equipment.
[Additional note 3]
The mounting device according to supplementary note 1 or 2, wherein the second portion does not move in the support direction during a period in which the first portion moves in the support direction.
[Additional note 4]
The connecting member suppresses a force applied from the moving member to the connecting member due to movement of the moving member in the supporting direction from being transmitted to the mounting member via the connecting member. 3. The mounting device according to any one of 3.
[Additional note 5]
a mounting member on which an object is mounted;
a support member that supports the mounting member in the support direction;
a moving device including a moving member movable along a moving direction intersecting the supporting direction;
a connecting member connecting the moving member and the placing member;
The connecting member suppresses a force applied from the moving member to the connecting member due to movement of the moving member in the support direction from being transmitted to the mounting member via the connecting member. .
[Additional note 6]
The object mounting device according to any one of Supplementary Notes 1 to 5, wherein the connecting member is a member having higher rigidity in the moving direction than in the supporting direction.
[Additional note 7]
a mounting member on which an object is mounted;
a support member that supports the mounting member in the support direction;
a moving device including a moving member movable along a moving direction intersecting the supporting direction;
a connecting member connecting the moving member and the placing member;
The connecting member is a member having higher rigidity in the moving direction than in the supporting direction.
[Additional note 8]
The mounting member is movable along the moving direction as the moving member connected to the mounting member via the connecting member moves,
The rigidity of the connecting member in the moving direction is such that, as the moving member moves along the moving direction, the mounting member moves in a desired moving manner assumed from the moving manner of the moving member in the moving direction. The object mounting device according to any one of Supplementary Notes 1 to 7, which satisfies a movement condition of moving along the movement direction.
[Additional note 9]
The object mounting device according to appendix 8, wherein the movement mode includes at least one of a movement direction, a movement amount, and a movement speed.
[Additional note 10]
The movement conditions include (i) a condition that the movement direction of the movement member in the movement direction matches the movement direction of the mounting member in the movement direction; (ii) a condition that the movement direction of the movement member in the movement direction the amount of movement is proportional to the amount of movement of the placement member in the movement direction, and (iii) the movement speed of the movement member in the movement direction is equal to the movement speed of the placement member in the movement direction; The object mounting device according to appendix 8 or 9, which includes at least one of the conditions of matching.
[Additional note 11]
According to any one of Supplementary Notes 1 to 10, the rigidity of the connecting member in the supporting direction satisfies a displacement absorption condition that the moving member is deformed in the supporting direction so as to absorb displacement of the movable member along the supporting direction. object placement device.
[Additional note 12]
The mounting device according to any one of Supplementary Notes 1 to 11, wherein the connecting member includes an elastic body.
[Additional note 13]
a mounting member on which an object is mounted;
a support member that supports the mounting member in the support direction;
a moving device including a moving member movable along a moving direction intersecting the supporting direction;
A mounting device comprising: a connecting member that connects the moving member and the mounting member and includes an elastic body.
[Additional note 14]
The mounting device according to appendix 12 or 13, wherein the elastic body includes at least one of a spring and an elastic hinge.
[Additional note 15]
The mounting device according to appendix 14, wherein the spring includes a plate spring.
[Additional note 16]
The connecting member includes a first portion connected to the movable member, a second portion connected to the placement member, and connected to the first portion via a first joint and connected to the second portion via the second joint. a third portion connected to the second portion;
The first and third portions are separately movable via the joint around an axis intersecting the support direction,
The mounting device according to any one of Supplementary Notes 1 to 15, wherein the second and third portions are movable separately around an axis intersecting the support direction via the second joint.
[Additional note 17]
The first and third portions are separately rotatable around an axis intersecting the support direction, with the first link mechanism as a rotation center,
The mounting device according to appendix 16, wherein the second and third portions are separately rotatable around an axis intersecting the support direction, with the second link mechanism as a rotation center.
[Additional note 18]
The connecting member includes a first portion connected to the moving member, a second portion connected to the placement member, and a third portion extending along the support direction and connected to the second portion. contains a part,
The mounting device according to any one of Supplementary Notes 1 to 15, wherein the first portion is movable relative to the third portion along the third portion.
[Additional note 19]
The mounting device according to any one of Supplementary Notes 1 to 18, wherein the connecting member extends from the moving member toward the mounting member.
