KR20230002363A - Laser processing head and laser processing device - Google Patents

Abstract

The laser processing head includes a first wall portion and a second wall portion opposed to each other in a first direction, a third wall portion and a fourth wall portion opposed to each other in a second direction perpendicular to the first direction, and a first and second wall portion opposed to each other in the first direction. A housing having a fifth wall portion and a sixth wall portion opposed to each other in a third direction perpendicular to the two directions, an incident portion disposed on the first wall portion or the fifth wall portion and inputting a laser beam into the housing, disposed within the housing and a laser beam adjustment unit for adjusting the laser beam incident from the incident unit, and a condensing unit disposed on the sixth wall and condensing the laser beam adjusted by the laser beam adjustment unit and emitting it out of the housing, the laser beam adjustment unit comprising: It has an optical axis adjustment unit for adjusting the optical axis of the laser beam incident from the incident unit, the incident unit is biased toward the first wall in the first direction, and the condensing unit is biased toward the second wall in the first direction.

Description

Laser processing head and laser processing device

The present disclosure relates to a laser processing head and a laser processing apparatus.

Patent Document 1 describes a laser processing apparatus including a holding mechanism for holding a workpiece and a laser irradiation mechanism for irradiating a laser beam to the workpiece held in the holding mechanism. In the laser processing apparatus described in Patent Literature 1, a laser irradiation mechanism having a condensing lens is fixed to a base, and a workpiece is moved along a direction perpendicular to an optical axis of the condensing lens by a holding mechanism.

Patent Document 1: Japanese Patent Publication No. 5456510

In the laser processing device described in Patent Document 1, since each component on the optical path of the laser beam from the laser oscillator to the condensing lens is arranged in the housing, it is difficult to move the condensing lens along the direction perpendicular to the optical axis of the condensing lens. In order to realize the movement of such a condensing lens, it is conceivable to miniaturize the housing by arranging a laser oscillator outside the housing, and to attach the housing provided with the condensing lens to a moving mechanism. However, in that case, it is difficult to maintain a state in which the optical axis of the laser beam incident on the condensing lens coincides with the optical axis of the condensing lens.

An object of the present disclosure is to provide a laser processing head capable of condensing laser light with high precision, and a laser processing apparatus including such a laser processing head.

The laser processing head of one aspect of the present disclosure includes a first wall portion and a second wall portion opposing each other in a first direction, a third wall portion and a fourth wall portion opposing each other in a second direction perpendicular to the first direction, and , a housing having a fifth wall portion and a sixth wall portion opposed to each other in a third direction perpendicular to the first and second directions, disposed on the first wall portion or the fifth wall portion, and entering the laser beam into the housing A laser beam adjustment unit disposed in the housing to adjust the laser beam incident from the incident unit, and a light collecting unit disposed on the sixth wall to condense the laser beam adjusted by the laser beam adjustment unit and emit it out of the housing. The laser beam adjustment unit has an optical axis adjustment unit for adjusting the optical axis of the laser light incident from the incident unit, the incident unit is biased toward the first wall in the first direction, and the light collecting unit is biased toward the second wall in the first direction. .

In this laser processing head, an optical axis adjusting unit for adjusting the optical axis of the laser light incident from the incident unit is disposed on the optical path of the laser beam from the incident unit to the condensing unit. By this, for example, when the exit end of an optical fiber for guiding the laser light from a light source that outputs the laser light is connected to the incident part, the optical axis of the laser light incident on the light collecting part can be aligned with the optical axis of the light collecting part. can Further, the incident portion is biased toward the first wall portion of the housing in the first direction, and the light collecting portion is biased toward the second wall portion of the housing in the first direction. This can suppress the optical path of the laser light from the incident part to the optical axis adjustment part from lengthening, and as a result, the deviation of the optical axis of the laser light incident on the light condensing part from the optical axis of the light condensing part can be suppressed. Therefore, according to this laser processing head, a laser beam can be condensed with high precision.

In the laser processing head of one aspect of the present disclosure, the incident unit is disposed on the fifth wall, and the laser light adjustment unit includes a first reflector, an attenuator, a beam expander, a second reflector, a reflective spatial light modulator, and an imaging optical system. Further, the first reflector reflects the laser light incident from the incident part toward the second wall, the attenuator adjusts the output of the laser light reflected from the first reflector, and the optical axis adjuster adjusts the output by the attenuator. The laser beam is reflected toward the sixth wall, the beam expander expands the diameter of the laser beam reflected by the optical axis adjustment unit, and the second reflector reflects the laser beam whose diameter is enlarged by the beam expander toward the first and fifth walls. The reflective spatial light modulator modulates the laser light reflected from the second reflector and reflects it toward the sixth wall, and in the imaging optical system, the reflective surface of the reflective spatial light modulator and the incident pupil surface of the condensing unit form an image. A telecentric optical system on both sides of the relationship may be configured. According to this, since the optical axis of the laser light incident on the "beam expander, the second reflector, the reflective spatial light modulator, the imaging optical system, and the condensing unit", which are components related to the shaping of the laser light, can be adjusted, the laser light can be produced with higher precision. can concentrate Further, since the attenuator is disposed between the first reflector and the optical axis adjusting unit, an increase in size of the housing due to the application of the attenuator can be suppressed.

In the laser processing head of one aspect of the present disclosure, the incident part is disposed on the fifth wall, and the laser light adjusting part includes an attenuator, a first reflector, a beam expander, a second reflector, a reflective spatial light modulator, and an imaging optical system. Further, the optical axis adjustment unit reflects the laser light incident from the incident unit to the second wall side, the attenuator adjusts the output of the laser light reflected from the optical axis adjustment unit, and the first reflection unit reflects the laser light whose output is adjusted by the attenuator. is reflected toward the sixth wall, the beam expander expands the diameter of the laser light reflected by the first reflector, and the second reflector reflects the laser light whose diameter is enlarged by the beam expander toward the first and fifth walls. The reflective spatial light modulator modulates the laser light reflected from the second reflector and reflects it toward the sixth wall, and the imaging optical system includes both sides where the reflective surface of the reflective spatial light modulator and the incident pupil plane of the condensing unit are in an imaging relationship. A telecentric optical system may be constituted. According to this, since the optical axis of the laser light incident on the "beam expander, the second reflector, the reflective spatial light modulator, the imaging optical system, and the condensing unit", which are components related to the shaping of the laser light, can be adjusted, the laser light can be produced with higher precision. can concentrate Further, since the attenuator is disposed between the optical axis adjusting unit and the first reflecting unit, an increase in size of the housing due to the application of the attenuator can be suppressed.

In the laser processing head of one aspect of the present disclosure, the incident part is disposed on the first wall, and the laser light adjustment part further has an attenuator, a beam expander, a reflector, a reflective spatial light modulator, and an imaging optical system, and the attenuator is incident adjusts the output of the laser beam incident from the unit, the optical axis adjustment unit reflects the laser beam whose output is adjusted by the attenuator toward the sixth wall, the beam expander expands the diameter of the laser beam reflected from the optical axis adjustment unit, and the reflector The laser beam whose diameter is enlarged by the expander is reflected toward the first wall and toward the fifth wall, the reflective spatial light modulator modulates the laser beam reflected from the reflector and reflects it toward the sixth wall, and the imaging optical system is a reflective type. A bilateral telecentric optical system may be constructed in which the reflection surface of the spatial light modulator and the entrance pupil plane of the condensing unit are in an image-forming relationship. According to this, since the optical axis of the laser light entering the "beam expander, reflector, reflective spatial light modulator, imaging optical system, and condensing unit", which are components related to laser light shaping, can be adjusted, the laser light can be condensed with higher precision. can In addition, since the attenuator is disposed between the incident part and the optical axis adjustment part, an increase in size of the housing due to the application of the attenuator can be suppressed.

In the laser processing head of one aspect of the present disclosure, the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion, and the housing includes the first wall portion, the second wall portion, the third wall portion, and the second wall portion. The housing is configured to be mounted on the mounting portion in a state where at least one of the five wall portions is disposed on the mounting portion side of the laser processing device, and the incident portion and the light collecting portion may be biased toward the fourth wall portion in the second direction. According to this, in the case where the housing is moved along the second direction (direction perpendicular to the optical axis of the light condensing part) in which the third and fourth walls face each other, for example, another configuration exists on the side of the fourth wall. Even if this is done, the light collector can be brought closer to the other configuration. Further, since the distance between the third and fourth walls is smaller than the distance between the first and second walls, when the third and fourth walls move the housing along the second direction opposite to each other, The space occupied by the housing can be reduced. In addition, since the incident part and the condensing part are biased towards the fourth wall in the second direction, the area can be effectively used, such as disposing a different configuration in the area on the third wall side with respect to the laser beam adjusting unit among the areas in the housing. there is.

