JP7417121B2

JP7417121B2 - light emitting device

Info

Publication number: JP7417121B2
Application number: JP2021177949A
Authority: JP
Inventors: 拓也山ノ井; 博文吉田
Original assignee: Nichia Corp
Current assignee: Nichia Corp
Priority date: 2021-10-29
Filing date: 2021-10-29
Publication date: 2024-01-18
Anticipated expiration: 2041-10-29
Also published as: JP2024039037A; JP2023067026A

Description

本開示は、発光装置に関する。 The present disclosure relates to a light emitting device.

発光装置において、基体に設けられた凹部に発光素子を配置し、凹部の上方を覆うように透光性部材をＡｕＳｎ等の接合材料を用いて基体に接合した構成が知られている（特許文献１参照）。 In a light emitting device, a configuration is known in which a light emitting element is disposed in a recess provided in a base, and a translucent member is bonded to the base using a bonding material such as AuSn so as to cover the upper part of the recess (Patent Document (see 1).

特開２０１９－２２０６７２号公報JP 2019-220672 Publication

このような発光装置においては、さらなる信頼性の向上が求められている。本開示は、信頼性の高い発光装置を提供する。 In such light emitting devices, further improvement in reliability is required. The present disclosure provides a highly reliable light emitting device.

本開示の一態様の発光装置は、上面を有する側壁部と、周囲を前記側壁部に囲まれた第１面と、を有する基体と、前記第１面に配置された発光素子と、
前記側壁部の上面に配置された接合部材と、前記側壁部及び前記第１面の上方に配置され、前記接合部材によって前記側壁部の上面と接合される透光性部材と、を備え、上面視において、前記基体は矩形であり、前記側壁部の上面は、前記基体の一辺の中央部に位置する第１上面と、前記第１上面と前記基体の隅部との間に位置する第２上面と、前記基体の隅部に位置する第３上面と、を有し、前記接合部材は、前記第１上面、前記第２上面及び前記第３上面に連続的に配置され、少なくとも一辺において、前記第１上面に位置する第１接合部が、前記第２上面に位置する第２接合部よりも前記基体の一辺と直交する方向における幅が広い。 A light emitting device according to one aspect of the present disclosure includes: a base body having a side wall portion having an upper surface; a first surface surrounded by the side wall portion; a light emitting element disposed on the first surface;
a joining member disposed on the upper surface of the side wall; and a translucent member disposed above the side wall and the first surface and joined to the upper surface of the side wall by the joining member; When viewed, the base is rectangular, and the upper surface of the side wall portion includes a first upper surface located at the center of one side of the base, and a second upper surface located between the first upper surface and a corner of the base. an upper surface and a third upper surface located at a corner of the base, the joining member is disposed continuously on the first upper surface, the second upper surface, and the third upper surface, and on at least one side, The first joint portion located on the first upper surface is wider than the second joint portion located on the second upper surface in a direction perpendicular to one side of the base body.

本開示によれば、信頼性の高い発光装置を提供することができる。 According to the present disclosure, a highly reliable light emitting device can be provided.

実施形態１に係る発光装置の概略上面図である。1 is a schematic top view of a light emitting device according to Embodiment 1. FIG. 実施形態１に係る発光装置の概略下面図である。1 is a schematic bottom view of a light emitting device according to Embodiment 1. FIG. 図１のＩＩＩ－ＩＩＩ線における概略断面図である。2 is a schematic cross-sectional view taken along line III-III in FIG. 1. FIG. 接合部材３０の配置を示す概略上面図である。FIG. 3 is a schematic top view showing the arrangement of a joining member 30. FIG. 透光性部材の概略下面図である。It is a schematic bottom view of a translucent member. 接合部材を配置する工程における接合部材の配置例を示す概略上面図である。FIG. 3 is a schematic top view showing an example of arrangement of joining members in a step of arranging joining members. 接合部材を配置する工程における接合部材の他の配置例を示す概略上面図である。FIG. 7 is a schematic top view showing another arrangement example of the joining members in the step of arranging the joining members. 実施形態２に係る発光装置の第１金属膜の配置を示す概略上面図である。FIG. 3 is a schematic top view showing the arrangement of a first metal film of a light emitting device according to a second embodiment. 実施形態２の透光性部材における第２金属膜の配置を示す概略下面図である。FIG. 7 is a schematic bottom view showing the arrangement of a second metal film in the light-transmitting member of Embodiment 2. FIG.

以下、発明の実施形態について適宜図面を参照して説明する。但し、以下に説明する形態は、本発明の技術思想を具体化するためのものであって、特定的な記載がない限り、本発明を以下のものに限定しない。また、図面が示す部材の大きさや位置関係等は、説明を明確にするため、誇張していることがある。
以下、図面に基づいて本発明を詳細に説明する。なお、以下の説明では、必要に応じて特定の方向や位置を示す用語（例えば、「上」、「下」、及びそれらの用語を含む別の用語）を用いるが、それらの用語の使用は図面を参照した発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が制限されるものではない。また、複数の図面に表れる同一符号の部分は同一もしくは同等の部分又は部材を示す。
さらに以下に示す実施形態は、本発明の技術思想を具体化するための発光装置を例示するものであって、本発明を以下に限定するものではない。また、以下に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、例示することを意図したものである。また、一の実施の形態、実施例において説明する内容は、他の実施の形態、実施例にも適用可能である。また、図面が示す部材の大きさや位置関係等は、説明を明確にするため、誇張していることがある。 Embodiments of the invention will be described below with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and unless there is a specific description, the present invention is not limited to the following embodiments. Furthermore, the sizes, positional relationships, etc. of members shown in the drawings may be exaggerated for clarity of explanation.
Hereinafter, the present invention will be explained in detail based on the drawings. In the following explanation, terms indicating specific directions or positions (for example, "upper", "lower", and other terms containing these terms) are used as necessary, but the use of these terms is The purpose of the drawings is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the invention is not limited by the meanings of these terms. Further, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or members.
Further, the embodiments shown below are illustrative of light emitting devices for embodying the technical idea of the present invention, and the present invention is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the component parts described below are not intended to limit the scope of the present invention, unless specifically stated, but are merely illustrative. It was intended. Furthermore, the content described in one embodiment or example is also applicable to other embodiments or examples. Furthermore, the sizes, positional relationships, etc. of members shown in the drawings may be exaggerated for clarity of explanation.

