JP6916453B2 - Light source device - Google Patents

Description

The present disclosure relates to a light source device.

Various light source devices in which one or more light emitting devices are mounted on a substrate are used. In such a light source device, it is known that the orientation of the light emitting device affects the emitted light of the light source device (Patent Document 1 and the like). Therefore, there is a demand for a light source device in which the displacement of the light emitting device is suppressed so that the light distribution of the light emitting device becomes a desirable light distribution after mounting the light emitting device.

Japanese Patent Application No. 2015-241247 (Japanese Unexamined Patent Publication No. 2016-157918)

An object of the present disclosure is to provide a light source device in which a misalignment when mounting a light emitting device on a substrate is suppressed.

The light source device of the embodiment of the present disclosure has a first electrode and a second electrode on the lower surface, and the light source device according to the present disclosure has a first electrode and a second electrode on the lower surface.
The first electrode includes an electronic component having first and second parts separated via a separation region, a base material, and a substrate having a pair of wiring layers arranged on the upper surface of the base material. A light source device in which an electronic component is placed so that the upper surface of a pair of wiring layers and the first electrode and the second electrode on the lower surface of the electronic component face each other, and the substrate faces the separation region. It has a first region at a position, and the first region is a region having a lower solder wettability than the surface of a pair of wiring layers located outside the first region.

According to the embodiment of the present disclosure, it is possible to provide a light source device in which misalignment when mounting the light emitting device on a substrate is suppressed.

It is a schematic top view which shows one Embodiment of the light source apparatus of this disclosure. It is a schematic top view which shows one Embodiment of the electronic component mounted on the light source device of FIG. It is a schematic bottom view which shows the electronic component of FIG. 2A. FIG. 3 is a schematic cross-sectional view taken along the line I-I'shown in FIG. 2A. It is a schematic transmission view in the top view of the electronic component of FIG. 2A. It is a schematic top view which shows one Embodiment of the substrate which comprises the light source apparatus of FIG. It is a schematic transmission diagram for demonstrating the positional relationship between a substrate and an electronic component. It is a schematic transmission diagram which shows another embodiment of the electronic component mounted on the light source apparatus of this disclosure. It is a schematic bottom view which shows the electronic component of FIG. 4A. It is a schematic transmission diagram for demonstrating the positional relationship between a substrate and an electronic component. It is a schematic transmission diagram for demonstrating the positional relationship between a substrate and an electronic component.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following. Further, the contents described in one embodiment can be applied to other embodiments. The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity.

[Light source device]
As shown in FIG. 1, the light source device 10 according to the embodiment of the present invention includes an electronic component 11a and a substrate 12.

[Electronic component 11a]
The electronic component 11a is a component mounted on the substrate 12 and constituting the light source device 10.
The electronic component 11a is, for example, a semiconductor light emitting element 1 such as a light emitting diode or a laser diode.
4. Or, a light emitting device 11 having a semiconductor light emitting element 14 can be used.

2A to 2C are diagrams showing an example of a light emitting device 11 used as an electronic component 11a. 2A is a schematic top view of the light emitting device 11, FIG. 2B is a schematic bottom view of the light emitting device 11, and FIG. 2C is a schematic cross-sectional view taken along the line I-I'shown in FIG. 2A. In FIG. 2C, the illustration of the wire is omitted. The light emitting device 11 includes a package 13 and a semiconductor light emitting element 14. The package 13 has a mother body 131, and a first electrode 15 and a second electrode 16. Figure 2
In the package 13 shown by A, a resin portion obtained by solidifying a light-reflecting resin material is used as the base body 131, and the base body 131, the first electrode 15, and the second electrode 16 are integrally formed.

The external shape of the electronic component 11a in the top view may be, for example, a polygon such as a quadrangle, a circle, or a shape close to these. For example, the light emitting device 11 has an outer shape in a top view, which is a quadrangle having a pair of sides extending in the first direction and a pair of sides extending in the second direction.

The first electrode 15 and the second electrode 16 are members for supplying power to the electronic component 11a. Therefore, as the first electrode 15 and the second electrode 16, a material having conductivity and having good wettability with a joining member such as solder is preferably used. In the light emitting device 11 shown in FIG. 2A, two semiconductor light emitting elements 14 are arranged on the upper surface of the first electrode 15, and the two semiconductor light emitting elements 14 are electrically connected to the first electrode 15 and the second electrode 16 via a wire. It is connected. The arrangement of the semiconductor light emitting element 14 is not limited to this, and may be arranged so as to straddle each of the first electrode 15 and the second electrode 16, for example. Further, at least one semiconductor light emitting element 14 may be arranged on the upper surface of each of the first electrode 21 and the second electrode 22.

The first electrode 15 and the second electrode 16 are arranged on the lower surface 11b of the electronic component 11a. FIG. 2B
In the light emitting device 11 shown by, the first electrode 15 and the second electrode 16 are the lower surface 11b of the light emitting device 11.
Is arranged so as to be exposed from the mother body 131. The first electrode 15 and the second electrode 16 arranged on the lower surface 11b of the electronic component 11a are joined to a pair of wiring layers 19 of the substrate 12, which will be described later, via solder.