The laser processing head of one aspect of the present disclosure may further include a circuit portion arranged on the third wall portion side with respect to the laser beam adjusting portion in the housing. According to this, the area|region on the side of a 3rd wall part can be used effectively with respect to a laser beam adjustment part among the area|region in a housing.

In the laser processing head of one aspect of the present disclosure, a partition wall portion is provided in the housing to divide a region in the housing into a region on the third wall side and a region on the fourth wall side, and the laser beam adjusting unit is in the housing, and is a partition wall portion. , and the circuit portion may be disposed on the third wall side with respect to the partition wall portion in the housing. According to this, since the heat generated in the circuit part is difficult to be transmitted to the laser light adjusting part, deformation of the laser light adjusting part due to the heat generated in the circuit part can be suppressed, and the laser light can be appropriately adjusted. Further, the circuit portion can be efficiently cooled in the area on the third wall portion side among the areas within the housing by, for example, air cooling or water cooling.

In the laser processing head of one aspect of the present disclosure, the laser beam adjusting unit may be attached to the partition wall portion. According to this, the laser beam adjusting part can be reliably and stably supported in the housing.

In the laser processing head of one aspect of the present disclosure, the circuit unit may be separated from the partition wall unit. According to this, it is possible to more reliably suppress heat generated in the circuit portion from being transmitted to the laser beam adjusting portion through the partition wall portion.

A laser processing head according to one aspect of the present disclosure includes a measurement unit that outputs measurement light for measuring the distance between the surface of an object and the light concentrating unit, and detects the measurement light reflected from the surface of the object via the light condensing unit; A dichroic mirror that reflects the measurement light and transmits the laser light is further provided, the circuit unit processes the signal output from the measurement unit, and the dichroic mirror is connected to the laser beam adjusting unit and the light collecting unit in the housing. It may be arrange|positioned in between. According to this, processing based on the measurement result of the distance between the surface of the object and the light concentrating portion can be performed in the laser processing apparatus while effectively using the area within the housing.

In the laser processing head of one aspect of the present disclosure, the measurement unit may be disposed on the first wall side with respect to the light collecting unit in the housing. According to this, processing based on the measurement result of the distance between the surface of the object and the light concentrating portion can be performed in the laser processing device while using the area within the housing more effectively.

The laser processing head of one aspect of the present disclosure further includes an observation unit for outputting observation light for observing the surface of an object and detecting the observation light reflected from the surface of the object through the light collecting unit, and the observation unit includes a housing. Inside, you may arrange|position on the 1st wall part side with respect to the light collecting part. According to this, it is possible to perform processing based on the observation result of the surface of the object in the laser processing apparatus while effectively using the area within the housing.

The laser processing head of one aspect of the present disclosure may further include a drive unit for moving the light collecting unit along the third direction, and the circuit unit may control the drive unit based on a signal output from the measurement unit. According to this, the position of the light condensing point of the laser beam can be adjusted based on the measurement result of the distance between the surface of the object and the light condensing part.

The laser processing apparatus of one aspect of the present disclosure includes a first laser processing head and a second laser processing head, which are the laser processing heads, a first mounting portion to which a housing of the first laser processing head is mounted, and a second laser processing head. A second mounting portion to which a housing is attached, a light source unit outputting a laser beam incident to the incident portion of the first laser processing head and the incident portion of the second laser processing head, respectively, and a support portion supporting an object, comprising: a first Each of the mounting portion and the second mounting portion moves along the second direction, and the first housing, which is a housing of the first laser processing head, has a fourth wall portion of the first housing relative to a third wall portion of the first housing of the second laser processing head. The second housing, which is a housing of the second laser processing head and is mounted on the first mounting portion, is located on the side of the first housing and is located on the support side with respect to the fifth wall portion of the first housing. The fourth wall of the second housing is located on the side of the first laser processing head with respect to the third wall of the second housing, and the sixth wall of the second housing is located on the side of the support with respect to the fifth wall of the second housing. is fitted

In this laser processing device, since laser beams are condensed with high precision by each of the first laser processing head and the second laser processing head, the object can be processed efficiently and with high accuracy.

In the laser processing device of one aspect of the present disclosure, each of the first mounting portion and the second mounting portion may move along the third direction. According to this, the object can be processed more efficiently.

In the laser processing apparatus of one aspect of the present disclosure, the support portion may move along the first direction and rotate with an axis parallel to the third direction as the center line. According to this, the object can be processed more efficiently.

The laser processing apparatus of one aspect of the present disclosure includes the laser processing head, a mounting portion in which a housing of the laser processing head is mounted, a light source unit outputting a laser beam incident to an incident portion of the laser processing head, and supporting an object. A support portion is provided, and the mounting portion moves along the second direction.

In this laser processing device, since the laser beam is precisely focused by the laser processing head, the object can be processed with high accuracy.

In the laser processing device of one aspect of the present disclosure, the mounting portion may move along the third direction. According to this, an object can be processed efficiently.

In the laser processing apparatus of one aspect of the present disclosure, the support portion may move along the first direction and rotate with an axis parallel to the third direction as the center line. According to this, an object can be processed efficiently.

According to the present disclosure, it becomes possible to provide a laser processing head capable of condensing a laser beam with high precision, and a laser processing apparatus provided with such a laser processing head.

1 is a perspective view of a laser processing apparatus according to an embodiment.
Fig. 2 is a front view of a part of the laser processing apparatus shown in Fig. 1;
FIG. 3 is a front view of a laser processing head of the laser processing apparatus shown in FIG. 1 .
Fig. 4 is a side view of the laser processing head shown in Fig. 3;
FIG. 5 is a configuration diagram of an optical system of the laser processing head shown in FIG. 3 .
6 is a configuration diagram of an optical system of a laser processing head of a modified example.
7 is a configuration diagram of an optical system of a laser processing head of a modified example.
8 is a perspective view of a laser processing device of a modified example.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this indication is described in detail with reference to drawings. In addition, in each drawing, the same code|symbol is attached|subjected to the same or equivalent part, and overlapping description is abbreviate|omitted.

[Configuration of laser processing equipment]

As shown in FIG. 1, the laser processing apparatus 1 includes a plurality of moving mechanisms 5 and 6, a support portion 7, and a pair of laser processing heads (a first laser processing head and a second laser processing head). 10A, 10B, a light source unit 8, and a control unit 9 are provided. Hereinafter, a first direction is referred to as an X direction, a second direction perpendicular to the first direction is referred to as a Y direction, and a third direction perpendicular to the first and second directions is referred to as a Z direction. In this embodiment, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction.

The moving mechanism 5 has a fixed part 51, a moving part 53, and a mounting part 55. The fixing part 51 is attached to the device frame 1a. The moving part 53 is mounted on a rail provided on the fixing part 51 and can move along the Y direction. The mounting portion 55 is mounted on a rail provided in the moving portion 53 and is movable along the X direction.

The moving mechanism 6 includes a fixed part 61, a pair of moving parts (a first moving part and a second moving part) 63 and 64, and a pair of attaching parts (first attaching part and second attaching part) ( 65, 66). The fixing part 61 is attached to the device frame 1a. Each of the pair of moving parts 63 and 64 is attached to a rail provided in the fixed part 61, and each can independently move along the Y direction. The mounting portion 65 is mounted on a rail provided in the moving portion 63 and is movable along the Z direction. The mounting portion 66 is mounted on a rail provided in the moving portion 64 and is movable along the Z direction. That is, with respect to the device frame 1a, each of the pair of mounting portions 65 and 66 is movable along each of the Y-direction and the Z-direction.

The support part 7 is attached to the rotation shaft provided in the attachment part 55 of the moving mechanism 5, and can rotate about the axis parallel to the Z direction as a center line. That is, the support part 7 can move along each of the X direction and the Y direction, and can rotate about the axis parallel to the Z direction as a center line. The support part 7 supports the object 100. The object 100 is, for example, a wafer.

