JP2024039037A - light emitting device - Google Patents

Abstract

[Problem] To provide a highly reliable light emitting device. [Solution] The light emitting device comprises a base having a sidewall portion having an upper surface and a first surface surrounded by the sidewall portion, a light emitting element arranged on the first surface, a bonding member arranged on an upper surface of the sidewall portion, and a light-transmitting member arranged above the sidewall portion and the first surface and bonded to the upper surface of the sidewall portion by the bonding member, wherein the base is rectangular in top view, the upper surface of the sidewall portion has a first upper surface located in a center of one side of the base, a second upper surface located between the first upper surface and a corner of the base, and a third upper surface located at the corner of the base, the bonding member is continuously arranged on the first upper surface, the second upper surface, and the third upper surface, and on at least one side, a first bonding portion located on the first upper surface is wider in a direction perpendicular to one side of the base than a second bonding portion located on the second upper surface, and the first bonding portion extends in a direction away from the first surface beyond an outer edge of the second bonding portion. [Selected figure] Figure 4

Description

The present disclosure relates to a light emitting device.

In a light emitting device, a configuration is known in which a light emitting element is disposed in a recess provided in a base, and a translucent member is bonded to the base using a bonding material such as AuSn so as to cover the upper part of the recess (Patent Document (see 1).

JP 2019-220672 Publication

In such light emitting devices, further improvement in reliability is required. The present disclosure provides a highly reliable light emitting device.

A light emitting device according to one aspect of the present disclosure includes a base body having a side wall portion having an upper surface, a first surface surrounded by the side wall portion, a light emitting element disposed on the first surface, and the side wall portion. and a light-transmitting member disposed above the side wall and the first surface and joined to the top surface of the side wall by the bonding member, when viewed from above. , the base body is rectangular, and the top surface of the side wall portion includes a first top surface located at the center of one side of the base body, and a second top surface located between the first top surface and a corner of the base body. , a third upper surface located at a corner of the base body, and the joining member is disposed continuously on the first upper surface, the second upper surface, and the third upper surface, and at least on one side, the joining member has a third upper surface located at a corner of the base. A first joint portion located on the top surface of the substrate is wider than a second joint portion located on the second top surface in a direction perpendicular to one side of the base, and the first joint portion is wider than the second joint portion located on the second top surface. The outer edge extends further away from the first surface than the outer edge.

According to the present disclosure, a highly reliable light emitting device can be provided.

1 is a schematic top view of a light emitting device according to Embodiment 1. FIG. 1 is a schematic bottom view of a light emitting device according to Embodiment 1. FIG. 2 is a schematic cross-sectional view taken along line III-III in FIG. 1. FIG. FIG. 3 is a schematic top view showing the arrangement of a joining member 30. FIG. It is a schematic bottom view of a translucent member. FIG. 3 is a schematic top view showing an example of arrangement of joining members in a step of arranging joining members. FIG. 7 is a schematic top view showing another arrangement example of the joining members in the step of arranging the joining members. FIG. 3 is a schematic top view showing the arrangement of a first metal film of a light emitting device according to a second embodiment. FIG. 7 is a schematic bottom view showing the arrangement of a second metal film in the light-transmitting member of Embodiment 2. FIG.

Embodiments of the invention will be described below with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and unless there is a specific description, the present invention is not limited to the following embodiments. Furthermore, the sizes, positional relationships, etc. of members shown in the drawings may be exaggerated for clarity of explanation.
Hereinafter, the present invention will be explained in detail based on the drawings. In the following explanation, terms indicating specific directions or positions (for example, "upper", "lower", and other terms containing these terms) are used as necessary, but the use of these terms is The purpose of the drawings is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the invention is not limited by the meanings of these terms. Also, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or members.
Further, the embodiments described below are illustrative of light emitting devices for embodying the technical idea of the present invention, and the present invention is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the component parts described below are not intended to limit the scope of the present invention, unless specifically stated, and are merely illustrative. It was intended. Furthermore, the content described in one embodiment or example is applicable to other embodiments or examples. Furthermore, the sizes, positional relationships, etc. of members shown in the drawings may be exaggerated for clarity of explanation.

