US20190198406A1 - Substrate and package module including the same - Google Patents

Substrate and package module including the same Download PDF

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Publication number
US20190198406A1
US20190198406A1 US15/895,259 US201815895259A US2019198406A1 US 20190198406 A1 US20190198406 A1 US 20190198406A1 US 201815895259 A US201815895259 A US 201815895259A US 2019198406 A1 US2019198406 A1 US 2019198406A1
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United States
Prior art keywords
substrate
protrusions
annular portion
interconnection layer
adhesive
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Granted
Application number
US15/895,259
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US10312169B1 (en
Inventor
Yu-Shiang CHEN
Chao-Wei Yu
Yu-Lin Hsiao
Ming-Te Tu
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Lingsen Precision Industries Ltd
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Lingsen Precision Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Assigned to LINGSEN PRECISION INDUSTRIES, LTD. reassignment LINGSEN PRECISION INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YU-SHIANG, HSIAO, YU-LIN, TU, MING-TE, YU, Chao-wei
Application granted granted Critical
Publication of US10312169B1 publication Critical patent/US10312169B1/en
Publication of US20190198406A1 publication Critical patent/US20190198406A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Definitions

  • the present invention relates to package technology, and more particularly to a substrate and a package module including the substrate.
  • the conventional package module is manufactured in a way that a metal ring is disposed on an upper surface of a substrate, a chip is then mounted on the upper surface of the substrate, and finally a solder paste is provided on the metal ring and a cap is attached to the metal ring through the solder paste.
  • the metal ring is too wide, there is insufficient space for better substrate layout, and if the metal ring is too narrow, the solder paste may be gathered in a certain area. As a result, the conventional package module still has drawbacks and therefore needs improvements.
  • the present invention provides a substrate which includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of first protrusions extending outward from an outer periphery of the annular portion.
  • the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion.
  • the annular portion and the first protrusions are formed integrally.
  • the annular portion and the first protrusions are manufactured from metal.
  • the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion.
  • the adhesive is solder paste.
  • the annular portion and the first protrusions are formed integrally from metal.
  • the adhesive when the bottom of the cap is attached to the interconnection layer of the substrate, the adhesive can be spread on the annular portion and the first protrusions of the interconnection layer to increase the bonding area of the adhesive, such that the bonding strength between the substrate and the cap can be enhanced, and the adhesive can be effectively gathered on the annular portion and the first protrusions.
  • the annular portion can be configured having a width smaller than the width of the conventional metal ring to increase available layout space of the substrate and reduce the size of the package module.
  • FIG. 1 is a perspective view of a substrate according to a first preferred embodiment of the present invention.
  • FIG. 2 is a sectional view of a package module according to the first preferred embodiment of the present invention, showing the cap is attached to the interconnection layer through the adhesive.
  • FIG. 3 is an exploded perspective view of the package module according to the first preferred embodiment of the present invention.
  • FIG. 4 is a perspective view of the substrate according to a second preferred embodiment of the present invention.
  • a substrate 10 according to a first preferred embodiment of the present invention includes a substrate body 20 and an interconnection layer 30 .
  • the substrate body 20 in the present embodiment may, but unlimited to, be a printed circuit board (usually referred to as “PCB”), a bismaleimide-triazine (usually referred to as “BT”) substrate, a glass fiber substrate (usually referred to as “FR4”), a ceramic substrate, or a direct bonded copper (usually referred to as “DBC”) substrate.
  • PCB printed circuit board
  • BT bismaleimide-triazine
  • FR4 glass fiber substrate
  • FR4 ceramic substrate
  • DRC direct bonded copper
  • the interconnection layer 30 is disposed on the bearing surface 22 of the substrate body 20 .
  • the interconnection layer 30 is a closed circuit; however, the interconnection layer 30 may have an opening according to actual needs.