As shown in FIGS. 1 and 2 , the laser processing head 10A is attached to the mounting portion 65 of the moving mechanism 6 . The laser processing head 10A irradiates a laser beam (first laser beam) L1 to an object 100 supported by the support section 7 in a state facing the support section 7 in the Z direction. The laser processing head 10B is attached to the mounting portion 66 of the moving mechanism 6 . The laser processing head 10B irradiates a laser beam (second laser beam) L2 to an object 100 supported by the support section 7 in a state facing the support section 7 in the Z direction.

The light source unit 8 has a pair of light sources 81 and 82. A pair of light sources 81 and 82 are mounted on the device frame 1a. The light source 81 outputs the laser light L1. The laser light L1 is emitted from the emitting part 81a of the light source 81 and guided to the laser processing head 10A by the optical fiber 2. The light source 82 outputs the laser light L2. The laser light L2 is emitted from the emitting part 82a of the light source 82, and is guided to the laser processing head 10B by another optical fiber 2.

The controller 9 controls each part of the laser processing apparatus 1 (such as a plurality of moving mechanisms 5 and 6, a pair of laser processing heads 10A and 10B, and the light source unit 8). The control unit 9 is configured as a computer device including a processor, memory, storage and communication device and the like. In the control unit 9, software (programs) read into memory or the like are executed by the processor, and reading and writing of data in the memory and storage and communication by the communication device are controlled by the processor. With this, the control unit 9 realizes various functions.

An example of processing by the laser processing apparatus 1 configured as described above will be described. An example of the processing is an example of forming a modified region inside the object 100 along a plurality of lines set in a lattice shape in order to cut the object 100, which is a wafer, into a plurality of chips.

First, the moving mechanism 5 moves the support portion 7 along each of the X and Y directions so that the support portion 7 supporting the object 100 faces the pair of laser processing heads 10A and 10B in the Z direction ( 7) is moved. Subsequently, the moving mechanism 5 rotates the support 7 with the axis parallel to the Z direction as the center line so that a plurality of lines extending in one direction in the object 100 follow the X direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the converging point of the laser beam L1 is located on one line extending in one direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the converging point of the laser beam L2 is located on another line extending in one direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the convergence point of the laser beam L1 is located inside the object 100 . On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the convergence point of the laser beam L2 is located inside the object 100 .

Next, while the light source 81 outputs the laser beam L1 and the laser processing head 10A irradiates the target object 100 with the laser beam L1, the light source 82 outputs the laser beam L2 And the laser processing head (10B) irradiates the laser light (L2) to the target object (100). At the same time, the light-converging point of the laser light L1 moves relatively along one line extending in one direction and the light-converging point of the laser light L2 moves relatively along the other line extending in one direction. , The moving mechanism 5 moves the support part 7 along the X direction. In this way, the laser processing apparatus 1 forms a modified region inside the object 100 along each of a plurality of lines extending in one direction in the object 100 .

Next, in the object 100, a plurality of lines extending in another direction orthogonal to one direction are along the X direction, so that the moving mechanism 5 uses the axis parallel to the Z direction as the center line to move the support part 7 rotate

Subsequently, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the converging point of the laser beam L1 is located on one line extending in the other direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the converging point of the laser beam L2 is located on another line extending in the other direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the convergence point of the laser beam L1 is located inside the object 100 . On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the convergence point of the laser beam L2 is located inside the target object 100 .

Next, while the light source 81 outputs the laser beam L1 and the laser processing head 10A irradiates the target object 100 with the laser beam L1, the light source 82 outputs the laser beam L2 And the laser processing head (10B) irradiates the laser light (L2) to the target object (100). At the same time, the focal point of the laser beam L1 moves relatively along one line extending in the other direction, and the focal point of the laser beam L2 moves relatively along the other line extending in the other direction. , The moving mechanism 5 moves the support part 7 along the X direction. In this way, the laser processing apparatus 1 forms a modified region inside the object 100 along each of a plurality of lines extending in another direction orthogonal to one direction in the object 100 .

In an example of the processing described above, the light source 81 outputs the laser light L1 having transparency to the target object 100 by, for example, a pulse oscillation method, and the light source 82, for example, For example, the laser light L2 having transparency to the target object 100 is outputted by the pulse oscillation method. When such a laser beam is condensed inside the target object 100, the laser beam is particularly absorbed in a portion corresponding to the convergence point of the laser beam, and a modified region is formed inside the target object 100. The modified region is a region whose density, refractive index, mechanical strength, and other physical properties are different from those of the surrounding unmodified region. Examples of the modified region include a melted region, a crack region, a dielectric breakdown region, and a refractive index change region.

When the laser light output by the pulse oscillation method is irradiated to the object 100 and the convergence point of the laser light is relatively moved along the line set in the object 100, a plurality of modified spots are formed so as to line up in a row along the line. . One modified spot is formed by irradiation of one pulse of laser light. A modified region in a row is a set of a plurality of modified spots arranged in a row. Modified spots adjacent to each other may be connected to each other or separated from each other depending on the relative movement speed of the convergence point of the laser beam with respect to the object 100 and the repetition frequency of the laser beam.

[Configuration of the laser processing head]

As shown in FIGS. 3 and 4 , the laser processing head 10A includes a housing 11, an incident part 12, a laser beam adjusting part 13, and a condensing part 14.

The housing 11 has a first wall portion 21 and a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26. . The 1st wall part 21 and the 2nd wall part 22 oppose each other in the X direction. The 3rd wall part 23 and the 4th wall part 24 oppose each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 face each other in the Z direction.

The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22 . The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26 . In addition, the distance between the 1st wall part 21 and the 2nd wall part 22 may be the same as the distance between the 5th wall part 25 and the 6th wall part 26, or the 5th wall part 25 and the 6th wall part It may be greater than the distance to (26).

In laser processing head 10A, the 1st wall part 21 is located on the opposite side to the fixed part 61 of the moving mechanism 6, and the 2nd wall part 22 is located on the fixed part 61 side. The 3rd wall part 23 is located on the side of the attachment part 65 of the moving mechanism 6, and the 4th wall part 24 is located on the side opposite to the attachment part 65, and is located on the side of the laser processing head 10B (refer FIG. 2) ). The fifth wall portion 25 is located on the opposite side to the support portion 7, and the sixth wall portion 26 is located on the support portion 7 side.

The housing 11 is configured so that the housing 11 is attached to the mounting portion 65 in a state where the third wall portion 23 is disposed on the side of the mounting portion 65 of the moving mechanism 6 . Specifically, it is as follows. The mounting portion 65 has a base plate 65a and a mounting plate 65b. The base plate 65a is mounted on a rail provided on the moving part 63 (see Fig. 2). Mounting plate 65b is standing upright at the end of the base plate 65a on the side of the laser processing head 10B (see Fig. 2). The housing 11 is attached to the mounting portion 65 by screwing the bolt 28 to the mounting plate 65b via the base 27 while the third wall portion 23 is in contact with the mounting plate 65b. is fitted The base 27 is provided on each of the first wall portion 21 and the second wall portion 22 . The housing 11 is detachable from the mounting portion 65 .

The incident part 12 is disposed on the fifth wall part 25 . The incident part 12 injects the laser light L1 into the housing 11 . The incident portion 12 is biased toward the first wall portion 21 in the X direction and toward the fourth wall portion 24 in the Y direction. That is, the distance between the incident part 12 and the first wall part 21 in the X direction is smaller than the distance between the incident part 12 and the second wall part 22 in the X direction, and the distance between the incident part 12 and the second wall part 22 in the Y direction The distance between the portion 12 and the fourth wall portion 24 is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

The exiting end 2a of the optical fiber 2 is connected to the entrance section 12 . Specifically, the incident portion 12 is a portion including the hole 25a formed in the fifth wall portion 25 . The 5th wall part 25 is provided with the attachment part 25b. To the mounting portion 25b, the main body portion 2b of the exit end portion 2a is attached with bolts or the like. In this state, the tip portion 2c of the exit end portion 2a is inserted into the hole 25a. Thus, the exit end 2a of the optical fiber 2 can be attached or detached from the entrance section 12 . Between the 5th wall part 25 and the body part 2b, the cover 25c is arrange|positioned. The cover 25c covers the gap formed between the hole 25a and the tip portion 2c. As an example, in the output end portion 2a, an isolator for suppressing return light is disposed within the body portion 2b, and a collimator lens for collimating the laser beam L1 is disposed within the tip portion 2c. In addition, the entrance part 12 may be a connector or the like configured so that the exit end 2a of the optical fiber 2 is connectable.