[Embodiment 1]
Fig. 1 is a schematic top view of the light emitting device according to the present embodiment, Fig. 2 is a schematic bottom view of the light emitting device according to the present embodiment, and Fig. 3 is a schematic cross-sectional view taken along line III-III in Fig. 1.

The light emitting device 100 shown in FIG. 3 includes a base 10, a light emitting element 20, a translucent member 40, and a joining member 30.

In the example shown in FIG. 3, the base 10 has a flat base 11 and a side wall 12 disposed on the base 11. The base portion 11 and the side wall portion 12 may be integrated or may be separate bodies. The base body 10 has a side wall portion 12 having an upper surface 12a, and a first surface 11a surrounded by the side wall portion 12. The first surface 11a is located on the upper surface of the base 11. The inner wall surface 12c of the side wall portion 12 and the first surface 11a of the base portion 11 define a recessed portion. The first surface 11a of the base 11 is the bottom of the recess. A light emitting element 20 is arranged on the first surface 11a. The light emitting element 20 is located in a space 13 defined by the inner wall surface 12c of the side wall portion 12 of the base body 10, the first surface 11a of the base portion 11, and the lower surface 40b of the translucent member 40.

As shown in FIG. 4, the base 10 has a rectangular shape when viewed from above. In this specification, a rectangle is a shape that includes four sides and four corners, and the corners may be a right angle, a rounded shape, or a chamfered arc shape as shown in FIG. (spoon side) etc. The shape of the first surface 11a of the base 11 is, for example, a rectangle when viewed from above. The upper surface 12a of the side wall portion 12 is located outside the first surface 11a of the base portion 11. The upper surface 12a of the side wall portion 12 has a frame shape with a rectangular outer shape in a top view and a rectangular opening inside.

The upper surface 12a of the side wall portion 12 includes a first upper surface 121a located at the center of one side of the base 10, a second upper surface 122a located between the first surface 121a and a corner of the base 10, and a corner of the base 10. and a third upper surface 123a located at the bottom. In the example shown in FIG. 4, the upper surface 12a of the side wall portion 12 has a first upper surface 121a and a second upper surface 122a on each side forming a rectangular outer shape. Further, it has a third upper surface 123a at the four corners forming the outer shape. That is, the upper surface 12a of the side wall portion 12 has four first upper surfaces 121a, eight second upper surfaces 122a, and four third upper surfaces. In a top view, the four sides of the inner edge (rectangular opening) of the frame-shaped side wall portion 12 are constituted by the inner edges of the first upper surface 121a and the second upper surface 122a. Furthermore, the four corners of the rectangular opening in the side wall portion 12 are defined by the inner edge of the third upper surface 123a. In a top view, the boundary between the first upper surface 121a and the second upper surface 122a is between the light emitting element 20 and the sides forming the outer shape of the base 10, that is, the side surface of the light emitting element 20 is projected onto the side wall 12 of the base 10. It can be set at any position in the area. As shown in FIG. 4, the boundary between the first upper surface 121a and the second upper surface 122a coincides with the boundary between the first joint 31 and the second joint 32, which will be described later. Further, in a top view, the boundary between the second upper surface 122a and the third upper surface 123a is located at the boundary between the side of the rectangular opening of the side wall portion 12 and the curve of the rounded corner.

On the first surface 11a of the base 10, positive and negative upper surface wirings 14 are arranged. The light emitting element 20 is flip-chip mounted on the first surface 11a of the base 10. Specifically, a light emitting element 20 having positive and negative electrodes on the same side is used, and the positive and negative electrodes of the light emitting element 20 are electrically connected to the positive and negative upper surface wirings 14 of the base 10 through conductive members, respectively. ing. As the conductive member, for example, eutectic solder mainly composed of gold and tin, tin, silver, and copper, conductive paste containing silver, gold, palladium, etc., bumps containing silver or gold, etc. can be used. can. Note that the light emitting element 20 may be connected (face-up mounting) to the upper surface wiring 14 of the base 10 by a wire. Alternatively, a light emitting element may be used that has one of the positive and negative electrodes on the upper surface and the other electrode on the lower surface.