  • the interconnection layer 30 has an annular portion 38 and a plurality of first protrusions 32 extending outward from an outer periphery of the annular portion 38 .
  • the annular portion 38 is a quadrilateral member with four lateral walls 34 .
  • the first protrusions 32 each extend outward and horizontally from the outer periphery of one of the lateral walls 34 , and the first protrusions 32 each have a bottom side thereof fixedly mounted on the bearing surface 22 of the substrate body 20 and a top side thereof flush with the top sides of the lateral walls 34 . Further, each of the outer peripheries of the lateral walls 34 may be provided with one or more first protrusions 32 . Preferably, the outer peripheries of the two opposite lateral walls 34 have the same number of the first protrusions 32 .
  • the first protrusions 32 and the annular portion 38 are formed integrally, and more specifically, the first protrusions 32 and the lateral walls 34 are formed integrally to reduce production process and manufacturing costs.
  • the annular portion 38 can be first formed, and then the first protrusions 32 are formed on the outer peripheries of the lateral walls 34 .
  • the annular portion 38 and the first protrusions 32 are manufactured from metal.
  • the annular portion 38 and the first protrusions 32 are formed integrally, they are made from the same material.
  • the annular portion 38 and the first protrusions 32 may be made from different metal according to actual needs.
  • the shape of the annular portion 38 may be modified according to different requirements.
  • the annular portion 38 may be triangular, polygonal or irregular.
  • the interconnection layer 30 has a plurality of second protrusions 36 .
  • the second protrusions 36 each extend inward and horizontally from an inner periphery of one of the lateral walls 34 , and the second protrusions 36 each have a bottom side thereof fixedly mounted on the bearing surface 22 of the substrate body 20 and a top side thereof flush with the top sides of the lateral walls 34 .
  • the second protrusions 36 and the annular portion 38 are formed integrally from the same or different metal, and furthermore, each of the inner peripheries of the lateral walls 34 may be provided with one or more second protrusions 36 .
  • the inner peripheries of the two opposite lateral walls 34 have the same number of the second protrusions 36 .
  • a package module 40 of the present invention includes the aforesaid substrate 10 , a chip 50 , and a cap 60 .
  • the chip 50 is mounted on the bearing surface 22 of the substrate body 20 and surrounded by the annular portion 38 of the interconnection layer 30 .
  • the chip 50 is an electric component or semiconductor component for receiving and processing electrical signals.
  • the chip 30 may be optionally and electrically connected to the interconnection layer 30 to prevent damage from static electricity.
  • the cap 60 is mounted on the bearing surface 22 of the substrate body 20 to define an accommodation chamber 70 with the substrate body 20 for enclosing the chip 50 .
  • the cap 60 has a top plate 62 , an annular wall 64 extending downward from an outer periphery of the top plate 62 , and a bottom 66 formed at a bottom end of the annular wall 64 .
  • the bottom 66 of the cap 60 is attached to the annular portion 38 and the first protrusions 32 of the interconnection layer 30 by an adhesive 80 .
  • the adhesive 80 is solder paste.
  • the adhesive 80 is spread evenly on the two opposites lateral walls 34 , such that the stresses generated between the cap 60 and the two opposite lateral walls 34 are equal to each other.
  • the bottom 66 of the cap 60 is attached to the second protrusions 36 of the interconnection layer 30 by the adhesive 80 . Further, since the two opposite lateral walls 34 have the same number of the second protrusions 36 , the adhesive 80 is spread evenly on the two opposites lateral walls 34 , such that the stresses generated between the cap 60 and the two opposite lateral walls 34 are equal to each other.
  • the adhesive 80 is spread on the top side of the annular portion 38 , the top sides of the first protrusions 32 , and the top sides of the second protrusions 36 , such that the bonding area of the adhesive 80 is enhanced, thereby increasing the bonding strength between the substrate 20 and the cap 60 and concentrating the adhesive 80 in the annular portion 38 , first protrusions 32 , and second protrusions 36 .
  • each of the lateral walls 34 can be designed having a width smaller than the width of the conventional metal ring to increase available layout space of the substrate 20 and reduce the size of the package module 40 , thereby enabling the package module 40 to achieve a lightweight design.

Abstract

A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.