The first electrode 15 is formed on the lower surface 11b of the electronic component 11a by the first portion 15a and the second portion 15.
Has b. The first part 15a and the second part 15b are separated via the separation region 13a. More specifically, the first part 15a and the second part 15b are the lower surface 11b of the electronic component 11a.
In, the first part 15a and the second part 15b are integrally connected on the upper surface side opposite to the lower surface 11b. In the light emitting device 11 shown in FIG. 2B, the first electrode 15 has a recessed portion 13b (a region surrounded by a broken line) on the lower surface thereof, and a part of the base body 131 is arranged in the recessed portion 13b. Then, on the lower surface 11b, the first
The portion 15a and the second portion 15b are separated by a mother body 131 arranged in the recessed portion 13b. The recessed portion 13b between the first portion 15a and the second portion 15b of the first electrode 15 can be formed by a known method. For example, a flat metal plate is prepared and subjected to etching or pressing to form a lead frame including a portion to be the first electrode 15 and a portion to be the second electrode 16. Then, at the same time as the step of forming the portion to be the first electrode 15 and the portion to be the second electrode 16, or in another step, the recessed portion 13b is formed in the lead frame. Specifically, the recessed portion 13b is formed by etching or pressing a part of the portion to be the first electrode 15 on the lower surface of the metal plate or the lead frame so as not to penetrate in the thickness direction. ..

On the lower surface 11b of the electronic component 11a, the planar shape of the first portion 15a is different from the planar shape of the second portion 15b. In the light emitting device 11 shown in FIG. 2B, the first part 15a and the second part 15
b are arranged side by side in the first direction, and the width of the first part 15a extending in the second direction is the second part 15b.
Wider than the width extending in the second direction of. Further, the width of the first part 15a extending in the first direction is wider than the width of the second part 15b extending in the first direction. First part 15a and second part of the first electrode 15.
When the electronic component 11a is mounted on the substrate 12, the tensile strength of the solder applied to each of the first portion 15a and the second portion 15b is different when the portion 15b has a different shape. This will
When the electronic component 11a is mounted on the substrate 12, the electronic component 11a may be misaligned. In the light source device 10 of the present disclosure, the substrate 12 has a first region 21 having poor solder wettability, which will be described later, and the first region 21 is a separation region 13a between the first portion 15a and the second portion 15b.
It is provided at a position facing the. By providing the first region 21 at a specific position on the substrate 12, even if an electronic component having a different shape from the first portion 15a and the second portion 15b of the first electrode 15 is used, the electronic component 11a The misalignment can be suppressed in the first region 21, and the mounting accuracy of the electronic component 11a can be improved.

Although the light emitting device 11 has been described as an example of the electronic component 11a, the electronic component 11a has been described so far.
Is not limited to the light emitting device. The electronic component 11a also includes a semiconductor light emitting element, a power semiconductor, a power supply rectifying diode, a Zener diode, a variable capacitance diode, a PIN diode, a Schottky barrier diode, a photodiode, a solar cell, a surge protection diode, a varistor, and a capacitor. Two-terminal device such as resistor, diode, bipolar transistor, electric field effect transistor, phototransistor, CCD image sensor, thyristor,
It may be a 3-terminal device such as an optical trigger thyristor, a memory such as a DRAM or SRAM, a microprocessor or the like. When the light source device 10 includes a plurality of electronic components 11a, the plurality of electronic components 11a can be used in combination with the light emitting device 11 and the above-mentioned electronic components.

The semiconductor light emitting device 14 is a nitride semiconductor (In _x Al _{y) capable of emitting light in the ultraviolet to visible region.}
It is preferable to include Ga _1-xy N, 0 ≦ x, 0 ≦ y, x + y ≦ 1). In addition, electronic component 1
When the light emitting device 11 is used as 1a, the light emitting device 11 may include one semiconductor light emitting element 14 or may include two or more semiconductor light emitting elements 14. When the light emitting device 11 includes two semiconductor light emitting elements 14, for example, a light emitting element that emits blue light and a light emitting element that emits green light can be used in combination. When the light emitting device 11 includes three semiconductor light emitting elements 14, for example, a light emitting element that emits blue light, a light emitting element that emits green light, and a light emitting element that emits red light can be used in combination. When there are two or more semiconductor light emitting elements 14, each semiconductor light emitting element is electrically connected in series, in parallel, or in a combination of series and parallel. When the light emitting device 11 is used as the electronic component 11a,
The semiconductor light emitting device 14 is mounted on the package 13 with the electrode forming surface facing up (face-up mounting), or mounted on the package 13 with the electrode forming surface facing down (flip chip mounting). Either is fine. When the semiconductor light emitting element 14 is used as the electronic component 11a, the first electrode 15 and the second electrode 16 of the semiconductor light emitting element 14 are formed on the same surface.
The semiconductor light emitting device 14 is mounted on the substrate 12 with the electrode forming surface facing down (flip chip mounting).
Will be done.