The laser beam adjustment unit 13 is disposed within the housing 11 . The laser beam adjustment unit 13 adjusts the laser beam L1 incident from the incident unit 12 . The laser beam adjustment unit 13 is disposed on the fourth wall portion 24 side with respect to the partition wall portion 29 in the housing 11 . The laser beam adjustment unit 13 is attached to the partition wall unit 29 . The partition wall part 29 is provided in the housing 11, and divides the area|region in the housing 11 into the area|region on the 3rd wall part 23 side, and the area|region on the 4th wall part 24 side. The partition wall portion 29 is constituted as a part of the housing 11 . Each component of the laser beam adjustment unit 13 is attached to the partition wall 29 on the fourth wall 24 side. The partition wall part 29 functions as an optical base supporting each structure of the laser beam adjustment part 13.

The light collecting part 14 is disposed on the sixth wall part 26 . Specifically, the light collecting portion 14 is disposed on the sixth wall portion 26 in a state of being inserted through the hole 26a formed in the sixth wall portion 26 . The condensing unit 14 condenses the laser light L1 adjusted by the laser beam adjusting unit 13 and emits it out of the housing 11 . The light collecting portion 14 is biased toward the second wall portion 22 in the X direction and toward the fourth wall portion 24 in the Y direction. That is, the distance between the light concentrating part 14 and the second wall part 22 in the X direction is smaller than the distance between the light concentrating part 14 and the first wall part 21 in the X direction, and the distance between the light concentrating part 14 and the first wall part 21 in the Y direction is The distance between the miner 14 and the fourth wall portion 24 is smaller than the distance between the light collecting portion 14 and the third wall portion 23 in the X direction.

As shown in FIG. 5 , the laser beam adjusting unit 13 includes a reflecting unit (first reflecting unit) 31 , an attenuator 32 and an optical axis adjusting unit 33 . The reflector 31, the attenuator 32, and the optical axis adjuster 33 are arranged on a first straight line A1 extending along the X direction. The reflection part 31 faces the incident part 12 in the Z direction. That is, the reflector 31 faces the output end 2a of the optical fiber 2 in the Z direction. The reflection part 31 reflects the laser light L1 incident from the incident part 12 toward the second wall part 22 . The reflector 31 is, for example, a mirror or a prism. The attenuator 32 adjusts the output of the laser light L1 reflected by the reflector 31 . The optical axis adjuster 33 reflects the laser beam L1 whose output is adjusted by the attenuator 32 toward the sixth wall portion 26 .

The optical axis adjustment unit 33 is a unit for adjusting the optical axis of the laser beam L1 incident from the incident unit 12 . In this embodiment, the optical axis adjustment unit 33 includes a first steering mirror 331 , a reflection member 332 , and a second steering mirror 333 .

The first steering mirror 331 is disposed on the first straight line A1. The first steering mirror 331 is composed of a mirror 331a and a holder 331b. The mirror 331a is attached to the holder 331b. The holder 331b is attached to the partition wall portion 29. The holder 3331 holds the mirror 331a so that the direction of the mirror 331a can be adjusted. The first steering mirror 331 reflects the laser light L1, the output of which is adjusted by the attenuator 32, toward the sixth wall portion 26.

The reflection member 332 reflects the laser light L1 reflected by the first steering mirror 331 toward the second wall portion 22 . The reflecting member 332 is, for example, a mirror or a prism.

The second steering mirror 333 is disposed on the second straight line A2. The second steering mirror 333 is constituted by a mirror 333a and a holder 333b. The mirror 333a is attached to the holder 333b. The holder 333b is attached to the partition wall portion 29. The holder 333b holds the mirror 333a so that the direction of the mirror 333a can be adjusted. The second steering mirror 333 reflects the laser light L1 reflected by the reflective member 332 toward the sixth wall portion 26 .

As an example, with respect to each holder 331b, 333b, access of a tool is possible through the opening (not shown) with a lid formed in the 2nd wall part 22. Thereby, by operating the tool while viewing an image or the like acquired by the observation unit 17 described later, the optical axis of the laser beam L1 incident on the light collecting unit 14 coincides with the optical axis of the light collecting unit 14, The direction of each mirror 331a, 333a can be adjusted.

The laser beam adjusting unit 13 further includes a beam expander 34 and a reflecting unit (second reflecting unit) 35 . The optical axis adjusting unit 33, the beam expander 34, and the reflecting unit 35 are arranged on a second straight line A2 extending along the Z direction. The beam expander 34 expands the diameter of the laser light L1 reflected by the optical axis adjuster 33 . The reflector 35 reflects the laser light L1 whose diameter has been enlarged by the beam expander 34 toward the first wall portion 21 side and the fifth wall portion 25 side. The reflector 35 is, for example, a mirror or a prism.

The laser light adjustment unit 13 includes a reflective spatial light modulator 36. It further has an imaging optical system 37. The reflective spatial light modulator 36, the imaging optical system 37, and the condensing unit 14 are arranged on a third straight line A3 extending along the Z direction. The reflective spatial light modulator 36 modulates the laser light L1 reflected by the reflector 35 and reflects it toward the sixth wall portion 26 . The reflective spatial light modulator 36 is, for example, a spatial light modulator (SLM) of reflective liquid crystal (LCOS). The imaging optical system 37 constitutes a bilateral telecentric optical system in which the reflection surface 36a of the reflective spatial light modulator 36 and the entrance pupil surface 14a of the condensing unit 14 are in an imaging relationship. The imaging optical system 37 is constituted by three or more lenses.

The 1st straight line A1, the 2nd straight line A2, and the 3rd straight line A3 are located on the plane perpendicular|vertical to the Y direction. The second straight line A2 is located on the side of the second wall portion 22 with respect to the third straight line A3. In the laser processing head 10A, the laser beam L1 incident in the housing 11 from the incident part 12 along the Z direction is reflected by the reflecting part 31 and travels on the first straight line A1. do. The laser beam L1 traveling along the first straight line A1 is reflected by the optical axis adjustment unit 33 and travels along the second straight line A2. The laser light L1 traveling along the second straight line A2 is sequentially reflected by the reflector 35 and the reflective spatial light modulator 36, and travels along the third straight line A3. The laser beam L1 traveling on the third straight line A3 is emitted out of the housing 11 from the condensing unit 14 along the Z direction.

The laser processing head 10A further includes a dichroic mirror 15, a measuring unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19.

The dichroic mirror 15 is disposed between the imaging optical system 37 and the condensing unit 14 on the third straight line A3. That is, the dichroic mirror 15 is disposed between the laser beam adjusting unit 13 and the condensing unit 14 in the housing 11 . The dichroic mirror 15 is attached to the partition wall portion 29 on the fourth wall portion 24 side. The dichroic mirror 15 transmits the laser light L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 is preferably a cube shape or two plate shapes arranged so as to have a torsional relationship, for example.

The measurement part 16 is arrange|positioned on the 1st wall part 21 side with respect to the 3rd straight line A3 in the housing 11. That is, the measurement unit 16 is disposed on the first wall portion 21 side with respect to the light collecting unit 14 in the X direction. The measurement part 16 is attached to the partition wall part 29 on the 4th wall part 24 side. The measurement unit 16 outputs measurement light L10 for measuring the distance between the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident) and the light collecting unit 14, Through the light collecting unit 14, the measurement light L10 reflected from the surface of the object 100 is detected. That is, the measurement light L10 output from the measurement unit 16 is irradiated to the surface of the object 100 via the light collecting unit 14, and the measurement light L10 reflected from the surface of the object 100 is, It is detected by the measuring unit 16 via the light collecting unit 14 .

More specifically, the measurement light L10 output from the measurement unit 16 is directed to the beam splitter 20 attached to the partition wall unit 29 on the side of the fourth wall unit 24, and the dichroic mirror 15 ), and is emitted from the light collecting unit 14 to the outside of the housing 11. The measurement light L10 reflected from the surface of the object 100 is incident into the housing 11 from the condensing unit 14 and is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, and the measurement unit ( 16) and is detected by the measuring unit 16.