［実施形態１］
図１は、本実施形態に係る発光装置の概略上面図である。図２は、本実施形態に係る発光装置の概略下面図である。図３は、図１のＩＩＩ－ＩＩＩ線における概略断面図である。 [Embodiment 1]
FIG. 1 is a schematic top view of a light emitting device according to this embodiment. FIG. 2 is a schematic bottom view of the light emitting device according to this embodiment. FIG. 3 is a schematic cross-sectional view taken along line III--III in FIG.

図３に示す発光装置１００は、基体１０と、発光素子２０と、透光性部材４０と接合部材３０とを備える。 The light emitting device 100 shown in FIG. 3 includes a base 10, a light emitting element 20, a translucent member 40, and a joining member 30.

図３に示す例においては、基体１０は、平板状の基部１１と、基部１１の上に配置される側壁部１２と、を有している。基部１１と側壁部１２は一体とされていてもよく、別体でもよい。基体１０は、上面１２ａを有する側壁部１２と、周囲を側壁部１２に囲まれた第１面１１ａとを有する。第１面１１ａは、基部１１の上面に位置している。側壁部１２の内壁面１２ｃと基部１１の第１面１１ａとによって凹部を画定している。基部１１の第１面１１ａは、凹部の底である。第１面１１ａに発光素子２０が配置されている。発光素子２０は、基体１０の側壁部１２の内壁面１２ｃと、基部１１の第１面１１ａと、透光性部材４０の下面４０ｂとによって画定される空間１３内に位置する。 In the example shown in FIG. 3, the base 10 has a flat base 11 and a side wall 12 disposed on the base 11. The base portion 11 and the side wall portion 12 may be integrated or may be separate bodies. The base body 10 has a side wall portion 12 having an upper surface 12a, and a first surface 11a surrounded by the side wall portion 12. The first surface 11a is located on the upper surface of the base 11. The inner wall surface 12c of the side wall portion 12 and the first surface 11a of the base portion 11 define a recessed portion. The first surface 11a of the base 11 is the bottom of the recess. A light emitting element 20 is arranged on the first surface 11a. The light emitting element 20 is located in a space 13 defined by the inner wall surface 12c of the side wall portion 12 of the base body 10, the first surface 11a of the base portion 11, and the lower surface 40b of the translucent member 40.

図４に示すように、上面視において、基体１０の形状は矩形である。本明細書において、矩形とは、４つの辺と４つの角部を含む形状であって、角部は、直角、丸みを帯びた形状、または、図４のように円弧状に面取りされた形状（匙面）等とすることができる。基部１１の第１面１１ａの形状は、上面視において例えば矩形である。基部１１の第１面１１ａよりも外側に、側壁部１２の上面１２ａが位置している。側壁部１２の上面１２ａの形状は、上面視において外形が矩形であって、内部に矩形の開口部を有する枠状である。 As shown in FIG. 4, the base 10 has a rectangular shape when viewed from above. In this specification, a rectangle is a shape that includes four sides and four corners, and the corners may be a right angle, a rounded shape, or a chamfered arc shape as shown in FIG. (spoon side) etc. The shape of the first surface 11a of the base 11 is, for example, a rectangle when viewed from above. The upper surface 12a of the side wall portion 12 is located outside the first surface 11a of the base portion 11. The upper surface 12a of the side wall portion 12 has a frame shape with a rectangular outer shape in a top view and a rectangular opening inside.

側壁部１２の上面１２ａは、基体１０の一辺の中央部に位置する第１上面１２１ａと、第１面１２１ａと基体１０の隅部との間に位置する第２上面１２２ａと、基体１０の隅部に位置する第３上面１２３ａとを有する。図４に示す例では、側壁部１２の上面１２ａは、矩形の外形を構成する各辺において、第１上面１２１ａ及び第２上面１２２ａを有している。また、外形を構成する四隅に第３上面１２３ａを有している。すなわち、側壁部１２の上面１２ａは、４つの第１上面１２１ａと、８つの第２上面１２２ａと、４つの第３上面とを有している。上面視において、枠状の側壁部１２の内縁（矩形の開口部）の４つの辺は、第１上面１２１ａ及び第２上面１２２ａの内縁によって構成されている。また、側壁部１２における矩形の開口部の４つの角部は、第３上面１２３ａの内縁によって構成されている。上面視において、第１上面１２１ａと第２上面１２２ａとの境界は、発光素子２０と基体１０の外形を構成する辺との間、すなわち、発光素子２０の側面を基体１０の側壁部１２へ投影した領域において任意の位置に設定することができる。図４に示すように、第１上面１２１ａと第２上面１２２ａとの境界は、後述する第１接合部３１と第２接合部３２との境界と一致する。また、上面視において、第２上面１２２ａと第３上面１２３ａとの境界は、側壁部１２の矩形の開口部における辺と、丸みを帯びた角部の曲線と、の境目に位置する。 The upper surface 12a of the side wall portion 12 includes a first upper surface 121a located at the center of one side of the base 10, a second upper surface 122a located between the first surface 121a and a corner of the base 10, and a corner of the base 10. and a third upper surface 123a located at the bottom. In the example shown in FIG. 4, the upper surface 12a of the side wall portion 12 has a first upper surface 121a and a second upper surface 122a on each side forming a rectangular outer shape. Further, it has a third upper surface 123a at the four corners forming the outer shape. That is, the upper surface 12a of the side wall portion 12 has four first upper surfaces 121a, eight second upper surfaces 122a, and four third upper surfaces. In a top view, the four sides of the inner edge (rectangular opening) of the frame-shaped side wall portion 12 are constituted by the inner edges of the first upper surface 121a and the second upper surface 122a. Furthermore, the four corners of the rectangular opening in the side wall portion 12 are defined by the inner edge of the third upper surface 123a. In a top view, the boundary between the first upper surface 121a and the second upper surface 122a is between the light emitting element 20 and the sides forming the outer shape of the base 10, that is, the side surface of the light emitting element 20 is projected onto the side wall 12 of the base 10. It can be set at any position in the area. As shown in FIG. 4, the boundary between the first upper surface 121a and the second upper surface 122a coincides with the boundary between the first joint 31 and the second joint 32, which will be described later. Further, in a top view, the boundary between the second upper surface 122a and the third upper surface 123a is located at the boundary between the side of the rectangular opening of the side wall portion 12 and the curve of the rounded corner.