Lower surface wiring 15 is arranged on the second surface 10b of the base 10, which is located on the opposite side to the first surface 11a. The base 11 of the base body 10 has a through hole, and internal wiring (not shown) is arranged within the through hole. The upper surface wiring 14 and the lower surface wiring 15 are each connected by internal wiring. The base body 10 may or may not have the second recess 16 on the second surface 10b side. The second recess 16 is arranged from the second surface 10b to the outer surface 10c of the base body 10. When the second recess 16 is provided, the lower wiring 15 is also arranged on the outer surface 16c of the base 10 that defines the second recess 16. When the lower wiring 15 of the light emitting device 100 is bonded to another mounting board using solder or the like, the solder can enter the second recess 16. Thereby, the lower surface wiring 15 can be electrically connected more stably.

The light-transmitting member 40 is a member having a light-transmitting property that transmits at least the light from the light-emitting element 20, and transmits 60% or more of the light emitted from the light-emitting element 20, preferably 90% or more. . The shape of the transparent member 40 is, for example, a rectangle when viewed from above. The translucent member 40 may have a flat plate shape as shown in FIGS. 1 and 3, or may have a lens shape such as a spherical or aspherical upper surface and/or lower surface.

The joining member 30 joins the upper surface 12a of the side wall portion 12 of the base body 10 and the translucent member 40. The joining member 30 has a first joining part 31 that is a part that is joined to the first upper surface 121a, a second joining part 32 that is a part that is joined to the second upper surface 122a, and a part that is joined to the third upper surface 123a. 3 joint portions 33. In the example shown in FIG. 4, the joining member 30 is continuously arranged on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a when viewed from above. The first joint portion 31, the second joint portion 32, and the third joint portion 33 may be integral or separate bodies.

In the bonding member 30, on at least one side of the base 10, the first bonding portion 31 is wider than the second bonding portion 32 in the direction perpendicular to the one side of the base 10 on which the bonding member 30 is disposed. Thereby, the contact area between the first joint portion 31 of the joint member 30 and the first upper surface 121a of the base body 10 and the contact area between the first joint portion 31 of the joint member 30 and the translucent member 40 can be increased. can. Furthermore, by increasing the width of only the first joint portion 31, the amount of the joining member 30 used can be minimized, and the inside of the recess of the light emitting device can be hermetically sealed while suppressing an increase in the cost of the light emitting device. can. Further, absorption of light from the light emitting element 20 by the joining member 30 can be reduced. A light emitting device using a base 10 having a base 11 and a side wall 12 warps due to thermal contraction, and the height of the side wall 12 at the center of one side of the base 10 is lower than the height of the side wall 12 around it. It may occur that the value is lower than the actual value. Therefore, by increasing the contact area between the first joint part 31 of the joint member 30 and the first upper surface 121a of the base 10 and the contact area between the first joint part 31 of the joint member 30 and the translucent member 40, It is possible to strengthen the bonding force between the bonding member 30 and the base 10 and between the bonding member 30 and the light-transmitting member 40 in this portion. Thereby, separation between the bonding member 30 and the base 10 and between the bonding member 30 and the light-transmitting member 40 at the center of one side of the base 10 can be prevented. It is preferable that the joining member 30 is arranged such that the first joining part 31 has a wider width in the direction perpendicular to the sides of the base 10 than the second joining part 32 on two opposing sides of the base 10 . When the outer shape and opening shape of the side wall portion 12 in a top view are rectangular, the first joint portion 31 is larger than the second joint portion 32 in the direction perpendicular to the side of the base body 10 on the two opposing long sides. It is preferable to arrange them so that the width is wide. Further, on each of the four sides of the base body 10, it is preferable that the first joint portion 31 is arranged to have a wider width in the direction orthogonal to the side of the base body 10 than the second joint portion 32.