The observation part 17 is arranged on the side of the first wall part 21 with respect to the third straight line A3 in the housing 11 . That is, the observation unit 17 is disposed on the first wall portion 21 side with respect to the light collecting unit 14 in the X direction. The observation part 17 is attached to the partition wall part 29 on the 4th wall part 24 side. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (for example, the surface on the side where the laser beam L1 is incident), and passes through the light collecting unit 14, Observation light L20 reflected from the surface of the object 100 is detected. That is, the observation light L20 output from the observation unit 17 is irradiated to the surface of the object 100 via the light collecting unit 14, and the observation light L20 reflected from the surface of the object 100 is It is detected by the observation unit 17 via the miner 14.

More specifically, the observation light L20 output from the observation unit 17 passes through the beam splitter 20, is reflected by the dichroic mirror 15, and exits from the light collecting unit 14 to the outside of the housing 11. do. Observation light L20 reflected from the surface of the object 100 is incident into the housing 11 from the condensing unit 14 and is reflected from the dichroic mirror 15, passing through the beam splitter 20 to observe the unit ( 17) and detected by the observation unit 17. In addition, the respective wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the respective center wavelengths are shifted from each other).

The drive part 18 is attached to the partition wall part 29 on the 4th wall part 24 side. The driving unit 18 moves the light collecting unit 14 disposed on the sixth wall 26 along the Z direction by, for example, a driving force of a piezoelectric element.

The circuit section 19 is arranged on the third wall section 23 side with respect to the partition wall section 29 in the housing 11 . That is, the circuit part 19 is arranged on the third wall part 23 side with respect to the laser beam adjustment part 13, the measuring part 16, and the observation part 17 in the housing 11. The circuit portion 19 is separated from the partition wall portion 29 . The circuit section 19 is, for example, a plurality of circuit boards. The circuit unit 19 processes a signal output from the measuring unit 16 and a signal input to the reflective spatial light modulator 36 . The circuit unit 19 controls the driving unit 18 based on the signal output from the measuring unit 16 . As an example, the circuit unit 19 maintains a constant distance between the surface of the object 100 and the light collecting unit 14 based on the signal output from the measurement unit 16 (ie, the surface of the object 100 and The driving unit 18 is controlled so that the distance from the converging point of the laser light L1 is kept constant.

In addition, in the partition wall portion 29, there is a notch through which wires for electrically connecting each of the measuring unit 16, the observation unit 17, the driving unit 18, and the reflective spatial light modulator 36 and the circuit unit 19 pass. (切欠), holes, etc. (not shown) are formed. Further, the housing 11 is provided with a connector (not shown) to which wires or the like for electrically connecting the circuit portion 19 and the control portion 9 (see Fig. 1) are connected.

Like the laser processing head 10A, the laser processing head 10B includes a housing 11, an incident part 12, a laser beam adjustment unit 13, a condensing unit 14, and a dichroic mirror ( 15), a measurement unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19. However, as shown in Fig. 2, each configuration of the laser processing head 10B passes through the midpoint between the pair of mounting parts 65 and 66 and is perpendicular to the Y-direction in relation to the virtual plane, the laser processing head 10A. ) are arranged so as to have a plane-symmetrical relationship with each configuration.

For example, in the housing (first housing) 11 of the laser processing head 10A, the fourth wall portion 24 is located on the laser processing head 10B side with respect to the third wall portion 23 and is a sixth wall portion. 26 is attached to the mounting portion 65 so as to be located on the side of the support portion 7 with respect to the fifth wall portion 25. On the other hand, in the housing (second housing) 11 of the laser processing head 10B, the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23 and is a sixth wall portion. 26 is attached to the mounting portion 66 so as to be located on the side of the support portion 7 with respect to the fifth wall portion 25.

The housing 11 of the laser processing head 10B is configured so that the housing 11 is attached to the mounting portion 66 in a state where the third wall portion 23 is disposed on the mounting portion 66 side. Specifically, it is as follows. The mounting portion 66 has a base plate 66a and a mounting plate 66b. The base plate 66a is mounted on a rail provided on the moving part 63. The mounting plate 66b is placed upright at the end of the base plate 66a on the side of the laser processing head 10A. The housing 11 of the laser processing head 10B is mounted on the mounting portion 66 with the third wall portion 23 in contact with the mounting plate 66b. The housing 11 of the laser processing head 10B is detachable from the mounting portion 66 .

[action and effect]

In the laser processing head 10A, on the optical path of the laser light L1 from the incident part 12 to the light collecting part 14, for adjusting the optical axis of the laser light L1 incident from the incident part 12 An optical axis adjustment unit 33 is disposed. By this, for example, for maintenance or the like, the exit end 2a of the optical fiber 2 is separated from the housing 11, and the exit end 2a of the optical fiber 2 is removed from the entrance part 12 again. ), the optical axis of the laser beam L1 incident on the condensing part 14 can be aligned with the optical axis of the condensing part 14. Further, the incident portion 12 is biased towards the first wall portion 21 of the housing 11 in the X direction, and the light collecting portion 14 is biased towards the second wall portion 22 of the housing 11 in the X direction. ) is skewed to the side. This makes it possible to suppress the lengthening of the optical path of the laser light L1 from the incident part 12 to the optical axis adjustment part 33, and as a result, the laser light L1 incident on the condensing part 14 It is possible to suppress deviation of the optical axis from the optical axis of the concentrating unit 14 . Therefore, according to the laser processing head 10A, the laser beam L1 can be accurately condensed.

In addition, in the laser processing head 10A, the incident part 12 is disposed on the fifth wall part 25 of the housing 11, and in the laser beam adjusting part 13, the optical axis adjusting part 33 is the reflecting part ( 31) and the rear end of the attenuator 32 (downstream side in the traveling direction of the laser light L1), furthermore, the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system It is disposed at the front end of (37) (on the upstream side in the traveling direction of the laser light L1). It is disposed in front of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37 (on the upstream side in the traveling direction of the laser light L1). As a result, the "beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optical system 37, and condenser 14", which are components related to the shaping of the laser light L1, Since the optical axis of the incident laser light L1 can be adjusted, the laser light L1 can be focused more accurately. In addition, the incident part 12 is disposed on the fifth wall part 25, and in the laser beam adjusting unit 13, the attenuator 32 is disposed between the reflecting unit 31 and the optical axis adjusting unit 33. there is. This makes it possible to suppress the size of the housing 11 due to the application of the attenuator 32 .

Moreover, in the laser processing head 10A, since the light source which outputs the laser beam L1 is not provided in the housing 11, the housing 11 can be downsized. Further, in the housing 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and the sixth wall portion 26 The disposed light concentrating portion 14 is biased towards the fourth wall portion 24 in the Y direction. As a result, when the housing 11 is moved along the Y direction in which the third wall portion 23 and the fourth wall portion 24 oppose each other, for example, another configuration on the fourth wall portion 24 side ( For example, even if the laser processing head 10B) is present, the light concentrating portion 14 can be brought closer to the other configuration. Moreover, since the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, the third wall portion 23 and the fourth wall portion 24 When moving the housing 11 along the mutually opposing Y direction, the space occupied by the housing 11 can be reduced. In addition, since the incident portion 12 and the light condensing portion 14 are biased toward the fourth wall portion 24 in the Y direction, the third wall portion 23 is relative to the laser beam adjusting portion 13 in the area within the housing 11. ) side, the area can be used effectively, such as arranging another configuration (for example, the circuit section 19).

Moreover, in the laser processing head 10A, the circuit part 19 is arrange|positioned on the 3rd wall part 23 side with respect to the laser beam adjustment part 13 in the housing 11. Thereby, the area|region on the side of the 3rd wall part 23 with respect to the laser beam adjusting part 13 of the area|region in the housing 11 can be utilized effectively.

In addition, in the laser processing head 10A, the laser beam adjustment unit 13 is disposed on the side of the fourth wall portion 24 with respect to the partition wall portion 29 in the housing 11, and the circuit portion 19, In the housing 11, it is arrange|positioned on the 3rd wall part 23 side with respect to the partition wall part 29. This makes it difficult for the heat generated in the circuit portion 19 to be transmitted to the laser beam adjusting portion 13, so that deformation of the laser beam adjusting portion 13 due to the heat generated in the circuit portion 19 can be suppressed. , the laser light L1 can be appropriately adjusted. Moreover, the circuit part 19 can be efficiently cooled in the area|region on the side of the 3rd wall part 23 among the area|region in the housing 11 by air cooling, water cooling, etc., for example.