基体１０の第１面１１ａに、正負の上面配線１４が配置されている。発光素子２０は、基体１０の第１面１１ａにフリップチップ実装されている。具体的には、同一面側に正負の電極を有する発光素子２０を用い、発光素子２０の正負の電極が、導電性部材を介して基体１０の正負の上面配線１４にそれぞれ電気的に接続されている。導電性部材としては、例えば、金と錫、錫と銀と銅などを主成分とする共晶半田、銀、金、パラジウムなどを含む導電ペースト、銀または金などを含むバンプ等を用いることができる。なお、発光素子２０は、ワイヤによって基体１０の上面配線１４に接続（フェイスアップ実装）されていてもよい。また、上面に正負いずれか一方の電極を有し、下面に他方の電極を有する発光素子を用いてもよい。 On the first surface 11a of the base 10, positive and negative upper surface wirings 14 are arranged. The light emitting element 20 is flip-chip mounted on the first surface 11a of the base 10. Specifically, a light emitting element 20 having positive and negative electrodes on the same side is used, and the positive and negative electrodes of the light emitting element 20 are electrically connected to the positive and negative upper surface wirings 14 of the base 10 through conductive members, respectively. ing. As the conductive member, for example, eutectic solder mainly composed of gold and tin, tin, silver, and copper, conductive paste containing silver, gold, palladium, etc., bumps containing silver or gold, etc. can be used. can. Note that the light emitting element 20 may be connected (face-up mounting) to the upper surface wiring 14 of the base 10 by a wire. Alternatively, a light emitting element may be used that has one of the positive and negative electrodes on the upper surface and the other electrode on the lower surface.

基体１０の第１面１１ａと反対側に位置する第２面１０ｂには、下面配線１５が配置されている。基体１０の基部１１は、貫通孔を有しており、貫通孔内に内部配線（図示せず）が配置されている。上面配線１４と下面配線１５とは、それぞれ内部配線により接続されている。基体１０の第２面１０ｂ側に、第２凹部１６を有していてもよいし、有していなくてもよい。第２凹部１６は、基体１０の第２面１０ｂから外側面１０ｃにかけて配置される。第２凹部１６を有する場合は、下面配線１５は、第２凹部１６を画定する基体１０の外側面１６ｃにも配置されている。発光装置１００の下面配線１５を、半田等を用いて他の実装基板等に接合する際に、半田が第２凹部１６に入り込むことが可能となっている。これにより、下面配線１５をより安定して電気的に接続することができる。 Lower surface wiring 15 is arranged on the second surface 10b of the base 10, which is located on the opposite side to the first surface 11a. The base 11 of the base body 10 has a through hole, and internal wiring (not shown) is arranged within the through hole. The upper surface wiring 14 and the lower surface wiring 15 are each connected by internal wiring. The base body 10 may or may not have the second recess 16 on the second surface 10b side. The second recess 16 is arranged from the second surface 10b to the outer surface 10c of the base body 10. When the second recess 16 is provided, the lower wiring 15 is also arranged on the outer surface 16c of the base 10 that defines the second recess 16. When the lower wiring 15 of the light emitting device 100 is bonded to another mounting board using solder or the like, the solder can enter the second recess 16. Thereby, the lower surface wiring 15 can be electrically connected more stably.

透光性部材４０は、少なくとも発光素子２０からの光を透過させる透光性を有する部材であり、発光素子２０から出射される光の６０％以上を透過し、好ましくは９０％以上を透過する。透光性部材４０の形状は、上面視において例えば矩形である。透光性部材４０は、図１及び図３に示されるような平板状のほか、上面及び／又は下面が球面や非球面などのレンズ状であってもよい。 The light-transmitting member 40 is a member having a light-transmitting property that transmits at least the light from the light-emitting element 20, and transmits 60% or more of the light emitted from the light-emitting element 20, preferably 90% or more. . The shape of the transparent member 40 is, for example, a rectangle when viewed from above. The translucent member 40 may have a flat plate shape as shown in FIGS. 1 and 3, or may have a lens shape such as a spherical or aspherical upper surface and/or lower surface.

接合部材３０は、基体１０の側壁部１２の上面１２ａと透光性部材４０とを接合する。接合部材３０は、第１上面１２１ａに接合する部分である第１接合部３１と、第２上面１２２ａに接合する部分である第２接合部３２と、第３上面１２３ａに接合する部分である第３接合部３３と、を有する。図４に示す例では、上面視において、接合部材３０は、第１上面１２１ａ、第２上面１２２ａ及び第３上面１２３ａに連続的に配置されている。第１接合部３１、第２接合部３２、及び第３接合部３３は一体でもよく、別体でもよい。 The joining member 30 joins the upper surface 12a of the side wall portion 12 of the base body 10 and the translucent member 40. The joining member 30 has a first joining part 31 that is a part that is joined to the first upper surface 121a, a second joining part 32 that is a part that is joined to the second upper surface 122a, and a part that is joined to the third upper surface 123a. 3 joint portions 33. In the example shown in FIG. 4, the joining member 30 is continuously arranged on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a when viewed from above. The first joint portion 31, the second joint portion 32, and the third joint portion 33 may be integral or separate bodies.