In a top view, the length of one side of the base body 10 can be, for example, 2 mm or more and 8 mm or less. The width of the first upper surface 121a and the second upper surface 122a of the base body 10 in the direction orthogonal to the sides of the base body 10 can be, for example, 0.3 mm or more and 0.7 mm or less. In the example shown in FIG. 1, the first upper surface 121a and the second upper surface 122a have the same width in the direction perpendicular to the sides of the base body 10. The first upper surface 121a and the second upper surface 122a may have different widths in the direction perpendicular to the sides of the base body 10. The length of the first upper surface 121a in the direction parallel to the sides of the base body 10 is preferably longer than the width (32W in FIG. 4) of the second joint portion 32, which will be described later. The length of the first upper surface 121a in the direction parallel to the sides of the base body 10 can be, for example, 300 μm or more and 1000 μm or less.

The ratio of the width of the first joint portion 31 of the joining member 30 (31W in FIG. 4) to the width of the upper surface 12a of the base body 10 (12W in FIG. 4) in the direction perpendicular to the sides of the base body 10 is, for example, 50% or more. It is preferable to do so. The width of the first joint portion 31 of the joint member 30 in the direction perpendicular to the sides of the base body 10 can be, for example, 0.15 mm or more and 0.65 mm or less. The ratio of the width of the second joint portion 32 of the joint member 30 (32W in FIG. 4) to the width of the upper surface 12a of the base body 10 (12W in FIG. 4) in the direction perpendicular to the sides of the base body 10 is, for example, 30% or more. It is preferable to do so. The width of the second joint portion 32 of the joint member 30 in the direction perpendicular to the sides of the base body 10 can be, for example, 0.09 mm or more and 0.6 mm or less.

Preferably, the first metal film 51 is disposed on the upper surface 12a of the base 10. In the example shown in FIG. 6 , the first metal film 51 is located between the bonding member 30 and the upper surface 12 a of the side wall portion 12 of the base body 10 . The first metal film 51 has a rectangular frame shape when viewed from above, and has four rounded corners. When the first metal film 51 is provided, the bonding member 30 is placed on the first metal film 51. Note that when the first metal film 51 is not provided, the bonding member 30 is arranged on the upper surface 12a of the side wall portion 12 of the base body 10.

As shown in FIG. 5, it is preferable that a second metal film 52 is disposed on the outer periphery of the lower surface 40b of the light-transmitting member 40. The second metal film 52 is located between the bonding member 30 and the lower surface 40b of the transparent member 40. The second metal film 52 is arranged to face the upper surface 12a of the side wall portion 12 of the base body 10. The second metal film 52 has a rectangular frame-like outer shape in a plan view when looking at the lower surface 40b of the light-transmitting member 40, and has four rounded corners. When having the second metal film 52, the joining member 30 is joined to the light-transmitting member 40 via the second metal film 52. Note that when the second metal film 52 is not included, the bonding member 30 is directly bonded to the lower surface 40b of the light-transmitting member 40. In the example shown in FIG. 5, the second metal film 52 is formed with the same width over the entire circumference.

The first metal film 51 and the second metal film 52 are preferably made of a metal material such as tungsten, molybdenum, nickel, gold, silver, platinum, titanium, copper, aluminum, or ruthenium. It is preferable that the first metal film 51 and the second metal film 52 have high wettability with respect to the bonding member 30.

The light emitting device 100 may or may not have a protection element such as a Zener diode. In the example shown in FIG. 4, a protection element 90 is arranged on the first surface 11a of the base 10.
Each element constituting the light emitting device 100 will be described below.

(Base 10)
The base 10 is for arranging the light emitting element 20. In the example shown in Fig. 3, the base 10 has a flat base 11 and a side wall 12 arranged on the base 11. The light emitting element 20 is arranged on a first surface 11a of the base 11, and a bonding member 30 is arranged on an upper surface 12a of the side wall 12. The shape of the first surface 11a of the base 11 defined by the side wall 12 is, for example, rectangular when viewed from above.