[Additional note 20]
The mounting device according to any one of Supplementary Notes 1 to 19, wherein the connecting member extends from one portion of the moving member toward another portion of the mounting member.
[Additional note 21]
The mounting device according to any one of Supplementary Notes 1 to 20, wherein the connecting member extends along a direction intersecting the supporting direction.
[Additional note 22]
The mounting device according to any one of Supplementary Notes 1 to 21, wherein the connecting member includes a plate-shaped or elongated member.
[Additional note 23]
23. The mounting device according to any one of Supplementary Notes 1 to 22, wherein at least a portion of the mounting member and at least a portion of the moving member are adjacent to each other along the support direction.
[Additional note 24]
The mounting device according to any one of Supplementary Notes 1 to 23, wherein the mounting member and the moving member are arranged at different positions with respect to the support direction.
[Additional note 25]
25. The mounting device according to any one of Supplementary Notes 1 to 24, wherein at least a portion of the mounting member and at least a portion of the moving member are arranged at the same position in a direction intersecting the support direction.
[Additional note 26]
26. The mounting device according to any one of Supplementary Notes 1 to 25, wherein at least a portion of the mounting member faces at least a portion of the moving member along the support direction.
[Additional note 27]
The connecting member connects one part of the movable member and another part of the mounting member whose position in a direction intersecting the support direction is different from that of the one part. The mounting device according to item 1.
[Additional note 28]
The support direction is a vertical direction,
28. The mounting device according to any one of Supplementary Notes 1 to 27, wherein at least a portion of the mounting member is located above at least a portion of the moving member.
[Additional note 29]
The mounting device according to attachment 28, wherein the connecting member connects the moving member and the mounting member through a space below at least a portion of the mounting member.
[Additional note 30]
The mounting device according to appendix 28 or 29, wherein at least a portion of the connecting member is arranged in a space below at least a portion of the mounting member.
[Additional note 31]
31. The mounting device according to Supplementary Notes 1 to 30, wherein the mounting member and the moving member are arranged at different positions in a direction intersecting the support direction.
[Additional note 32]
The support direction is a vertical direction,
The mounting device according to any one of Supplementary Notes 1 to 31, wherein the mounting member is located on a side of the moving member.
[Additional note 33]
The mounting device according to attachment 32, wherein the connecting member connects the moving member and the mounting member via a space on at least a part of the side of the mounting member.
[Additional note 34]
The mounting device according to appendix 32 or 33, wherein at least a portion of the connecting member is arranged in a space to the side of at least a portion of the mounting member.
[Additional note 35]
The mounting member is movable along the movement direction in accordance with movement of the moving member connected to the mounting member via the connection member. Mounting device.
[Appendix 36]
Any of Supplementary Notes 1 to 35, wherein the supporting member that supports the mounting member is movable along the moving direction as the moving member connected to the mounting member via the connecting member moves. The mounting device according to item (1).
[Additional note 37]
The mounting device according to attachment 36, wherein the moving device is arranged at a position where it does not interfere with movement of the support member.
[Appendix 38]
The support member moves while facing the opposing member,
The mounting device according to attachment 37, wherein at least a portion of the moving device is embedded in the opposing member so as not to protrude from the surface of the opposing member in a direction intersecting the moving direction.
[Additional note 39]
The moving device includes a first extending member extending along a first moving direction intersecting the supporting direction, and a first moving member movable along the first extending member. a second extending member extending along a second moving direction intersecting the first moving direction and connected to the first moving member; and a second extending member moving along the second moving member. a second moving member capable of moving and connected to the mounting member by the connecting member;
39. The mounting device according to attachment 38, wherein the first extending member is embedded in the opposing member so as not to protrude from the surface of the opposing member in a direction intersecting the moving direction.
[Additional note 40]
The support member moves while facing the opposing member,
The mounting device according to attachment 37, wherein at least a portion of the moving device is disposed at a position away from the surface of the opposing member in a direction intersecting the moving direction.
[Additional note 41]
The mounting member has an internal space formed therein;
The mounting device according to attachment 40, wherein at least a portion of the moving device is arranged in the internal space.