接合部材３０は、基体１０の少なくとも一辺において、第１接合部３１が第２接合部３２よりも、その接合部材３０が配置されている基体１０の一辺と直交する方向における幅が広い。これにより、接合部材３０の第１接合部３１と基体１０の第１上面１２１ａとの接触面積、及び接合部材３０の第１接合部３１と透光性部材４０との接触面積を広くすることができる。また、第１接合部３１のみの幅を広くすることで、接合部材３０を用いる量を極力抑えて、発光装置のコストの増加を抑えつつ、発光装置の凹部内を気密に封止することができる。また、発光素子２０からの光が接合部材３０に吸収されることを低減することができる。基部１１と側壁部１２とを有する基体１０を用いた発光装置は、熱収縮による反りが発生し、基体１０の一辺の中央部における側壁部１２の高さが、その周辺の側壁部１２の高さよりも低くなることが生じ得る。そのため、接合部材３０の第１接合部３１と基体１０の第１上面１２１ａとの接触面積、及び接合部材３０の第１接合部３１と透光性部材４０との接触面積を広くすることによって、この部分における接合部材３０と基体１０、及び接合部材３０と透光性部材４０との接合力を強くすることができる。これにより、基体１０の一辺の中央部における接合部材３０と基体１０との間、及び接合部材３０と透光性部材４０との間の剥離を防止することができる。接合部材３０は、基体１０の対向する二辺において、第１接合部３１が第２接合部３２よりも基体１０の辺と直交する方向における幅を広くなるように配置することが好ましい。側壁部１２の上面視における外形及び開口形状が長方形である場合は、長辺側の対向する二辺において、第１接合部３１が第２接合部３２よりも基体１０の辺と直交する方向における幅が広くなるように配置することが好ましい。また、基体１０の４辺それぞれにおいて、第１接合部３１が第２接合部３２よりも基体１０の辺と直交する方向における幅が広くなるように配置することが好ましい。 In the bonding member 30, on at least one side of the base 10, the first bonding portion 31 is wider than the second bonding portion 32 in the direction perpendicular to the one side of the base 10 on which the bonding member 30 is disposed. Thereby, the contact area between the first joint portion 31 of the joint member 30 and the first upper surface 121a of the base body 10 and the contact area between the first joint portion 31 of the joint member 30 and the translucent member 40 can be increased. can. Furthermore, by increasing the width of only the first joint portion 31, the amount of the joining member 30 used can be minimized, and the inside of the recess of the light emitting device can be hermetically sealed while suppressing an increase in the cost of the light emitting device. can. Furthermore, absorption of light from the light emitting element 20 by the joining member 30 can be reduced. A light emitting device using a base 10 having a base 11 and a side wall 12 warps due to thermal contraction, and the height of the side wall 12 at the center of one side of the base 10 is lower than the height of the side wall 12 around it. It may occur that the value is lower than the actual value. Therefore, by increasing the contact area between the first joint part 31 of the joint member 30 and the first upper surface 121a of the base 10 and the contact area between the first joint part 31 of the joint member 30 and the translucent member 40, It is possible to strengthen the bonding force between the bonding member 30 and the base 10 and between the bonding member 30 and the light-transmitting member 40 in this portion. Thereby, separation between the bonding member 30 and the base 10 and between the bonding member 30 and the light-transmitting member 40 at the center of one side of the base 10 can be prevented. It is preferable that the joining member 30 is arranged such that the first joining part 31 has a wider width in the direction orthogonal to the sides of the base 10 than the second joining part 32 on two opposing sides of the base 10 . When the outer shape and opening shape of the side wall portion 12 in a top view are rectangular, the first joint portion 31 is larger than the second joint portion 32 in the direction perpendicular to the side of the base body 10 on the two opposing long sides. It is preferable to arrange them so that they are wide in width. Further, on each of the four sides of the base body 10, it is preferable that the first joint portion 31 is arranged to have a wider width in the direction orthogonal to the side of the base body 10 than the second joint portion 32.

上面視において、基体１０の一辺の長さは、例えば２ｍｍ以上８ｍｍ以下とすることができる。基体１０の辺に直交する方向における基体１０の第１上面１２１ａ及び第２上面１２２ａの幅は、例えば０．３ｍｍ以上０．７ｍｍ以下とすることができる。図１に示す例においては、第１上面１２１ａと第２上面１２２ａは、基体１０の辺に直交する方向における幅が等しい。第１上面１２１ａと第２上面１２２ａは、基体１０の辺に直交する方向における幅が異なっていてもよい。基体１０の辺と平行な方向における第１上面１２１ａの長さは、後述する第２接合部３２の幅（図４における３２Ｗ）よりも長いことが好ましい。基体１０の辺と平行な方向における第１上面１２１ａの長さは、例えば３００μｍ以上１０００μｍ以下とすることができる。 In a top view, the length of one side of the base body 10 can be, for example, 2 mm or more and 8 mm or less. The width of the first upper surface 121a and the second upper surface 122a of the base body 10 in the direction orthogonal to the sides of the base body 10 can be, for example, 0.3 mm or more and 0.7 mm or less. In the example shown in FIG. 1, the first upper surface 121a and the second upper surface 122a have the same width in the direction perpendicular to the sides of the base body 10. The first upper surface 121a and the second upper surface 122a may have different widths in the direction perpendicular to the sides of the base body 10. The length of the first upper surface 121a in the direction parallel to the sides of the base body 10 is preferably longer than the width (32W in FIG. 4) of the second joint portion 32, which will be described later. The length of the first upper surface 121a in the direction parallel to the sides of the base body 10 can be, for example, 300 μm or more and 1000 μm or less.

基体１０の辺に直交する方向における基体１０の上面１２ａの幅（図４における１２Ｗ）に対する接合部材３０の第１接合部３１の幅（図４における３１Ｗ）が占める割合は、例えば５０％以上とすることが好ましい。基体１０の辺に直交する方向における接合部材３０の第１接合部３１の幅は、例えば０．１５ｍｍ以上０．６５ｍｍ以下とすることができる。基体１０の辺に直交する方向における基体１０の上面１２ａの幅（図４における１２Ｗ）に対する接合部材３０の第２接合部３２の幅（図４における３２Ｗ）が占める割合は、例えば３０％以上とすることが好ましい。基体１０の辺に直交する方向における接合部材３０の第２接合部３２の幅は、例えば０．０９ｍｍ以上０．６ｍｍ以下とすることができる。 The ratio of the width of the first joint portion 31 of the joining member 30 (31W in FIG. 4) to the width of the upper surface 12a of the base body 10 (12W in FIG. 4) in the direction perpendicular to the sides of the base body 10 is, for example, 50% or more. It is preferable to do so. The width of the first joint portion 31 of the joint member 30 in the direction perpendicular to the sides of the base body 10 can be, for example, 0.15 mm or more and 0.65 mm or less. The ratio of the width of the second joint portion 32 of the joint member 30 (32W in FIG. 4) to the width of the upper surface 12a of the base body 10 (12W in FIG. 4) in the direction perpendicular to the sides of the base body 10 is, for example, 30% or more. It is preferable to do so. The width of the second joint portion 32 of the joint member 30 in the direction perpendicular to the sides of the base body 10 can be, for example, 0.09 mm or more and 0.6 mm or less.

基体１０の上面１２ａには第１金属膜５１が配置されていることが好ましい。図６に示す例においては、第１金属膜５１は、接合部材３０と基体１０の側壁部１２の上面１２ａとの間に位置している。第１金属膜５１は、上面視において外形が矩形の枠状であって、四隅の角部が丸みを帯びた形状である。第１金属膜５１を有する場合は、第１金属膜５１の上に接合部材３０が配置される。なお、第１金属膜５１を有していない場合は、基体１０の側壁部１２の上面１２ａに接合部材３０が配置される。 Preferably, the first metal film 51 is disposed on the upper surface 12a of the base 10. In the example shown in FIG. 6 , the first metal film 51 is located between the bonding member 30 and the upper surface 12 a of the side wall portion 12 of the base body 10 . The first metal film 51 has a rectangular frame shape when viewed from above, and has four rounded corners. When the first metal film 51 is provided, the bonding member 30 is placed on the first metal film 51. Note that when the first metal film 51 is not provided, the bonding member 30 is arranged on the upper surface 12a of the side wall portion 12 of the base body 10.