Base 10 includes an insulating base material, upper surface wiring 14, and lower surface wiring 15. Examples of the material for the insulating base material include ceramics, glass epoxy, and resin. It is preferable to use ceramics with high heat resistance and weather resistance, and examples of such ceramics include alumina, aluminum nitride, and mullite.

The first surface 11 a of the base 10 has upper surface wiring 14 . The second surface 10b of the base 10 has lower surface wiring 15. The upper surface wiring 14 and the lower surface wiring 15 can be made of materials known in the art. For the upper surface wiring 14 and the lower surface wiring 15, metals such as copper, aluminum, gold, silver, and tungsten can be used, for example.

(Light emitting element 20)
The light emitting element 20 is arranged on the first surface 11a of the base 10. As the light emitting element 20, a light emitting diode, a laser diode, etc. can be used.

The emission peak wavelength of the light emitting element 20 is not particularly limited, and a desired emission peak wavelength can be selected as appropriate, and for example, a wavelength of 250 nm or more and 600 nm or less can be used. For example, by using a light emitting diode that emits ultraviolet light, it can be used as a light source for sterilization or sterilization. The light emission peak wavelength of the light emitting element 20 that emits ultraviolet light is, for example, 400 nm or less.

The light emitting element 20 preferably uses a nitride semiconductor layer containing, for example, In _X Al _Y Ga _1-XY N (0≦X, 0≦Y, X+Y≦1). When using a light emitting element that emits light in the wavelength range from deep ultraviolet to ultraviolet, it is preferable that the element has a nitride semiconductor layer containing at least Al. The light emitting element 20 has at least a semiconductor layer including a light emitting layer and positive and negative electrodes.

In the example shown in FIG. 4, the light-emitting element 20 is disposed at the center of the first surface 11a of the base 10. Also, in the example shown in FIG. 4, one light-emitting element 20 is disposed in the light-emitting device 100. The light-emitting device 100 may be disposed with a plurality of light-emitting elements 20. The light-emitting element 20 may be, for example, rectangular in top view. In this case, the length of one side of the light-emitting element 20 in top view is, for example, preferably 50 μm or more and 3000 μm or less, and more preferably 300 μm or more and 2000 μm or less. Also, the shape of the light-emitting element 20 in top view may be, for example, a polygon such as a triangle or a hexagon.

(Joining member 30)
The joining member 30 is disposed between the base body 10 and the light-transmitting member 40 and joins the base body 10 and the light-transmitting member 40 together. When the light emitting device 100 has the first metal film 51 and the second metal film 52, the bonding member 30 is disposed between the first metal film 51 and the second metal film 52. Examples of the bonding member 30 include solder, low melting point glass, and resin. Examples of solder materials include Au-Sn and Au-In. Examples of the resin include silicone resin and epoxy resin.

A joining member 30 that joins the base body 10 and the translucent member 40 is arranged continuously on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a, as shown in FIG. That is, by disposing the bonding member 30 over the entire circumference of the upper surface 12a of the frame-shaped side wall portion 12, the inside of the recess of the light emitting device can be hermetically sealed.

In the example shown in FIG. 4, the inner edge of the joining member 30 is spaced apart from the opening of the side wall 12 when viewed from above. Thereby, absorption of light from the light emitting element 20 by the bonding member 30 can be reduced compared to the case where the bonding member 30 is disposed adjacent to the first surface 11a when viewed from above. As shown in FIG. 4, when viewed from above, the second joint 32 is arranged apart from the first surface 11a, and the first joint 31 is closer to the first surface 11a than the inner edge of the second joint 32. It may be made to extend.

(Translucent member 40)
The light-transmitting member 40 has a function of transmitting light from the light-emitting element 20 disposed on the base 10 and emitting the light to the outside of the light-emitting device 100. The material of the translucent member 40 is an inorganic material made of at least one selected from the group consisting of sapphire, borosilicate glass, quartz glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. I can give an example. The thickness of the transparent member 40 is 0.1 mm or more and 7 mm or less.