[Additional note 42]
The mounting member has an internal space formed therein;
The object mounting device according to attachment 40 or 41, wherein the moving member is movable in the internal space.
[Additional note 43]
The moving device includes a first extending member extending along a first moving direction intersecting the supporting direction, and a first moving member movable along the first extending member. a second extending member extending along a second moving direction intersecting the first moving direction and connected to the first moving member; and a second extending member moving along the second moving member. a second moving member capable of moving and connected to the mounting member by the connecting member;
At least a portion of the first and second extending members are arranged in the internal space,
The mounting device according to any one of appendices 40 to 42, wherein at least a portion of the first and second moving members are movable in the internal space.
[Additional note 44]
The mounting member has an opening connected to the internal space,
The mounting device according to attachment 43, wherein at least one of the first and second extending members can extend from the internal space to a space outside the mounting member through the opening.
[Additional note 45]
The mounting member includes a first outer surface that can face the surface of the opposing member, and a second outer surface that is different from the first outer surface,
the support member is disposed on the first outer surface,
The mounting device according to any one of appendices 40 to 44, wherein the object is mounted on the second outer surface.
[Additional note 46]
The mounting device according to any one of Supplementary Notes 1 to 45, further comprising a peripheral member surrounding at least a portion of the moving device.
[Additional note 47]
47. The mounting device according to attachment 46, wherein the peripheral member reduces adhesion of substances to at least a portion of the moving device.
[Additional note 48]
The mounting device according to attachment 46 or 47, wherein the peripheral member reduces intrusion of substances into at least a portion of the space in which the moving member moves.
[Additional note 49]
The moving device includes an extending member extending along the moving direction, and the moving member movable along the extending member,
The mounting device according to any one of appendices 46 to 48, wherein the peripheral member surrounds at least a portion of the extension member.
[Additional note 50]
The moving device includes an extending member extending along the moving direction, and the moving member movable along the extending member,
50. The mounting device according to any one of Supplementary Notes 1 to 49, further comprising a peripheral member surrounding at least a portion of the extending member.
[Additional note 51]
The mounting device according to attachment 49 or 50, wherein the peripheral member reduces adhesion of substances to at least a portion of the elongated member.
[Additional note 52]
The mounting device according to any one of appendices 49 to 51, wherein the peripheral member reduces intrusion of substances into at least a portion of the space in which the extension member exists.
[Additional note 53]
The mounting device according to appendix 47, 48, 51, or 52, wherein the substance includes a substance generated during processing of the object.
[Additional note 54]
The mounting device according to any one of appendices 46 to 53, wherein an opening is formed in the peripheral member.
[Additional note 55]
55. The mounting device according to attachment 54, wherein the connecting member extends from a space surrounded by the peripheral member to a space outside the peripheral member through the opening.
[Additional note 56]
56. The mounting device according to any one of Supplementary Notes 1 to 55, wherein the support member supports the mounting member so as to maintain a relative position between the reference plane and the mounting member in the support direction.
[Additional note 57]
57. The mounting device according to any one of Supplementary Notes 1 to 56, wherein the support member supports the mounting member in a non-contact state with respect to the reference surface.
[Additional note 58]
The mounting device according to attachment 57, wherein the support member is arranged on the mounting member.
[Additional note 59]
The mounting according to attachment 57 or 58, wherein the support member supports the mounting member by forming a gas film between the supporting member and the reference surface and floating the mounting member with respect to the reference surface. Device.
[Additional note 60]
The support member faces the opposing member,
The mounting device according to any one of Supplementary Notes 56 to 59, wherein the reference plane includes a surface of the opposing member.
[Additional note 61]
The object mounting device according to any one of claims 1 to 60, comprising a plurality of the connecting members.
[Additional note 62]
The mounting device according to any one of Supplementary Notes 1 to 61, wherein the support member includes an air bearing.
[Additional note 63]
The mounting device according to any one of Supplementary Notes 1 to 62, including a plurality of the connecting members.
[Additional note 64]
The mounting device according to any one of Supplementary Notes 1 to 63, wherein the supporting direction is a vertical direction.
[Additional note 65]
65. The mounting device according to any one of Supplementary Notes 1 to 64, wherein the moving direction is a direction along a horizontal plane.