図５に示すように、透光性部材４０の下面４０ｂの外周部に第２金属膜５２が配置されていることが好ましい。第２金属膜５２は、接合部材３０と透光性部材４０の下面４０ｂとの間に位置する。第２金属膜５２は、基体１０の側壁部１２の上面１２ａと対向するように配置される。第２金属膜５２は、透光性部材４０の下面４０ｂを見た平面視において外形が矩形の枠状であって、四隅の角部が丸みを帯びた形状である。第２金属膜５２を有する場合は、接合部材３０は、第２金属膜５２を介して透光性部材４０と接合される。なお、第２金属膜５２を有していない場合は、接合部材３０は、透光性部材４０の下面４０ｂと直接接合される。図５に示す例においては、第２金属膜５２は、全周にわたって同じ幅で形成されている。 As shown in FIG. 5, it is preferable that a second metal film 52 is disposed on the outer periphery of the lower surface 40b of the light-transmitting member 40. The second metal film 52 is located between the bonding member 30 and the lower surface 40b of the transparent member 40. The second metal film 52 is arranged to face the upper surface 12a of the side wall portion 12 of the base body 10. The second metal film 52 has a rectangular frame shape with a rectangular outer shape in a plan view when looking at the lower surface 40b of the light-transmitting member 40, and has four rounded corners. When having the second metal film 52, the joining member 30 is joined to the light-transmitting member 40 via the second metal film 52. Note that when the second metal film 52 is not provided, the joining member 30 is directly joined to the lower surface 40b of the light-transmitting member 40. In the example shown in FIG. 5, the second metal film 52 is formed with the same width over the entire circumference.

第１金属膜５１及び第２金属膜５２は、例えば、タングステン、モリブデン、ニッケル、金、銀、白金、チタン、銅、アルミニウム、ルテニウムなどの金属材料を用いることが好ましい。第１金属膜５１及び第２金属膜５２は、接合部材３０に対して高い濡れ性を有することが好ましい。 The first metal film 51 and the second metal film 52 are preferably made of a metal material such as tungsten, molybdenum, nickel, gold, silver, platinum, titanium, copper, aluminum, or ruthenium. It is preferable that the first metal film 51 and the second metal film 52 have high wettability with respect to the bonding member 30.

発光装置１００は、ツェナーダイオード等の保護素子を有していてもよいし、有していなくてもよい。図４に示す例では、基体１０の第１面１１ａに保護素子９０が配置されている。
以下、発光装置１００を構成する各要素について説明する。 The light emitting device 100 may or may not have a protection element such as a Zener diode. In the example shown in FIG. 4, a protection element 90 is arranged on the first surface 11a of the base 10.
Each element constituting the light emitting device 100 will be described below.

（基体１０）
基体１０は、発光素子２０を配置するためのものである。図３に示す例においては、基体１０は、平板状の基部１１と、基部１１の上に配置される側壁部１２と、を有している。基部１１の第１面１１ａに発光素子２０が配置され、側壁部１２の上面１２ａに接合部材３０が配置される。側壁部１２によって画定される基部１１の第１面１１ａの形状は、上面視において例えば矩形である。 (Base 10)
The base body 10 is for arranging the light emitting element 20. In the example shown in FIG. 3, the base 10 has a flat base 11 and a side wall 12 disposed on the base 11. The light emitting element 20 is arranged on the first surface 11a of the base 11, and the joining member 30 is arranged on the upper surface 12a of the side wall 12. The shape of the first surface 11a of the base portion 11 defined by the side wall portion 12 is, for example, rectangular when viewed from above.

基体１０は、絶縁性の基材と、上面配線１４と、下面配線１５とを含む。絶縁性の基材の材料としては、セラミックス、ガラスエポキシ、樹脂などを例示することができる。セラミックスとしては、耐熱性および耐候性の高いものを用いることが好ましく、このようなセラミックスとしては、アルミナ、窒化アルミニウム、ムライトなどを例示することができる。 Base 10 includes an insulating base material, upper surface wiring 14, and lower surface wiring 15. Examples of the material for the insulating base material include ceramics, glass epoxy, and resin. It is preferable to use ceramics with high heat resistance and weather resistance, and examples of such ceramics include alumina, aluminum nitride, and mullite.

基体１０の第１面１１ａは、上面配線１４を有している。基体１０の第２面１０ｂは、下面配線１５を有している。上面配線１４及び下面配線１５の材料は、当該分野で公知の材料によって形成することができる。上面配線１４及び下面配線１５は、例えば、銅、アルミニウム、金、銀、タングステン等の金属を用いることができる。 The first surface 11 a of the base 10 has upper surface wiring 14 . The second surface 10b of the base 10 has lower surface wiring 15. The upper surface wiring 14 and the lower surface wiring 15 can be made of materials known in the art. For the upper surface wiring 14 and the lower surface wiring 15, metals such as copper, aluminum, gold, silver, and tungsten can be used, for example.

（発光素子２０）
発光素子２０は、基体１０の第１面１１ａに配置される。発光素子２０としては、発光ダイオード、レーザダイオード等を用いることができる。 (Light emitting element 20)
The light emitting element 20 is arranged on the first surface 11a of the base 10. As the light emitting element 20, a light emitting diode, a laser diode, etc. can be used.

発光素子２０の発光ピーク波長は特に限定されず、所望の発光ピーク波長のものを適宜選択することができ、例えば２５０ｎｍ以上６００ｎｍ以下のものを用いることができる。例えば、紫外光を発する発光ダイオードを用いることで、殺菌用又は除菌用の光源として用いることができる。紫外光を発する発光素子２０の発光ピーク波長は、例えば、４００ｎｍ以下である。 The emission peak wavelength of the light emitting element 20 is not particularly limited, and a desired emission peak wavelength can be selected as appropriate, and for example, a wavelength of 250 nm or more and 600 nm or less can be used. For example, by using a light emitting diode that emits ultraviolet light, it can be used as a light source for sterilization or sterilization. The light emission peak wavelength of the light emitting element 20 that emits ultraviolet light is, for example, 400 nm or less.