Moreover, in the laser processing head 10A, the laser beam adjustment part 13 is attached to the partition wall part 29. Thereby, the laser beam adjustment part 13 can be reliably and stably supported in the housing 11.

Moreover, in the laser processing head 10A, the circuit part 19 is separated from the partition wall part 29. Thereby, heat generated in the circuit portion 19 can be more reliably suppressed from being transmitted to the laser beam adjusting portion 13 via the partition wall portion 29 .

In addition, in the laser processing head 10A, the measurement unit 16 and the observation unit 17 are arranged in an area on the side of the first wall portion 21 with respect to the light condensing unit 14 among the areas within the housing 11, The circuit section 19 is arranged on the side of the third wall section 23 with respect to the laser beam adjusting section 13 in the area within the housing 11, and the dichroic mirror 15 is located within the housing 11 to generate the laser beam. It is disposed between the adjustment unit 13 and the light collecting unit 14. In this way, the area within the housing 11 can be used effectively. Further, in the laser processing apparatus 1, processing based on the measurement result of the distance between the surface of the object 100 and the light concentrating portion 14 becomes possible. Moreover, in the laser processing apparatus 1, processing based on the observation result of the surface of the object 100 becomes possible.

Moreover, in the laser processing head 10A, the circuit part 19 controls the drive part 18 based on the signal output from the measurement part 16. Thereby, the position of the light condensing point of the laser light L1 can be adjusted based on the measurement result of the distance between the surface of the target object 100 and the light collecting part 14 .

The above actions and effects are similarly achieved by the laser processing head 10B.

In addition, in the laser processing apparatus 1, since the laser beam L1 is precisely focused by the respective laser processing heads 10A and 10B, the object 100 can be processed efficiently and with high accuracy.

Moreover, in the laser processing apparatus 1, each of a pair of mounting parts 65 and 66 moves along each of the Y direction and the Z direction. In this way, the object 100 can be processed more efficiently.

Moreover, in the laser processing apparatus 1, the support part 7 moves along each of the X direction and the Y direction, and rotates about the axis line parallel to the Z direction as a center line. In this way, the object 100 can be processed more efficiently.

[Modified example]

This indication is not limited to the above-mentioned embodiment. For example, in the laser processing head 10A, as shown in FIG. 6 , the incident portion 12 is disposed on the first wall portion 21 of the housing 11, and in the laser beam adjusting portion 13, The optical axis adjuster 33 may be disposed at the rear end of the attenuator 32 and at the front end of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. In the laser processing head 10A shown in FIG. 6 , the incident part 12, the attenuator 32, and the optical axis adjustment unit 33 (specifically, the first steering mirror 331 of the optical axis adjustment unit 33) , It is arrange|positioned on the 1st straight line A1 (others are the same as 10 A of laser processing heads shown in FIG. 5). In the laser processing head 10A shown in FIG. 6 , the attenuator 32 adjusts the output of the laser beam L1 incident from the incident part 12 . According to this, "the beam expander 34, the reflector 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condenser 14", which are components related to the shaping of the laser light L1, Since the optical axis of the incident laser light L1 can be adjusted, the laser light L1 can be focused more accurately. In addition, since the attenuator 32 is disposed between the incident part 12 and the optical axis adjustment part 33, the size of the housing 11 due to the application of the attenuator 32 can be suppressed. In addition, a reduction in height of the laser processing device 1 can be achieved. The above configuration is also applicable to the laser processing head 10B.

In addition, in the laser processing head 10A, as shown in FIG. 7 , the incident part 12 is disposed on the fifth wall part 25 of the housing 11, and in the laser beam adjusting part 13, the optical axis adjusting part 33 may be disposed in front of the attenuator 32, the reflector 31, the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. . In the laser processing head 10A shown in FIG. 7 , the optical axis adjustment unit 33 (specifically, the second steering mirror 333 of the optical axis adjustment unit 33), the attenuator 32, and the reflection unit 31 , disposed on the first straight line A1, the optical axis adjusting unit 33 (specifically, the first steering mirror 331 of the optical axis adjusting unit 33) faces the incident unit 12 in the Z direction, , and the reflector 31 faces the beam expander 34 in the Z direction (the rest is the same as that of the laser processing head 10A shown in FIG. 5 ). In the laser processing head 10A shown in FIG. 7 , the optical axis adjustment unit 33 reflects the laser beam L1 incident from the incident unit 12 toward the second wall portion 22 side of the housing 11, and the attenuator 32 adjusts the output of the laser beam L1 reflected by the optical axis adjustment unit 33, and the reflector 31 transmits the laser beam L1 whose output is adjusted by the attenuator 32 to the housing 11 The beam expander 34 expands the diameter of the laser beam L1 reflected by the reflection section 31. According to this, "the beam expander 34, the reflector 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condenser 14", which are components related to the shaping of the laser light L1, Since the optical axis of the incident laser light L1 can be adjusted, the laser light L1 can be focused more precisely. In addition, since the attenuator 32 is disposed between the optical axis adjusting unit 33 and the reflecting unit 31, the size of the housing 11 due to the application of the attenuator 32 can be suppressed. The above configuration is also applicable to the laser processing head 10B.

In the laser processing head 10A shown in each of FIGS. 5 and 6 , the attenuator 32 may be disposed between the optical axis adjustment unit 33 and the beam expander 34 . In addition, in the laser processing head 10A shown in FIG. 7 , the attenuator 32 may be disposed between the reflecting portion 31 and the beam expander 34 . In addition, in the laser processing head 10A shown in each of FIGS. 5, 6 and 7, the attenuator 32 is located at the rear end of the beam expander 34 (for example, the reflector 35 and the reflective space). between the light modulator 36). Each of the above configurations is also applicable to the laser processing head 10B.

In addition, the optical axis adjustment unit 33 is not limited to having the first steering mirror 331, the reflecting member 332, and the second steering mirror 333. The optical axis adjusting unit 33 should just have a configuration for adjusting the optical axis of the laser beam L1 incident from the incident unit 12 . As an example, the optical axis adjustment unit 33 is a first steering that reflects the laser beam L1 incident from the first wall portion 21 side along the X direction to the first wall portion 21 side and the fifth wall portion 25 side. It may have a mirror 331 and a second steering mirror 333 that reflects the laser beam L1 reflected by the first steering mirror 331 toward the sixth wall portion 26 along the Z direction. Also, each of the first steering mirror 331 and the second steering mirror 333 may be an electric mirror that operates electrically. In that case, the first steering mirror 331 and the second steering mirror 333 may be configured to automatically adjust the direction of each mirror 331a, 333a based on the image acquired by the observation unit 17. .

In addition, in the housing 11, at least one of the first wall portion 21, the second wall portion 22, the third wall portion 23, and the fifth wall portion 25 is the mounting portion 65 of the laser processing apparatus 1 ( Alternatively, the housing 11 may be configured so that the housing 11 is mounted on the mounting portion 65 (or the mounting portion 66) in a state of being disposed on the side of the mounting portion 66.

Further, the circuit unit 19 is not limited to processing the signal output from the measurement unit 16 and/or the signal input to the reflective spatial light modulator 36, and processes any signal from the laser processing head. It should be what you do.

Also, the light source unit 8 may have one light source. In that case, the light source unit 8 should just be structured so that a part of the laser beam output from one light source may be emitted from the emitting part 81a, and the remainder of the laser beam may be radiated from the emitting part 82a.

In addition, the laser processing apparatus 1 is provided with a single laser processing head 10A, and the mounting portion 65 to which the housing 11 of the single laser processing head 10A is mounted is at least along the Y direction. It could be moving. Even in that case, since the laser beam L1 is precisely focused by the laser processing head 10A, the object 100 can be processed with high accuracy. Moreover, in the laser processing apparatus 1 provided with the single laser processing head 10A, when the mounting part 65 moves along the Z direction, the target object 100 can be processed efficiently. Further, in the laser processing apparatus 1 provided with a single laser processing head 10A, when the support portion 7 moves along the X direction and rotates with the axis parallel to the Z direction as the center line, the object ( 100) can be efficiently processed.