[Additional note 66]
The mounting device according to any one of Supplementary Notes 1 to 65;
A processing system comprising: a processing device that processes the object;
[Additional note 67]
A processing method for processing the object placed on the mounting device according to any one of Supplementary Notes 1 to 65.
[Additional note 68]
a first member having a first surface;
a mounting device having a second member spaced apart from the first surface in a first direction;
a moving device that moves the second member on the first surface;
a processing device that processes the object by irradiating the object with an energy beam;
and a measuring device that measures the object,
The mounting device includes a floating member that is provided on the second member and floats the second member above the first surface,
The moving device moves the second member floated on the first surface by the floating member in a direction intersecting the first direction,
At least one of the processing device and the measuring device is provided in the second member. Processing system.
[Additional note 69]
The processing system according to attachment 68, wherein the processing device includes an irradiation optical device that irradiates the object with the energy beam.
[Additional note 70]
The processing system according to attachment 68 or 69, further comprising a measuring device that measures a part of the object processed by the processing device.
[Additional note 71]
The processing system according to attachment 70, wherein the measuring device measures the position of the surface of the object with respect to the first direction.
[Additional note 72]
The processing system according to attachment 71, wherein the measuring device measures at multiple locations within a plane parallel to the first surface.
[Additional note 73]
The moving device has a moving member,
the second member and the moving member are connected by a connecting member;
The moving device moves the second member on the first surface in a direction intersecting the first direction by moving the moving member. processing system.
[Additional note 74]
The second member moves on the first surface in a direction intersecting the first direction, using the first surface as a guide surface,
The processing system according to attachment 73, wherein the moving member moves on a guide member different from the first member.
[Additional note 75]
The processing system according to attachment 73 or 74, wherein the moving device does not control the position of the moving member in the first direction.
[Additional note 76]
The processing system according to any one of attachments 73 to 75, wherein the rigidity of the connecting member in the first direction is lower than the rigidity in a direction intersecting the first direction.
[Additional note 77]
The floating member forms a gas bearing between the floating member and the first surface,
The processing system according to any one of appendices 73 to 76, wherein the connection member and the gas bearing maintain the positional relationship between the second member and the first surface.

At least some of the constituent features of each of the above-described embodiments can be combined as appropriate with at least some of the other constituent features of each of the above-described embodiments. Some of the constituent elements of each embodiment described above may not be used. In addition, to the extent permitted by law, the disclosures of all publications and US patents cited in each of the above-mentioned embodiments are incorporated into the description of the main text.

The present invention is not limited to the embodiments described above, and can be modified as appropriate within the scope of the claims and the overall spirit or idea of the invention as can be seen from the entire specification. , a mounting device, a processing system, and a processing method are also included in the technical scope of the present invention.

SYS Processing system 1 Processing device 2 Measuring device 3 Stage device 32 Stage 31 Surface plate 32 Stage 33 Stage drive system 33X X stage drive system 331X X rail member 332X X slide member 33Y Y stage drive system 331Y Y rail member 332Y Y slide member 34 Connecting member 35 Air bearing 36 Mounting member 4 Housing 7 Control device W Work EL Processing light

Claims (28)

a first member having a first surface;
a second member that is movable within at least a second surface that is spaced from the first surface in a first direction;
a floating member provided on the second member and floating the second member above the first surface;
a moving device including an actuator that moves a moving member along a guide extending in a second direction intersecting the first direction;
a connecting member connecting the moving member and the second member;
The rigidity of the connecting member in the first direction is lower than the rigidity in a direction parallel to the second surface,
The moving member moves in the second direction while contacting the guide.
