JP2021118211A5 - - Google Patents

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Publication number
JP2021118211A5
JP2021118211A5 JP2020008770A JP2020008770A JP2021118211A5 JP 2021118211 A5 JP2021118211 A5 JP 2021118211A5 JP 2020008770 A JP2020008770 A JP 2020008770A JP 2020008770 A JP2020008770 A JP 2020008770A JP 2021118211 A5 JP2021118211 A5 JP 2021118211A5
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JP
Japan
Prior art keywords
housing
cylindrical housing
lid
region
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020008770A
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English (en)
Japanese (ja)
Other versions
JP7423322B2 (ja
JP2021118211A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2020008770A priority Critical patent/JP7423322B2/ja
Priority claimed from JP2020008770A external-priority patent/JP7423322B2/ja
Priority to US17/149,162 priority patent/US11503741B2/en
Publication of JP2021118211A publication Critical patent/JP2021118211A/ja
Publication of JP2021118211A5 publication Critical patent/JP2021118211A5/ja
Application granted granted Critical
Publication of JP7423322B2 publication Critical patent/JP7423322B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020008770A 2020-01-22 2020-01-22 筐体 Active JP7423322B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020008770A JP7423322B2 (ja) 2020-01-22 2020-01-22 筐体
US17/149,162 US11503741B2 (en) 2020-01-22 2021-01-14 Housing to dissipate heat from a heat generating body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020008770A JP7423322B2 (ja) 2020-01-22 2020-01-22 筐体

Publications (3)

Publication Number Publication Date
JP2021118211A JP2021118211A (ja) 2021-08-10
JP2021118211A5 true JP2021118211A5 (https=) 2023-01-19
JP7423322B2 JP7423322B2 (ja) 2024-01-29

Family

ID=76857566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020008770A Active JP7423322B2 (ja) 2020-01-22 2020-01-22 筐体

Country Status (2)

Country Link
US (1) US11503741B2 (https=)
JP (1) JP7423322B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1040802S1 (en) * 2020-03-20 2024-09-03 Mercury Mission Systems, Llc Information system housing
CN214412924U (zh) * 2020-11-20 2021-10-15 京东方科技集团股份有限公司 一种网络适配器以及终端设备
US11978978B2 (en) 2020-12-23 2024-05-07 CACI, Inc.—Federal Process and system for managing carrier systems
US20240373599A1 (en) * 2023-05-04 2024-11-07 Power Integrations, Inc. Housing and housing grasping features usable with a heat dissipating device
USD1095523S1 (en) * 2023-06-07 2025-09-30 Shenzhen Chuangyingxin Industrial Co., Ltd. Computer host
USD1087079S1 (en) * 2024-01-30 2025-08-05 Shenzhen Tecno Technology Co., Ltd Computer case

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149840U (https=) * 1974-10-14 1976-04-15
US4656559A (en) * 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
JPH01100167U (https=) * 1987-12-23 1989-07-05
US5381176A (en) * 1991-08-11 1995-01-10 Sony Corporation Miniaturized video camera
DE4221119C2 (de) * 1992-06-26 1995-07-20 Knuerr Mechanik Ag Gerätekoffer
US5742478A (en) * 1996-09-25 1998-04-21 Wu; Chih-Hsien Radiating structure of a power converter
JPH1168344A (ja) * 1997-08-08 1999-03-09 Toyota Autom Loom Works Ltd 電気機器用ケース
US6046908A (en) * 1998-09-04 2000-04-04 Long Well Electronics Corp. Heat-radiating structure of power adapter
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
JP2002324993A (ja) * 2001-04-24 2002-11-08 Toshiba Corp 電子機器装置
JP4589239B2 (ja) * 2006-01-12 2010-12-01 株式会社日立製作所 電子機器の冷却構造
TWM351389U (en) * 2008-09-01 2009-02-21 Aopen Inc Computer enclosure and computer
JP2010226227A (ja) 2009-03-19 2010-10-07 Toshiba Corp 撮像装置
KR200457764Y1 (ko) * 2010-03-10 2012-01-02 이정숙 히트싱크를 갖춘 파워 서플라이
JP5892691B2 (ja) * 2011-12-15 2016-03-23 太陽誘電株式会社 電子装置
CN110475459B (zh) * 2014-09-26 2021-07-13 液体冷却解决方案公司 发热电子元件的冷却方法及液体浸没冷却的电子系统
US10268108B2 (en) * 2015-04-28 2019-04-23 Jai Ltd. Function enhancement device, attaching/detaching structure for function enhancement device, and function enhancement system
JP6800261B2 (ja) * 2019-02-27 2020-12-16 日立オートモティブシステムズ株式会社 電動駆動装置
US11265521B2 (en) * 2019-04-18 2022-03-01 Hisense Laser Display Co., Ltd. Digital light processing projector

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