When the light emitting device 11 is used as the electronic component 11a, the material constituting the base 131 of the package 13 is, for example, a ceramic or resin such as aluminum oxide or aluminum nitride (for example, a silicone resin, a silicone-modified resin, an epoxy resin, or an epoxy-modified resin). , Unsaturated polyester resin, phenol resin, polycarbonate resin, acrylic resin, trimethylpentene resin, polynorbornene resin or hybrid resin containing one or more of these resins), pulp, glass, or a composite material thereof. In addition, the mother body 1 of the package 13
31 may have a single-layer structure or a multi-layer structure including a plurality of layers.

The first electrode 15 and the second electrode 16 are made of, for example, copper, aluminum, gold, silver, as a base material.
Metals such as tungsten, iron and nickel, or alloys such as iron-nickel alloy and phosphor bronze can be used. Further, the first electrode 15 and the second electrode 16 may be provided with a metal layer on the surface of the base material. The metal layer is, for example, silver, aluminum, nickel, palladium, rhodium,
Gold, copper, alloys thereof, etc. can be made into a single layer or a plurality of layers. The first electrode 1
The 5 and the second electrode 16 may have a region where the metal layer is not provided. Further, in the first electrode 15 and the second electrode 16, the metal layer formed on the upper surface and the metal layer formed on the lower surface may be different. For example, the metal layer formed on the upper surface may be a metal layer composed of a plurality of layers including a nickel metal layer, and the metal layer formed on the lower surface may be a metal layer not containing a nickel metal layer. Further, the thickness of the metal layer formed on the upper surface is preferably thicker than the thickness of the metal layer formed on the lower surface. Since the metal layer on the upper surface side is thick, the light from the semiconductor light emitting element 14 can be efficiently reflected upward. Further, by thinning the metal layer on the lower surface side that does not directly reflect the light from the semiconductor light emitting element 14, the cost of the light emitting device 11 can be suppressed. When the thickness of the metal layer on the upper surface and the thickness of the metal layer on the lower surface are different, the number of layers of each metal layer is the same, and the total thickness is obtained by making the thickness of some or all of the layers different. May be changed. Alternatively, the overall thickness may be changed by making the number of layers of the metal layer on the upper surface different from that of the metal layer on the lower surface.

When a silver or silver alloy metal layer is formed on the outermost surfaces of the first electrode 15 and the second electrode 16, a protective layer such as silicon oxide may be provided on the surface of the silver or silver alloy metal layer. preferable. As a result, it is possible to prevent the metal layer of silver or the silver alloy from being discolored due to the sulfur component in the atmosphere. The protective layer can be formed by a vacuum process such as sputtering or atomic layer deposition, and other known methods may be used.

[Board 12]
FIG. 3A is a schematic top view of the substrate 12 before the electronic component 11a is mounted, and FIG. 3B is a schematic transmission for explaining the positional relationship between the substrate 12 and the electronic component 11a after the electronic component 11a is mounted. It is a figure. As shown in FIG. 3A, the substrate 12 includes a base material 17 and a pair of wiring layers 19 (first wiring layer 19a and second wiring layer 19b). The substrate 12 is a member for mounting the electronic component 11a, and is a member constituting the light source device 10. As shown in FIG. 3B
A part of the pair of wiring layers 19 is arranged directly below the electronic component 11a. Specifically, the electronic component 1
A part of the first wiring layer 19a is arranged directly below the first electrode 15 of 1a, and the second electronic component 11a is provided.
A part of the second wiring layer 19b is arranged directly below the electrode 16. The first electrode 15 and the first wiring layer 19a and the second electrode 16 and the second wiring layer 19b are electrically connected via solder, respectively.

The substrate 12 has a first region 21 at a position that overlaps with the electronic component 11a in the top view and faces the separation region 13a of the lower surface 11b of the electronic component 11a. The first region 21 is
The solder wettability is worse than the surface of the pair of wiring layers 19 in regions other than the first region 21. FIG. 3B
In the first region 21, a through hole is provided in the first wiring layer 19a, and a part of the base material 17 is exposed at the bottom of the through hole. A part of the base material 17 exposed at the bottom of the through hole has poorer solder wettability than the pair of wiring layers 19. Then, the electronic component 11a is solder-mounted on the substrate 12 so that the separation region 13a of the electronic component 11a and the first region 21 (through hole) of the substrate 12 face each other. By mounting the electronic component 11a on the substrate 12 in such an arrangement, the first region 21 of the substrate 12 is located between the first portion 15a and the second portion 15b of the electronic component 11a in the top view. As a result, a part of the solder that wets and spreads in the first part 15a and a part of the solder that spreads in the second part 15b are separated through the first region 21 having poor solder wettability. As a result, the first
The pulling force of the solder applied to the part 15a can be made less likely to affect the second part 15b side, while the pulling force of the solder applied to the second part 15b can be made less likely to affect the first part 15a side. .. As a result, the self-alignment property of the electronic component 11a can be improved.