Mobile device. a first member having a first surface;
a second member that is movable within at least a second surface that is spaced from the first surface in a first direction;
a floating member provided on the second member and floating the second member above the first surface;
a moving device including an actuator that moves a moving member along a guide extending in a second direction intersecting the first direction;
a connecting member connecting the moving member and the second member;
Equipped with
The rigidity of the connecting member in the first direction is lower than the rigidity in a direction parallel to the second surface,
A first portion of the connecting member connected to the second member and a second portion of the connecting member connected to the movable member are movable separately in the first direction. a first member having a first surface;
a second member that is movable within at least a second surface that is spaced from the first surface in a first direction;
a floating member provided on the second member and floating the second member above the first surface;
a moving device including an actuator that moves a moving member along a guide extending in a second direction intersecting the first direction;
a connecting member connecting the moving member and the second member;
Equipped with
The rigidity of the connecting member in the first direction is lower than the rigidity in a direction parallel to the second surface,
The movable body device is configured such that the movable member is displaced in the first direction when moving in the second direction. The movable body device according to any one of claims 1 to 3 , wherein the connecting member includes a plate-like member extending along the second surface or a plane parallel to the second surface. The mobile device according to any one of claims 1 to 4 , wherein the connecting member includes an elastic member that is an elastic body. The mobile device is a first mobile device,
The moving member is a first moving member,
Further comprising a second moving device having a second moving member that moves in a third direction intersecting the first and second directions.
The mobile device according to any one of claims 1 to 5 . The first moving device has a longitudinal direction in the second direction,
The mobile device according to claim 6 , wherein the second moving device has a longitudinal direction in the third direction. The moving body device according to claim 6 or 7 , wherein the first moving device is located on the second moving device. The movable body device according to any one of claims 6 to 8 , wherein the second moving device is arranged on the first member. The mobile device according to any one of claims 6 to 9 , wherein the first and second moving devices are arranged between the first and second members. The second member includes a portion facing toward the first surface of the first member and away from the first surface,
The movable body device according to any one of claims 6 to 10 , wherein the first and second moving devices are arranged between the portion of the second member and the first surface. The floating member includes a first floating member and a second floating member,
The mobile device according to any one of claims 6 to 11 , wherein the second moving device is arranged between the first and second floating members. The floating member further includes a third floating member,
The mobile device according to any one of claims 6 to 12 , wherein the first moving device is arranged between the first and third floating members. The mobile device according to any one of claims 1 to 13 , wherein the connecting member is arranged between the second member and the first surface. The moving body device according to any one of claims 1 to 14 , wherein the moving device is arranged between the first and second members. The second member includes a portion facing toward the first surface of the first member and away from the first surface,
The moving body device according to any one of claims 1 to 15 , wherein the moving device is arranged between the portion of the second member and the first surface. The floating member includes a first floating member and a second floating member,
The moving body device according to any one of claims 1 to 16 , wherein the moving device is arranged between the first and second floating members. A mobile device according to any one of claims 1 to 17 ,
A processing system comprising: a processing device that processes an object placed on the second member of the mobile device. The processing device processes the object by irradiating the object with an energy beam,
Processing a first region on the object by moving the irradiation position of the energy beam on the object placed on the second member while the moving member is stationary;
After the processing of the first region is completed, the second member is moved on the first surface in a direction intersecting the first direction by movement of the moving member,
After the movable member is moved, a second region on the object is processed by moving the irradiation position of the energy beam on the object placed on the second member while the movable member is kept stationary. The processing system according to claim 18 . measuring the object placed on the second member with the measuring device;
After measuring the object, moving the second member on the first surface by moving the moving member in a direction intersecting the first direction,
The processing system according to claim 18 or 19 , wherein the processing device processes the object based on the measurement result of the measurement device after the moving member moves. The second member moves on the first surface in a direction intersecting the first direction, using the first surface as a guide surface,
The processing system according to any one of claims 18 to 20 , wherein the moving member moves on a guide member different from the first member. The processing system according to any one of claims 18 to 21 , wherein the moving device does not control the position of the moving member in the first direction. The floating member forms a gas bearing between the floating member and the first surface,
The processing system according to any one of claims 18 to 22 , wherein the connecting member and the gas bearing maintain a positional relationship between the second member and the first surface. The processing device processes the object by irradiating the object with an energy beam,
The processing system according to any one of claims 18 to 23 , wherein the processing device includes an irradiation optical device that irradiates the object with the energy beam. The processing system according to any one of claims 18 to 24 , wherein the object is placed on the second member without applying any external force. The processing system according to any one of claims 18 to 25 , further comprising a measuring device that measures a part of the object processed by the processing device. The processing system according to claim 26 , wherein the measuring device measures the position of the surface of the object with respect to the first direction. The processing system according to claim 27 , wherein the measuring device measures at multiple locations within a plane parallel to the first surface.

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