発光素子２０は、例えばＩｎ_ＸＡｌ_ＹＧａ_{１－Ｘ－Ｙ}Ｎ（０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）を含む窒化物半導体層を用いたものであることが好ましい。深紫外から紫外の波長域で発光する発光素子を用いる場合は、少なくともＡｌを含む窒化物半導体層を有するものであることが好ましい。発光素子２０は、少なくとも、発光層を含む半導体層と、正負の電極と、を有する。 The light emitting element 20 preferably uses a nitride semiconductor layer containing, for example, In _X Al _Y Ga _1-XY N (0≦X, 0≦Y, X+Y≦1). When using a light emitting element that emits light in the wavelength range from deep ultraviolet to ultraviolet, it is preferable that the element has a nitride semiconductor layer containing at least Al. The light emitting element 20 has at least a semiconductor layer including a light emitting layer and positive and negative electrodes.

図４に示す例においては、発光素子２０は、基体１０の第１面１１ａの中央に配置されている。また、図４に示す例においては、発光装置１００は、１つの発光素子２０が配置されている。発光装置１００は、複数の発光素子２０が配置されてもよい。発光素子２０は、上面視において、例えば、矩形状とすることができる。この場合、発光素子２０の上面視における一辺の長さは、例えば、５０μｍ以上３０００μｍ以下であることが好ましく、３００μｍ以上２０００μｍ以下であることがさらに好ましい。また、発光素子２０の上面視における形状は、例えば、三角形、六角形等の多角形等でもよい。 In the example shown in FIG. 4, the light emitting element 20 is arranged at the center of the first surface 11a of the base 10. Further, in the example shown in FIG. 4, the light emitting device 100 includes one light emitting element 20. In the light emitting device 100, a plurality of light emitting elements 20 may be arranged. The light emitting element 20 can have, for example, a rectangular shape when viewed from above. In this case, the length of one side of the light emitting element 20 when viewed from above is preferably, for example, 50 μm or more and 3000 μm or less, and more preferably 300 μm or more and 2000 μm or less. Further, the shape of the light emitting element 20 when viewed from above may be, for example, a polygon such as a triangle or a hexagon.

（接合部材３０）
接合部材３０は、基体１０と透光性部材４０との間に配置され、基体１０と透光性部材４０とを接合する。接合部材３０は、発光装置１００が第１金属膜５１及び第２金属膜５２を有する場合は、第１金属膜５１と第２金属膜５２との間に配置される。接合部材３０は、例えば、半田、低融点ガラス、樹脂等が挙げられる。半田の材料としては、Ａｕ－Ｓｎ、Ａｕ－Ｉｎ等が挙げられる。樹脂としては、シリコーン樹脂、エポキシ樹脂等が挙げられる。 (Joining member 30)
The joining member 30 is disposed between the base body 10 and the light-transmitting member 40 and joins the base body 10 and the light-transmitting member 40 together. When the light emitting device 100 has the first metal film 51 and the second metal film 52, the bonding member 30 is disposed between the first metal film 51 and the second metal film 52. Examples of the bonding member 30 include solder, low melting point glass, and resin. Examples of solder materials include Au-Sn and Au-In. Examples of the resin include silicone resin and epoxy resin.

基体１０と透光性部材４０とを接合する接合部材３０が、図４に示すように第１上面１２１ａ、第２上面１２２ａ及び第３上面１２３ａに連続的に配置される。すなわち、接合部材３０が枠状の側壁部１２の上面１２ａの全周にわたって配置されることで、発光装置の凹部内を気密に封止することができる。 A joining member 30 that joins the base body 10 and the translucent member 40 is arranged continuously on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a, as shown in FIG. That is, by disposing the bonding member 30 over the entire circumference of the upper surface 12a of the frame-shaped side wall portion 12, the inside of the recess of the light emitting device can be hermetically sealed.

図４に示す例では、上面視において、接合部材３０の内縁は側壁部１２の開口部から離隔して配置されている。これにより、上面視において接合部材３０が第１面１１ａに隣接して配置される場合と比べて、発光素子２０からの光が接合部材３０に吸収されることを低減することができる。図４に示すように、上面視において、第２接合部３２が第１面１１ａから離隔して配置され、第１接合部３１が、第２接合部３２の内縁よりも第１面１１ａ側に延在するようにしてもよい。 In the example shown in FIG. 4, the inner edge of the joining member 30 is spaced apart from the opening of the side wall 12 when viewed from above. Thereby, absorption of light from the light emitting element 20 by the bonding member 30 can be reduced compared to the case where the bonding member 30 is disposed adjacent to the first surface 11a when viewed from above. As shown in FIG. 4, when viewed from above, the second joint 32 is arranged apart from the first surface 11a, and the first joint 31 is closer to the first surface 11a than the inner edge of the second joint 32. It may be made to extend.

（透光性部材４０）
透光性部材４０は、基体１０に配置された発光素子２０からの光を透過させて、発光装置１００の外部に光を放出させる機能を有する。透光性部材４０の材料としては、サファイア、ホウ珪酸ガラス、石英ガラス、フッ化カルシウムガラス、アルミノホウ珪酸ガラス、オキシナイトライドガラス、カルコゲナイドガラスからなる群から選択された少なくとも１種からなる無機材料を例示することができる。透光性部材４０の厚みは０．１ｍｍ以上７ｍｍ以下が挙げられる。 (Translucent member 40)
The light-transmitting member 40 has a function of transmitting light from the light-emitting element 20 disposed on the base 10 and emitting the light to the outside of the light-emitting device 100. The material of the translucent member 40 is an inorganic material made of at least one selected from the group consisting of sapphire, borosilicate glass, quartz glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. I can give an example. The thickness of the transparent member 40 is 0.1 mm or more and 7 mm or less.

図３に示すように、透光性部材４０の下面４０ｂは、基体１０の第１面１１ａの上方に位置する第１領域４１ｂと、基体１０の側壁部１２の上方に位置する第２領域４２ｂとを含む。第１領域４１ｂは、空間１３を隔てて発光素子２０の上面に対向している。透光性部材４０の下面４０ｂの第２領域４２ｂは、接合部材３０によって、基体１０の側壁部１２の上面１２ａと接合される。 As shown in FIG. 3, the lower surface 40b of the translucent member 40 includes a first region 41b located above the first surface 11a of the base 10 and a second region 42b located above the side wall 12 of the base 10. including. The first region 41b faces the upper surface of the light emitting element 20 with the space 13 in between. The second region 42b of the lower surface 40b of the light-transmitting member 40 is joined to the upper surface 12a of the side wall portion 12 of the base body 10 by the joining member 30.