Moreover, the laser processing apparatus 1 may be equipped with three or more laser processing heads. 8 is a perspective view of a laser processing apparatus 1 provided with two laser processing heads. The laser processing apparatus 1 shown in FIG. 8 includes a plurality of movement mechanisms 200, 300, and 400, a support portion 7, a pair of laser processing heads 10A and 10B, and a pair of laser processing. Heads 10C and 10D and a light source unit (not shown) are provided.

The moving mechanism 200 moves the support portion 7 along each of the X, Y, and Z directions, and rotates the support portion 7 with an axis parallel to the Z direction as a center line.

The moving mechanism 300 has a fixing part 301 and a pair of attaching parts (a first attaching part and a second attaching part) 305 and 306 . The fixing part 301 is attached to a device frame (not shown). Each of the pair of attachment parts 305 and 306 is attached to a rail provided on the fixing part 301, and each can independently move along the Y direction.

The moving mechanism 400 has a fixing part 401 and a pair of attaching parts (a first attaching part and a second attaching part) 405 and 406 . The fixing part 401 is attached to a device frame (not shown). Each of the pair of attachment parts 405 and 406 is attached to a rail provided on the fixing part 401, and each can independently move along the X direction. In addition, the rails of the fixing part 401 are arranged so as to intersect the rails of the fixing part 301 three-dimensionally.

The laser processing head 10A is attached to the mounting portion 305 of the moving mechanism 300 . The laser processing head 10A irradiates the target object 100 supported by the support portion 7 with a laser beam in a state facing the support portion 7 in the Z direction. A laser beam emitted from the laser processing head 10A is guided by an optical fiber 2 from a light source unit (not shown). The laser processing head 10B is attached to the mounting portion 306 of the moving mechanism 300 . The laser processing head 10B irradiates the target object 100 supported by the support portion 7 with a laser beam in a state facing the support portion 7 in the Z direction. A laser beam emitted from the laser processing head 10B is guided by an optical fiber 2 from a light source unit (not shown).

The laser processing head 10C is attached to the mounting portion 405 of the moving mechanism 400 . The laser processing head 10C irradiates the target object 100 supported by the support portion 7 with a laser beam in a state facing the support portion 7 in the Z direction. A laser beam emitted from the laser processing head 10C is guided by an optical fiber 2 from a light source unit (not shown). The laser processing head 10D is attached to the mounting portion 406 of the moving mechanism 400 . The laser processing head 10D irradiates the target object 100 supported by the support portion 7 with a laser beam in a state facing the support portion 7 in the Z direction. A laser beam emitted from the laser processing head 10D is guided by an optical fiber 2 from a light source unit (not shown).

The configuration of a pair of laser processing heads 10A and 10B in the laser processing apparatus 1 shown in FIG. 8 is a pair of laser processing heads in the laser processing apparatus 1 shown in FIG. 1 ( 10A, 10B) is the same as the configuration. The configuration of a pair of laser processing heads 10C and 10D in the laser processing device 1 shown in FIG. 8 is a pair of laser processing heads in the laser processing device 1 shown in FIG. 1 ( 10A, 10B) is the same as the configuration of a pair of laser processing heads 10A, 10B at the time of rotating 90 degrees with the axis parallel to the Z direction as the center line.

For example, in the housing (first housing) 11 of the laser processing head 10C, the fourth wall portion 24 is located on the laser processing head 10D side with respect to the third wall portion 23, and is also a sixth wall portion. 26 is attached to the mounting portion 65 so as to be located on the side of the support portion 7 with respect to the fifth wall portion 25. In addition, in the housing (second housing) 11 of the laser processing head 10D, the fourth wall portion 24 is located on the laser processing head 10C side with respect to the third wall portion 23, and the sixth wall portion 26 ) is attached to the mounting portion 66 so as to be located on the side of the support portion 7 with respect to the fifth wall portion 25 .

In addition, the laser processing head and laser processing apparatus of the present disclosure are not limited to those for forming a modified region inside the object 100, and may be for performing other laser processing.

Finally, an example of the operation of the laser processing apparatus 1 will be described. An example of the operation of the laser processing device 1 is as follows. It is assumed that the target object 100 is provided with a plurality of lines extending in the X direction and arranged in the Y direction. In such a state, the controller 9 performs a first scan process in which the laser light L1 is scanned in the X direction for one line, and a second scan process in which the laser light L2 is scanned in the X direction for another line. The scan processing is executed so as to overlap in at least a part of the time. In particular, the control unit 9 sequentially executes the first scan process from the line located at one end of the Y direction of the object 100 toward the inner line in the Y direction, while the other end of the Y direction of the object 100 The second scan process can be executed sequentially from the line located in the Y-direction toward the inner line. Thereby, improvement of throughput is aimed at.

An example of the operation of the laser processing device 1 is as follows. In the laser processing apparatus 1, in the 1st state in which the laser processing heads 10A and 10B are arranged on one line, the control part 9 sets the light convergence point of the laser beam L1 in the Z direction. 1st scanning process of scanning the laser beam L1 in the X direction with respect to the one line while positioning it at the 1st position of, and in the 1st state, the convergence point of the laser beam L2 in the Z direction A second scanning process is executed in which the laser beam L2 is scanned in the X direction with respect to the one line while being positioned at the second position (position on the incident surface side rather than the first position). At this time, the controller 9 sets the converging point of the laser beam L2 at a position separated from the converging point of the laser beam L1 by a predetermined distance or more in the direction opposite to the X direction, and performs the first scan process and the second scan process. run The predetermined distance is, for example, 300 μm. This makes it possible to sufficiently propagate a crack from the modified region while improving the throughput.

An example of the operation of the laser processing device 1 is as follows. The control unit 9 performs a first scan process for scanning the laser light L1 in the X direction for one line and a second scan process for scanning the laser light L2 for another line in the X direction, at least In addition to executing overlapping at some time, when only the second scan process is being executed, the area of the object 100 including the processed line is movable together with the laser processing head 10A. Imaging unit Image pickup processing for capturing an image is executed by In the imaging process, light passing through the target object 100 (for example, light in the near-infrared region) is used. In this way, it is possible to check the success of the laser processing non-destructively by using the time during which the first scan processing is not performed.

An example of the operation of the laser processing device 1 is as follows. The laser processing apparatus 1 performs a peeling process to peel a part of the target object 100 . For example, in the peeling process, the laser beams L1 and L2 are irradiated from the laser processing heads 10A and 10B, respectively, while the supporting portion 7 is rotated, and the converging points of the laser beams L1 and L2 are respectively irradiated. By controlling the movement in the horizontal direction, a modified region is formed along the virtual plane inside the object 100 . As a result, part of the object 100 can be peeled off with the modified region spanning the virtual plane as a boundary.

An example of the operation of the laser processing device 1 is as follows. The laser processing apparatus 1 performs a trimming process to remove unnecessary parts in the target object 100 . In the trimming process, for example, while rotating the support unit 7, the light converging point is located at a position along the circumferential edge of the effective area in the object 100, and based on the rotation information of the support unit 7, a laser beam is used. By controlling the start and stop of irradiation of the laser beams L1 and L2 in the processing heads 10A and 10B, a modified region is formed along the periphery of the effective region in the object 100 . As a result, it becomes possible to remove unnecessary parts with the modified region as a boundary, for example, by using a jig or air.

An example of the operation of the laser processing device 1 is as follows. Regarding the object 100 having the functional element layer on the surface side, the functional element layer is irradiated with a laser beam L1 along a line from the back surface of the object 100, and a weakened region is formed in the functional element layer along the line. do. From the back side of the object 100, the inside of the object 100 is irradiated with a laser light L2 having a shorter pulse width than the pulse width of the laser light L1 so as to follow the laser light L1 along a line. . By irradiation of the laser beam L2, a crack reaching the surface of the target object 100 is surely formed along the line using the weakened region.

It is not limited to the material and shape mentioned above, and various materials and shapes can be applied to each structure in the above-mentioned embodiment. In addition, each configuration in one embodiment or modification described above can be arbitrarily applied to each configuration in another embodiment or modification.