The fact that the first region 21 has a lower solder wettability than the surface of the pair of wiring layers 19 in regions other than the first region 21 means that the affinity (easiness of adhesion) of the solder with respect to the first region 21 is first. It refers to a solder having a lower affinity for a pair of wiring layers 19 other than the region 21. Solder wettability is the first
It can be represented by the contact angle of the solder on the surface of the region 21 or the pair of wiring layers 19. The contact angle of the solder becomes large in the region where the solder wettability is poor. Therefore, the contact angle of the solder in the first region 21 is larger than the contact angle of the solder on the surface of the pair of wiring layers 19. The contact angle of the solder can be measured by a known method such as a sessile drop method, a suspension method, a plate method, or a Washburn method.

After mounting the electronic component 11a on the substrate 12, the first region 21 is the first part 1 in the top view.
The position is substantially in contact with at least one of the inner portion 150a of the 5a and the inner portion 150b of the second portion 15b. The substantially contacting position means, for example, a distance separated by about 0 to 50 μm. For example, when the first region 21 is in a position substantially in contact with the inner portion 150a of the first portion 15a in the top view, the electronic component 11a is displaced in the direction from the first portion 15a to the second portion 15b. Can be suppressed. On the other hand, when the first region 21 is in a position substantially in contact with the inner portion 150b of the second portion 15b in the top view, the electronic component 11a is moved from the second portion 15b to the first portion 1.
It is possible to suppress the displacement in the direction toward 5a. In FIG. 3B, the first region 21 is provided at a position where it is in contact with both the inner portion 150a of the first portion 15a and the inner portion 150b of the second portion 15b. As a result, it is possible to suppress the positional deviation in both the + direction and the-direction in the first direction.

The first region 21 can have various shapes. The planar shape of the first region 21 is circular.
Examples thereof include an ellipse, a polygon, and an irregular shape obtained by combining these shapes. Among them, the planar shape of the first region 21 is preferably a shape such as a circular shape or an elliptical shape that can be easily processed. The first region 21 shown in FIG. 3B has a track shape that is long in the first direction when viewed from above.
The planar shape of the first region 21 may be, for example, a shape long in the second direction, or the first portion 15 may be formed.
It may have a substantially rectangular shape having a straight line parallel to the inner portion 150a of the inner portion 150a of a or the inner portion 150b of the second portion 15b.
The width of the first region 21 preferably has, for example, a width corresponding to the separation region 13a, that is, the shortest distance between the first portion 15a and the second portion 15b. Further, the first region 21 may be provided in all the regions facing the separation region 13a, or as shown in FIG. 3B, the separation region 1
It may be a part of the region facing 3a. The first region 21 may be one for each electronic component 11a, but two or more may be arranged.

Further, the substrate 12 may have a second region 22 in addition to the first region 21. Similar to the first region 21, the second region 22 is a region having poorer solder wettability than the surface of the wiring layer 19 in regions other than the first region 21 and the second region 22. The first region 21 is the substrate 1 as described above.
It is provided at a position facing the separation region 13a of the lower surface 11b of the electronic component 11a on the surface of 2. On the other hand, the second region 22 is a peripheral region on the surface of the substrate 12, excluding the position facing the separation region 13a of the lower surface 11b of the electronic component 11a, and on the periphery of the first electrode 15 and the second electrode 16. It is provided at a facing position. In FIG. 3B, the second region 22 is provided at a position facing the peripheral regions of the four corners of the first electrode 15 and the second electrode 16 on the surface of the substrate 12.
Specifically, the lower surface 11b of the electronic component 11a is separated from the first side 11c in the second direction.
And has a second side 11d. The second region 22 provided on the substrate 12 is located at a position facing both ends of the region sandwiched between the side portions 151a and 151b of the first electrode 15 and the second electrode 16 and the first side 11c, respectively. Side portions 152a, 153a and second side 11 of 1 electrode 15
It is located at a position facing both ends of the region sandwiched by d. The first wiring layer 19a and the second wiring layer 19b are not provided in the second region 22, and the base material 17 is exposed. Each second region 22 has side portions 151a, 152a, 153a when the electronic component 11a is mounted.
, 151b. The positions that are substantially in contact with the side portions 151a, 152a, 153a, 151b are, for example, the second side portions 151a, 152a, 153a, 151b and the second.
The distance from the region 22 is 0 to 50 μm. In this way, the second region 22 is provided in the regions on the first side 11c side and the second side 11d side facing each other in the second direction on the upper surface of the substrate 12, and the second region 22, the first electrode 15, and the second region are provided. By being in a position where the side portions of the two electrodes 16 are substantially in contact with each other, it is possible to prevent the electronic component 11a from shifting in the second direction when the electronic component 11a is mounted via solder. As a result, the self-alignment property of the electronic component 11a can be improved, and the mounting accuracy of the electronic component 11a can be improved. In addition, the second region 22
Is provided at a position facing the peripheral regions of the four corners of the first electrode 15 and the second electrode 16, so that the rotation of the electronic component 11a can be suppressed, and the mounting accuracy of the electronic component 11a is further improved. The displacement of the electronic component 11a in the first direction is suppressed by the first region 21.

In the substrate 12 shown in FIG. 3B, a plurality of second regions 22 are provided, but the second region 22 is 1.
Any number is acceptable. Further, the solder wettability of the first region 21 and the second region 22 is preferably the same, but may be different.