As shown in FIG. 3, the lower surface 40b of the translucent member 40 includes a first region 41b located above the first surface 11a of the base 10 and a second region 42b located above the side wall 12 of the base 10. including. The first region 41b faces the upper surface of the light emitting element 20 with the space 13 in between. The second region 42b of the lower surface 40b of the light-transmitting member 40 is joined to the upper surface 12a of the side wall portion 12 of the base body 10 by the joining member 30.

Hereinafter, a method for joining the base body 10 and the translucent member 40 using the joining member 30 will be described. As shown in FIG. 6, the bonding member 30a is placed on the upper surface 12a of the base 10 (or the upper surface of the first metal film 51 if it has the first metal film 51) by a printing method, a dispensing method, or the like. In the example shown in FIG. 5, a plurality of joining members 30a are arranged annularly at intervals. The joining member 30a is preferably formed with a diameter in the range of 80 to 400 μm, and more preferably in the range of 90 to 200 μm, for example. Further, the distance between the center points of adjacent joining members 30a is preferably set in the range of 80 μm to 1000 μm, and more preferably set in the range of 100 μm to 400 μm. By arranging the plurality of joining members 30a at intervals in this manner, the amount of joining members 30a can be reduced. Two joining members 30a are arranged on the first upper surface 121a in a direction perpendicular to the sides of the base body 10. On the first upper surface 121a, three or more joining members 30a may be arranged in a direction perpendicular to the sides of the base body 10. In the example shown in FIG. 6, the plurality of joining members 30a are each formed with the same diameter.

After placing the joining member 30a, the transparent member 40 is placed on the base 10 via the joining member 30a, and the joining member 30a is heated and melted to join the base 10 and the transparent member 40. . By connecting the melted joining members 30a, the joining members 30 can be continuously arranged on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a, as shown in FIG. Thereby, the space in which the light emitting element 20 is located can be hermetically sealed. In FIG. 5, the plurality of bonding members 30a arranged on the first upper surface 121a can form a first bonding portion 31 having a wide width in a direction orthogonal to one side of the base body 10. In addition, in the process of arranging the joining member 30a, the joining member 30a may be continuously formed on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a by, for example, a printing method or a dispensing method.

FIG. 7 shows another arrangement example of the joining member 30a in the step of arranging the joining member 30a. In the example shown in FIG. 7, among the joining members 30a arranged annularly at intervals, the diameter of the joining member 30A arranged on the first upper surface 121a of the base 10 is the same as that of the joining members arranged on other parts. It is larger than the diameter of 30a. The joining member 30A disposed on the first upper surface 121a is preferably formed with a diameter in the range of 100 μm to 300 μm, for example. By arranging such a joining member 30A, it is possible to configure the first joining portion 31 having a wide width in the direction perpendicular to one side of the base body 10.

[Embodiment 2]
FIG. 8 is a schematic top view showing an example of the arrangement of the first metal film 51 in the light emitting device according to the second embodiment.

In the example shown in FIG. 8, the first metal film 51 includes a first metal portion 511 located on the first upper surface 121a of the base 10, a second metal portion 512 located on the second upper surface 122a of the base 10, and a second metal portion 512 located on the second upper surface 122a of the base 10. and a third metal portion 513 located on the third upper surface 123a of. The width of the first metal part 511 in the direction perpendicular to one side of the base 10 is wider than the width of the second metal part 512 in the direction perpendicular to the one side of the base.

In the step of arranging the bonding member 30a, it is preferable to form a larger amount of the bonding member 30a on the first upper surface 121a than on other parts, similarly to the first embodiment. In the step of heating the bonding member 30a described above, the first metal film 51 has higher wettability with respect to the melted bonding member 30a than the base material. Therefore, the melted joining member 30a spreads more easily on the first metal film 51 than on the base material. The area in which the melted bonding member 30 a spreads and spreads on the base 10 side can be approximately the same as the shape of the first metal film 51 . Thereby, the contact area between the joining member 30a and the first metal portion 511 can be increased.