One… Laser processing device 7 . . . support
8… Light source unit 10A, 10B, 10C, 10D: laser processing head (first laser processing head, second laser processing head)
11... housing (first housing, second housing) 12 . . . entrance department
13... laser beam adjustment unit 14 . . . collector
14a... 15… dichroic mirror
16... measuring unit 17 . . . observation department
18... driving unit 19 . . . circuit part
21... 1st wall part 22... 2nd wall part
23... 3rd wall part 24... 4th wall
25... 5th wall part 26... 6th wall
29... Partition wall portion 31 . . . Reflection section (first reflection section)
32... Attenuator 33 . . . Optical axis adjuster
34... Beam expander 35)... Reflector (second reflector)
36... reflective spatial light modulator 36a... reflective surface
37... imaging optics
65, 66, 305, 306, 405, 406... Mounting part (first attaching part, second attaching part)

Claims (19)

A first wall portion and a second wall portion opposed to each other in a first direction, a third wall portion and a fourth wall portion opposed to each other in a second direction perpendicular to the first direction, and the first and second directions. A housing having a fifth wall portion and a sixth wall portion opposed to each other in a third direction perpendicular to the housing;
an incident part disposed on the first wall part or the fifth wall part and incident the laser light into the housing;
a laser beam adjustment unit disposed in the housing and configured to adjust the laser beam incident from the incident unit;
a light collecting part disposed on the sixth wall and condensing the laser light adjusted by the laser light adjusting part and radiating out of the housing;
The laser light adjustment unit has an optical axis adjustment unit for adjusting the optical axis of the laser light incident from the incident unit,
The incident portion is biased toward the first wall portion in the first direction,
The laser processing head, wherein the light collecting portion is biased toward the second wall portion in the first direction. The method of claim 1,
The incident part is disposed on the fifth wall part,
The laser light adjustment unit further has a first reflector, an attenuator, a beam expander, a second reflector, a reflective spatial light modulator, and an imaging optical system;
The first reflection part reflects the laser light incident from the incident part toward the second wall part,
The attenuator adjusts the output of the laser light reflected by the first reflector,
The optical axis adjusting unit reflects the laser light whose output is adjusted by the attenuator toward the sixth wall;
The beam expander expands the diameter of the laser light reflected by the optical axis adjusting unit,
The second reflector reflects the laser light whose diameter is enlarged by the beam expander toward the first wall part and the fifth wall part,
the reflective spatial light modulator modulates the laser light reflected from the second reflector and reflects it toward the sixth wall;
wherein the imaging optical system constitutes a bilateral telecentric optical system in which a reflective surface of the reflective spatial light modulator and an incident pupil surface of the light collecting unit are in an imaging relationship. The method of claim 1,
The incident part is disposed on the fifth wall part,
The laser light adjustment unit further has an attenuator, a first reflector, a beam expander, a second reflector, a reflective spatial light modulator, and an imaging optical system;
The optical axis adjustment unit reflects the laser light incident from the incident unit toward the second wall unit,
The attenuator adjusts the output of the laser light reflected by the optical axis adjusting unit,
The first reflector reflects the laser light whose output is adjusted by the attenuator toward the sixth wall;
The beam expander expands the diameter of the laser light reflected by the first reflector,
The second reflector reflects the laser light whose diameter is enlarged by the beam expander toward the first wall part and the fifth wall part,
the reflective spatial light modulator modulates the laser light reflected from the second reflector and reflects it toward the sixth wall;
wherein the imaging optical system constitutes a bilateral telecentric optical system in which a reflective surface of the reflective spatial light modulator and an entrance pupil plane of the light collecting unit are in an imaging relationship. The method of claim 1,
The incident part is disposed on the first wall part,
The laser light adjustment unit further has an attenuator, a beam expander, a reflector, a reflective spatial light modulator, and an imaging optical system;
The attenuator adjusts the output of the laser light incident from the incident part,
The optical axis adjusting unit reflects the laser light whose output is adjusted by the attenuator toward the sixth wall;
The beam expander expands the diameter of the laser light reflected by the optical axis adjusting unit,
The reflector reflects the laser light whose diameter is enlarged by the beam expander toward the first wall part and the fifth wall part,
the reflective spatial light modulator modulates the laser light reflected from the reflector and reflects it toward the sixth wall;
wherein the imaging optical system constitutes a bilateral telecentric optical system in which a reflective surface of the reflective spatial light modulator and an incident pupil plane of the light collecting unit are in an imaging relationship. The method according to any one of claims 1 to 4,
a distance between the third wall portion and the fourth wall portion is smaller than a distance between the first wall portion and the second wall portion;
The housing is configured so that the housing is mounted on the mounting portion in a state where at least one of the first wall portion, the second wall portion, the third wall portion, and the fifth wall portion is disposed on the mounting portion side of the laser processing apparatus,
The laser processing head, wherein the incident portion and the light collecting portion are biased toward the fourth wall portion in the second direction. The method of claim 5,
The laser processing head further includes a circuit portion arranged on a side of the third wall portion with respect to the laser beam adjusting portion in the housing. The method of claim 6,
In the housing, a partition wall portion is provided that divides an area in the housing into an area on the side of the third wall portion and an area on the side of the fourth wall portion;
The laser beam adjustment unit is disposed in the housing on the side of the fourth wall with respect to the partition wall,
The laser processing head, wherein the circuit portion is arranged on a side of the third wall portion with respect to the partition wall portion in the housing. The method of claim 7,
The laser processing head, wherein the laser beam adjustment unit is attached to the partition wall portion. According to claim 7 or claim 8,
The laser processing head, wherein the circuit portion is separated from the partition wall portion. The method according to any one of claims 6 to 9,
a measurement unit configured to output measurement light for measuring a distance between a surface of an object and the light concentrating unit, and to detect the measurement light reflected from the surface of the object via the light concentrating unit;
a dichroic mirror that reflects the measurement light and transmits the laser light;
The circuit unit processes the signal output from the measurement unit,
The laser processing head, wherein the dichroic mirror is disposed between the laser beam adjustment unit and the condensing unit in the housing. The method of claim 10,
The laser processing head, wherein the measurement unit is disposed on a side of the first wall portion with respect to the light collecting unit in the housing. According to claim 10 or claim 11,
Further comprising an observation unit outputting observation light for observing the surface of the object and detecting the observation light reflected from the surface of the object through the light collecting unit;
The laser processing head, wherein the observation unit is disposed on a side of the first wall portion with respect to the light collecting unit in the housing. According to any one of claims 10 to 12,
A driving unit for moving the light concentrating unit in the third direction is further provided;
Wherein the circuit unit controls the driving unit based on the signal output from the measuring unit, the laser processing head. A first laser processing head and a second laser processing head, each of which is a laser processing head according to any one of claims 1 to 13;
A first mounting portion to which the housing of the first laser processing head is mounted;
A second mounting portion to which the housing of the second laser processing head is mounted;
A light source unit outputting the laser light incident on the incident part of the first laser processing head and the incident part of the second laser processing head, respectively;
A support unit for supporting the object is provided;
Each of the first mounting portion and the second mounting portion moves along the second direction;
In the first housing, which is the housing of the first laser processing head, the fourth wall portion of the first housing is located on the side of the second laser processing head with respect to the third wall portion of the first housing, and The sixth wall portion is mounted to the first mounting portion so that the fifth wall portion of the first housing is located on the support portion side;
In the second housing, which is the housing of the second laser processing head, the fourth wall portion of the second housing is located on the side of the first laser processing head with respect to the third wall portion of the second housing, and the second housing The laser processing apparatus, wherein the second attachment part is attached so that the sixth wall part is located on the support part side with respect to the fifth wall part of the second housing. The method of claim 14,
Wherein each of the first mounting portion and the second mounting portion moves along the third direction, the laser processing device. According to claim 14 or claim 15,
The laser processing apparatus, wherein the support part moves along the first direction and rotates about an axis parallel to the third direction as a center line. The laser processing head according to any one of claims 1 to 13;
a mounting portion in which the housing of the laser processing head is mounted;
a light source unit for outputting the laser light incident on the incident part of the laser processing head;
A support unit for supporting the object is provided;
The mounting portion moves along the second direction, the laser processing device. The method of claim 17
The mounting portion moves along the third direction, the laser processing device. According to claim 17 or claim 18,
The laser processing apparatus, wherein the support part moves along the first direction and rotates about an axis parallel to the third direction as a center line.

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