The first region 21 is not limited to a form in which a through hole is provided in the pair of wiring layers 19. for example,
The substrate 12 may have a conductive member or an insulating member on the upper surface of the pair of wiring layers 19 located in the first region 21. As the conductive member or the insulating member, a material having a lower solder wettability than the surface of the pair of wiring layers 19 in a region other than the first region 21 is used. In addition, the substrate 12
Is to change a part of the material of the pair of wiring layers 19 or a part of the state (surface roughness, surface treatment state, etc.) of the pair of wiring layers 19 in the first region 21. The solder wettability may be different. The second region 22 is the same as the first region 21.

Examples of the insulating member constituting the first region 21 include silicone resin, silicone-modified resin, and the like.
Examples thereof include epoxy resin, phenol resin, polycarbonate resin, acrylic resin, trimethylpentene resin, polynorbornene resin, and hybrid resin containing one or more of these resins. In addition, oxides such as aluminum oxide and nitrides such as aluminum nitride can be used.
As the conductive member constituting the first region 21, the pair of wiring layers 19 and the first electrode 1 described above are used.
It can be selected from the materials constituting the 5 and the second electrode 16.

When the base material 17 exposed from the through holes formed in the pair of wiring layers 19 is used as the first region 21 or the second region 22, the through holes are formed at the same time when the pair of wiring layers 19 are patterned. can do. By forming through holes at the same time when patterning the pair of wiring layers 19, the first region 21 or the second region 22 can be formed at low cost. Alternatively, it can be formed by a pressing method using a mold, a roll press, or the like, punching by punching, or the like.
When a conductive member or an insulating member is used as the first region 21 or the second region 22, it can be arranged at a specific position by using a photolithography, a sputtering method, a printing method, or the like. In this case, the thickness of the conductive member or the like is preferably the same as or thinner than the thickness of the solder used for mounting the electronic component 11a and the substrate 12. In this form, the volume of the pair of wiring layers 19 is not reduced. Therefore, the heat dissipation of the substrate 12 can be improved as compared with the form of the through hole.
When the surface roughness of the wiring layer in the first region 21 or the second region 22 is different, it can be formed by polishing, laser scribe, or the like. In this form,
After forming the pair of wiring layers 19, the first region 21 or the second region 22 can be formed with a high degree of freedom, if necessary.

The substrate 12 preferably includes a covering member 23 that covers the upper surface of the pair of wiring layers 19 in addition to the base material 17 and the pair of wiring layers 19. By covering the upper surfaces of the pair of wiring layers 19 with the covering member 23, the pair of wiring layers 19 can be protected and the insulating property of the substrate 12 can be ensured. Further, the covering member 23 is preferably a member having high light reflectivity, and preferably has a laminated structure composed of a plurality of layers. As a preferred form of the covering member 23, the covering member 23 has a first covering member 23a and a second covering member 23b. The first covering member 23a covers substantially the entire area of the upper surface of the base material 17 other than the mounting area of the electronic component 11a. As the second covering member 23b, a member having higher light reflectivity than the first covering member 23a is used, and the upper surface of the first covering member 23a is locally covered, for example, the electronic component 1.
Only the vicinity of 1a is covered. In this way, the covering member 23 has the first covering member 23a and the second covering member 23b, and by arranging each covering member as described above, the pair of wiring layers 19 is protected by the first covering member 23a. The second covering member 23b can efficiently reflect the light emitted from the electronic component 11a (light emitting device 11) to the upper surface side.
As the first covering member 23a and the second covering member 23b, a member containing a light-reflecting substance in a resin material can be used.

(Base material 17)
A pair of wiring layers 19 are arranged on the surface of the base material 17. Examples of the material of the base material 17 include metals such as aluminum and copper, ceramics such as aluminum oxide and aluminum nitride, resins, pulps, glass, and composite materials thereof. Examples of the composite material include glass epoxy, glass silicone and glass modified silicone. The base material 17 may have a single-layer structure or a multi-layer structure including a plurality of layers.

(Pair of wiring layers 19)
The pair of wiring layers 19 are members that are electrically connected to the electronic component 11a and supply power to the electronic component 11a. The pair of wiring layers 19 are arranged on the upper surface of the base material 17. The pair of wiring layers 19
It has a first wiring layer 19a and a second wiring layer 19b, and the first wiring layer 19a and the second wiring layer 19b are separated from each other with a groove 18 interposed therebetween.
The pair of wiring layers 19 can be formed of, for example, a metal such as copper, aluminum, gold, silver, tungsten, iron or nickel, or an alloy such as an iron-nickel alloy or phosphor bronze.
The surface of the pair of wiring layers 19 may be covered with a metal layer or the like.

The substrate 12 may be other than the pair of wiring layers 19 depending on the number of electronic components 11a mounted on the substrate 17, the connection form of the electronic components 11a, the number of external electrodes (or terminals) in one electronic component, and the like. Other wiring layers may be provided. The other wiring layer may be, for example, a portion intended for heat dissipation that does not contribute to energization. Further, the first wiring layer 19a and the second wiring layer 19b may be different in size and shape from each other in the top view.