以下、接合部材３０によって基体１０と透光性部材４０とを接合する方法について説明する。図６に示すように、基体１０の上面１２ａ（第１金属膜５１を有する場合は、第１金属膜５１の上面）に接合部材３０ａを印刷法やディスペンス法等により配置する。図５に示す例においては、複数の接合部材３０ａが間隔を開けて環状に配置されている。接合部材３０ａは、例えば、８０μｍ～４００μｍの範囲の径で形成することが好ましく、９０～２００μｍの範囲の径で形成することがさらに好ましい。また、隣接する接合部材３０ａの中心点同士の間隔は、８０μｍ～１０００μｍの範囲に設定することが好ましく、１００μｍ～４００μｍの範囲に設定することがさらに好ましい。このように複数の接合部材３０ａを間隔を開けて配置することによって、接合部材３０ａの量を低減することができる。第１上面１２１ａにおいて、基体１０の辺と直交する方向に２つの接合部材３０ａが配置されている。第１上面１２１ａにおいて、接合部材３０ａは、基体１０の辺と直交する方向に３つ以上配置してもよい。図６に示す例においては、複数の接合部材３０ａはそれぞれ、同じ径で形成されている。 Hereinafter, a method for joining the base body 10 and the translucent member 40 using the joining member 30 will be described. As shown in FIG. 6, the bonding member 30a is placed on the upper surface 12a of the base 10 (or the upper surface of the first metal film 51 if it has the first metal film 51) by a printing method, a dispensing method, or the like. In the example shown in FIG. 5, a plurality of joining members 30a are arranged annularly at intervals. The joining member 30a is preferably formed with a diameter in the range of 80 to 400 μm, and more preferably in the range of 90 to 200 μm, for example. Further, the distance between the center points of adjacent joining members 30a is preferably set in the range of 80 μm to 1000 μm, and more preferably set in the range of 100 μm to 400 μm. By arranging the plurality of joining members 30a at intervals in this manner, the amount of joining members 30a can be reduced. Two joining members 30a are arranged on the first upper surface 121a in a direction perpendicular to the sides of the base body 10. On the first upper surface 121a, three or more joining members 30a may be arranged in a direction perpendicular to the sides of the base body 10. In the example shown in FIG. 6, the plurality of joining members 30a are each formed with the same diameter.

接合部材３０ａを配置した後、接合部材３０ａを介して透光性部材４０を基体１０の上に配置し、接合部材３０ａを加熱して溶融させ、基体１０と透光性部材４０とを接合する。溶融した接合部材３０ａ同士が繋がることによって、図４に示すように第１上面１２１ａ、第２上面１２２ａ及び第３上面１２３ａに連続的に配置された接合部材３０とすることができる。これにより、発光素子２０が位置する空間を気密封止することができる。図５において第１上面１２１ａに配置した複数の接合部材３０ａによって、基体１０の一辺と直交する方向における幅が広い第１接合部３１を構成することができる。なお、接合部材３０ａを配置する工程において、接合部材３０ａを例えば印刷法やディスペンス法によって第１上面１２１ａ、第２上面１２２ａ及び第３上面１２３ａに連続的に形成してもよい。 After placing the joining member 30a, the transparent member 40 is placed on the base 10 via the joining member 30a, and the joining member 30a is heated and melted to join the base 10 and the transparent member 40. . By connecting the melted joining members 30a, the joining members 30 can be continuously arranged on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a, as shown in FIG. Thereby, the space in which the light emitting element 20 is located can be hermetically sealed. In FIG. 5, the plurality of bonding members 30a arranged on the first upper surface 121a can form a first bonding portion 31 having a wide width in a direction orthogonal to one side of the base body 10. In addition, in the process of arranging the joining member 30a, the joining member 30a may be continuously formed on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a by, for example, a printing method or a dispensing method.

図７は、接合部材３０ａを配置する工程における接合部材３０ａの別の配置例を示す。図７に示す例では、それぞれ間隔を開けて環状に配置された接合部材３０ａのうち、基体１０の第１上面１２１ａに配置される接合部材３０Ａの径が、他の部分に配置される接合部材３０ａの径よりも大きい。第１上面１２１ａに配置する接合部材３０Ａは、例えば、１００μｍ～３００μｍの範囲の径で形成することが好ましい。このような接合部材３０Ａを配置することで、基体１０の一辺と直交する方向における幅が広い第１接合部３１を構成することができる。 FIG. 7 shows another arrangement example of the joining member 30a in the step of arranging the joining member 30a. In the example shown in FIG. 7, among the joining members 30a arranged annularly at intervals, the diameter of the joining member 30A arranged on the first upper surface 121a of the base 10 is the same as that of the joining members arranged on other parts. It is larger than the diameter of 30a. The joining member 30A disposed on the first upper surface 121a is preferably formed with a diameter in the range of 100 μm to 300 μm, for example. By arranging such a joining member 30A, it is possible to configure the first joining portion 31 having a wide width in the direction perpendicular to one side of the base body 10.

［実施形態２］
図８は、実施形態２に係る発光装置における第１金属膜５１の配置例を示す概略上面図である。 [Embodiment 2]
FIG. 8 is a schematic top view showing an example of the arrangement of the first metal film 51 in the light emitting device according to the second embodiment.

図８に示す例において、第１金属膜５１は、基体１０の第１上面１２１ａに位置する第１金属部５１１と、基体１０の第２上面１２２ａに位置する第２金属部５１２と、基体１０の第３上面１２３ａに位置する第３金属部５１３と、を有する。第１金属部５１１の基体１０の一辺と直交する方向における幅は、第２金属部５１２の基体の一辺と直交する方向における幅よりも広い。 In the example shown in FIG. 8, the first metal film 51 includes a first metal portion 511 located on the first upper surface 121a of the base 10, a second metal portion 512 located on the second upper surface 122a of the base 10, and a second metal portion 512 located on the second upper surface 122a of the base 10. and a third metal portion 513 located on the third upper surface 123a of. The width of the first metal part 511 in the direction perpendicular to one side of the base 10 is wider than the width of the second metal part 512 in the direction perpendicular to the one side of the base.