Description

    BACKGROUND OF THE INVENTION 1. Field of the Invention
  • The present invention relates to package technology, and more particularly to a substrate and a package module including the substrate.
    • 2. Description of the Related Art
  • The conventional package module is manufactured in a way that a metal ring is disposed on an upper surface of a substrate, a chip is then mounted on the upper surface of the substrate, and finally a solder paste is provided on the metal ring and a cap is attached to the metal ring through the solder paste. However, because the size of the package module is getting smaller, the flexibility of substrate layout will be limited by the metal ring. If the metal ring is too wide, there is insufficient space for better substrate layout, and if the metal ring is too narrow, the solder paste may be gathered in a certain area. As a result, the conventional package module still has drawbacks and therefore needs improvements.
    • SUMMARY OF THE INVENTION
  • It is a primary objective of the present invention to provide a substrate for a package module, which has the advantages of lowering costs, increasing available layout space, and reducing the size of the package module.
  • To attain the above objective, the present invention provides a substrate which includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of first protrusions extending outward from an outer periphery of the annular portion.
  • Preferably, the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion.
  • Preferably, the annular portion and the first protrusions are formed integrally.
  • Preferably, the annular portion and the first protrusions are manufactured from metal.
  • It is a secondary objective of the present invention to provide a package module which includes the aforesaid substrate, a chip mounted on the bearing surface of the substrate body and surrounded by the annular portion of the interconnection layer, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive.
  • Preferably, the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion.
  • Preferably, the adhesive is solder paste.
  • Preferably, the annular portion and the first protrusions are formed integrally from metal.
  • It can be understood from the above illustration that when the bottom of the cap is attached to the interconnection layer of the substrate, the adhesive can be spread on the annular portion and the first protrusions of the interconnection layer to increase the bonding area of the adhesive, such that the bonding strength between the substrate and the cap can be enhanced, and the adhesive can be effectively gathered on the annular portion and the first protrusions.
  • As a result, by means of the first protrusions of the interconnection layer, the bonding area of the adhesive is enhanced, and the bonding strength between the substrate and the cap is increased. Further, the annular portion can be configured having a width smaller than the width of the conventional metal ring to increase available layout space of the substrate and reduce the size of the package module.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a substrate according to a first preferred embodiment of the present invention.
  • FIG. 2 is a sectional view of a package module according to the first preferred embodiment of the present invention, showing the cap is attached to the interconnection layer through the adhesive.
  • FIG. 3 is an exploded perspective view of the package module according to the first preferred embodiment of the present invention.
  • FIG. 4 is a perspective view of the substrate according to a second preferred embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1, a substrate 10 according to a first preferred embodiment of the present invention includes a substrate body 20 and an interconnection layer 30.
  • The substrate body 20 in the present embodiment may, but unlimited to, be a printed circuit board (usually referred to as “PCB”), a bismaleimide-triazine (usually referred to as “BT”) substrate, a glass fiber substrate (usually referred to as “FR4”), a ceramic substrate, or a direct bonded copper (usually referred to as “DBC”) substrate. As such, the substrate body 20 has a relatively lower manufacturing cost. The substrate body 20 has a bearing surface 22.
  • The interconnection layer 30 is disposed on the bearing surface 22 of the substrate body 20. In the present embodiment, the interconnection layer 30 is a closed circuit; however, the interconnection layer 30 may have an opening according to actual needs. The interconnection layer 30 has an annular portion 38 and a plurality of first protrusions 32 extending outward from an outer periphery of the annular portion 38. In the present embodiment, the annular portion 38 is a quadrilateral member with four lateral walls 34. The first protrusions 32 each extend outward and horizontally from the outer periphery of one of the lateral walls 34, and the first protrusions 32 each have a bottom side thereof fixedly mounted on the bearing surface 22 of the substrate body 20 and a top side thereof flush with the top sides of the lateral walls 34. Further, each of the outer peripheries of the lateral walls 34 may be provided with one or more first protrusions 32. Preferably, the outer peripheries of the two opposite lateral walls 34 have the same number of the first protrusions 32.
  • In the present embodiment, the first protrusions 32 and the annular portion 38 are formed integrally, and more specifically, the first protrusions 32 and the lateral walls 34 are formed integrally to reduce production process and manufacturing costs. In other embodiment, the annular portion 38 can be first formed, and then the first protrusions 32 are formed on the outer peripheries of the lateral walls 34. Besides, the annular portion 38 and the first protrusions 32 are manufactured from metal. In the present embodiment, since the annular portion 38 and the first protrusions 32 are formed integrally, they are made from the same material. In other embodiment, the annular portion 38 and the first protrusions 32 may be made from different metal according to actual needs.
  • Moreover, the shape of the annular portion 38 may be modified according to different requirements. For example, the annular portion 38 may be triangular, polygonal or irregular.
  • As shown in FIG. 4, in a second preferred embodiment, the interconnection layer 30 has a plurality of second protrusions 36. The second protrusions 36 each extend inward and horizontally from an inner periphery of one of the lateral walls 34, and the second protrusions 36 each have a bottom side thereof fixedly mounted on the bearing surface 22 of the substrate body 20 and a top side thereof flush with the top sides of the lateral walls 34. The second protrusions 36 and the annular portion 38 are formed integrally from the same or different metal, and furthermore, each of the inner peripheries of the lateral walls 34 may be provided with one or more second protrusions 36. Preferably, the inner peripheries of the two opposite lateral walls 34 have the same number of the second protrusions 36.
  • As shown in FIGS. 2-3, a package module 40 of the present invention includes the aforesaid substrate 10, a chip 50, and a cap 60.
  • The chip 50 is mounted on the bearing surface 22 of the substrate body 20 and surrounded by the annular portion 38 of the interconnection layer 30. In the present embodiment, the chip 50 is an electric component or semiconductor component for receiving and processing electrical signals. Further, the chip 30 may be optionally and electrically connected to the interconnection layer 30 to prevent damage from static electricity.
  • The cap 60 is mounted on the bearing surface 22 of the substrate body 20 to define an accommodation chamber 70 with the substrate body 20 for enclosing the chip 50. In the present embodiment, the cap 60 has a top plate 62, an annular wall 64 extending downward from an outer periphery of the top plate 62, and a bottom 66 formed at a bottom end of the annular wall 64. The bottom 66 of the cap 60 is attached to the annular portion 38 and the first protrusions 32 of the interconnection layer 30 by an adhesive 80. In the present embodiment, the adhesive 80 is solder paste. Further, since the two opposite lateral walls 34 have the same number of the first protrusions 32, the adhesive 80 is spread evenly on the two opposites lateral walls 34, such that the stresses generated between the cap 60 and the two opposite lateral walls 34 are equal to each other.
  • In the second preferred embodiment, in addition to the annular portion 38 and the first protrusions 32, the bottom 66 of the cap 60 is attached to the second protrusions 36 of the interconnection layer 30 by the adhesive 80. Further, since the two opposite lateral walls 34 have the same number of the second protrusions 36, the adhesive 80 is spread evenly on the two opposites lateral walls 34, such that the stresses generated between the cap 60 and the two opposite lateral walls 34 are equal to each other.
  • In summary, when the bottom 66 of the cap 60 is adhered to the interconnection layer 30 by the adhesive 80, the adhesive 80 is spread on the top side of the annular portion 38, the top sides of the first protrusions 32, and the top sides of the second protrusions 36, such that the bonding area of the adhesive 80 is enhanced, thereby increasing the bonding strength between the substrate 20 and the cap 60 and concentrating the adhesive 80 in the annular portion 38, first protrusions 32, and second protrusions 36. Further, by means of the first and second protrusions 32, 36, each of the lateral walls 34 can be designed having a width smaller than the width of the conventional metal ring to increase available layout space of the substrate 20 and reduce the size of the package module 40, thereby enabling the package module 40 to achieve a lightweight design.