The groove 18 located between the first wiring layer 19a and the second wiring layer 19b faces the region between the first electrode 15 and the second electrode 16 of the electronic component 11a.
The planar shape of the groove 18 is preferably bent just below one electronic component.
The bending direction of the groove 18 is not particularly limited, and examples thereof include those in which the groove 18 extends in the second direction and bends in the first direction. The bending from the second direction to the first direction may be one or a plurality. Further, there may be one or more bends from the first direction to the second direction.
Further, in the top view, the shape or size of the groove 18 facing the region between the first electrode 15 and the second electrode 16 is the shape or size of the region between the first electrode 15 and the second electrode 16. It is preferable that the result is substantially the same as.

The pair of wiring layers 19 can be formed on the base material 17 in any shape by a method known in the art. For example, a method of forming a material to be a wiring layer by a sputtering method or the like through a mask and patterning by lift-off, a method of forming a film of a material to be a wiring layer by vapor deposition or the like on the entire surface, and a photolithography method using a mask, etc. A method of patterning using the above can be mentioned. Further, a pair of wiring layers 19 may be formed by pasting the pre-patterned wiring on the base material 17.

The electronic component 11a is mounted on the upper surface of the pair of wiring layers 19 of the substrate 12 via solder. Examples of the solder material include an alloy containing Ag, Cu and Sn as main components, an alloy containing Cu and Sn as main components, and an alloy containing Bi and Sn as main components.
In such mounting via solder, the solder spreads on the upper surface of the pair of wiring layers 19, and the electronic component 1
1a may cause misalignment. In the light source device 10 of the present disclosure, since the substrate 12 has the first region 21 and the second region 22 described above, self-alignment when the electronic component 11a is mounted can be effectively ensured. As a result, the mounting accuracy of the electronic component 11a can be improved.

(Other parts)
When the light emitting device 11 is used as the electronic component 11a, the light emitting device 11 may be further provided with an optical member such as a sealing member and a protective element such as a Zener diode 25 on the upper surface serving as the light extraction surface thereof.

(Embodiment 1)
As shown in FIG. 1, the light source device 10 of the first embodiment includes a light emitting device 11 corresponding to an electronic component 11a and a substrate 12.
As shown in FIGS. 2A to 2C, the light emitting device 11 includes two semiconductor light emitting elements 14 and a package 13 on which the semiconductor light emitting elements 14 are mounted.
Package 13 is a base 1 containing an epoxy resin containing 15 to 25% by weight of titanium oxide.
It has 31 and a first electrode 15 and a second electrode 16, and has a substantially square planar shape (for example, 3 mm × 3 mm). The first electrode 15 and the second electrode 16 include copper and a metal layer formed on the surface of the copper, and are formed to have a maximum thickness of 200 μm. The first electrode 15 and the second electrode 16 are electrically connected to a pair of electrodes of the semiconductor light emitting element 14 by a wire.
The first electrode 15 is formed on the lower surface 11b of the light emitting device 11 by the first portion 15a and the second portion 15b.
have. The first part 15a and the second part 15b are separated via a separation region 13a.

FIG. 2D is a transmission top view of the light emitting device 11 of the first embodiment. As shown in FIG. 2D, the first electrode 15 and the second electrode 16 have outer peripheral portions 15X and 16X, and the first portion 15a and the second portion 15
It has a separation region 13a between b and a recessed portion recessed from the lower surface side to the upper surface side. In addition, the first electrode 1
On the upper surfaces of the 5 and the second electrode 16, the mother body 131 containing the resin material, the first electrode 15 and the second electrode 16
It has recesses 15Y and 16Y in order to improve the adhesion with the electrode 16. The recess 15Y formed on the upper surface of the first portion 15a and the 15Y formed on the upper surface of the second portion 15b are separated in a region overlapping the separation region 13a in the top view. As a result, the recessed portion formed on the lower surface of the first electrode 15 and the recessed portion 15Y formed on the upper surface do not overlap in the upper surface view, so that the strength of the first electrode 15 can be ensured.
On the lower surface 11b of the light emitting device 11, the first portion 15a has a larger flat area than the second portion 15b.

As shown in FIGS. 3A and 3B, the substrate 12 includes a base material 17 and a pair of wiring layers 19. The base material 17 of the first embodiment is made of a glass epoxy having a single layer structure, and the pair of wiring layers 19 are made of copper.
The substrate 12 has a first region 21 at a position facing the separation region 13a on the lower surface 11b of the light emitting device 11 at a position where the light emitting device 11 is mounted. The first region 21 is a region having poorer solder wettability than the surface of the pair of wiring layers 19 in regions other than the first region 21. In particular,
A through hole is formed in the pair of wiring layers 19 located in the first region 21, and a part of the base material 17 is exposed at the bottom of the through hole. In other words, of the pair of wiring layers 19 containing copper, the pair of wiring layers 19 located in the first region 21 are provided with through holes, and the base material 17 containing glass epoxy is exposed at the bottom of the through holes. That is, the first region 21 in the first embodiment becomes the base material 17. The solder wettability on the surface of the base material 17 containing the glass epoxy is worse than the solder wettability on the surface of the pair of wiring layers 19 containing copper.
The substrate 12 further has four second regions 22 in addition to the first region 21. Second
Similar to the first region 21, the region 22 is a region having poorer solder wettability than the surface of the pair of wiring layers 19 in regions other than the first region 21 and the second region 22. The second region 22 is also the first region 21
Similarly, a through hole is provided, and a part of the base material 17 is exposed at the bottom of the through hole. That is, the second region 22 in the first embodiment is the base material 17.