In the example shown in FIG. 8, the first metal portion 511 has an extending portion 511e that extends outward from the outer edge of the second metal portion 512 (in the direction away from the first surface 11a). In the step of heating the joining member 30a described above, by allowing the excess joining member 30a to flow toward the extension portion 511e, it is possible to suppress the joining member 30a from flowing toward the first surface 11a.

FIG. 9 is a schematic bottom view showing an example of the arrangement of the second metal film 52 in the light emitting device according to the second embodiment.

In the example shown in FIG. 9, the second metal film 52 includes a first metal portion 521 located above the first top surface 121a of the base 10 and a second metal portion 522 located above the second top surface 122a of the base 10. and a third metal portion 523 located above the third upper surface 123a of the base body 10. The width of the first metal portion 521 in the direction perpendicular to one side of the base 10 is wider than the width of the second metal portion 522 in the direction perpendicular to the one side of the base 10 . In the step of heating the joining member 30a described above, the melted joining member 30a tends to spread onto the second metal film 52 on the light-transmitting member 40 side. Thereby, the contact area between the joining member 30a and the first metal portion 521 can be increased.

In the example shown in FIG. 9, the first metal part 521 has an extending part 521e that extends inward (on the first region 41b side) from the inner edge of the second metal part 522, and the second metal part 522 and the third metal portion 523 are arranged apart from the first region 41b of the translucent member 40. Thereby, light from the light emitting element 20 can be prevented from being blocked by the second metal part 522 and the third metal part 523. Note that the first metal portion 521 may have an extension portion that extends outside the outer edge of the second metal portion 522 (in the direction away from the first region 41b).

10 Base 20 Light emitting element 30 Bonding member 40 Transparent member 51 First metal film 52 Second metal film 90 Protective element 100 Light emitting device

Claims (8)

a base body having a side wall portion having an upper surface and a first surface surrounded by the side wall portion;
a light emitting element disposed on the first surface;
a joining member disposed on the upper surface of the side wall portion;
a translucent member disposed above the side wall and the first surface and joined to the upper surface of the side wall by the joining member;
Equipped with
When viewed from above, the base body is rectangular;
The upper surfaces of the side wall portions include a first upper surface located at the center of one side of the base, a second upper surface located between the first upper surface and a corner of the base, and a second upper surface located at a corner of the base. a third upper surface;
The bonding member is disposed on the first top surface, the second top surface, and the third top surface, and at least on one side of the base, the first bonding portion located on the first top surface is located on the second top surface. The width in the direction perpendicular to one side of the base is wider than the second joint,
A light emitting device in which the first joint portion extends in a direction farther from the first surface than an outer edge of the second joint portion. In a top view, the second joint portion is spaced apart from the first surface,
The light emitting device according to claim 1, wherein the first joint portion extends closer to the first surface than an inner edge of the second joint portion. The lower surface of the light-transmitting member has a first region disposed above the first surface and a second region disposed above the side wall portion,
a metal film disposed in the second region of the lower surface of the light-transmitting member and surrounding the first region;
The joining member is joined to the light-transmitting member via the metal film,
The metal film has a first metal part located above the first top surface and a second metal part located above the second top surface,
3. The light emitting device according to claim 1, wherein a width of the first metal part in a direction perpendicular to one side of the base is wider than a width of the second metal part in a direction perpendicular to one side of the base. the second metal part is spaced apart from the first region,
The light emitting device according to claim 3, wherein the first metal part extends closer to the first region than an inner edge of the second metal part. The light emitting device according to claim 3 or 4, wherein the first metal part extends in a direction farther from the first region than an outer edge of the second metal part. The light emitting device according to any one of claims 1 to 5, wherein the base is made of ceramic. The light-emitting device according to claim 1, wherein the light-transmitting member is made of an inorganic material. The light emitting device according to any one of claims 1 to 7, wherein the light emitting element is a light emitting element that emits ultraviolet light.

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