JP7431339B2 - エッチング改善 - Google Patents
エッチング改善 Download PDFInfo
- Publication number
- JP7431339B2 JP7431339B2 JP2022547193A JP2022547193A JP7431339B2 JP 7431339 B2 JP7431339 B2 JP 7431339B2 JP 2022547193 A JP2022547193 A JP 2022547193A JP 2022547193 A JP2022547193 A JP 2022547193A JP 7431339 B2 JP7431339 B2 JP 7431339B2
- Authority
- JP
- Japan
- Prior art keywords
- ion beam
- structures
- substrate
- rotation angle
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0081—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. enlarging, the entrance or exit pupil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062971811P | 2020-02-07 | 2020-02-07 | |
| US62/971,811 | 2020-02-07 | ||
| PCT/US2021/013086 WO2021158338A1 (en) | 2020-02-07 | 2021-01-12 | Etch improvement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023513120A JP2023513120A (ja) | 2023-03-30 |
| JP2023513120A5 JP2023513120A5 (https=) | 2023-12-13 |
| JP7431339B2 true JP7431339B2 (ja) | 2024-02-14 |
Family
ID=77177991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022547193A Active JP7431339B2 (ja) | 2020-02-07 | 2021-01-12 | エッチング改善 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11852853B2 (https=) |
| EP (1) | EP4100987A4 (https=) |
| JP (1) | JP7431339B2 (https=) |
| KR (1) | KR102791914B1 (https=) |
| CN (1) | CN115152001B (https=) |
| TW (1) | TWI908760B (https=) |
| WO (1) | WO2021158338A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11487058B2 (en) | 2020-08-13 | 2022-11-01 | Applied Materials, Inc. | Method for manufacturing optical device structures |
| WO2023205288A1 (en) * | 2022-04-20 | 2023-10-26 | Applied Materials, Inc. | Method for roughness reduction in manufacturing optical device structures |
| US12255067B2 (en) * | 2022-05-23 | 2025-03-18 | Applied Materials, Inc. | Method for depositing layers directly adjacent uncovered vias or contact holes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160035539A1 (en) | 2014-07-30 | 2016-02-04 | Lauri SAINIEMI | Microfabrication |
| US20160111294A1 (en) | 2014-10-21 | 2016-04-21 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
| US20190258008A1 (en) | 2018-02-21 | 2019-08-22 | Varian Semiconductor Equipment Associates, Inc. | Optical component having variable depth gratings and method of formation |
| WO2019231576A1 (en) | 2018-05-30 | 2019-12-05 | Applied Materials, Inc. | Controlling etch angles by substrate rotation in angled etch tools |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61245452A (ja) | 1985-04-24 | 1986-10-31 | Nippon Telegr & Teleph Corp <Ntt> | 電子ビ−ム溶接機 |
| JP2841441B2 (ja) * | 1989-03-27 | 1998-12-24 | 株式会社島津製作所 | 回折格子およびその製作方法 |
| US5116461A (en) * | 1991-04-22 | 1992-05-26 | Motorola, Inc. | Method for fabricating an angled diffraction grating |
| JP4157654B2 (ja) * | 1999-08-23 | 2008-10-01 | 独立行政法人 日本原子力研究開発機構 | 円錐回折斜入射分光器及び該分光器用回折格子 |
| CN102396025B (zh) * | 2009-04-13 | 2015-09-30 | 应用材料公司 | 使用激光、e束或聚焦离子束的hdd图案化设备 |
| US8907307B2 (en) | 2011-03-11 | 2014-12-09 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and method for maskless patterned implantation |
| CN102540298B (zh) * | 2012-02-01 | 2013-10-16 | 中国科学技术大学 | 软x射线双频光栅及其制作方法 |
| US20160033784A1 (en) | 2014-07-30 | 2016-02-04 | Tapani Levola | Optical Components |
| DE102016111998B4 (de) * | 2016-06-30 | 2024-01-18 | Infineon Technologies Ag | Ausbilden von Elektrodengräben unter Verwendung eines gerichteten Ionenstrahls und Halbleitervorrichtung mit Graben-Elektrodenstrukturen |
| KR102673632B1 (ko) * | 2016-12-06 | 2024-06-13 | 삼성전자주식회사 | 이온 빔 추출을 위한 슬릿 구조체를 포함하는 이온 빔 장비, 및 이를 이용한 식각 방법 및 자기기억소자의 제조방법 |
| US10761334B2 (en) * | 2018-07-13 | 2020-09-01 | Varian Semiconductor Equipment Associates, Inc. | System and method for optimally forming gratings of diffracted optical elements |
| US11137536B2 (en) * | 2018-07-26 | 2021-10-05 | Facebook Technologies, Llc | Bragg-like gratings on high refractive index material |
| CN110632689B (zh) * | 2019-08-16 | 2021-11-16 | 诚瑞光学(常州)股份有限公司 | 表面浮雕光栅结构的制作方法 |
-
2021
- 2021-01-12 WO PCT/US2021/013086 patent/WO2021158338A1/en not_active Ceased
- 2021-01-12 JP JP2022547193A patent/JP7431339B2/ja active Active
- 2021-01-12 KR KR1020227030762A patent/KR102791914B1/ko active Active
- 2021-01-12 CN CN202180016019.3A patent/CN115152001B/zh active Active
- 2021-01-12 EP EP21750582.5A patent/EP4100987A4/en active Pending
- 2021-01-12 US US17/147,338 patent/US11852853B2/en active Active
- 2021-01-29 TW TW110103417A patent/TWI908760B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160035539A1 (en) | 2014-07-30 | 2016-02-04 | Lauri SAINIEMI | Microfabrication |
| US20160111294A1 (en) | 2014-10-21 | 2016-04-21 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
| US20190258008A1 (en) | 2018-02-21 | 2019-08-22 | Varian Semiconductor Equipment Associates, Inc. | Optical component having variable depth gratings and method of formation |
| WO2019231576A1 (en) | 2018-05-30 | 2019-12-05 | Applied Materials, Inc. | Controlling etch angles by substrate rotation in angled etch tools |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202146945A (zh) | 2021-12-16 |
| KR102791914B1 (ko) | 2025-04-03 |
| CN115152001B (zh) | 2026-01-20 |
| EP4100987A1 (en) | 2022-12-14 |
| US20210247554A1 (en) | 2021-08-12 |
| CN115152001A (zh) | 2022-10-04 |
| KR20220136423A (ko) | 2022-10-07 |
| US11852853B2 (en) | 2023-12-26 |
| JP2023513120A (ja) | 2023-03-30 |
| EP4100987A4 (en) | 2024-03-06 |
| TWI908760B (zh) | 2025-12-21 |
| WO2021158338A1 (en) | 2021-08-12 |
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