The pair of wiring layers 19 are arranged on the upper surface of the base material 17 with the groove 18 interposed therebetween. The groove 18 is arranged on the upper surface of the substrate 12 facing the region between the first electrode 15 and the second electrode 16 of the light emitting device 11. The width of the groove is, for example, 400 μm.
The groove 18 is bent immediately below one semiconductor light emitting device 14 in accordance with the shape of the separated region between the first electrode 15 and the second electrode 16.

A part of the surface of the pair of wiring layers 19 is covered with the covering member 23. Covering member 2
3 exposes a part of the wiring layer necessary for electrical connection with the light emitting device 11 and covers the surface of the base material 17 including the other wiring layer. That is, the covering member 23 has an opening that exposes the area where the light emitting device 11 is mounted.
The covering member 23 includes a first covering member 23a that covers a pair of wiring layers 19 over substantially the entire surface of the substrate 12, and a second covering member 23b that is arranged only around the light emitting device 11.

The light emitting device 11 is mounted on the wiring layer 19 of the substrate 12 via solder. The solder material is, for example, an alloy containing Ag, Cu, and Sn as main components. When the light emitting device 11 is mounted via solder, the solder usually spreads on the upper surface of the wiring layer, which may cause the light emitting device 11 to be displaced, the light emitting device to rotate, or the like. However, in the light source device 10 of the present disclosure, by arranging the first region 21 and the second region 22 at specific positions on the substrate 12, it is possible to effectively prevent the misalignment of the light emitting device 11. Further, when the light source device 10 is used as a direct type backlight light source, a lens member may be provided on the upper surface of each light emitting device 11. Even in such a case, in the light source device 10 of the present disclosure, the misalignment of the light emitting device 11 is effectively suppressed, so that the optical axis of each light emitting device 11 and the optical axis of each lens member are aligned. It has the effect of being easy.

(Embodiment 2)
As shown in FIGS. 4A to 4C, the light source device of the second embodiment includes a light emitting device 31 corresponding to the electronic component 11a and a substrate. 4A is a schematic transmission view of the light emitting device 31 in a top view, FIG. 4B is a schematic bottom view showing the light emitting device 31 of FIG. 4A, and FIG. 4C is a substrate and a light emitting device 31.
It is a schematic transparent view for demonstrating the positional relationship with.
As shown in FIG. 4A, the light emitting device 31 has a rectangular shape long in the first direction, and the package 3
3 and two semiconductor light emitting elements 34 mounted on the package 33 are provided. Light emitting device 31
The first electrode 35 and the second electrode 36 are provided, and the first electrode 35 and the second electrode 36 are exposed on the lower surface of the light emitting device 31. The first electrode 35 has a first portion 35a and a second portion 35b on the lower surface of the light emitting device 31. The first part 35a and the second part 35b are separated via the separation region 31b.
The first portion 35a and the second portion 35b of the first electrode 35 are arranged side by side in the first direction.

As shown in FIG. 4C, the substrate includes a pair of wiring layers 39a, 39b arranged on the upper surface.
A groove 38 is arranged between the pair of wiring layers 39a and 39b.
Immediately below one light emitting device 31, the groove 18 extends in the second direction and bends in the first direction, corresponding to the shapes of the first electrode 35 and the second electrode 36.
The substrate is a separation region 31b on the lower surface of the light emitting device 31 at a position where the light emitting device 31 is mounted.
The first region 41 is provided at a position facing the surface. The substrate further has four second regions 42 in addition to the first region 41. Through holes are formed in the pair of wiring layers 39a and 39b located in the first region 41, and a part of the base material is exposed at the bottom of the through holes. Similarly, through holes are formed in the pair of wiring layers 39a and 39b located in the second region 42, and a part of the base material is exposed at the bottom of the through holes.

The light source device has the same configuration as that of the first embodiment except for the above.
By arranging the first region 21 and the second region 22 at specific positions on the substrate in this way,
The misalignment of the light emitting device 31 can be effectively prevented. As a result, the self-alignment of the light emitting device 31 can be effectively ensured, and the mounting accuracy of the light emitting device 31 can be improved.