Claims (8)

1. A substrate comprising:
a substrate body having a bearing surface; and
an interconnection layer disposed on the bearing surface of the substrate body and having an annular portion and a plurality of first protrusions extending outward from an outer periphery of the annular portion;
wherein the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion, and each of the first protrusions and each of the second protrusions are interlaced with each other.
2. (canceled)
3. The substrate as claimed in claim 1, wherein the annular portion and the first protrusions are formed integrally.
4. The substrate as claimed in claim 1, wherein the annular portion and the first protrusions are manufactured from metal.
5. A package module comprising:
a substrate as defined in claim 1;
a chip mounted on the bearing surface of the substrate body and surrounded by the annular portion of the interconnection layer; and
a cap enclosing the chip and having a bottom adhered to the annular portion and the first protrusions by an adhesive.
6. (canceled)
7. The package module as claimed in claim 5, wherein the adhesive is solder paste.
8. The package module as claimed in claim 5, wherein the annular portion and the first protrusions are formed integrally from metal.
US15/895,259 2017-12-27 2018-02-13 Substrate and package module including the same Active US10312169B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW106146083A TWI650053B (en) 2017-12-27 2017-12-27 Substrate structure and packaging module
TW106146083 2017-12-27
TW106146083A 2017-12-27

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US10312169B1 US10312169B1 (en) 2019-06-04
US20190198406A1 true US20190198406A1 (en) 2019-06-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7417121B2 (en) 2021-10-29 2024-01-18 日亜化学工業株式会社 light emitting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US7554190B2 (en) * 2004-12-03 2009-06-30 Chris Macris Liquid metal thermal interface material system
US9826630B2 (en) * 2014-09-04 2017-11-21 Nxp Usa, Inc. Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
US9832860B2 (en) * 2014-09-26 2017-11-28 Intel Corporation Panel level fabrication of package substrates with integrated stiffeners
US10881001B2 (en) * 2017-03-02 2020-12-29 Flex Ltd. Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7417121B2 (en) 2021-10-29 2024-01-18 日亜化学工業株式会社 light emitting device

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US10312169B1 (en) 2019-06-04
TWI650053B (en) 2019-02-01
TW201929621A (en) 2019-07-16

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