JP7423322B2 - 筐体 - Google Patents

筐体 Download PDF

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Publication number
JP7423322B2
JP7423322B2 JP2020008770A JP2020008770A JP7423322B2 JP 7423322 B2 JP7423322 B2 JP 7423322B2 JP 2020008770 A JP2020008770 A JP 2020008770A JP 2020008770 A JP2020008770 A JP 2020008770A JP 7423322 B2 JP7423322 B2 JP 7423322B2
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JP
Japan
Prior art keywords
casing
cylindrical casing
lid
cylindrical
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020008770A
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English (en)
Japanese (ja)
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JP2021118211A5 (https=
JP2021118211A (ja
Inventor
篤史 香取
武 大屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020008770A priority Critical patent/JP7423322B2/ja
Priority to US17/149,162 priority patent/US11503741B2/en
Publication of JP2021118211A publication Critical patent/JP2021118211A/ja
Publication of JP2021118211A5 publication Critical patent/JP2021118211A5/ja
Application granted granted Critical
Publication of JP7423322B2 publication Critical patent/JP7423322B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Studio Devices (AREA)
JP2020008770A 2020-01-22 2020-01-22 筐体 Active JP7423322B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020008770A JP7423322B2 (ja) 2020-01-22 2020-01-22 筐体
US17/149,162 US11503741B2 (en) 2020-01-22 2021-01-14 Housing to dissipate heat from a heat generating body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020008770A JP7423322B2 (ja) 2020-01-22 2020-01-22 筐体

Publications (3)

Publication Number Publication Date
JP2021118211A JP2021118211A (ja) 2021-08-10
JP2021118211A5 JP2021118211A5 (https=) 2023-01-19
JP7423322B2 true JP7423322B2 (ja) 2024-01-29

Family

ID=76857566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020008770A Active JP7423322B2 (ja) 2020-01-22 2020-01-22 筐体

Country Status (2)

Country Link
US (1) US11503741B2 (https=)
JP (1) JP7423322B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1040802S1 (en) * 2020-03-20 2024-09-03 Mercury Mission Systems, Llc Information system housing
CN214412924U (zh) * 2020-11-20 2021-10-15 京东方科技集团股份有限公司 一种网络适配器以及终端设备
US11978978B2 (en) 2020-12-23 2024-05-07 CACI, Inc.—Federal Process and system for managing carrier systems
US20240373599A1 (en) * 2023-05-04 2024-11-07 Power Integrations, Inc. Housing and housing grasping features usable with a heat dissipating device
USD1095523S1 (en) * 2023-06-07 2025-09-30 Shenzhen Chuangyingxin Industrial Co., Ltd. Computer host
USD1087079S1 (en) * 2024-01-30 2025-08-05 Shenzhen Tecno Technology Co., Ltd Computer case

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324993A (ja) 2001-04-24 2002-11-08 Toshiba Corp 電子機器装置
JP2007188998A (ja) 2006-01-12 2007-07-26 Hitachi Communication Technologies Ltd 電子機器の冷却構造
JP2013125897A (ja) 2011-12-15 2013-06-24 Taiyo Yuden Co Ltd 電子装置
WO2016175225A1 (ja) 2015-04-28 2016-11-03 株式会社ジェイエイアイコーポレーション 機能拡張装置、機能拡張装置の脱着構造、及び機能拡張システム
JP2019106885A (ja) 2019-02-27 2019-06-27 日立オートモティブシステムズ株式会社 電動駆動装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149840U (https=) * 1974-10-14 1976-04-15
US4656559A (en) * 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
JPH01100167U (https=) * 1987-12-23 1989-07-05
US5381176A (en) * 1991-08-11 1995-01-10 Sony Corporation Miniaturized video camera
DE4221119C2 (de) * 1992-06-26 1995-07-20 Knuerr Mechanik Ag Gerätekoffer
US5742478A (en) * 1996-09-25 1998-04-21 Wu; Chih-Hsien Radiating structure of a power converter
JPH1168344A (ja) * 1997-08-08 1999-03-09 Toyota Autom Loom Works Ltd 電気機器用ケース
US6046908A (en) * 1998-09-04 2000-04-04 Long Well Electronics Corp. Heat-radiating structure of power adapter
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
TWM351389U (en) * 2008-09-01 2009-02-21 Aopen Inc Computer enclosure and computer
JP2010226227A (ja) 2009-03-19 2010-10-07 Toshiba Corp 撮像装置
KR200457764Y1 (ko) * 2010-03-10 2012-01-02 이정숙 히트싱크를 갖춘 파워 서플라이
CN110475459B (zh) * 2014-09-26 2021-07-13 液体冷却解决方案公司 发热电子元件的冷却方法及液体浸没冷却的电子系统
US11265521B2 (en) * 2019-04-18 2022-03-01 Hisense Laser Display Co., Ltd. Digital light processing projector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324993A (ja) 2001-04-24 2002-11-08 Toshiba Corp 電子機器装置
JP2007188998A (ja) 2006-01-12 2007-07-26 Hitachi Communication Technologies Ltd 電子機器の冷却構造
JP2013125897A (ja) 2011-12-15 2013-06-24 Taiyo Yuden Co Ltd 電子装置
WO2016175225A1 (ja) 2015-04-28 2016-11-03 株式会社ジェイエイアイコーポレーション 機能拡張装置、機能拡張装置の脱着構造、及び機能拡張システム
JP2019106885A (ja) 2019-02-27 2019-06-27 日立オートモティブシステムズ株式会社 電動駆動装置

Also Published As

Publication number Publication date
JP2021118211A (ja) 2021-08-10
US20210227722A1 (en) 2021-07-22
US11503741B2 (en) 2022-11-15

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