(Other embodiments)
The first electrode and the second electrode of the electronic component of the present disclosure can have various shapes. FIG. 5 shows a first electrode 55 and a second electrode 56 exposed on the lower surface of an electronic component, and a first electrode arranged on a substrate.
It is a schematic diagram which shows the region 21 and the 2nd region 22. For the sake of simplicity, the external parts and the outer shape of the substrate are omitted.
As shown in FIG. 5, the first electrode 55 has a convex portion in a top view, the second electrode 56 faces the first electrode 55, and has a concave portion in which the convex portion of the first electrode 55 fits. And the first electrode 5
Reference numeral 5 denotes a substantially rectangular first portion 55a and a substantially rectangular second portion 55b corresponding to a convex portion on the lower surface of the electronic component. Then, the separation region 51b between the first part 55a and the second part 55b
The first region 21 is arranged at a position facing the surface. Further, the first electrode 55 and the second electrode 5
Four second regions 22 are arranged in the vicinity of the corners of 6. The substrate is provided with a pair of wiring layers on the upper surface, and grooves 58 are arranged between the pair of wiring layers.
The shapes of the first electrode and the second electrode also have the same effect as that of the first embodiment.

10 Light source device 11, 31 Light emitting device 11a Electronic component 11b Bottom surface 11c First side 11d Second side 12 Substrate 13, 33 Package 131 Mother body 13a Separation area 13b Recessed portion 14, 34 Semiconductor light emitting element 15, 35, 55 First electrode 15X Outer peripheral part 15Y Recesses 15a, 35a, 55a First part 15b, 35b, 55b Second part 150a Inner part 150b Inner part 151a, 151b, 152a, 153a Side parts 16, 36, 56 Second electrode 16X Outer part 16Y 17 recesses Material 18, 38, 58 Grooves 19, 19a, 19b, 39a, 39b Wiring layer 21, 41 First region 22, 42 Second region 23 Coating member 23a First coating member 23b Second coating member 25 Zener diode 31b Separation region

Claims (15)

A light source device having a semiconductor light emitting element.
A package having a first electrode and a second electrode,
It has a pair of wiring layers, and the lower surface of the first electrode is placed facing the upper surface of one wiring layer, and the lower surface of the second electrode is placed facing the upper surface of the other wiring layer. With a substrate,
The first electrode is separated into a first part and a second part via a first separation region on the lower surface, and the first part and the second part are integrally connected on the upper surface.
The substrate has a region that is partially provided in the one wiring layer and has poorer solder wettability than the wiring layer facing the first portion and the second portion.
The region having poor solder wettability is a light source device provided in a part of a region facing the first separation region. The light source device according to claim 1 , wherein the semiconductor light emitting device is arranged on the first electrode or the upper surface of the second electrode of the package. The light source device according to any one of claims 1 or 2, wherein the semiconductor light emitting device is arranged on the upper surface of the first electrode of the package and is electrically connected to the second electrode via a wire. The light source device according to any one of claims 1 to 3, wherein the semiconductor light emitting device is arranged on the upper surface of the first electrode and the second electrode of the package. It has at least two of the semiconductor light emitting devices and has
The light source device according to any one of claims 1 to 4, wherein at least one semiconductor light emitting device is arranged on the upper surface of each of the first electrode and the second electrode of the package. The first electrode or the second electrode has a plurality of metal layers, and the metal layer formed on the upper surface of the package, and the metal layer formed on the lower surface of the package, is a different metal The light source device according to any one of claims 1 to 5. Further, the region having poor solder wettability is a region facing a region having a distance of 0 to 50 μm from the peripheral edges of the first electrode and the second electrode, excluding the position facing the first separation region on the substrate. The light source device according to any one of claims 1 to 6, which is provided in a part of the region. The first to seventh aspects of the one wiring layer, wherein the region facing the first portion and the region facing the second portion are connected via a region facing the first separation region. The light source device according to any one item. The first electrode and the second electrode each have a recess formed on the upper surface thereof.
Any of claims 1 to 8, wherein the recess formed on the upper surface of the first portion and the recess formed on the upper surface of the second portion are separated in a region overlapping the first separation region. The light source device according to claim 1. The substrate has a through hole at a position facing the first separation region, and the bottom portion of the through hole is more solder wettable than the upper surface of the wiring layer facing the first portion and the second portion. The light source device according to any one of claims 1 to 9, which is bad. The substrate has a conductive member or an insulating member provided on the upper surface of the wiring layer at a position facing the first separation region.
The light source according to any one of claims 1 to 10, wherein the conductive member or the insulating member has a lower solder wettability than the upper surface of the wiring layer facing the first part and the second part. Device. 10. The light source device according to the first paragraph. On the lower surface of the package, the first separation region that separates the first part and the second part of the first electrode, and the first part and the second electrode of the first electrode are separated from each other. The light source device according to any one of claims 1 to 12 , wherein the two separation regions are connected to each other. The package is a quadrangle having an outer shape in a top view having a pair of first sides extending in the first direction and a pair of second sides extending in the second direction.
On the lower surface of the package, the first part and the second part of the first electrode are separated from each other in the first direction.
The light source device according to any one of claims 1 to 13 , wherein the first part of the first electrode and the second electrode are separated from each other in the first direction on the lower surface of the package. On the lower surface of the package, a virtual straight line that passes through one end of both ends of the first part of the first electrode in the second direction and proceeds in the first direction, and the first end that passes through the other end. The light source device according to claim 14 , wherein the second part of the first electrode and the second electrode are arranged between a virtual straight line traveling in a direction.

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