接合部材３０ａを配置する工程において、実施形態１と同様に第１上面１２１ａに形成する接合部材３０ａの量を他の部分よりも多くすることが好ましい。上述した接合部材３０ａを加熱する工程において、溶融した接合部材３０ａに対する濡れ性は、第１金属膜５１が基材よりも高い。このため、溶融した接合部材３０ａは基材よりも第１金属膜５１上に広がりやすい。基体１０側において溶融した接合部材３０ａが濡れ広がる範囲は、第１金属膜５１の形状と略同一になり得る。これにより、接合部材３０ａと第１金属部５１１との接触面積を広くすることができる。 In the step of arranging the bonding member 30a, it is preferable to form a larger amount of the bonding member 30a on the first upper surface 121a than on other parts, similarly to the first embodiment. In the step of heating the bonding member 30a described above, the first metal film 51 has higher wettability with respect to the melted bonding member 30a than the base material. Therefore, the melted joining member 30a spreads more easily on the first metal film 51 than on the base material. The area in which the melted bonding member 30 a spreads and spreads on the base 10 side can be approximately the same as the shape of the first metal film 51 . Thereby, the contact area between the joining member 30a and the first metal portion 511 can be increased.

図８に示す例においては、第１金属部５１１が、第２金属部５１２の外縁よりも外側（第１面１１ａから離れる方向）に延在する延在部５１１ｅを有している。上述した接合部材３０ａを加熱する工程において、余剰の接合部材３０ａが延在部５１１ｅに向かって流れるようにすることで、接合部材３０ａが第１面１１ａ側へ流れることを抑制することができる。 In the example shown in FIG. 8, the first metal portion 511 has an extending portion 511e that extends outward from the outer edge of the second metal portion 512 (in the direction away from the first surface 11a). In the step of heating the joining member 30a described above, by allowing the excess joining member 30a to flow toward the extension portion 511e, it is possible to suppress the joining member 30a from flowing toward the first surface 11a.

図９は、実施形態２に係る発光装置における第２金属膜５２の配置例を示す概略下面図である。 FIG. 9 is a schematic bottom view showing an example of the arrangement of the second metal film 52 in the light emitting device according to the second embodiment.

図９に示す例において、第２金属膜５２は、基体１０の第１上面１２１ａの上方に位置する第１金属部５２１と、基体１０の第２上面１２２ａの上方に位置する第２金属部５２２と、基体１０の第３上面１２３ａの上方に位置する第３金属部５２３と、を有する。第１金属部５２１の基体１０の一辺と直交する方向における幅は、第２金属部５２２の基体１０の一辺と直交する方向における幅よりも広い。上述した接合部材３０ａを加熱する工程において、溶融した接合部材３０ａは透光性部材４０側において第２金属膜５２上に広がりやすい。これにより、接合部材３０ａと第１金属部５２１との接触面積を広くすることができる。 In the example shown in FIG. 9, the second metal film 52 includes a first metal portion 521 located above the first top surface 121a of the base 10 and a second metal portion 522 located above the second top surface 122a of the base 10. and a third metal portion 523 located above the third upper surface 123a of the base body 10. The width of the first metal portion 521 in the direction perpendicular to one side of the base 10 is wider than the width of the second metal portion 522 in the direction perpendicular to the one side of the base 10 . In the step of heating the bonding member 30a described above, the melted bonding member 30a tends to spread onto the second metal film 52 on the light-transmitting member 40 side. Thereby, the contact area between the joining member 30a and the first metal portion 521 can be increased.

図９に示す例においては、第１金属部５２１が、第２金属部５２２の内縁よりも内側（第１領域４１ｂ側）に延在する延在部５２１ｅを有しており、第２金属部５２２及び第３金属部５２３は、透光性部材４０の第１領域４１ｂから離隔して配置されている。これにより、発光素子２０からの光が第２金属部５２２及び第３金属部５２３によって遮られることを低減することができる。なお、第１金属部５２１は、第２金属部５２２の外縁よりも外側（第１領域４１ｂから離れる方向）に延在する延在部を有していてもよい。 In the example shown in FIG. 9, the first metal part 521 has an extending part 521e that extends inward (on the first region 41b side) from the inner edge of the second metal part 522, and the second metal part 522 and the third metal portion 523 are arranged apart from the first region 41b of the translucent member 40. Thereby, light from the light emitting element 20 can be prevented from being blocked by the second metal part 522 and the third metal part 523. Note that the first metal portion 521 may have an extension portion that extends outside the outer edge of the second metal portion 522 (in the direction away from the first region 41b).

１０基体
２０発光素子
３０接合部材
４０透光性部材
５１第１金属膜
５２第２金属膜
９０保護素子
１００発光装置 10 Base 20 Light emitting element 30 Bonding member 40 Transparent member 51 First metal film 52 Second metal film 90 Protective element 100 Light emitting device

Claims

a base body having a side wall portion having an upper surface and a first surface surrounded by the side wall portion;
a light emitting element disposed on the first surface;
a joining member disposed on the upper surface of the side wall portion;
a translucent member disposed above the side wall and the first surface and joined to the upper surface of the side wall by the joining member;
Equipped with
When viewed from above, the base body is rectangular;
The upper surfaces of the side wall portions include a first upper surface located at the center of one side of the base, a second upper surface located between the first upper surface and a corner of the base, and a second upper surface located at a corner of the base. a third upper surface;
The bonding member is arranged continuously on the first top surface, the second top surface, and the third top surface, and at least on one side of the base, the first bonding portion located on the first top surface is connected to the second top surface. the width in the direction perpendicular to one side of the base is wider than the second joint located at
The lower surface of the light-transmitting member has a first region disposed above the first surface and a second region disposed above the side wall portion,
a metal film disposed in the second region of the lower surface of the light-transmitting member and surrounding the first region;
The joining member is joined to the light-transmitting member via the metal film,
The metal film has a first metal part located above the first top surface and a second metal part located above the second top surface,
The width of the first metal part in a direction perpendicular to one side of the base is wider than the width of the second metal part in a direction perpendicular to one side of the base,
A light emitting device in which the first metal portion extends in a direction farther from the first region than an outer edge of the second metal portion .

In a top view, the second joint portion is spaced apart from the first surface,
The light emitting device according to claim 1, wherein the first joint portion extends closer to the first surface than an inner edge of the second joint portion.

The light emitting device according to claim 1, wherein the first joint portion extends in a direction farther from the first surface than an outer edge of the second joint portion when viewed from above.

the second metal part is spaced apart from the first region,
The light emitting device according to any one of claims 1 to 3, wherein the first metal part extends closer to the first region than the inner edge of the second metal part.

The light emitting device according to any one of claims 1 to 4 , wherein the base is made of ceramic.

The light-emitting device according to claim 1 , wherein the light-transmitting member is made of an inorganic material.

The light emitting device according to any one of claims 1 to 6 , wherein the light emitting element is a light emitting element that emits ultraviolet rays.